JPS6315100B2 - - Google Patents
Info
- Publication number
- JPS6315100B2 JPS6315100B2 JP13006481A JP13006481A JPS6315100B2 JP S6315100 B2 JPS6315100 B2 JP S6315100B2 JP 13006481 A JP13006481 A JP 13006481A JP 13006481 A JP13006481 A JP 13006481A JP S6315100 B2 JPS6315100 B2 JP S6315100B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grinding wheel
- grinding
- finish
- rough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000007246 mechanism Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
【発明の詳細な説明】
本発明はウエハ研削盤とくにローダ、アンロー
ダ付のインデツクス形平面研削盤に適用しうるウ
エハ研削盤に関するものである。
従来この種のウエハ研削盤においては、第1図
に示す如く、円周方向に90゜間隔で4個のウエハ
3を夫々真空吸着する真空吸着装置2を備え、
90゜毎に矢印方向に回動するインデツクステーブ
ル1を設け、このインデツクステーブル1の周囲
上記4個のウエハ3の対向位置にローダ4、アン
ローダ5、荒研削装置6a、仕上研削装置6bを
配置している。
上記ローダ4およびアンローダ5はブロツクで
しか示していないが、一方のローダ4は上記真空
吸着装置2が対向位置まで回動して停止したと
き、これに連動して新たなウエハ3を真空吸着装
置2上に搬送して真空吸着装置2にローダ完了の
信号を発信するように形成されている。またアン
ローダ5は加工完了後のウエハ3が対向位置まで
回動して停止、真空吸着装置2がウエハ3の吸着
を解除すると、ウエハ3を搬出して上記にインデ
ツクステーブル1の回動装置にアンローダ完了の
信号を発信するように形成されている。
真空吸着装置2は図示していないが、加工後の
ウエハ3を吸着してアンローダ5の対向位置まで
回動して停止すると、真空吸着を解除してアンロ
ーダ5に信号を発信し、然る後、ローダ4に対向
位置まで回動して停止しローダ4によつて新たな
ウエハ3が塔載したときウエハ3を吸着しインデ
ツクステーブル1の回動装置およびアンローダ5
に吸着完了の信号を発信するようにしている。
荒研削装置6aおよび仕上研削装置6bは夫々
上記インデツクステーブル1の回動中心により
90゜の間隔で放射状に配置されたベツト7a,7
bと、このベツト7a,7b上にインデツクステ
ーブル1に向つて矢印方向に前進、後退する如く
塔載されたコラム8a,8bと、このコラム8
a,8bにその摺動面9a,9bにそうて上下方
向に移動自在に塔載し荒研削用砥石10aおよび
仕上研削用砥石10bを夫々保持する主軸頭11
a,11bと、上記コラム8a,8b上に塔載
し、上記各砥石10a,10bを夫々ベルト12
a,12bを介して矢印方向に回転させるモータ
13a,13bとから形成されている。
なお、上記コラム8a,8bの前進、後退およ
び主軸頭11a,11bの上下動をさせる駆動機
構は図示していないが夫々ベツト7a,7b内に
設置されている。
したがつて荒研削装置6aおよび仕上研削装置
6bは、夫々の対向位置にウエハ3が回動して停
止し、インデツクステーブル1の回動装置よりウ
エハ3の加工位置決め完了の信号が送られてくる
と、両砥石10a,10bが回転しつつウエハ3
に向つて前進してウエハ3をc,dに示す如き軌
跡を画きながら荒研削および仕上研削する。
研削完了すると、両砥石10a,10bが後退
移動し、元の位置に達したとき、インデツクステ
ーブル1の回転装置に研削完了の信号を発信して
インデツクステーブル1が回動し以下上記作用を
繰返す。
然るに上記構成のウエハ研削盤においては、荒
研削用砥石10aおよび仕上研削砥石10bを
夫々駆動する荒研削装置6aおよび仕上研削装置
6bが独立して設置されているため、ウエハ研削
盤全体の形状が大形化して製造費が高くなる。ま
た荒研削砥石10aおよび仕上研削用砥石10b
が夫々ウエハ3を同一方向の軌跡c,dを画きな
がら研削するため、ヘアクラツクの成生を助長す
る傾向にある。
本発明は上記従来の欠点を除去し、形状を小型
化して製造費を安価にし、かつヘアクラツクの助
長を防止するウエハ研削盤を提供することにあ
る。
本発明は上記の目的を達成するため、ベツト上
をインデツクスに向つて前進後退するコラムに共
通台を上下動自在に設け、この共通台上に荒研削
用砥石および仕上研削用砥石を並列にかつ一方の
砥石のみ移動可能に設け、共通台を介して荒研削
用砥石および仕上研削用砥石を同時に移動させる
ようにしたものである。
以下本発明の実施例を示す第2図および第3図
につき説明する。第2図は本発明の実施例を示す
ウエハ研削盤の平面図、第3図は第2図のA−A
矢視正面図である。なお、従来と同一部分は第1
図と同符号をもつて示す。
14はコラムにして、ベツト15上にインデツ
クステーブル1に向つて前進後退可能に支持され
ている。16は上下動案内テーブルにして、上記
ベツト15内に設けた駆動機構(図示せず)に接
続し、コラム14に固定されたクランププレート
17にそうて上下動するように形成され一端部に
共通台18他端部に砥石回転用モータ19を固定
している。
上記共通台18は、荒研削用砥石20を支持す
る主軸頭21および仕上研削用砥石22を支持す
る主軸頭23を並列に塔載し、微小上下動用リブ
24を回転することにより一方の荒研削用主軸頭
21のみ上下動可能になつている。上記砥石回転
用モータ19は軸端部に固定されたプーリ25と
上記荒研削用砥石20および仕上研削用砥石22
に夫々接続するプーリ26,27とベルト28を
介して連動するようになつている。なお、図の
l、fは荒研削用砥石20および仕上研削用砥石
22の研削軌跡、h0は素材ウエハ3aの厚さ、h1
は荒研削後のウエハ3の厚さ、h2は仕上研削後の
ウエハ3の厚さを示す。上記の構成であるから、
予じめ素材ウエハ3aの厚さh0に対して仕上研削
後のウエハ3の厚さh2になるように共通台18を
上下動させて仕上研削用砥石22の位置を調整し
たのち、荒研削後のウエハ3の厚みがh1になるよ
うに微小上下動リブ24を回転して荒研削用砥石
20の位置を調整する。この状態で、砥石回転用
モータ19を駆動して両砥石20,22を回転さ
せると同時にウエハ3に向つて前進移動させる
と、両砥石20,22は互いに異なる方向の軌跡
l、fを画きながら2個のウエハ3を夫々荒研
削、仕上研削する。
なお、上記実施例においては1個の砥石回転用
モータ19にて2個の砥石20,22を同時に回
転させているが、これに限定されるものでなく2
個の砥石回転モータにて夫々の砥石20,22を
回転することも可能である。
即ち、本発明においては荒研削用砥石および仕
上研削用砥石を1個の共通台に載置し、この共通
台を介して上記2個の砥石を1個の上下駆動機構
により同時に上下動させること、上記共通台を保
持する部材例えばコラムおよびベツトを1個にし
たことにあるから、これ以外の部分において上記
実施例と異なる構成にしても本発明の要旨を変更
するものでない。
本発明は以上述べたる如くであるから少くとも
荒研削用砥石および仕上研削用砥石を上下動させ
る駆動機構を1個にすることができ、かつ上記両
砥石を保持する部材を1個にすることができるの
で、ウエハ研削盤全体の形状を小形化して製造費
を安価にすることができる。また上記両砥石の研
削軌跡を異なる方向にしてヘアクラツクの助長を
少くかつ精度が安定に得られる効果を有する。 DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wafer grinding machine that can be applied to a wafer grinding machine, particularly an index type surface grinding machine equipped with a loader and an unloader. Conventionally, this type of wafer grinding machine is equipped with a vacuum suction device 2 for vacuum suctioning four wafers 3 at 90° intervals in the circumferential direction, as shown in FIG.
An index table 1 that rotates every 90 degrees in the direction of the arrow is provided, and a loader 4, an unloader 5, a rough grinding device 6a , and a finish grinding device 6b are installed around the index table 1 at positions facing the four wafers 3 mentioned above. It is placed. Although the loader 4 and unloader 5 are shown only as blocks, when the vacuum suction device 2 rotates to the opposing position and stops, one loader 4 moves the new wafer 3 to the vacuum suction device. 2 and sends a loader completion signal to the vacuum suction device 2. The unloader 5 rotates to a position facing the wafer 3 after processing and stops. When the vacuum suction device 2 releases the suction of the wafer 3, the unloader 5 unloads the wafer 3 and transfers it to the rotation device of the index table 1. The unloader is configured to signal that the unloader is complete. Although the vacuum suction device 2 is not shown, when it suctions the processed wafer 3 and rotates to a position facing the unloader 5 and stops, it releases the vacuum suction and sends a signal to the unloader 5, and then , rotates to a position facing the loader 4 and stops, and when a new wafer 3 is placed on the tower by the loader 4, the wafer 3 is sucked and the rotation device of the index table 1 and the unloader 5
A signal indicating completion of adsorption is sent. The rough grinding device 6a and the finish grinding device 6b are respectively rotated by the center of rotation of the index table 1.
Bets 7a, 7 arranged radially at 90° intervals
b, columns 8a and 8b mounted on the beds 7a and 7b so as to move forward and backward in the direction of the arrow toward the index table 1;
A spindle head 11 is mounted on sliding surfaces 9a and 9b on a and 8b so as to be movable in the vertical direction, and holds a rough grinding wheel 10a and a finish grinding wheel 10b, respectively.
a, 11b and the columns 8a, 8b, and the respective grindstones 10a, 10b are mounted on the belt 12.
It is formed from motors 13a and 13b that rotate in the direction of the arrow via motors a and 12b. Although not shown, drive mechanisms for advancing and retracting the columns 8a and 8b and moving the spindle heads 11a and 11b up and down are installed in the beds 7a and 7b, respectively. Therefore, the rough grinding device 6a and the finish grinding device 6b rotate and stop the wafer 3 in their respective opposing positions, and a signal indicating completion of processing positioning of the wafer 3 is sent from the rotation device of the index table 1. When this happens, both grinding wheels 10a and 10b rotate while grinding the wafer 3.
The wafer 3 is roughly ground and finished ground while moving forward toward , tracing the trajectories shown in c and d. When the grinding is completed, both the grinding wheels 10a and 10b move backward, and when they reach their original positions, a signal indicating the completion of grinding is sent to the rotating device of the index table 1, and the index table 1 rotates, and the above-mentioned operations are performed below. Repeat. However, in the wafer grinding machine having the above configuration, the rough grinding device 6a and the finish grinding device 6b, which drive the rough grinding wheel 10a and the finish grinding wheel 10b, respectively, are installed independently, so that the overall shape of the wafer grinding machine is The larger the size, the higher the manufacturing cost. Also, a rough grinding wheel 10a and a finish grinding wheel 10b
Since each grinder grinds the wafer 3 while tracing trajectories c and d in the same direction, this tends to encourage the formation of hair cracks. SUMMARY OF THE INVENTION The object of the present invention is to provide a wafer grinding machine which eliminates the above-mentioned conventional drawbacks, reduces the size of the machine, reduces manufacturing costs, and prevents the formation of hair cracks. In order to achieve the above object, the present invention provides a common table that is movable up and down on a column that moves forward and backward toward an index on a bed, and a rough grinding wheel and a finishing grinding wheel are placed in parallel on this common table. Only one of the grindstones is movable, and the rough grinding wheel and the finish grinding wheel are moved simultaneously via a common stand. Embodiments of the present invention will be explained below with reference to FIGS. 2 and 3, which show embodiments of the present invention. Fig. 2 is a plan view of a wafer grinding machine showing an embodiment of the present invention, and Fig. 3 is an A-A in Fig. 2.
FIG. Note that the same parts as before are in the first part.
Indicated with the same reference numerals as in the figure. A column 14 is supported on a bed 15 so as to be able to move forward and backward toward the index table 1. Reference numeral 16 designates a vertically movable guide table, which is connected to a drive mechanism (not shown) provided in the bed 15 and is formed to be vertically movable on a clamp plate 17 fixed to the column 14. A grindstone rotation motor 19 is fixed to the other end of the stand 18. The common stand 18 has a spindle head 21 supporting a rough grinding wheel 20 and a spindle head 23 supporting a finish grinding wheel 22 mounted in parallel, and by rotating the fine vertical movement rib 24, one of the spindle heads can be used for rough grinding. Only the spindle head 21 can be moved up and down. The grindstone rotation motor 19 includes a pulley 25 fixed to the shaft end, the rough grinding wheel 20 and the finish grinding wheel 22.
The belt 28 is interlocked with pulleys 26 and 27 connected to the belt 28, respectively. Note that l and f in the figure are the grinding trajectories of the rough grinding wheel 20 and the finish grinding wheel 22, h 0 is the thickness of the material wafer 3a, and h 1
indicates the thickness of the wafer 3 after rough grinding, and h 2 indicates the thickness of the wafer 3 after finish grinding. Because of the above configuration,
After adjusting the position of the finish grinding wheel 22 in advance by moving the common table 18 up and down so that the thickness h 2 of the wafer 3 after finish grinding is adjusted to the thickness h 0 of the raw material wafer 3a, The position of the rough grinding wheel 20 is adjusted by rotating the minute vertically moving rib 24 so that the thickness of the wafer 3 after grinding becomes h1 . In this state, when the grindstone rotation motor 19 is driven to rotate both the grindstones 20 and 22 and simultaneously move them forward toward the wafer 3, the two grindstones 20 and 22 move while drawing trajectories l and f in different directions. The two wafers 3 are subjected to rough grinding and finish grinding, respectively. In the above embodiment, the two grindstones 20 and 22 are simultaneously rotated by one grindstone rotation motor 19, but the invention is not limited to this.
It is also possible to rotate each of the grindstones 20 and 22 using separate grindstone rotation motors. That is, in the present invention, a rough grinding wheel and a finish grinding wheel are placed on one common stand, and the two grinding wheels are simultaneously moved up and down by one vertical drive mechanism via this common stand. Since the members for holding the common base, such as the column and the bed, are reduced to one, the gist of the present invention will not be changed even if the structure is different from the above embodiment in other parts. As described above, the present invention is capable of reducing at least one drive mechanism for vertically moving the rough grinding wheel and the finishing grinding wheel, and reducing the number of members for holding both of the grindstones to one. As a result, the overall shape of the wafer grinding machine can be made smaller and manufacturing costs can be reduced. Further, by setting the grinding trajectories of the two grindstones in different directions, hair cracks are less likely to occur and accuracy can be stably obtained.
第1図は従来のローダ、アンローダ付のインデ
ツクス形平面研削盤を示す平面図、第2図は本発
明によるローダ、アンローダ付インデツクス形平
面研削盤を示す平面図、第3図は第2図のA−A
矢視正面図である。
14……コラム、15……ベツト、16……上
下動案内テーブル、17……クランププレート、
18……共通台、19……砥石回転用モータ、2
0……荒研削用砥石、21……主軸頭、22……
仕上研削用砥石、23……主軸頭、24……微小
上下動リブ、25,26,27……プーリ、28
……ベルト。
FIG. 1 is a plan view showing a conventional index type surface grinder with a loader and unloader, FIG. 2 is a plan view showing an index type surface grinder with a loader and unloader according to the present invention, and FIG. A-A
FIG. 14...Column, 15...Bed, 16...Vertical movement guide table, 17...Clamp plate,
18... Common stand, 19... Grinding wheel rotation motor, 2
0... Rough grinding wheel, 21... Spindle head, 22...
Finish grinding wheel, 23... Spindle head, 24... Minute vertical movement rib, 25, 26, 27... Pulley, 28
……belt.
Claims (1)
定角度宛回動するインデツクステーブルの周囲に
荒研削装置および仕上研削装置を設けたウエハ研
削盤において、ベツト上をインデツクステーブル
に向つて前進後退するコラムを設け、このコラム
に上下動自在に保持された共通台を設け、この共
通台に荒研削砥石および仕上研削用砥石を並列に
かつ一方の砥石のみ移動可能に設け、上記共通台
を介して荒研削用砥石および仕上研削用砥石を1
個の駆動機構にて同時に移動しうるようにしたこ
とを特徴とするウエハ研削盤。1. In a wafer grinding machine that has a plurality of vacuum suction devices in the circumferential direction and has a rough grinding device and a finish grinding device around an index table that rotates at a predetermined angle, a wafer is placed on the bed toward the index table. A column that moves forward and backward is provided, a common stand is provided on this column so as to be movable up and down, a rough grinding wheel and a finish grinding wheel are provided in parallel on this common stand, and only one of the grindstones is movable; The rough grinding wheel and the finish grinding wheel are connected through the
A wafer grinding machine characterized by being able to move simultaneously using separate drive mechanisms.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13006481A JPS5834751A (en) | 1981-08-21 | 1981-08-21 | Wafer grinder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13006481A JPS5834751A (en) | 1981-08-21 | 1981-08-21 | Wafer grinder |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5834751A JPS5834751A (en) | 1983-03-01 |
JPS6315100B2 true JPS6315100B2 (en) | 1988-04-02 |
Family
ID=15025147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13006481A Granted JPS5834751A (en) | 1981-08-21 | 1981-08-21 | Wafer grinder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5834751A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59232758A (en) * | 1983-06-13 | 1984-12-27 | Matsushita Electric Ind Co Ltd | Spherical face working system |
JPS6044206A (en) * | 1983-08-19 | 1985-03-09 | Kitamura Kikai Kk | Tool length adjusting device for multi-spindle vertical type milling machine |
JPS6076959A (en) * | 1983-09-30 | 1985-05-01 | Fujitsu Ltd | Manufacture of semi-conductor device |
JPS60242953A (en) * | 1984-05-17 | 1985-12-02 | Matsushita Electric Ind Co Ltd | Bevelling machine |
JPS60242951A (en) * | 1984-05-17 | 1985-12-02 | Matsushita Electric Ind Co Ltd | Bevelling system |
JP4808278B2 (en) * | 1999-01-06 | 2011-11-02 | 株式会社東京精密 | Planar processing apparatus and method |
JP4455750B2 (en) * | 2000-12-27 | 2010-04-21 | 株式会社ディスコ | Grinding equipment |
-
1981
- 1981-08-21 JP JP13006481A patent/JPS5834751A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5834751A (en) | 1983-03-01 |
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