JPS6314436Y2 - - Google Patents
Info
- Publication number
- JPS6314436Y2 JPS6314436Y2 JP2404683U JP2404683U JPS6314436Y2 JP S6314436 Y2 JPS6314436 Y2 JP S6314436Y2 JP 2404683 U JP2404683 U JP 2404683U JP 2404683 U JP2404683 U JP 2404683U JP S6314436 Y2 JPS6314436 Y2 JP S6314436Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- capacitor
- fuse
- resin
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Fuses (AREA)
Description
【考案の詳細な説明】
本考案は保安機能を有するモールドコンデンサ
に関するものである。[Detailed Description of the Invention] The present invention relates to a molded capacitor having a safety function.
コンデンサは、劣化した場合、大電流が流れ発
熱し破壊したり燃焼するような事故が発生するこ
とがあり、このような事故を防止するために、コ
ンデンサ素子と直列に電流ヒユーズや温度ヒユー
ズ等のヒユーズを接続し、大電流や発熱によりヒ
ユーズを溶断し、コンデンサを外部回路から開放
するような構造にしたものがある。 If a capacitor deteriorates, a large current will flow through it, causing it to generate heat and cause an accident such as destruction or combustion.To prevent such an accident, install a current fuse, temperature fuse, etc. in series with the capacitor element. Some have a structure in which a fuse is connected and the fuse is blown by large current or heat, thereby opening the capacitor from the external circuit.
ところで、従来のヒユーズは、溶断部や熱感知
部からリード線が引き出される構成になつてお
り、そのまま、コンデンサ素子に接続した場合、
樹脂モールド外装を形成する際の樹脂の注入圧力
によつて容易に変形する。そのため端子等を介し
て接続する場合等には、端子を所定の位置に配設
することが非常に困難である欠点があつた。 By the way, conventional fuses have a structure in which the lead wire is drawn out from the fusing part or the heat sensing part, and when connected to the capacitor element as is,
It is easily deformed by the injection pressure of resin when forming the resin mold exterior. Therefore, when connecting via terminals or the like, there is a drawback that it is very difficult to arrange the terminals at predetermined positions.
このような欠点を改良するものとして、絶縁基
板にヒユーズを取りつけたりあるいはヒユーズ回
路を直接絶縁基板に印刷したものが考案されてい
る。が、このようなヒユーズ機構を、例えばコン
デンサ素子の端面に設けられたメタリコンに接続
し、コンデンサ素子に樹脂モールド外装を設けた
コンデンサの場合には、従来は絶縁基板の端部の
みでメタリコンに接続しているため、モールドの
際の樹脂の注入圧力によつて絶縁基板とメタリコ
ンとの接続が容易に外れる欠点があつた。 In order to overcome these drawbacks, it has been proposed to attach a fuse to an insulating substrate or to print a fuse circuit directly on an insulating substrate. However, in the case of a capacitor in which such a fuse mechanism is connected, for example, to a metallic contact provided on the end face of a capacitor element, and the capacitor element has a resin molded exterior, conventionally it is connected to the metallic contact only at the end of the insulating substrate. Therefore, there was a drawback that the connection between the insulating substrate and the metallicon was easily disconnected due to the injection pressure of the resin during molding.
本考案は、以上の欠点を改良し、保安機構を有
する絶縁基板を確実に取り付けることのできるモ
ールドコンデンサの提供を目的とするものであ
る。 The present invention aims to improve the above-mentioned drawbacks and provide a molded capacitor to which an insulating substrate having a security mechanism can be reliably attached.
本考案は、上記の目的を達成するために、ヒユ
ーズ機構が設けられ、端子が接続されるととも
に、端部及び両側端部がメタリコンに接続されて
いる絶縁基板を有することを特徴とするモールド
コンデンサを提供するものである。 In order to achieve the above object, the present invention provides a molded capacitor characterized by having an insulating substrate provided with a fuse mechanism, connected to a terminal, and having an end and both ends connected to a metallic contact. It provides:
以下、本考案の実施例を図面に基づいて説明す
る。 Hereinafter, embodiments of the present invention will be described based on the drawings.
図において、１は金属化プラスチツクフイルム
や金属化紙を巻回したコンデンサ素子であり、両
端面に亜鉛や鉛等の金属のメタリコン２が設けら
れている。３は、ガラス−エポキシ樹脂やガラス
−フエノール樹脂等からなる厚さ１mm程度の長方
形状の絶縁基板であり、端部４並びに両側端部５
及び６に銅箔部７，８及び９が印刷され、この銅
箔部７，８及び９の箇所がメタリコン２に半田付
け１０，１１及び１２されている。１３は、絶縁
基板３に印刷された、電流ヒユーズや温度ヒユー
ズの機能を有するヒユーズ回路であり、一端が銅
箔部７に接続されている。１４は、端子であり、
一端が絶縁基板３のヒユーズ回路７に半田付け１
５されている。１６はコンデンサ素子１を被覆し
ているエポキシやポリエチレン等の樹脂モールド
外装である。 In the figure, reference numeral 1 denotes a capacitor element made of a metallized plastic film or metallized paper wound thereon, and metallic contacts 2 made of metal such as zinc or lead are provided on both end faces. 3 is a rectangular insulating substrate made of glass-epoxy resin, glass-phenol resin, etc. and having a thickness of about 1 mm, and has an end portion 4 and both side end portions 5.
Copper foil parts 7, 8, and 9 are printed on and 6, and the copper foil parts 7, 8, and 9 are soldered 10, 11, and 12 to the metallcon 2. A fuse circuit 13 is printed on the insulating substrate 3 and has a function of a current fuse and a temperature fuse, and one end thereof is connected to the copper foil section 7. 14 is a terminal;
One end is soldered 1 to the fuse circuit 7 on the insulating board 3.
5 has been done. 16 is a resin molded exterior made of epoxy, polyethylene, etc. that covers the capacitor element 1.
すなわち、本考案は、上記の通り、絶縁基板３
の端部４並びに両側端部５及び６がメタリコン２
に接続される構成となつているので、絶縁基板３
とメタリコン２との接続が強固になり、樹脂モー
ルド外装１６の形成の際の樹脂の注入圧力によつ
ても絶縁基板３が外れることがない。 That is, in the present invention, as described above, the insulating substrate 3
The end portion 4 and both side end portions 5 and 6 are made of metallicon 2.
Since it is configured to be connected to the insulating substrate 3
The connection between the metallcon 2 and the resin mold 2 becomes strong, and the insulating substrate 3 will not come off even under the injection pressure of the resin when forming the resin mold exterior 16.
以上の通り、本考案によれば、保安機能を有す
る絶縁基板とメタリコンとの接続を強固にできる
ので、製造が容易で、しかも端子等を所定の位置
から引き出すことができ、劣化した場合の燃焼等
を防止できるモールドコンデンサが得られる。 As described above, according to the present invention, it is possible to strengthen the connection between the insulating substrate having a safety function and the metallicon, making it easy to manufacture, and making it possible to pull out terminals etc. from predetermined positions. A molded capacitor that can prevent such problems can be obtained.
図は本考案の実施例の側面断面図を示す。
１……コンデンサ素子、２……メタリコン、３
……絶縁基板、４……端部、５，６……側端部、
１４……端子、１６……樹脂モールド外装。
The figure shows a side sectional view of an embodiment of the invention. 1... Capacitor element, 2... Metallicon, 3
...Insulating substrate, 4... End part, 5, 6... Side end part,
14...terminal, 16...resin mold exterior.
Claims (1)
樹脂モールドの外装をしたモールドコンデンサに
おいて、ヒユーズ機構が設けられ、端子が接続さ
れるとともに、端部及び両側端部がメタリコンに
接続されている絶縁基板を有することを特徴とす
るモールドコンデンサ。 A molded capacitor in which a capacitor element with metallic contacts on both end faces is covered with a resin mold, is provided with a fuse mechanism, has terminals connected to it, and has an insulating substrate whose ends and both ends are connected to the metallic contacts. A molded capacitor characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404683U JPS59131137U (en) | 1983-02-21 | 1983-02-21 | molded capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404683U JPS59131137U (en) | 1983-02-21 | 1983-02-21 | molded capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59131137U JPS59131137U (en) | 1984-09-03 |
| JPS6314436Y2 true JPS6314436Y2 (en) | 1988-04-22 |
Family
ID=30155105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2404683U Granted JPS59131137U (en) | 1983-02-21 | 1983-02-21 | molded capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59131137U (en) |
-
1983
- 1983-02-21 JP JP2404683U patent/JPS59131137U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59131137U (en) | 1984-09-03 |
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