JPS63136365U - - Google Patents
Info
- Publication number
- JPS63136365U JPS63136365U JP2743987U JP2743987U JPS63136365U JP S63136365 U JPS63136365 U JP S63136365U JP 2743987 U JP2743987 U JP 2743987U JP 2743987 U JP2743987 U JP 2743987U JP S63136365 U JPS63136365 U JP S63136365U
- Authority
- JP
- Japan
- Prior art keywords
- hill
- concave
- solder
- display device
- led display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Description
第1図〜第6図は本考案の一実施例を説明する
ための図であつて、第1図はLED表示装置の構
造を説明する概略側面図、第2図はその平面図、
第3図〜第6図はLED表示装置の製造組立、構
成の工程を説明するための側面図並びに平面図で
ある。第7図、第8図は従来のLED表示装置の
側面図並びに平面図である。 1……LEDチツプ、2……接着剤、3……金
線、4……PC板、5,51……電極パターン、
6……レンズ、7……レジスト、8……凹型半田
丘、81……半田クリーム、82……半田丘、8
3……凹部、88……斜面。
ための図であつて、第1図はLED表示装置の構
造を説明する概略側面図、第2図はその平面図、
第3図〜第6図はLED表示装置の製造組立、構
成の工程を説明するための側面図並びに平面図で
ある。第7図、第8図は従来のLED表示装置の
側面図並びに平面図である。 1……LEDチツプ、2……接着剤、3……金
線、4……PC板、5,51……電極パターン、
6……レンズ、7……レジスト、8……凹型半田
丘、81……半田クリーム、82……半田丘、8
3……凹部、88……斜面。
Claims (1)
- プリント基板上に開口側を幅広とした凹型半田
丘を形成し、該凹型半田丘の凹型底部にLEDチ
ツプを固定したことを特徴とするLED表示装置
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2743987U JPS63136365U (ja) | 1987-02-27 | 1987-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2743987U JPS63136365U (ja) | 1987-02-27 | 1987-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63136365U true JPS63136365U (ja) | 1988-09-07 |
Family
ID=30829468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2743987U Pending JPS63136365U (ja) | 1987-02-27 | 1987-02-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63136365U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001291905A (ja) * | 2000-04-11 | 2001-10-19 | Nichia Chem Ind Ltd | 光半導体素子 |
JP2011044752A (ja) * | 2010-12-02 | 2011-03-03 | Nichia Corp | 光半導体素子の製造方法 |
-
1987
- 1987-02-27 JP JP2743987U patent/JPS63136365U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001291905A (ja) * | 2000-04-11 | 2001-10-19 | Nichia Chem Ind Ltd | 光半導体素子 |
JP4677653B2 (ja) * | 2000-04-11 | 2011-04-27 | 日亜化学工業株式会社 | 光半導体素子 |
JP2011044752A (ja) * | 2010-12-02 | 2011-03-03 | Nichia Corp | 光半導体素子の製造方法 |