JPS63133953U - - Google Patents
Info
- Publication number
- JPS63133953U JPS63133953U JP2505187U JP2505187U JPS63133953U JP S63133953 U JPS63133953 U JP S63133953U JP 2505187 U JP2505187 U JP 2505187U JP 2505187 U JP2505187 U JP 2505187U JP S63133953 U JPS63133953 U JP S63133953U
- Authority
- JP
- Japan
- Prior art keywords
- ball nut
- cooling device
- ball
- cooler
- nut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims 4
- 230000005679 Peltier effect Effects 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000002826 coolant Substances 0.000 description 2
Landscapes
- Transmission Devices (AREA)
Description
第1図は本考案の実施例を示す平面図、第2図
は第1図の断面図である。
11……ボールナツト、12……ボールナツト
平面加工部、13……サーモモジユール、14…
…冷却器、15……冷却液流入管、16……サー
モモジユール用配線、17……リターンチユーブ
、18……冷却液流出管、19……ボール。
FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view of FIG. 1. 11... Ball nut, 12... Ball nut flat processing section, 13... Thermo module, 14...
... Cooler, 15 ... Coolant inflow pipe, 16 ... Thermo module wiring, 17 ... Return tube, 18 ... Coolant outflow pipe, 19 ... Ball.
Claims (1)
囲に冷却液を通す冷却器を設け、ボールネジナツ
ト機構と前記冷却器の間にペルチエ効果により熱
移動を行なわせることができるサーモモジユール
を設置したことを特徴とするボールナツト冷却装
置。 (2) 冷却器が、フイン構造であることを特徴と
する実用新案登録請求の範囲第1項記載のボール
ナツト冷却装置。 (3) サーモモジユールに熱電半導体素子を使用
していることを特徴とする実用新案登録請求の範
囲第1項記載のボールナツト冷却装置。 (4) ボールナツトの周囲が、ボールナツトの平
面加工部であることを特徴とする実用新案登録請
求の範囲第1項記載のボールナツト冷却装置。[Claims for Utility Model Registration] (1) A cooler for passing a cooling liquid around a ball nut screwed onto a ball screw shaft is provided, and heat is transferred between the ball screw nut mechanism and the cooler by the Peltier effect. A ball nut cooling device characterized by being equipped with a thermo module that can (2) The ball nut cooling device according to claim 1, wherein the cooler has a fin structure. (3) The ball nut cooling device according to claim 1, which is characterized in that a thermoelectric semiconductor element is used in the thermo module. (4) The ball nut cooling device according to claim 1, wherein the periphery of the ball nut is a flat surface processed portion of the ball nut.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2505187U JPS63133953U (en) | 1987-02-23 | 1987-02-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2505187U JPS63133953U (en) | 1987-02-23 | 1987-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63133953U true JPS63133953U (en) | 1988-09-01 |
Family
ID=30824841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2505187U Pending JPS63133953U (en) | 1987-02-23 | 1987-02-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63133953U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999028220A1 (en) * | 1997-12-03 | 1999-06-10 | Nikon Corporation | Substrate transferring device and method |
JP2013072475A (en) * | 2011-09-27 | 2013-04-22 | Hiwin Technologies Corp | Transmission module provided with cooling device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5922735A (en) * | 1982-07-30 | 1984-02-06 | Hashimoto Forming Co Ltd | Molding of end cap of extruded synthetic resin braid |
-
1987
- 1987-02-23 JP JP2505187U patent/JPS63133953U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5922735A (en) * | 1982-07-30 | 1984-02-06 | Hashimoto Forming Co Ltd | Molding of end cap of extruded synthetic resin braid |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999028220A1 (en) * | 1997-12-03 | 1999-06-10 | Nikon Corporation | Substrate transferring device and method |
US6577382B2 (en) | 1997-12-03 | 2003-06-10 | Nikon Corporation | Substrate transport apparatus and method |
JP2013072475A (en) * | 2011-09-27 | 2013-04-22 | Hiwin Technologies Corp | Transmission module provided with cooling device |
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