JPS62201359U - - Google Patents
Info
- Publication number
- JPS62201359U JPS62201359U JP8975486U JP8975486U JPS62201359U JP S62201359 U JPS62201359 U JP S62201359U JP 8975486 U JP8975486 U JP 8975486U JP 8975486 U JP8975486 U JP 8975486U JP S62201359 U JPS62201359 U JP S62201359U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- thermo module
- module
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Description
第１図ａ，ｂ，ｃはいずれも本考案の実施例を
示すヒートパイプ式冷却装置を示す図であり、ａ
は正面図、ｂは側面図、ｃは平面図である。
１…ヒートパイプ、２…金属アダプター、３…
サーモ・モジユール、４…放熱フイン、５…ネジ
、６…リード線、７…フアン、８…作動液、９…
吸熱部。
Figures 1a, b, and c are all diagrams showing a heat pipe type cooling device showing an embodiment of the present invention, and a
is a front view, b is a side view, and c is a plan view. 1...Heat pipe, 2...Metal adapter, 3...
Thermo module, 4... Heat dissipation fin, 5... Screw, 6... Lead wire, 7... Fan, 8... Working fluid, 9...
Endothermic part.
Claims (1)
放熱フインを装着したサーモ・モジユールを金属
アダプターを介して取付け、該サーモ・モジユー
ルに通電することによつてモジユール面間にペル
チエ温度差を発生させ、低温側の冷熱をヒートパ
イプ全長に伝達させ該ヒートパイプの冷熱により
冷却することを特徴とするヒートパイプ式冷却装
置。 A thermo module equipped with a heat radiation fin is attached via a metal adapter to one end of a heat pipe in which the working fluid is sealed under reduced pressure, and a Peltier temperature difference is generated between the module surfaces by energizing the thermo module. A heat pipe type cooling device characterized in that cold heat on a low temperature side is transmitted to the entire length of a heat pipe and cooling is performed by the cold heat of the heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8975486U JPS62201359U (en) | 1986-06-12 | 1986-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8975486U JPS62201359U (en) | 1986-06-12 | 1986-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62201359U true JPS62201359U (en) | 1987-12-22 |
Family
ID=30949017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8975486U Pending JPS62201359U (en) | 1986-06-12 | 1986-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62201359U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5012646A (en) * | 1973-06-04 | 1975-02-08 |
-
1986
- 1986-06-12 JP JP8975486U patent/JPS62201359U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5012646A (en) * | 1973-06-04 | 1975-02-08 |