JPS63126296A - Manufacture of multilayer printed circuit board - Google Patents
Manufacture of multilayer printed circuit boardInfo
- Publication number
- JPS63126296A JPS63126296A JP27181686A JP27181686A JPS63126296A JP S63126296 A JPS63126296 A JP S63126296A JP 27181686 A JP27181686 A JP 27181686A JP 27181686 A JP27181686 A JP 27181686A JP S63126296 A JPS63126296 A JP S63126296A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- photosensitive resin
- multilayer printed
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 25
- 229920001971 elastomer Polymers 0.000 claims description 14
- 239000005060 rubber Substances 0.000 claims description 14
- 238000007772 electroless plating Methods 0.000 claims description 12
- -1 imidazole compound Chemical class 0.000 claims description 11
- 239000007800 oxidant agent Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 239000011810 insulating material Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 229920002601 oligoester Polymers 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- JWZZKOKVBUJMES-UHFFFAOYSA-N (+-)-Isoprenaline Chemical compound CC(C)NCC(O)C1=CC=C(O)C(O)=C1 JWZZKOKVBUJMES-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- NJMYQRVWBCSLEU-UHFFFAOYSA-N 4-hydroxy-2-methylidenebutanoic acid Chemical compound OCCC(=C)C(O)=O NJMYQRVWBCSLEU-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- 240000005979 Hordeum vulgare Species 0.000 description 1
- 235000007340 Hordeum vulgare Nutrition 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- BMFYCFSWWDXEPB-UHFFFAOYSA-N cyclohexyl(phenyl)methanone Chemical compound C=1C=CC=CC=1C(=O)C1CCCCC1 BMFYCFSWWDXEPB-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229960003750 ethyl chloride Drugs 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N perisophthalic acid Natural products OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 238000005502 peroxidation Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は多層プリント回路板の製造方法にかかわり、特
に、高精度な多層プリント回路板を安価に製造するのに
好適な製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a multilayer printed circuit board, and particularly to a method suitable for manufacturing a highly accurate multilayer printed circuit board at low cost.
従来、多層プリント回路板の製造方法としては、例えば
特開詔６１−８７３９８号公報に記載のように、プリン
ト板の回路上に絶縁層を介して、無電解めっきを用いて
回路を形成する方式が知られている。ところが、この方
式では、熱硬化性の絶縁樹脂上に回路を形成するので、
層間材料として用いる絶縁樹脂層のパターン形成にスク
リーン印刷法を用いる必要があり、高精度の多層プリン
ト回路板の製造には、必ずしも適した方法ではなかった
。さらに、絶縁樹脂と銅めっき回路との密着力を十分確
保するための配慮がなされているとはいえなかった。Conventionally, as a method for manufacturing a multilayer printed circuit board, there has been a method of forming a circuit on a circuit of a printed board using electroless plating via an insulating layer, as described in Japanese Patent Application Laid-open No. 61-87398, for example. It has been known. However, with this method, the circuit is formed on thermosetting insulating resin, so
It is necessary to use a screen printing method to pattern the insulating resin layer used as the interlayer material, and this method is not necessarily suitable for manufacturing high-precision multilayer printed circuit boards. Furthermore, it could not be said that consideration was given to ensuring sufficient adhesion between the insulating resin and the copper-plated circuit.
密着力を確保する方法としては、既に特公昭５２−５７
０４号公報に開示された、ゴム成分を含有する絶縁材料
を酸化剤で処理し、粗面化した材料面こ銅めっき回路を
形成する方法がある。この方法は、密着力の確保には十
分であるが、絶縁材料が熱硬化性樹脂とゴム成分を主体
としてなるものであるため、前記の方法と同様、精度の
良い多層プリント回路板の製造Ｃ二は適さなかった。さ
ら（：、この方法は、熱硬化性樹脂の硬化条件の変動に
よって酸化剤による粗面化が一定になりにくく、安定し
た製造方法として、好ましいものではなかった。As a method to ensure adhesion, the method of
There is a method disclosed in Japanese Patent No. 04 in which an insulating material containing a rubber component is treated with an oxidizing agent to form a copper-plated circuit on the roughened surface of the material. Although this method is sufficient to ensure adhesion, since the insulating material is mainly composed of thermosetting resin and rubber components, it is difficult to manufacture multilayer printed circuit boards with high precision as with the above method. The second one was not suitable. Furthermore, this method was not preferred as a stable manufacturing method because the roughening caused by the oxidizing agent was difficult to become constant due to fluctuations in the curing conditions of the thermosetting resin.
〔発明が解決しようとする問題点〕
上記従来技術は、絶縁材料層を高精度に形成する点と、
該材料上に形成する銅めっき回路と材料との密着力を安
定に確保する点とが同時に満足できず、そのため高精度
の多層プリント回路板が実現できないという問題があっ
た。[Problems to be solved by the invention] The above-mentioned conventional technology has the following points: Forming an insulating material layer with high precision;
There was a problem in that it was not possible to simultaneously ensure stable adhesion between the copper-plated circuit formed on the material and the material, and as a result, a highly accurate multilayer printed circuit board could not be realized.
本発明の目的は、上記した２つの点を同時に満足し、高
＃１４度な多層プリント回路板を実現できる製造方法を
提供することにある。An object of the present invention is to provide a manufacturing method that simultaneously satisfies the above two points and can realize a multilayer printed circuit board with a high #14 degree.
上記目的は、絶縁材料の主成分として、光エネルギーで
硬化する感光性を有しかつ未露光部が溶媒により現像除
去できる樹脂を用いることにより、高精度な絶縁材料層
を形成し、これに加えて、該感光性材料にゴム成分を含
有せしめ、高精度に形成した絶縁材料層の表面を酸化剤
により粗面化して、めっき回路との密着力を確保するこ
とによって、達成される。The above purpose is to form a high-precision insulating material layer by using a photosensitive resin that hardens with light energy and whose unexposed areas can be removed by development with a solvent as the main component of the insulating material. This is achieved by incorporating a rubber component into the photosensitive material and roughening the surface of the insulating material layer formed with high precision using an oxidizing agent to ensure adhesion to the plating circuit.
上記のように、本発明の製造方法は、ゴム成分を含んで
なる露光現像型の感光性樹脂を絶縁材料として用い、こ
の樹脂を、あらかじめ回路を形成したプリント回路板上
に全面に塗布する工程、ネガマスクを用いて、元エネル
ギーで所望部を硬化する工程、不要部を現象除去する工
程、該絶縁樹脂表面を酸化剤処理で粗面化する工程、該
粗面化した材料上に無電解めっきで回路を形成する工程
を、少なくとも含んでなるものである。As described above, the manufacturing method of the present invention uses an exposure-developable photosensitive resin containing a rubber component as an insulating material, and the process involves coating the entire surface of a printed circuit board on which a circuit has been formed in advance. , a step of curing desired parts with original energy using a negative mask, a step of removing unnecessary parts, a step of roughening the surface of the insulating resin with an oxidizing agent treatment, and an electroless plating on the roughened material. The method includes at least a step of forming a circuit using the method.
本発明で用いる感光性樹脂は、光重合性の七ツマ−およ
び／もしくはプレポリマーと、光重合開始剤と、ゴム成
分とを少なくとも含んでなるものとして特徴づけられる
ものである。The photosensitive resin used in the present invention is characterized as containing at least a photopolymerizable hexamer and/or prepolymer, a photopolymerization initiator, and a rubber component.
光重合性のモノマーは、例えば不飽和カルボン酸と２価
以上のポリヒドロキシ化合物とのエステル化反応によっ
て得られる。不飽和カルボン酸としては、アクリル酸、
メタクリル酸、イタコン酸、クロトン酸、マレイン酸等
が挙げられ、２価以上のポリヒドロキシ化合物としては
、エチレングリコール、フロピレンゲリコール、トリエ
チレングリコール、ヒドロキノン、ビロカロール等が挙
げられる。このような不飽和カルボン酸とポリヒドロキ
シ化合物とのエステル化反応によって得られた化合物と
しては、ジエチレングリコールジアクリレート、ポリエ
チレングリコールジアクリレート、ネオペンチルグリコ
ールジアクリレート、１゜５ベンタンジオールジアクリ
レー）、ｔ、６ヘキサンジオールジアクリレート、トリ
メチロールプロパントリアクリレート、ペンタエリスリ
トールトリアクリレート、ジエチレングリコールジメタ
クリレート、トリメチロールプロパントリメタクリレー
ト、１，５ブタンジオールジメタクリレート等に代表さ
れるジアクリレート、ジメタクリレート化合物や、ジペ
ンタエリトリトールのトリ、テトラ、ペンタアクリレー
トもしくはメタクリレート、ソルビトールのトリ、テト
ラ、ペンタ、ヘキサアクリレートもしくはメタクリレー
トなどに代表される多価アクリレート、メタクリレート
化合物や、オリゴエステルアクリレート、オリゴエステ
ルメタクリレート等、またエポキシ樹脂とアクリル酸お
よびメタアクリル酸の反応によりできるエポキシ（メタ
）アクリレート等を挙げることができる。The photopolymerizable monomer is obtained, for example, by an esterification reaction between an unsaturated carboxylic acid and a divalent or higher polyhydroxy compound. Examples of unsaturated carboxylic acids include acrylic acid,
Examples include methacrylic acid, itaconic acid, crotonic acid, maleic acid, etc., and examples of polyhydroxy compounds having a valence of 2 or more include ethylene glycol, propylene gellicol, triethylene glycol, hydroquinone, virocalol, etc. Examples of compounds obtained by the esterification reaction between an unsaturated carboxylic acid and a polyhydroxy compound include diethylene glycol diacrylate, polyethylene glycol diacrylate, neopentyl glycol diacrylate, t , 6-hexanediol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, diethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, 1,5-butanediol dimethacrylate, etc.; Polyvalent acrylates and methacrylate compounds such as erythritol tri, tetra, pentaacrylate or methacrylate, sorbitol tri, tetra, penta, hexaacrylate or methacrylate, oligoester acrylates, oligoester methacrylates, etc., as well as epoxy resins and acrylics. Examples include epoxy (meth)acrylate produced by the reaction of acid and methacrylic acid.
また、光重合性のプレポリマーは、オルト、イソまたは
テレフタル酸のジアリルエステルのプレポリマーや、メ
タフリル酸メチル、アクリロニトリル、アクリル酸、メ
ダクリル酸、βヒドロキシエチルアクリル酸等の単官能
感光要素の鎖状重合体からなるプレポリマー、これらの
混合物のプレポリマーであり、分子量として約６０００
〜５０口００が好ましい。In addition, photopolymerizable prepolymers include prepolymers of diallyl esters of ortho, iso, or terephthalic acid, and chains of monofunctional photosensitive elements such as methyl methacrylate, acrylonitrile, acrylic acid, medacrylic acid, and β-hydroxyethyl acrylic acid. It is a prepolymer consisting of a polymer, a prepolymer of a mixture of these, and has a molecular weight of about 6000.
-50 mouths 00 is preferable.
また、光重合開始剤は、例えばアセトフェノン、アセト
フェノンの誘導体、ベンゾフェノン、ベンゾフェノンの
誘導体、ミヒラーグトン、ベンジル、ベンゾイン、ベン
ゾインアルキルエーテル、ペンジルアルキルグタール、
チオキサントン、チオキサントンの誘導体、アントラキ
ノン、アントラキノンの誘導体、テトラメチルチクラム
モノサルファイド、１−ヒドロキンシクロへキンルフェ
ニルケトン、２−メチル−１−（ａ−（メチルチオ）フ
ェニルツー２−モルフォリノ−プロペン−１に代表され
るα−アミノケトン化合物等が挙げられる。必要により
、光重合開始剤の混合物を使用できる。また必要により
、光重合開始剤の作用を増感するアミン化合物等を使用
することも可能である。In addition, photopolymerization initiators include, for example, acetophenone, acetophenone derivatives, benzophenone, benzophenone derivatives, Michlargton, benzyl, benzoin, benzoin alkyl ether, penzyl alkyl gutal,
Thioxanthone, derivatives of thioxanthone, anthraquinone, derivatives of anthraquinone, tetramethylthiclam monosulfide, 1-hydroquine cyclohexyl phenyl ketone, 2-methyl-1-(a-(methylthio)phenyl-2-morpholino-propene-) Examples include α-aminoketone compounds represented by 1.If necessary, a mixture of photopolymerization initiators can be used.Also, if necessary, it is also possible to use an amine compound etc. that sensitizes the action of the photopolymerization initiator. It is.
また、ゴム成分としては、イソプレンゴム、スチレンブ
タジェンゴム、ポリブタジェンゴム、ブチルゴム、ニト
リルゴム、クロロブレンゴムなどのゴムや、これらのブ
ロック重合体や、これらのエポキシ、アクリル変成物な
どが挙げられる。Examples of rubber components include rubbers such as isoprene rubber, styrene-butadiene rubber, polybutadiene rubber, butyl rubber, nitrile rubber, and chloroprene rubber, block polymers of these rubbers, and epoxy and acrylic modified products of these rubbers. It will be done.
さらに、本発明で用いる感光性樹脂においては、露光、
現像性に悪影響を与えない範囲で、無電解めっき中に、
層間樹脂と下部の銅箔回路との剥離を防止することを目
的として、適量のエポキシ樹脂と硬化剤を含むことが好
ましい。Furthermore, in the photosensitive resin used in the present invention, exposure,
During electroless plating, as long as it does not adversely affect developability,
For the purpose of preventing peeling between the interlayer resin and the lower copper foil circuit, it is preferable to include an appropriate amount of epoxy resin and curing agent.
上記のエポキシ樹脂としては、平均して１分子量り２個
以上のエポキン基を有するもので、例えばビスフェノー
ルＡ、ハロゲン化ビスフェノールＡ１カテコール、レゾ
ルシノール等のような多価フェノールまたはグリセリン
のような多価アルコールとエピクロルヒドリンとを塩基
性触媒の存在下で反応させて得られるポリグリシジルエ
ーテルあるいはポリグリシジルエステル、ノボラック型
フェノール樹脂とエピクロルヒドリンとを縮合せしめて
得られるエポキシノボラック、過酸化法でエポキシ化し
たエポキシ化ポリオレフィン、エポキシ化ポリブタジェ
ン、ジシクロペンタジェン化オキサイド、あるいはエポ
キシ化植物油等が挙げられる。The above-mentioned epoxy resins have on average two or more epoxy groups per molecular weight, such as polyhydric phenols such as bisphenol A, halogenated bisphenol A1 catechol, resorcinol, or polyhydric alcohols such as glycerin. Polyglycidyl ether or polyglycidyl ester obtained by reacting and epichlorohydrin in the presence of a basic catalyst, epoxy novolak obtained by condensing a novolak type phenol resin and epichlorohydrin, and epoxidized polyolefin epoxidized by a peroxidation method. , epoxidized polybutadiene, dicyclopentagenated oxide, or epoxidized vegetable oil.
また、硬化剤としては、ジアミノトリアジン変性イミダ
ゾール化合物とジシアンジアミドとの混合物が、感光性
樹脂の剥離防止１；対して好適である。As the curing agent, a mixture of a diaminotriazine-modified imidazole compound and dicyandiamide is suitable for preventing peeling of photosensitive resins.
本発明で用いる上記のジアミノトリアジン変性イミダゾ
ール化合物としては、下記の一般式で示される、エポキ
サイド化合物に対して潜在硬化性を有する化合物を用い
ることができる。As the diaminotriazine-modified imidazole compound used in the present invention, a compound represented by the following general formula and having latent curability with respect to an epoxide compound can be used.
（Ｒはイミダゾール化合物）
例えば、２，４−ジアミノ−６（２′−メチルイミダゾ
ール−（１’））エチル−８−）リアジン、２゜４−ジ
アミノ−６（２′−エチル−４′−メチルイミダゾール
−（１’ ） ）エチル−５−）リアジン、２゜４−ジ
アミノ−６（２′−ウソデシルイミダゾール−（１’）
）エチル−８−）リアジンもしくは２゜４−ジアミノ−
６（２’−メチルイミダゾール（１’））エチル−８−
）リアジン・インシアヌール酸付加物等が挙げられる。(R is an imidazole compound) For example, 2,4-diamino-6(2'-methylimidazole-(1'))ethyl-8-)riazine, 2°4-diamino-6(2'-ethyl-4'- Methylimidazole-(1'))ethyl-5-)riazine, 2゜4-diamino-6(2'-usodecylimidazole-(1')
)ethyl-8-)riazine or 2゜4-diamino-
6(2'-methylimidazole(1'))ethyl-8-
) riazine incyanuric acid adduct, etc.
さらに、本発明で用いる感光性樹脂は、必要であれば、
希釈剤としての有機溶剤、消泡剤、充てん剤、揺変剤を
含むこともできる。Furthermore, the photosensitive resin used in the present invention, if necessary,
An organic solvent as a diluent, an antifoaming agent, a filler, and a thixotropic agent can also be included.
上記の有機溶剤の適当な例としては、セロソルブ、セロ
ソルブアセテート、メチルセルソルブ、ブチルセルソル
ブ、ブチルセルソルブアセテート、カルピトール、メチ
ルカルピトール、ブチルカルピトール、テルピネオール
等高沸点溶剤が好ましいが、アセトン、メチルエチルケ
トン、メチルイソブチルケトン、エタノール等が使用で
きないわけではない。Suitable examples of the above organic solvents include high boiling point solvents such as cellosolve, cellosolve acetate, methyl cellosolve, butyl cellosolve, butyl cellosolve acetate, carpitol, methyl carpitol, butyl carpitol, and terpineol, but acetone, This does not mean that methyl ethyl ketone, methyl isobutyl ketone, ethanol, etc. cannot be used.
消泡剤は、シリコーンオイルに代表されるシロキチン結
合を含む有機ケイ素化合物が好んで用いられる。As the antifoaming agent, an organosilicon compound containing a silochitin bond, typified by silicone oil, is preferably used.
充てん剤は、無機フィラーとして感光性樹脂に添加する
ものであり、炭酸カルシウム、シリカ、アルミナ、タル
ク等の微粉末が好んで用いられる。The filler is added to the photosensitive resin as an inorganic filler, and fine powders of calcium carbonate, silica, alumina, talc, etc. are preferably used.
揺変剤は、感光性樹脂の粘度、特にチキソトロピー性の
改善に寄与するものとして超微粉末シリカが好んで用い
られる。As the thixotropic agent, ultrafine powdered silica is preferably used as it contributes to improving the viscosity, particularly the thixotropy, of the photosensitive resin.
本発明で用いる感光性樹脂を構成するのに好ましい組成
比は、光重合性七ツマ−および／もしくはプレポリマー
１００重量部に対し、光重合開始剤０．５〜２ＯＮ童部
、ゴム成分１０〜２００重量部である。さらに、エポキ
シ樹脂を用いる場合には、エポキシ樹脂５〜３０重量部
であり、ジアミノトリアジン変性イミダゾール化合物の
配合は、エポキシ樹脂１００重量部に対して１〜２０重
量部、ジシアンジアミドの配合は１５〜１５重量部であ
る。上記のような配合組成の下限は、感光性樹脂の露光
感度が不足しないことから、また上限は、露光時の密着
露光性、耐めっき性、耐熱性が確保できることから決め
たものである。The preferred composition ratio for constituting the photosensitive resin used in the present invention is 100 parts by weight of the photopolymerizable hexamer and/or prepolymer, 0.5 to 2 parts of the photopolymerization initiator, and 10 to 2 parts of the rubber component. It is 200 parts by weight. Furthermore, when using an epoxy resin, the epoxy resin is 5 to 30 parts by weight, the diaminotriazine-modified imidazole compound is 1 to 20 parts by weight, and the dicyandiamide is 15 to 15 parts by weight. Parts by weight. The lower limit of the above-mentioned composition was determined so that the exposure sensitivity of the photosensitive resin would not be insufficient, and the upper limit was determined so that contact exposure, plating resistance, and heat resistance during exposure could be ensured.
その他、添加剤は、塗布時の粘度にかかわるもので、適
量加えて調整する。Other additives are related to the viscosity during coating, and are adjusted by adding appropriate amounts.
上記構成において、層間絶縁材料として感光性を有する
樹脂を用いるため、露光・現像により任意の形状に絶縁
層を設けることが可能となる。従って、あらかじめ回路
を形成したプリント回路板の任意の位置に、無電解めっ
き回路との接続孔を設けることができる。これは、いわ
ゆる表層ピアホールと称するもので、スクリーン印刷法
を用いた場合に比べ、比較にならないほど精度良く接続
ができるので、多層プリント回路板の精度と配線密度が
著しく向上する。さらＣ；、層間材料中にはゴム成分を
含むため、容易に酸化剤処理で表面を粗面化することが
できる。従って、材料上にめっきで形成した回路の密着
性に優れ、伯′頼性の高い多層プリント回路板を供する
ことが可能となる。In the above structure, since a photosensitive resin is used as the interlayer insulating material, the insulating layer can be provided in any shape by exposure and development. Therefore, a connection hole with an electroless plating circuit can be provided at any position on a printed circuit board on which a circuit is previously formed. This is what is called a surface layer pier hole, and since connections can be made with incomparably more precision than when using the screen printing method, the precision and wiring density of multilayer printed circuit boards are significantly improved. Furthermore, since the interlayer material contains a rubber component, the surface can be easily roughened by treatment with an oxidizing agent. Therefore, it is possible to provide a highly reliable multilayer printed circuit board in which the circuit formed by plating on the material has excellent adhesion.
さらに、樹脂中には熱硬化樹脂成分を少量しか含まない
か、あるいは全く含まないため、硬化条件の変動に起因
する酸化剤処理の不安定性をも回避できるという特長が
ある。Furthermore, since the resin contains only a small amount or no thermosetting resin component, it has the advantage that instability in oxidizing agent treatment due to fluctuations in curing conditions can be avoided.
以下、本発明の一実施例を％１図により説明する。 Hereinafter, one embodiment of the present invention will be explained using a %1 diagram.
第１図は該実施例の多層プリント回路板の製造工程を基
板の断面によって示したもので、プリント回路板１には
あらかじめ、回路２、スルーホール孔３、ランド部４を
形成しておく（第１図（Ａ））。FIG. 1 shows the manufacturing process of the multilayer printed circuit board according to this embodiment by means of a cross section of the board. A circuit 2, a through-hole hole 3, and a land portion 4 are formed in advance on the printed circuit board 1. Figure 1 (A)).
このプリント回路板１１二、本発明にかかわる感光性樹
脂５を塗布する。塗布１：は、全面スクリーン印刷やロ
ールコータ等の当該業者に周知の方法を用いることがで
きる。あらかじめスルーホール孔３を設けたプリント回
路板１に塗布するとき、樹脂が孔内にたれ込な場合もあ
るが、これは後述の現像工程で除去できるので問題とな
らないことも不法の利点の一つである（同図（Ｂ））。This printed circuit board 112 is coated with a photosensitive resin 5 according to the present invention. For coating 1:, a method well known to those skilled in the art, such as full screen printing or a roll coater, can be used. When coating on a printed circuit board 1 that has through-hole holes 3 in advance, resin may drip into the holes, but this can be removed in the development process described later, so this is not a problem. ((B) in the same figure).
次Ｃ二、ネガマスク（図示せず）を用いて感光性樹脂５
を露光し、溶媒現像により未硬化部を除去する。このよ
うにして、ランド部４とピアホール部６を除いた部分：
：絶縁材料パタンを正確に形成する（同図（Ｃ））。Next C2, photosensitive resin 5 using a negative mask (not shown)
is exposed to light, and the uncured portion is removed by solvent development. In this way, the part excluding the land part 4 and the pier hole part 6:
: Accurately form an insulating material pattern ((C) in the same figure).
次に、当該業者ζ；周知のクロム酸、過マンガン酸等の
酸化剤で処理して、感光性樹脂５の表面な粗面化する。Next, the surface of the photosensitive resin 5 is roughened by treatment with a well-known oxidizing agent such as chromic acid or permanganic acid.
その麦、当該業者に周知の触媒処理を施して、スルホー
ル孔内、感光性樹脂上に触媒７を付着させ、無電解めっ
きに対する活性を付与する（同図（Ｄ））。The barley is subjected to a catalyst treatment well known to those skilled in the art to deposit a catalyst 7 on the photosensitive resin inside the through holes to impart activity for electroless plating ((D) in the same figure).
次に、無電解めっきが不要な部分にめっき用マスクパタ
ン８を形成する。このマスクパタン８には、本発明の感
光性樹脂５と同じものを用いてもよいし、他の適当なレ
ジスト材料を用いることも可能である（同図（Ｅ））。Next, a plating mask pattern 8 is formed in areas where electroless plating is not required. For this mask pattern 8, the same material as the photosensitive resin 5 of the present invention may be used, or it is also possible to use another suitable resist material (FIG. 3(E)).
最後に、無電解めっき９でスルーホール孔５、ピアホー
ル部６の接続と回路９′をｊＦ３成し、多層プリント回
路板が出来あがる（同図（Ｆ））。Finally, electroless plating 9 is used to connect the through-hole holes 5 and the peer-hole portions 6 and form a circuit 9', thereby completing a multilayer printed circuit board (FIG. 3(F)).
なお、本発明は、第１図に示した工程の製造法に限定さ
れるものではなく、例えばスルーホール孔あけは感光性
樹脂パタンを形成した麦に行ってもよい。また、樹脂上
の回路形成には、めっき用マスクを用いることが必ずし
も必要ではなく、全面に無電解めっきを施した後、不要
部をエツチング除去することも可能である。このような
製造法の変形は、当該業者の周知の範囲である。さらに
、無電解めっきとしては、主として経済的な理由から一
般に銅めっきが用いられるが、ニッケル、金等が使えな
いことを意味するものではないことは自明である。また
、本発明を実施するための、あらかじめ回路を形成した
プリント回路板としては、両面板、片面板、多層板や、
片面、両面のフレキシブルプリント板、金属芯を有する
プリント板、セラミック配線板等、当該業者に周知のす
べてのプリント回路板が含まれることは言うまでもない
。Note that the present invention is not limited to the manufacturing method of the steps shown in FIG. 1; for example, through-hole drilling may be performed on wheat on which a photosensitive resin pattern has been formed. Further, it is not always necessary to use a plating mask to form a circuit on a resin, and it is also possible to perform electroless plating on the entire surface and then remove unnecessary portions by etching. Variations in such manufacturing methods are within the knowledge of those skilled in the art. Further, as electroless plating, copper plating is generally used mainly for economic reasons, but it is obvious that this does not mean that nickel, gold, etc. cannot be used. In addition, the printed circuit board on which a circuit is formed in advance for carrying out the present invention includes a double-sided board, a single-sided board, a multilayer board,
It goes without saying that all printed circuit boards known to those skilled in the art are included, such as single-sided or double-sided flexible printed boards, printed boards with metal cores, ceramic wiring boards, etc.
さらに実施例を詳細に説明するために、以下に具体例を
示す。In order to further explain the embodiments in detail, specific examples will be shown below.
１．６瓢厚のガラスエポキシ両面銅張積層板にスルーホ
ールをあけた後、３５μｍの銅箔をエツチングして回路
を形成した。このプリント板に、後記する組成の感光性
樹脂を三本ロールで混練してインク化したものを、スク
リーン印刷で全面に塗布した後、１００℃で１時間乾燥
し、表面を固化した。次いで、ネガマスクを密着して４
００Ｗ高圧水銀灯で露光し、１，１．１−ｔｌクロロエ
タンで現像し、感光性樹脂のパタンを形成した。After making through holes in a glass epoxy double-sided copper-clad laminate having a thickness of 1.6 mm, a circuit was formed by etching a 35 μm copper foil. An ink obtained by kneading a photosensitive resin having the composition described below with a three-roll roller was applied to the entire surface of this printed board by screen printing, and then dried at 100° C. for 1 hour to solidify the surface. Next, put a negative mask on 4
It was exposed to light using a 00W high-pressure mercury lamp and developed with 1,1.1-tl chloroethane to form a photosensitive resin pattern.
この基板を硫酸／クロム酸液に５分間浸漬して、樹脂光
面を粗面化し、十分な水洗後、市販のスズ／パラジウム
コロイド触媒に浸漬して活性化した。This substrate was immersed in a sulfuric acid/chromic acid solution for 5 minutes to roughen the resin optical surface, and after thorough washing with water, it was immersed in a commercially available tin/palladium colloid catalyst for activation.
水洗、加熱乾燥後、この基板Ｉ；再度、前記感光性樹脂
を全面に塗布し、露光、現像、加熱乾燥を行い、無電解
銅めっきのマスクを形成した。After washing with water and heating and drying, this substrate I was again coated with the photosensitive resin on the entire surface, exposed to light, developed, and heated and dried to form a mask for electroless copper plating.
最後に、後記する組成の無電解鋼めっき液に１５時間浸
漬して、約６５μｍの銅めっきを施し、多層プリント回
路板を製造した。Finally, it was immersed in an electroless steel plating solution having the composition described below for 15 hours, and was plated with copper to a thickness of about 65 μm to produce a multilayer printed circuit board.
感光性樹脂の組成
トリメチロールプロパントリアクリレート・・・ ２０
部
ジアリルイソフタレートプレポリマー
・・・ ８０部
ベンゾフェノン ・・・ ３部ミヒラ
ーケトン ・・・ １１５部アクリル変
成ブタジェンニトリルゴム
・・・ ２０部
エポキシノボラック樹脂 ・・・ ２０部トリア
ジン変性イミダゾール ・・・ １部ジシアンジア
ミド ・・・ １部メチルセロソルブ
・・・ ７０部シリコーンオイル
・・・ ２部炭酸カルシウム
・・・ ５０部アエロジル ・・
・ ５部無電解鋼めっき液の組成
硫酸銅 ・・・ １２１ＥＤＴ
Ａ２Ｎａ ・−４２ｆＮａＯＨＰＨ
１２，３とする量
５７Ｘホルマリン ・・・ ５ｍｔαα′
ジピリジル ・・・ ６０ｍ？ポリエチ
レングリコールステアリルアミン・・・１００ｍｆ
水 １ｔとするｔめっき温
度 ・・・ ７０℃以上述べた方法
により、従来の方法では困難であった、２．５４瓢格子
に３本の配線を、絶縁層を介してピアホールで接続する
多層プリント回路板が、極めて容易に製造できることが
わかった。Composition of photosensitive resin Trimethylolpropane triacrylate... 20
Diarylisophthalate prepolymer... 80 parts Benzophenone... 3 parts Michler's ketone... 115 parts Acrylic modified butadiene nitrile rubber... 20 parts Epoxy novolac resin... 20 parts Triazine modified imidazole... 1 part Dicyandiamide... 1 part methyl cellosolve
... 70 parts silicone oil
... 2 parts calcium carbonate
... 50 parts Aerosil...
・Composition of 5-part electroless steel plating solution Copper sulfate... 121EDT
A2Na ・-42fNaOHPH
12.3 amount 57X formalin...5mtαα'
Dipyridyl... 60m? Polyethylene glycol stearylamine...100mf water 1t plating temperature...70°C or more By the method described above, three wires were formed on a 2.54mm grid and an insulating layer was formed, which was difficult with the conventional method. It has been found that multilayer printed circuit boards with via-pier-hole connections can be manufactured very easily.
本発明によれば、高精度かつ高密度の多層プリント回路
板を極めて容易に製造でき、安価に提供できるので、そ
の経済的効果は顕著である。According to the present invention, a high-precision, high-density multilayer printed circuit board can be manufactured extremely easily and provided at low cost, so that the economical effects thereof are significant.
第１図は本発明の一実施例の多層プリント回路板の製造
工程を基板の断面によって示した図である。
１・・・プリント回路板、２・・・回路、３・・・スル
ーホール孔、４・・・ランド部、５・・・感光性樹脂、
６・・・ピアホール部、７・・・触媒、８・・・めりき
用マスクバタン、？・・・無電解めっき。FIG. 1 is a diagram showing the manufacturing process of a multilayer printed circuit board according to an embodiment of the present invention using a cross section of the board. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Circuit, 3... Through-hole hole, 4... Land portion, 5... Photosensitive resin,
6...Pier hole part, 7...Catalyst, 8...Mask button for marking,? ...Electroless plating.
Claims (1)
め回路を形成したプリント回路板上に、ゴム成分を含有
する感光性樹脂を塗布する工程と、該感光性樹脂の所望
部をネガマスクを用いて露光し、硬化する工程と、該感
光性樹脂の未硬化部を現像により除去する工程と、該感
光性樹脂表面を酸化剤処理により粗面化する工程と、該
感光性樹脂の粗面化した表面を無電解めっきに対し活性
化する工程と、無電解めっきにより該感光性樹脂上に回
路を形成する工程とを含んでなることを特徴とする多層
プリント回路板の製造方法。 ２、特許請求の範囲第１項に記載の多層プリント回路板
の製造方法において、感光性樹脂が、光重合性モノマー
および／もしくはプレポリマー１００重量部に対し、光
重合開始剤０．５〜２０重量部、ゴム成分１０〜２００
重量部を含んでなることを特徴とする多層プリント回路
板の製造方法。 ３、特許請求の範囲第１項に記載の多層プリント回路板
の製造方法において、感光性樹脂が、光重合性モノマー
および／もしくはプレポリマー、光重合開始剤、ゴム成
分、エポキシ樹脂、ジアミノトリアジン変性イミダゾー
ル化合物、ジシアンジアミドを含んでなることを特徴と
する多層プリント回路板の製造方法。[Claims] 1. A method for manufacturing a multilayer printed circuit board, which includes the steps of: coating a photosensitive resin containing a rubber component on a printed circuit board on which a circuit has been formed in advance; and coating a desired portion of the photosensitive resin. A step of exposing to light using a negative mask and curing, a step of removing the uncured portion of the photosensitive resin by development, a step of roughening the surface of the photosensitive resin by treatment with an oxidizing agent, and a step of curing the photosensitive resin. A method for manufacturing a multilayer printed circuit board, comprising the steps of activating a roughened surface for electroless plating, and forming a circuit on the photosensitive resin by electroless plating. 2. In the method for manufacturing a multilayer printed circuit board according to claim 1, the photosensitive resin contains 0.5 to 20 parts by weight of a photopolymerization initiator per 100 parts by weight of the photopolymerizable monomer and/or prepolymer. Part by weight, rubber component 10-200
A method for producing a multilayer printed circuit board, comprising: a weight part. 3. In the method for manufacturing a multilayer printed circuit board according to claim 1, the photosensitive resin includes a photopolymerizable monomer and/or prepolymer, a photoinitiator, a rubber component, an epoxy resin, a diaminotriazine-modified A method for producing a multilayer printed circuit board, comprising an imidazole compound and dicyandiamide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27181686A JPS63126296A (en) | 1986-11-17 | 1986-11-17 | Manufacture of multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27181686A JPS63126296A (en) | 1986-11-17 | 1986-11-17 | Manufacture of multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63126296A true JPS63126296A (en) | 1988-05-30 |
Family
ID=17505245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27181686A Pending JPS63126296A (en) | 1986-11-17 | 1986-11-17 | Manufacture of multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63126296A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232554A (en) * | 1993-01-29 | 1994-08-19 | Victor Co Of Japan Ltd | Manufacture of multilayer printed wiring board |
| JPH07170070A (en) * | 1993-12-15 | 1995-07-04 | Sony Corp | Manufacture of multilayer printed wiring board |
| JP2003064269A (en) * | 2001-08-23 | 2003-03-05 | Hitachi Chem Co Ltd | Insulating resin composition and method for producing multilayer wiring board using the same |
-
1986
- 1986-11-17 JP JP27181686A patent/JPS63126296A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232554A (en) * | 1993-01-29 | 1994-08-19 | Victor Co Of Japan Ltd | Manufacture of multilayer printed wiring board |
| JPH07170070A (en) * | 1993-12-15 | 1995-07-04 | Sony Corp | Manufacture of multilayer printed wiring board |
| JP2003064269A (en) * | 2001-08-23 | 2003-03-05 | Hitachi Chem Co Ltd | Insulating resin composition and method for producing multilayer wiring board using the same |
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