JPS63119239U - - Google Patents

Info

Publication number
JPS63119239U
JPS63119239U JP1987011304U JP1130487U JPS63119239U JP S63119239 U JPS63119239 U JP S63119239U JP 1987011304 U JP1987011304 U JP 1987011304U JP 1130487 U JP1130487 U JP 1130487U JP S63119239 U JPS63119239 U JP S63119239U
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
identification display
utility
rear end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987011304U
Other languages
Japanese (ja)
Other versions
JPH0510363Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987011304U priority Critical patent/JPH0510363Y2/ja
Publication of JPS63119239U publication Critical patent/JPS63119239U/ja
Application granted granted Critical
Publication of JPH0510363Y2 publication Critical patent/JPH0510363Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは本考案の実施例に係るワイヤボ
ンデイング用キヤピラリーを示す斜視図、第２図
、第３図ａ，ｂはそれぞれ本考案の他の実施例を
示す斜視図である。第４図は従来のワイヤボンデ
イング用キヤピラリーを示す斜視図である。第５
図は本考案実施例に係るワイヤボンデイング用キ
ヤピラリーをホルダーに取付けた状態を示す側面
図である。 １０，２０，３０，４０，５０：キヤピラリー
、１１，２１，３１，４１，５１：識別表示部。 1A and 1B are perspective views showing a capillary for wire bonding according to an embodiment of the present invention, and FIGS. 2A and 3B are perspective views showing other embodiments of the present invention, respectively. FIG. 4 is a perspective view showing a conventional capillary for wire bonding. Fifth
The figure is a side view showing a state in which the wire bonding capillary according to the embodiment of the present invention is attached to a holder. 10, 20, 30, 40, 50: Capillary, 11, 21, 31, 41, 51: Identification display section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 後端面に識別表示部を形成したことを特徴とす
るワイヤボンデイング用キヤピラリー。 A capillary for wire bonding, characterized in that an identification display portion is formed on the rear end surface.
JP1987011304U 1987-01-28 1987-01-28 Expired - Lifetime JPH0510363Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987011304U JPH0510363Y2 (en) 1987-01-28 1987-01-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987011304U JPH0510363Y2 (en) 1987-01-28 1987-01-28

Publications (2)

Publication Number Publication Date
JPS63119239U true JPS63119239U (en) 1988-08-02
JPH0510363Y2 JPH0510363Y2 (en) 1993-03-15

Family

ID=30798396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987011304U Expired - Lifetime JPH0510363Y2 (en) 1987-01-28 1987-01-28

Country Status (1)

Country Link
JP (1) JPH0510363Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231006A (en) * 1994-02-16 1995-08-29 Nec Corp Wire bonding apparatus
JP2011502232A (en) * 2007-10-29 2011-01-20 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Plunger for solenoid valve and method for identifying plunger for solenoid valve

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231006A (en) * 1994-02-16 1995-08-29 Nec Corp Wire bonding apparatus
JP2011502232A (en) * 2007-10-29 2011-01-20 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Plunger for solenoid valve and method for identifying plunger for solenoid valve

Also Published As

Publication number Publication date
JPH0510363Y2 (en) 1993-03-15

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