JPS631151B2 - - Google Patents
Info
- Publication number
- JPS631151B2 JPS631151B2 JP56042223A JP4222381A JPS631151B2 JP S631151 B2 JPS631151 B2 JP S631151B2 JP 56042223 A JP56042223 A JP 56042223A JP 4222381 A JP4222381 A JP 4222381A JP S631151 B2 JPS631151 B2 JP S631151B2
- Authority
- JP
- Japan
- Prior art keywords
- metal stem
- stem
- metal
- groove
- bonding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は、ICモジユール用の金属ステムの製
造方法に関し、特に金属ステムの平押しをすると
同時に接合材の逃げ溝を形成するようにした金属
ステムの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a metal stem for an IC module, and more particularly to a method of manufacturing a metal stem in which an relief groove for a bonding material is formed at the same time as the metal stem is pressed flat.
従来の誘電体又は半導体からなる基板を金属ス
テムに接合するタイプのICモジユール１は、第
１図に示すように、金属ステム２の表面に基板３
をロウ付け又はハンダ付け等をしていた。この場
合、基板３は、シリコン或はセラミツク等の硬脆
材料でできているため上記金属ステム２が反りの
ない平滑面でないと割れるおそれがあつた。ま
た、仮に金属ステム２が平行平滑面であつても、
上記基板３の面積がある程度以上に大きくなる
と、ロウ又はハンダ等の接合材をそのままでは接
合面内に均一に分布させることはできなかつた。
さらに、ロウ又はハンダ等を溶かして接合する際
の加熱により発生するガス又は混入していた空気
等が接合面内に残つて気泡ができ、該気泡により
基板３と金属ステム２との熱伝導率が悪くなり、
特にトランジスタ等の能動素子の効率が悪化する
ことがあつた。そこで、従来は、まず金属ステム
２を平行平面とするためにフライス装置等によつ
て平面削りをし、その後第１図の基板３の接合す
る部分を全幅にわたつてみぞ削りをして逃げ溝４
を形成し、この逃げ溝４によつて接合材が接合面
内に行きわたるようにすると共に、上記気泡が外
部に逃げるようにしていた。このように従来例に
おいては、加工工数の大きい切削機械加工で平面
削りをした後みぞ削りをしていたので、平行平面
と逃げ溝とを有する金属ステム２の製造に多くの
時間を費やし、生産性は高くなかつた。 A conventional IC module 1 of the type in which a substrate made of a dielectric or a semiconductor is bonded to a metal stem has a substrate 3 on the surface of a metal stem 2, as shown in FIG.
were brazed or soldered. In this case, since the substrate 3 is made of a hard and brittle material such as silicon or ceramic, there is a risk that the metal stem 2 will break unless it has a smooth surface without warping. Moreover, even if the metal stem 2 is a parallel smooth surface,
When the area of the substrate 3 becomes larger than a certain level, it is not possible to uniformly distribute the bonding material such as wax or solder within the bonding surface as it is.
Furthermore, gas generated by heating during melting and joining wax or solder, etc., or mixed air, etc., remain within the joint surface and form bubbles, which increase the thermal conductivity between the substrate 3 and the metal stem 2. becomes worse,
In particular, the efficiency of active elements such as transistors sometimes deteriorated. Therefore, in the past, the metal stem 2 was first milled using a milling machine or the like to make it a parallel plane, and then a groove was cut across the entire width of the part where the substrate 3 of FIG. 4
The escape groove 4 allows the bonding material to spread within the bonding surface and allows the air bubbles to escape to the outside. In this way, in the conventional example, the surface was milled and then the groove was milled using cutting machining, which requires a large number of machining steps. Therefore, a lot of time was spent manufacturing the metal stem 2 having parallel planes and relief grooves, and production I wasn't very sexually active.
本発明は、上記欠点を除去するためになされた
もので、金属ステムの平押しをすると同時に接合
材の逃げ溝を形成して、生産性を向上するように
した金属ステムの製造方法を提供することを目的
とする。 The present invention has been made in order to eliminate the above-mentioned drawbacks, and provides a method for manufacturing a metal stem that improves productivity by forming relief grooves for the bonding material at the same time as pressing the metal stem flat. The purpose is to
以下、本発明による金属ステムの製造方法の実
施例を添付図面を参照して詳細に説明する。 Hereinafter, embodiments of the method for manufacturing a metal stem according to the present invention will be described in detail with reference to the accompanying drawings.
本発明による製造方法は、金属ステムの上下両
面に連続した溝状の平押しノツチを成形すべくプ
レス加工をすることにより、上記金属ステムの平
押しをすると同時にその表面に接合材の逃げ溝を
形成することからなつている。 The manufacturing method according to the present invention involves press working to form continuous groove-shaped flat pressing notches on both the upper and lower surfaces of the metal stem, thereby simultaneously flat pressing the metal stem and simultaneously creating relief grooves for the bonding material on its surface. It comes from forming.
本発明による製造方法に用いるプレスは、第２
図に示すように、その上型５ａの下面及び下型５
ｂの上面にくさび形の突条６ａ，６ｂがそれぞれ
の面において碁盤目状になるように形成されてお
り、これでその間に置かれた金属ステム７をプレ
ス加工する。ここで、上記突条６ａ及び６ｂの突
出位置は、第２図に見られるように上下で半ピツ
チずつずれて形成されている。 The press used in the manufacturing method according to the present invention is
As shown in the figure, the lower surface of the upper mold 5a and the lower mold 5
Wedge-shaped protrusions 6a and 6b are formed on the upper surface of b in a checkerboard pattern on each surface, and a metal stem 7 placed between them is pressed. Here, as shown in FIG. 2, the protruding positions of the protrusions 6a and 6b are shifted by half a pitch in the upper and lower directions.
このようなプレスを用いて金属ステム７をプレ
ス加工すると、第２図に示すように、金属ステム
７の上下両面には、くさび形の溝状の平押しノツ
チ８ａ，８ｂが成形される。この平押しノツチ８
ａ，８ｂが形成される際のいわゆる平押し効果に
よる金属ステム７の反りを除去して平行平面とす
ることができる。 When the metal stem 7 is pressed using such a press, wedge-shaped groove-shaped flat press notches 8a and 8b are formed on both upper and lower surfaces of the metal stem 7, as shown in FIG. This flat push notch 8
It is possible to eliminate the warping of the metal stem 7 due to the so-called flat pressing effect when forming the metal stems a and 8b, thereby making it a parallel plane.
このとき上記プレス加工と同時に、金属ステム
７の上下両面には、第３図に示すように、縦横に
碁盤目状に連続して成形された溝状の平押しノツ
チ８ａ，８a′；８ｂ，８b′からなる逃げ溝９ａ，
９ｂが形成される。なお、第３図においては、逃
げ溝９ａ，９ｂを金属ステム７の全面に碁盤目状
に形成したが、該金属ステム７の大きさによつて
は、必ずしも碁盤目状でなく縦又は横方向のみで
もよいし、また基板３を接合する部分のみに形成
してもよい。 At this time, simultaneously with the above-mentioned press working, groove-shaped flat press notches 8a, 8a'; 8b, 8b, Relief groove 9a consisting of 8b',
9b is formed. In FIG. 3, the relief grooves 9a and 9b are formed in a checkerboard pattern over the entire surface of the metal stem 7, but depending on the size of the metal stem 7, the relief grooves 9a and 9b may not necessarily be in a checkerboard shape but may be formed in the vertical or horizontal direction. Alternatively, it may be formed only on the portion where the substrate 3 is to be bonded.
本発明は以上のように構成されたので、金属ス
テム７の上下両面に縦横に連続した溝状の平押ノ
ツチ８ａ，８ｂ，８a′，８b′を成形すべくプレス
加工することにより、上記金属ステム７の平押し
をしてその反りを除去し該金属ステム７を平行平
面とすることができると同時に、上記プレス加工
によつて成形された平押しノツチでもつて金属ス
テム７の上下両面にロウ又はハンダ等の接合材の
逃げ溝９ａ，９ｂを形成することができる。従つ
て、従来のように平行平面とすることと、逃げ溝
を形成することとを切削機械加工で別工程で行う
ことなく、単にプレス加工をするのみで同時に行
うことができ、金属ステムの生産性を向上するこ
とができる。また、第３図に示すように、逃げ溝
９ａ，９ｂを碁盤目状に形成した場合は、半導体
基板３と金属ステム７との間の接合面内に接合材
をより良く均一に分布しうると共に接合材内の気
泡の逃がしもよくでき、その接合強度を高め且つ
熱伝導率を高め、ICモジユール全体の信頼性を
高めることができる等の効果を有する。 Since the present invention is constructed as described above, the metal stem 7 is press-worked to form continuous groove-shaped flat press notches 8a, 8b, 8a', 8b' on both upper and lower surfaces of the metal stem 7. The metal stem 7 can be pressed flat to remove its warp and become a parallel plane, and at the same time, the flat pressing notch formed by the above-mentioned press processing can apply wax to both the upper and lower surfaces of the metal stem 7. Alternatively, relief grooves 9a and 9b for a bonding material such as solder can be formed. Therefore, instead of creating parallel planes and forming relief grooves in separate cutting machining processes as in the past, they can be done at the same time by simply press working, which improves the production of metal stems. can improve sexual performance. Furthermore, as shown in FIG. 3, when the escape grooves 9a and 9b are formed in a checkerboard pattern, the bonding material can be distributed more uniformly within the bonding surface between the semiconductor substrate 3 and the metal stem 7. At the same time, air bubbles in the bonding material can be easily released, increasing the bonding strength and thermal conductivity, and has the effect of increasing the reliability of the entire IC module.
第１図は従来の方法で製造された金属ステムを
使用したICモジユールを示す斜視図、第２図は
本発明による方法で金属ステムを製造する状態を
示す側面図、第３図は本発明による方法で製造さ
れた金属ステムを示す斜視図である。
１……ICモジユール、３……基板、７……金
属ステム、８ａ，８ｂ，８a′，８b′……平押しノ
ツチ、９ａ，９ｂ……逃げ溝。
Fig. 1 is a perspective view showing an IC module using a metal stem manufactured by a conventional method, Fig. 2 is a side view showing a state in which a metal stem is manufactured by a method according to the present invention, and Fig. 3 is a perspective view showing a state in which a metal stem is manufactured by a method according to the present invention. FIG. 3 is a perspective view of a metal stem manufactured by the method. 1... IC module, 3... Substrate, 7... Metal stem, 8a, 8b, 8a', 8b'... Flat press notch, 9a, 9b... Relief groove.
Claims (1)
する金属ステムにおいて、該金属ステムの上下両
面に連続した溝状の平押しノツチを成形すべくプ
レス加工することにより、上記金属ステムの平押
しをすると同時にその表面に接合材の逃げ溝を形
成することを特徴とする金属ステムの製造方法。1. In a metal stem to which a substrate made of a dielectric or a semiconductor is bonded to the surface, flat pressing of the metal stem is performed by pressing to form continuous groove-shaped flat pressing notches on both the upper and lower surfaces of the metal stem. A method for manufacturing a metal stem, characterized in that at the same time, an escape groove for a bonding material is formed on the surface of the stem.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56042223A JPS57156873A (en) | 1981-03-23 | 1981-03-23 | Manufacture of metallic stem |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56042223A JPS57156873A (en) | 1981-03-23 | 1981-03-23 | Manufacture of metallic stem |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57156873A JPS57156873A (en) | 1982-09-28 |
| JPS631151B2 true JPS631151B2 (en) | 1988-01-11 |
Family
ID=12630029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56042223A Granted JPS57156873A (en) | 1981-03-23 | 1981-03-23 | Manufacture of metallic stem |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57156873A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967028U (en) * | 1982-10-26 | 1984-05-07 | 株式会社東芝 | surface acoustic wave device |
| KR100405035B1 (en) * | 2001-04-17 | 2003-11-07 | 주식회사 우리 | Method For Manufacturing The Embossing Plate For bomb |
-
1981
- 1981-03-23 JP JP56042223A patent/JPS57156873A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57156873A (en) | 1982-09-28 |
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