JPS63113978U - - Google Patents
Info
- Publication number
- JPS63113978U JPS63113978U JP470487U JP470487U JPS63113978U JP S63113978 U JPS63113978 U JP S63113978U JP 470487 U JP470487 U JP 470487U JP 470487 U JP470487 U JP 470487U JP S63113978 U JPS63113978 U JP S63113978U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- terminals
- conductive pattern
- substrate
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000011156 evaluation Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004615 ingredient Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は本考案の一実施例を示す半導体素子評
価試験用治具の正面図、第２図は裏面図、第３図
は底面図、第４図は側面図である。
１……基板、２……半導体素子実装部分、３…
…スルーホール、４……導体パターン、５……端
子、６……被覆部材。
FIG. 1 is a front view, FIG. 2 is a back view, FIG. 3 is a bottom view, and FIG. 4 is a side view of a semiconductor device evaluation test jig showing an embodiment of the present invention. 1... Board, 2... Semiconductor element mounting part, 3...
...Through hole, 4... Conductor pattern, 5... Terminal, 6... Covering member.
Claims (1)
ーン及び端子を形成した基板において、少なくと
も端子を除く基板表面の導体パターン上及び側面
が被覆部材で被覆されていることを特徴とする半
導体素子評価試験用治具。 A cure for semiconductor device evaluation testing, characterized in that, in a substrate on which a conductive pattern and terminals are formed to connect to a mounting part of a semiconductor device to be evaluated, at least the top and side surfaces of the conductive pattern on the surface of the substrate excluding the terminals are covered with a covering member. Ingredients.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP470487U JPS63113978U (en) | 1987-01-14 | 1987-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP470487U JPS63113978U (en) | 1987-01-14 | 1987-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63113978U true JPS63113978U (en) | 1988-07-22 |
Family
ID=30785611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP470487U Pending JPS63113978U (en) | 1987-01-14 | 1987-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63113978U (en) |
-
1987
- 1987-01-14 JP JP470487U patent/JPS63113978U/ja active Pending