JPH044777U - - Google Patents
Info
- Publication number
- JPH044777U JPH044777U JP4371190U JP4371190U JPH044777U JP H044777 U JPH044777 U JP H044777U JP 4371190 U JP4371190 U JP 4371190U JP 4371190 U JP4371190 U JP 4371190U JP H044777 U JPH044777 U JP H044777U
- Authority
- JP
- Japan
- Prior art keywords
- land
- central part
- peripheral part
- electrically connected
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図、第２図および第３図は、本考案の第１
実施例、第２実施例および第３実施例をそれぞれ
示すチエツク用ランドの配線パターンの平面図、
第４図は、従来のチエツク用ピンの一例を示す斜
視図、第５図は、従来のチエツク用ピンの他の例
を示す正面図、第６図は、面実装部品として構成
されたチツプ型チエツクピンの斜視図、第７図お
よび第８図は、上記チツプ型チエツクピンの使用
態様をそれぞれ示す正面図、第９図は、コンタク
トピンの使用態様の一例を示す正面図、第１０図
は、電極ランドに面実装部品を固定する状態を示
す拡大平面図、第１１図は、ランドの不具合を説
明するための拡大平面図である。
１，２，２Ａ，３……ランド、１ａ，１ｂ，２
ａ，２ｂ，３ａ，３ｂ……ランド中央部、１ｃ，
２ｃ，２Ａｃ，３ｃ……ランド周辺部、４……絶
縁層、１５……チエツク用部品。
Figures 1, 2 and 3 are the first diagrams of the present invention.
A plan view of the wiring pattern of the check land showing the embodiment, the second embodiment, and the third embodiment, respectively;
FIG. 4 is a perspective view showing an example of a conventional check pin, FIG. 5 is a front view showing another example of a conventional check pin, and FIG. 6 is a chip type configured as a surface mount component. A perspective view of the check pin, FIGS. 7 and 8 are front views showing how the chip-type check pin is used, FIG. 9 is a front view showing an example of how the contact pin is used, and FIG. FIG. 11 is an enlarged plan view showing a state in which a surface mount component is fixed to a land, and FIG. 11 is an enlarged plan view for explaining a problem with the land. 1, 2, 2A, 3...land, 1a, 1b, 2
a, 2b, 3a, 3b... central part of the land, 1c,
2c, 2Ac, 3c... Land periphery, 4... Insulating layer, 15... Check parts.
Claims (1)
ンドであつて、同ランドの中央部が周辺部と導通
していることを特徴とするプリント配線基板の配
線パターン。 (2) 中央部と周辺部が電気的に接続されている
ランドであつて、その表面上に、上記中央部と周
辺部との間に、両部を電気的に絶縁するための絶
縁層を設けたことを特徴とするプリント配線基板
の配線パターン。[Scope of Claim for Utility Model Registration] (1) Wiring of a printed wiring board characterized by a land on which a checking component can be placed, the central part of which is electrically connected to the peripheral part. pattern. (2) A land in which the central part and the peripheral part are electrically connected, and an insulating layer is provided on the surface between the central part and the peripheral part to electrically insulate both parts. A wiring pattern for a printed wiring board, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4371190U JPH044777U (en) | 1990-04-24 | 1990-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4371190U JPH044777U (en) | 1990-04-24 | 1990-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044777U true JPH044777U (en) | 1992-01-16 |
Family
ID=31556354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4371190U Pending JPH044777U (en) | 1990-04-24 | 1990-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044777U (en) |
-
1990
- 1990-04-24 JP JP4371190U patent/JPH044777U/ja active Pending