JPS63102274U - - Google Patents
Info
- Publication number
- JPS63102274U JPS63102274U JP19782486U JP19782486U JPS63102274U JP S63102274 U JPS63102274 U JP S63102274U JP 19782486 U JP19782486 U JP 19782486U JP 19782486 U JP19782486 U JP 19782486U JP S63102274 U JPS63102274 U JP S63102274U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- surface mount
- hole
- pads
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図a,bは本考案の一実施例のパツド部近
傍の平面図及びA―A線断面斜視図、第2図は従
来の印刷配線板のパツド部近傍の平面図である。 1……貫通孔、2……パツド、10……基板。
傍の平面図及びA―A線断面斜視図、第2図は従
来の印刷配線板のパツド部近傍の平面図である。 1……貫通孔、2……パツド、10……基板。
Claims (1)
- 表面実装用部品の複数のリードを噴流方式で半
田付けするパツドを有する印刷配線板において、
前記表面実装用部品を装着する部位の表裏の回路
パターンに接触しない位置に貫通孔を設けたこと
を特徴とする印刷配線板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19782486U JPS63102274U (ja) | 1986-12-22 | 1986-12-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19782486U JPS63102274U (ja) | 1986-12-22 | 1986-12-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63102274U true JPS63102274U (ja) | 1988-07-02 |
Family
ID=31157942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19782486U Pending JPS63102274U (ja) | 1986-12-22 | 1986-12-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63102274U (ja) |
-
1986
- 1986-12-22 JP JP19782486U patent/JPS63102274U/ja active Pending