JPS63101987U - - Google Patents

Info

Publication number
JPS63101987U
JPS63101987U JP1986197092U JP19709286U JPS63101987U JP S63101987 U JPS63101987 U JP S63101987U JP 1986197092 U JP1986197092 U JP 1986197092U JP 19709286 U JP19709286 U JP 19709286U JP S63101987 U JPS63101987 U JP S63101987U
Authority
JP
Japan
Prior art keywords
led
display unit
metal substrate
led display
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986197092U
Other languages
Japanese (ja)
Other versions
JPH046056Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986197092U priority Critical patent/JPH046056Y2/ja
Publication of JPS63101987U publication Critical patent/JPS63101987U/ja
Application granted granted Critical
Publication of JPH046056Y2 publication Critical patent/JPH046056Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第３図は本考案のＬＥＤ表示ユニツ
トの一実施例を示し、第１図は縦断面図、第２図
はスリツト板を除去した状態の斜視図、第３図は
第１図の一部の拡大図、第４図および第５図は何
れも本考案の他の実施例の一部の縦断面図、第６
図および第７図は何れも従来のＬＥＤ表示ユニツ
トの縦断面図である。 ２……ＬＥＤチツプ、１０……金属基板、１２
……リード端子ピン、１３，１５，１６……透明
樹脂、１４……マスク。 1 to 3 show an embodiment of the LED display unit of the present invention, in which FIG. 1 is a longitudinal sectional view, FIG. 2 is a perspective view with the slit plate removed, and FIG. 3 is the same as the one shown in FIG. 1. FIGS. 4 and 5 are partially enlarged views of another embodiment of the present invention, and FIGS.
Both FIG. 7 and FIG. 7 are longitudinal sectional views of a conventional LED display unit. 2...LED chip, 10...Metal substrate, 12
...Lead terminal pins, 13, 15, 16...Transparent resin, 14...Mask.

Claims (1)

【実用新案登録請求の範囲】 (1) 金属基板に、これに形成された行方向配線
パターンと列方向配線パターンとの各交点にそれ
ぞれＬＥＤチツプを取付けるとともに、前記金属
基板に、リード端子ピンを打ち込みにより植設し
、この金属基板の少なくとも各ＬＥＤチツプの実
装面を透明樹脂でモールドして各ＬＥＤチツプを
被覆し、このモールド樹脂の表面に、各ＬＥＤチ
ツプの対向部分からのみ光を出すマスクを設けて
なることを特徴とするＬＥＤ表示ユニツト。 (2) 前記モールド樹脂の表面における少なくと
も各ＬＥＤへの対向部分を除く部分を、梨子地に
形成したことを特徴とする実用新案登録請求の範
囲第１項に記載のＬＥＤ表示ユニツト。 (3) 前記モールド樹脂の表面における各ＬＥＤ
への対向部分を突出させて表示部を形成したこと
を特徴とする実用新案登録請求の範囲第１項また
は第２項に記載のＬＥＤ表示ユニツト。[Claims for Utility Model Registration] (1) LED chips are attached to each intersection of a row direction wiring pattern and a column direction wiring pattern formed on the metal substrate, and lead terminal pins are attached to the metal substrate. At least the mounting surface of each LED chip on this metal substrate is molded with a transparent resin to cover each LED chip, and a mask is placed on the surface of this molded resin to emit light only from the opposing portions of each LED chip. An LED display unit characterized by being provided with. (2) The LED display unit according to claim 1, wherein at least a portion of the surface of the molded resin other than a portion facing each LED is formed with a satin finish. (3) Each LED on the surface of the mold resin
2. The LED display unit according to claim 1 or 2, wherein the display portion is formed by protruding a portion facing the LED display unit.
JP1986197092U 1986-12-22 1986-12-22 Expired JPH046056Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986197092U JPH046056Y2 (en) 1986-12-22 1986-12-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986197092U JPH046056Y2 (en) 1986-12-22 1986-12-22

Publications (2)

Publication Number Publication Date
JPS63101987U true JPS63101987U (en) 1988-07-02
JPH046056Y2 JPH046056Y2 (en) 1992-02-19

Family

ID=31156504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986197092U Expired JPH046056Y2 (en) 1986-12-22 1986-12-22

Country Status (1)

Country Link
JP (1) JPH046056Y2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108544A (en) * 2003-09-29 2005-04-21 Matsumura Denki Seisakusho:Kk Led lighting device
JP2008118115A (en) * 2006-09-25 2008-05-22 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Compact high-luminance led-based illumination source, and method for fabricating illumination source
JP2012222126A (en) * 2011-04-08 2012-11-12 Stanley Electric Co Ltd Optical semiconductor device
JP2015023220A (en) * 2013-07-22 2015-02-02 ローム株式会社 Display device
JP2015056428A (en) * 2013-09-10 2015-03-23 ウシオ電機株式会社 Light emitting module device
JP2019197875A (en) * 2018-05-10 2019-11-14 ユニスターズ・コーポレーションＵｎｉｓｔａｒｓ Ｃｏｒｐｏｒａｔｉｏｎ Optoelectronic package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5079293A (en) * 1973-11-12 1975-06-27
JPS5570080A (en) * 1978-11-21 1980-05-27 Nec Corp Preparation of luminous display device
JPS55132083A (en) * 1979-03-30 1980-10-14 Sanyo Electric Co Ltd Light emitting diode substrate
JPS55154564U (en) * 1979-04-24 1980-11-07
JPS5922488U (en) * 1982-08-03 1984-02-10 株式会社東芝 Substrate for light emitting display device
JPS59171358U (en) * 1983-04-28 1984-11-16 三洋電機株式会社 light emitting diode display

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922488B2 (en) * 1981-04-16 1984-05-26 吉恭 河田 Straw eight hands

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5079293A (en) * 1973-11-12 1975-06-27
JPS5570080A (en) * 1978-11-21 1980-05-27 Nec Corp Preparation of luminous display device
JPS55132083A (en) * 1979-03-30 1980-10-14 Sanyo Electric Co Ltd Light emitting diode substrate
JPS55154564U (en) * 1979-04-24 1980-11-07
JPS5922488U (en) * 1982-08-03 1984-02-10 株式会社東芝 Substrate for light emitting display device
JPS59171358U (en) * 1983-04-28 1984-11-16 三洋電機株式会社 light emitting diode display

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108544A (en) * 2003-09-29 2005-04-21 Matsumura Denki Seisakusho:Kk Led lighting device
JP2008118115A (en) * 2006-09-25 2008-05-22 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Compact high-luminance led-based illumination source, and method for fabricating illumination source
JP2012222126A (en) * 2011-04-08 2012-11-12 Stanley Electric Co Ltd Optical semiconductor device
JP2015023220A (en) * 2013-07-22 2015-02-02 ローム株式会社 Display device
JP2015056428A (en) * 2013-09-10 2015-03-23 ウシオ電機株式会社 Light emitting module device
JP2019197875A (en) * 2018-05-10 2019-11-14 ユニスターズ・コーポレーションＵｎｉｓｔａｒｓ Ｃｏｒｐｏｒａｔｉｏｎ Optoelectronic package

Also Published As

Publication number Publication date
JPH046056Y2 (en) 1992-02-19

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