JPS6292399A - Shilding unit of tuner - Google Patents
Shilding unit of tunerInfo
- Publication number
- JPS6292399A JPS6292399A JP23118285A JP23118285A JPS6292399A JP S6292399 A JPS6292399 A JP S6292399A JP 23118285 A JP23118285 A JP 23118285A JP 23118285 A JP23118285 A JP 23118285A JP S6292399 A JPS6292399 A JP S6292399A
- Authority
- JP
- Japan
- Prior art keywords
- tuner
- case
- bpf
- board
- shilding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Receivers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はテレビ受像機、ビデオテープレコーダ、ＣＡＴ
Ｏ等に使用するチューナに係り、リフロー半田作業性及
びシールド効果に優れたノぐンドノ（スフィルタを含む
チューナのシールド体に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention is applicable to television receivers, video tape recorders, CAT
The present invention relates to a tuner used for a tuner, etc., and relates to a tuner shield body including a nozzle filter having excellent reflow soldering workability and shielding effect.
〔発明の背景）
従来のチューナ・シールド体の一例を第３，４図に示す
。第３図に３ＧＨｚ帯の受信周波数を２３ＭＨｚの帯域
に縮めるバンドパスフィルタ（ＢＰＦ）の湿式多層セラ
ミック基板１への実装斜視図を示し、第４図にその分解
斜視図を示す。これらの図において、ＢＰＦ基板４上面
の入出力導体パターン５とセラミック基板導体パターン
２とを端子１０によル接続し、ペースト半田７，３で固
定している。この時、２箇所の入出力端子１０の半田付
部分はＢＰＦケース（Ｊ：）８で一部包われておシ、す
７０−半田の際の赤外勝がケースによシ遮蔽され高温で
溶融する為、ＢＰＦ基板４の導体パターン５，６の銅が
酸化変色することとなる。又、半田付チェック、補修及
びフラックス、玉半田洗浄も充分ではなかった。[Background of the Invention] An example of a conventional tuner shield body is shown in FIGS. 3 and 4. FIG. 3 shows a perspective view of a bandpass filter (BPF) for reducing the reception frequency of the 3 GHz band to a band of 23 MHz, mounted on the wet multilayer ceramic substrate 1, and FIG. 4 shows an exploded perspective view thereof. In these figures, the input/output conductor pattern 5 on the upper surface of the BPF board 4 and the ceramic substrate conductor pattern 2 are connected through a terminal 10 and fixed with paste solders 7 and 3. At this time, the soldered parts of the two input/output terminals 10 are partially covered by the BPF case (J:) 8, and the infrared radiation during soldering is shielded by the case and exposed to high temperatures. Since the copper is melted, the copper of the conductive patterns 5 and 6 of the BPF board 4 becomes oxidized and discolored. Also, the soldering check, repair, flux, and ball solder cleaning were not sufficient.
本発明の目的は、遮蔽物の無いケース内の基板上面ペー
スト半田を赤外線で溶融后、端子部の半田形状チェック
、玉半田及びフラックス除去するクロロセン洗浄を容易
にすることにあル、かつシールド効果の高いチューナ・
シールド体を得ることにある。The purpose of the present invention is to melt the paste solder on the top surface of the board in a case without any shielding with infrared rays, check the solder shape of the terminal part, and facilitate chlorocene cleaning to remove ball solder and flux, and to improve the shielding effect. high tuner
The purpose is to obtain a shield body.
シールド効果を失なわず、かつリフロー半田の熱が容易
にペースト半田に尚る為には、半田付部上面のケースに
穴を開けることが出来ず、一体ケースの一部を利用して
リフロー半田、洗浄后、フタをする構造とした。In order to not lose the shielding effect and to allow the heat from reflow soldering to easily turn into paste solder, it is not possible to make a hole in the case on the top of the soldering part, and a part of the integral case is used for reflow soldering. The structure is such that the lid is closed after cleaning.
以下、本発明の一実施例を第１，２図によ）説明する。 An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
第１図に湿式多層セラミック基板１１にＢＰＦＡＳＳ（
バフＦ／ニスフィルタアッセンブリ）を実装した斜視図
を示す。第２図にＢＰＦＡＳＳの組立性を分か）易ぐす
る為の分解斜視図を示し、ＢＰＦ基板１４の入出力端子
１５上のペースト半田１７に端子２２を挾み込み、ＢＰ
Ｆケース１８．２１を上下よ）組み立てる。FIG. 1 shows a wet multilayer ceramic substrate 11 with BPFASS (
A perspective view showing the mounting of the buff F/varnish filter assembly) is shown. Figure 2 shows an exploded perspective view to facilitate the assembly of the BPFASS.
Assemble F case 18.21 (top and bottom).
この時、ＢＰＦケース１８の基板端子上面側は切欠かれ
てお、９、ＢＰＦケース１８と一体にして成る７タ止め
部１９とフタ２０とから成る。At this time, the upper surface of the board terminal of the BPF case 18 is notched and consists of a stopper part 19 and a lid 20, which are integrally formed with the BPF case 18.
湿式多層セラミック基板１１の導体パターン１２に印刷
されたペースト半田１３上に先のＢＰＦＡＳＳの端子２
２を載せてリフロー半田付することに釦よシ各２の導体
を半田で固定することができる。The terminal 2 of the previous BPFASS is placed on the paste solder 13 printed on the conductor pattern 12 of the wet multilayer ceramic substrate 11.
By mounting 2 and reflow soldering, each 2 conductor can be fixed with solder on the button.
この時、リフロー半田付温度／Ｉｉ湿式多層基板上のペ
ースト半田とＢＰＦ基板上のペースト半田の溶融する温
度差を少なくするという効果が有る。At this time, the reflow soldering temperature/Ii has the effect of reducing the melting temperature difference between the paste solder on the wet multilayer board and the paste solder on the BPF board.
尚、リフロー半田、チェック補修、洗浄後ＢＰＦケース
７タ２０をフタ止め部１９まで折）曲げるものとする。Note that after reflow soldering, check repair, and cleaning, the BPF case 7 is bent to the lid stop 19.
本発明によれば、下記効果がある。 According to the present invention, there are the following effects.
１）湿式多層セラミック基板とＢＰＦ基板のペースト半
田の溶融温度差をシールド効果を悪くすることなく少な
くすることができる。1) The difference in melting temperature of paste solder between a wet multilayer ceramic board and a BPF board can be reduced without deteriorating the shielding effect.
２）半田付部のチェック・補修が容易となる。2) Checking and repairing soldered parts becomes easier.
３）玉半田、フラックスの洗浄が確実となる。3) Cleaning of ball solder and flux becomes reliable.
第１＠け本発明の一実施例を示す斜視図、第２図は同分
解斜視図、第３図はチューナのシールド体の従来例を示
す斜視図、第４図は同分解斜視図、である。
符号の説明
１１・・・・・・湿式多層セラミック基板１４・・・・
・・ＢＰＦ基板、１８・・・・・・ＢＰＦケース１９・
・・・・・ＢＰＦケース７タ止め部。Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2 is an exploded perspective view, Fig. 3 is a perspective view showing a conventional example of a tuner shield body, and Fig. 4 is an exploded perspective view. be. Explanation of symbols 11... Wet multilayer ceramic substrate 14...
...BPF board, 18...BPF case 19.
・・・・・・BPF case 7 stopper part.
Claims (1)
ルタ基板を含むチューナを金属ケースで被覆して成るチ
ューナのシールド体において、前記ケースに、前記端子
部を望む窓部とその開閉蓋を設けておき、該窓部を介し
て前記端子部に対する半田付け処理を行なった後、その
開閉蓋を閉じてシールドを完全ならしめるようにしたこ
とを特徴とするチューナのシールド体。1) In a tuner shield body comprising a tuner including a bandpass filter board having a terminal portion to be soldered and covered with a metal case, the case is provided with a window portion through which the terminal portion is viewed and an opening/closing lid thereof. 1. A tuner shield body, characterized in that, after soldering the terminal portion through the window portion, the opening/closing lid is closed to completely level the shield.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23118285A JPS6292399A (en) | 1985-10-18 | 1985-10-18 | Shilding unit of tuner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23118285A JPS6292399A (en) | 1985-10-18 | 1985-10-18 | Shilding unit of tuner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6292399A true JPS6292399A (en) | 1987-04-27 |
Family
ID=16919605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23118285A Pending JPS6292399A (en) | 1985-10-18 | 1985-10-18 | Shilding unit of tuner |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6292399A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003063371A1 (en) * | 2002-01-22 | 2003-07-31 | Matsushita Electric Industrial Co., Ltd. | High frequency signal receiving apparatus |
-
1985
- 1985-10-18 JP JP23118285A patent/JPS6292399A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003063371A1 (en) * | 2002-01-22 | 2003-07-31 | Matsushita Electric Industrial Co., Ltd. | High frequency signal receiving apparatus |
| US7194245B2 (en) | 2002-01-22 | 2007-03-20 | Matsushita Electric Industrial Co., Ltd. | High-frequency signal receiving apparatus |
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