JPH0562805B2 - - Google Patents
Info
- Publication number
- JPH0562805B2 JPH0562805B2 JP60045421A JP4542185A JPH0562805B2 JP H0562805 B2 JPH0562805 B2 JP H0562805B2 JP 60045421 A JP60045421 A JP 60045421A JP 4542185 A JP4542185 A JP 4542185A JP H0562805 B2 JPH0562805 B2 JP H0562805B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- plate terminal
- drum core
- protrusion
- narrow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 46
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 238000004804 winding Methods 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子機器に用いられるチツプイン
ダクタに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to chip inductors used in various electronic devices.
従来の技術
近年、半導体を含め各種電子部品のチツプ化が
進み電子機器の小型化が急速に押し進められてい
る。これらリードレスのチツプ部品は高密度自動
実装技術、リフロー半田付技術の進展及び電子機
器の多機能化に伴い、個々のチツプ部品に対し従
来より一層高い信頼性の保証が要求されている。BACKGROUND OF THE INVENTION In recent years, various electronic components including semiconductors have been made into chips, and electronic devices have been rapidly miniaturized. With the advancement of high-density automatic mounting technology, reflow soldering technology, and the multifunctionalization of electronic devices, these leadless chip components are required to guarantee higher reliability than ever before for each chip component.
以下図面を参照しながら従来のチツプインダク
タについて説明する。 A conventional chip inductor will be described below with reference to the drawings.
第５図は従来のチツプインダクタの透過斜視図
である。ドラムコア１に巻線３を施し、一対の金
属板端子２にまたがるようにドラムコア１を固定
した後、巻線端７を金属板端子２のドラムコア固
定部と外部回路接続部６の間に溶接もしくは半田
付等により電気的接続を行い、金属板端子２の外
部回路接続部６を残して全体を外装成形体４でモ
ールドして構成していた。 FIG. 5 is a transparent perspective view of a conventional chip inductor. After winding 3 is applied to the drum core 1 and the drum core 1 is fixed so as to span the pair of metal plate terminals 2, the winding end 7 is welded or Electrical connections were made by soldering or the like, and the whole was molded with an exterior molded body 4, except for the external circuit connection portion 6 of the metal plate terminal 2.
以上のように構成されたチツプインダクタは、
第６図に示すようにプリント基板１０上に装着さ
れ、金属板端子２の外部回路接続部６とプリント
基板１０間を半田９により電気的接続並びに機械
的固定し、他の電子部品と共に種々の回路を構成
して各種電子機器に用いられていた。 The chip inductor configured as above is
As shown in FIG. 6, it is mounted on a printed circuit board 10, and electrical connection and mechanical fixation are made between the external circuit connection part 6 of the metal plate terminal 2 and the printed circuit board 10 by solder 9, and various electronic components are connected. It was used to form circuits in various electronic devices.
発明が解決しようとする問題点
上記のように構成され使用されたチツプインダ
クタにおいては、プリント基板１０への実装後で
の超音波洗浄時に超音波振動により巻線端７の近
傍にて銅線が断線するという問題点を有してい
た。すなわちプリント基板１０の振動が半田９を
経て金属板端子２の外部回路接続部６、巻線端７
と金属板端子２の接続部、さらにはドラムコア１
及び全体を通して外装成形体４へと順に伝達され
るが、ここで巻線端７への銅線引出部は周囲をす
べて外装成形体４で被われており一体となつてい
るため、振動伝達の時間的ズレにより銅線引出部
と金属板端子２に電気的接続された巻線端７の間
に位相の異なる機械的振動を起こし銅線が断線す
るもので、この現象は振動伝達経路が短いことか
らも判る通り超音波のような振動周波数の高い場
合に多く発生するものであつた。Problems to be Solved by the Invention In the chip inductor configured and used as described above, the copper wire is damaged near the winding end 7 due to ultrasonic vibration during ultrasonic cleaning after mounting on the printed circuit board 10. This had the problem of wire breakage. That is, the vibration of the printed circuit board 10 passes through the solder 9 to the external circuit connection part 6 of the metal plate terminal 2 and the winding end 7.
and the connection part between the metal plate terminal 2 and the drum core 1.
The vibration is transmitted to the exterior molded body 4 in order throughout the entire body, but here, the copper wire lead-out portion to the winding end 7 is entirely covered with the exterior molded body 4 and is integrated, so that vibration transmission is reduced. Due to the time lag, mechanical vibrations with different phases occur between the copper wire lead-out part and the winding end 7 electrically connected to the metal plate terminal 2, causing the copper wire to break.This phenomenon occurs due to the short vibration transmission path. As can be seen from the above, this phenomenon often occurs when the vibration frequency is high, such as ultrasonic waves.
問題点を解決するための手段
本発明は前記問題点を解決するために、同一平
面上で相対する一対の金属板端子上に巻線を施し
たドラムコアを、この中心軸が金属板端子面に対
して垂直でかつ前記金属板端子間にまたがるよう
に配置して固定し、前記金属板端子のドラムコア
固定部より幅狭の突出部を設け、この突出部の先
端に巻線端を電気的接続し、前記金属板端子の外
部回路への接続部を残して全体を外装成形体で覆
い、前記幅狭の突出部には金属板端子の外部回路
への接続部からの振動が金属板端子のドラムコア
固定部を介して伝達されるように構成したもので
ある。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a drum core in which wires are wound around a pair of metal plate terminals facing each other on the same plane. The metal plate terminal is arranged perpendicular to the metal plate terminal and fixed so as to span between the metal plate terminals, and a protrusion narrower than the drum core fixing part of the metal plate terminal is provided, and the end of the winding is electrically connected to the tip of this protrusion. The entire part of the metal plate terminal is covered with an exterior molded body except for the connection part of the metal plate terminal to the external circuit, and the narrow protruding part absorbs vibrations from the connection part of the metal plate terminal to the external circuit. The signal is transmitted via the drum core fixing section.
作 用
前記手段により構成したチツプインダクタをプ
リント基板に実装、半田付した状態での超音波洗
浄時などの超音波振動の伝達経路は、プリント基
板から金属板端子を経てドラムコアに伝わり、さ
らに外装成形体及び巻線端を電気的接続した金属
板端子の幅狭の突出部へと伝わるため、この巻線
端の接続部と銅線引出部を押えている外装成形体
は振動伝達の時間的ズレ、すなわち機械的振動の
位相差が少なくなると共に、プリント基板から金
属板端子に伝わつた振動がチツプインダクタの中
で最も重量の重いドラムコアの固定部を経て巻線
端を接続した金属板端子の幅狭の突出部へ伝達さ
れるため、その部位では大きく振動が減衰してお
り、超音波振動による断線発生が防止できるもの
である。Operation When the chip inductor constructed by the above method is mounted and soldered on a printed circuit board, the transmission path of ultrasonic vibration is such that it is transmitted from the printed circuit board to the drum core via the metal plate terminal, and then to the outer molding. Since the vibration is transmitted to the narrow protrusion of the metal plate terminal that electrically connects the coil end and the end of the winding, the external molded body holding down the connection part of the end of the winding and the copper wire lead-out part prevents the time lag in vibration transmission. In other words, the phase difference of mechanical vibration is reduced, and the vibration transmitted from the printed circuit board to the metal plate terminal passes through the fixed part of the drum core, which is the heaviest part of the chip inductor, and increases the width of the metal plate terminal where the winding end is connected. Since the vibration is transmitted to the narrow protruding part, the vibration is greatly attenuated at that part, and the occurrence of wire breakage due to ultrasonic vibration can be prevented.
実施例
以下本発明の一実施例を図面を参照しながら説
明する。Embodiment An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例におけるチツプイン
ダクタの透過斜視図を示すものである。 FIG. 1 shows a transparent perspective view of a chip inductor in one embodiment of the present invention.
同図において１はドラムコア、２は一対の金属
板端子で先端部に穴８をあけ、ドラムコア１の固
定部からその穴８内に折り返すように幅狭の突出
部５を設け、その突出部５に巻線端７を電気的に
接続している。３はドラムコア１に巻回した巻
線、４は外装成形体であり、金属板端子２の外部
回路への接続部６を残して全体を覆うようにモー
ルドしている。 In the figure, 1 is a drum core, 2 is a pair of metal plate terminals, a hole 8 is made at the tip, a narrow protrusion 5 is provided so as to be folded back from the fixed part of the drum core 1 into the hole 8, and the protrusion 5 The winding end 7 is electrically connected to. 3 is a winding wound around the drum core 1, and 4 is an exterior molded body, which is molded so as to cover the entire body except for a connecting portion 6 of the metal plate terminal 2 to an external circuit.
第２図は同実施例を下方から見た透視図であ
る。判りやすくするため金属板端子２の外部回路
への接続部６は曲げずに真つすぐのまま表現して
いる。 FIG. 2 is a perspective view of the embodiment seen from below. For clarity, the connecting portion 6 of the metal plate terminal 2 to the external circuit is shown straight without being bent.
以上のように構成した本実施例のチツプインダ
クタでは、プリント基板に加えられた超音波振動
は金属板端子２の外部回路への接続部６から外装
成形体４内の金属板端子２へ伝わりドラムコア１
の固定部を経て巻線端７を接続した幅狭の突出部
５へ伝わる。ここで外装成形体４は通常エポキシ
樹脂等を用いておりドラムコア１と表面積で多く
接していること及びドラムコア１と巻線３の重量
が重く、これに比べ外装成形体４は非常に軽いた
めドラムコア１と外装成形体４はほぼ同一の振動
を起こす。これに対し、巻線端７の接続した金属
板端子２の幅狭の突出部５は前記ドラムコア１の
固定部から穴８に突き出すと共に、その突出部５
の周囲をすべて外装成形体４で覆うように構成し
ているため、その突出部５もドラムコア１及び外
装成形体４とほぼ同一の振動モールドとすること
が可能であり、合わせてプリント基板の振動はそ
の振動伝達経路において重量の重いドラムコア固
定部を経ることにより超音波振動幅も小さくする
ことができるものである。 In the chip inductor of this embodiment configured as described above, the ultrasonic vibrations applied to the printed circuit board are transmitted from the connection portion 6 of the metal plate terminal 2 to the external circuit to the metal plate terminal 2 in the exterior molded body 4, and the ultrasonic vibration is transmitted to the drum core. 1
It is transmitted to the narrow protrusion 5 to which the winding end 7 is connected via the fixed part. Here, the exterior molded body 4 is usually made of epoxy resin, etc., and has a large surface area in contact with the drum core 1, and the weight of the drum core 1 and the winding 3 is heavy.In comparison, the exterior molded body 4 is very light, so the drum core 1 and the exterior molded body 4 cause almost the same vibration. On the other hand, the narrow protrusion 5 of the metal plate terminal 2 connected to the winding end 7 protrudes from the fixing part of the drum core 1 into the hole 8, and the protrusion 5
Since the outer molded body 4 covers the entire periphery of the drum core 1, the protrusion 5 can also be made of the same vibration mold as the drum core 1 and the exterior molded body 4, and the vibration of the printed circuit board can be reduced. The ultrasonic vibration width can also be reduced by passing through a heavy drum core fixing part in the vibration transmission path.
次に本発明の他の実施例について図面を参照し
ながら説明する。 Next, other embodiments of the present invention will be described with reference to the drawings.
第３図及び第４図は第２図と同様にチツプイン
ダクタを下方より見た金属板端子形状を示す透視
図である。同図中１から６までは第１図及び第２
図と同じであるので説明は略す。第３図に示す実
施例では巻線端を電気的接続する金属板端子２の
幅狭の突出部５をドラムコア１の固定部から斜め
横方向に突出するように設けた例である。同様に
第４図は金属板端子２の幅狭の突出部５をドラム
コア固定部からＵ字状に折り返して設けた例であ
る。第３図及び第４図に示すいずれの実施例にお
いても、巻線端７の接続部である金属板端子２の
幅狭の突出部５はドラムコア１の固定部から突出
するように設けており、かつ突出部５の周囲はす
べて外装成形体４で覆うように構成されておりプ
リント基板の超音波振動に対する動作も第１図に
示した実施例と同じである。 3 and 4 are perspective views showing the shape of the metal plate terminals when the chip inductor is viewed from below, similar to FIG. 2. Numbers 1 to 6 in the same figure refer to Figures 1 and 2.
Since it is the same as the figure, the explanation will be omitted. In the embodiment shown in FIG. 3, a narrow protrusion 5 of a metal plate terminal 2 for electrically connecting the ends of the winding is provided so as to protrude obliquely from the fixed portion of the drum core 1 in a horizontal direction. Similarly, FIG. 4 shows an example in which the narrow protruding portion 5 of the metal plate terminal 2 is folded back in a U-shape from the drum core fixing portion. In both the embodiments shown in FIGS. 3 and 4, the narrow protrusion 5 of the metal plate terminal 2, which is the connection part of the winding end 7, is provided so as to protrude from the fixed part of the drum core 1. , and the entire periphery of the protrusion 5 is constructed to be covered with the exterior molded body 4, and the operation with respect to ultrasonic vibration of the printed circuit board is also the same as in the embodiment shown in FIG.
発明の効果
以上の説明から明らかなように、本発明による
チツプインダクタは同一平面上で相対する一対の
金属板端子上に巻線を施したドラムコアを、この
中心軸が金属板端子面に対して垂直で、かつ前記
金属板端子間にまたがるように配置して固定し、
前記金属板端子のドラムコア固定部より幅狭の突
出部を設け、この突出部の先端に巻線端を電気的
接続し、前記金属板端子の外部回路への接続部を
残して全体を外装樹脂成形体で覆い、前記幅狭の
突出部には金属板端子の外部回路への接続部から
の振動が金属板端子のドラムコア固定部を介して
伝達されるように構成することにより、チツプイ
ンダクタをプリント基板に実装した後にプリント
基板から伝わつて来る超音波振動を含むあらゆる
機械的振動に対しインダクタの致命的欠点である
断線を発生しないという非常に大きな効果が得ら
れる。これは機器の高信頼性を追求している市場
ニーズに合致するもので、特に近年プリント基板
に各種部品を実装半田付後、プリント基板を超音
波洗浄する機器組立工程が通常化している状況下
では超音波振動耐量の向上がより一層重要なポイ
ントである。Effects of the Invention As is clear from the above description, the chip inductor according to the present invention has a drum core in which wires are wound on a pair of metal plate terminals facing each other on the same plane. arranged and fixed vertically and across the metal plate terminals;
A protrusion narrower than the drum core fixing part of the metal plate terminal is provided, the end of the winding is electrically connected to the tip of the protrusion, and the entire metal plate terminal is covered with exterior resin, leaving the connection part to the external circuit. The chip inductor is covered with a molded body, and the narrow protrusion is configured so that vibrations from the connection part of the metal plate terminal to the external circuit are transmitted through the drum core fixing part of the metal plate terminal. A very large effect can be obtained in that disconnection, which is a fatal drawback of inductors, does not occur against all mechanical vibrations including ultrasonic vibrations transmitted from the printed circuit board after it is mounted on the printed circuit board. This is in line with the market needs for high reliability of equipment, especially in light of the fact that in recent years the equipment assembly process that involves ultrasonically cleaning the printed circuit board after mounting and soldering various components to the printed circuit board has become the norm. Therefore, improving ultrasonic vibration resistance is an even more important point.
第１図は本発明の一実施例のチツプインダクタ
を示す透過斜視図、第２図は同インダクタを下方
より見た金属板端子形状を示す平面図、第３図及
び第４図は本発明の他の実施例によるチツプイン
ダクタを下方より見た金属板端子形状を示す平面
図、第５図は従来のチツプインダクタを示す透過
斜視図、第６図はチツプインダクタをプリント基
板に実装して半田付した状態の断面図である。
１……ドラムコア、２……金属板端子、３……
巻線、４……外装成形体、５……幅狭突出部、６
……外部回路接続部、７……巻線端。
FIG. 1 is a transparent perspective view showing a chip inductor according to an embodiment of the present invention, FIG. 2 is a plan view showing the metal plate terminal shape of the inductor as viewed from below, and FIGS. 3 and 4 are A plan view showing the metal plate terminal shape of a chip inductor according to another embodiment as seen from below, FIG. 5 is a transparent perspective view showing a conventional chip inductor, and FIG. 6 is a chip inductor mounted on a printed circuit board and soldered. FIG. 1...Drum core, 2...Metal plate terminal, 3...
Winding wire, 4...Exterior molded body, 5...Narrow protrusion, 6
... External circuit connection part, 7 ... Winding end.
Claims (1)
巻線を施したドラムコアを、この中心軸が金属板
端子面に対して垂直でかつ前記金属板端子間にま
たがるように配置して固定し、前記金属板端子の
ドラムコア固定部より幅狭の突出部を設け、この
突出部の先端に巻線端を電気的接続し、前記金属
板端子の外部回路への接続部を残して全体を外装
成形体で覆い、前記幅狭の突出部には金属板端子
の外部回路への接続部からの振動が金属板端子の
ドラムコア固定部を介して伝達されるように構成
したチツプインダクタ。 ２ 金属板端子の幅狭の突出部をドラムコア固定
部からＵ字状に折り返すように配置し、この幅狭
の突出部の先端に巻線端を電気的接続した特許請
求の範囲第１項記載のチツプインダクタ。 ３ 金属板端子の相対する先端部に穴を設けると
共にこの穴内に折り返すように幅狭の突出部を設
け、その突出部の先端に巻線端を電気的接続した
特許請求の範囲第１項記載のチツプインダクタ。[Scope of Claims] 1. A drum core having wires wound around a pair of metal plate terminals facing each other on the same plane is arranged so that its central axis is perpendicular to the metal plate terminal surface and extends between the metal plate terminals. a protruding part narrower than the drum core fixing part of the metal plate terminal, electrically connecting the winding end to the tip of the protruding part, and connecting the metal plate terminal to an external circuit; The whole is covered with an exterior molded body except for the narrow protruding part, and the narrow protruding part is configured so that vibrations from the connecting part of the metal plate terminal to the external circuit are transmitted through the drum core fixing part of the metal plate terminal. Chip inductor. 2. The narrow protrusion of the metal plate terminal is arranged so as to be folded back in a U-shape from the drum core fixing part, and the winding end is electrically connected to the tip of the narrow protrusion. chip inductor. 3. A hole is provided at the opposing tips of the metal plate terminal, and a narrow protrusion is provided in the hole so as to be folded back, and the winding end is electrically connected to the tip of the protrusion, as described in claim 1. chip inductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60045421A JPS61203606A (en) | 1985-03-07 | 1985-03-07 | Chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60045421A JPS61203606A (en) | 1985-03-07 | 1985-03-07 | Chip inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61203606A JPS61203606A (en) | 1986-09-09 |
| JPH0562805B2 true JPH0562805B2 (en) | 1993-09-09 |
Family
ID=12718802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60045421A Granted JPS61203606A (en) | 1985-03-07 | 1985-03-07 | Chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61203606A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453404A (en) * | 1987-08-24 | 1989-03-01 | Matsushita Electric Ind Co Ltd | Inductance element and manufacture thereof |
| JPH02102707U (en) * | 1989-01-31 | 1990-08-15 | ||
| JPH0499808U (en) * | 1991-02-06 | 1992-08-28 | ||
| DE69632422T2 (en) | 1995-08-11 | 2005-05-19 | Zenon Environmental Inc., Oakville | Process for embedding hollow fiber membranes |
| US9812588B2 (en) * | 2012-03-20 | 2017-11-07 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US10234513B2 (en) | 2012-03-20 | 2019-03-19 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
-
1985
- 1985-03-07 JP JP60045421A patent/JPS61203606A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61203606A (en) | 1986-09-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |