JPS628639U - - Google Patents
Info
- Publication number
- JPS628639U JPS628639U JP9963685U JP9963685U JPS628639U JP S628639 U JPS628639 U JP S628639U JP 9963685 U JP9963685 U JP 9963685U JP 9963685 U JP9963685 U JP 9963685U JP S628639 U JPS628639 U JP S628639U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead pin
- semiconductor package
- groove
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは第１実施例の半導体デバイスの
底面図および要部断面図、第２図ａ，ｂは第２実
施例の半導体デバイスの底面図および要部断面図
、第３図は他の実施例を示す部分底面図、第４図
ａ，ｂは従来の半導体デバイスの底面図および要
部断面図を示す。
２，１２，２２…半導体パツケージ、４，１４
，２４…リードピン、６…凹部、８…突部、１０
，２０…半導体デバイス、１６，２６…凹溝。
1A and 1B are a bottom view and a sectional view of a main part of a semiconductor device of a first embodiment, FIGS. 2A and 2B are a bottom view and a sectional view of a main part of a semiconductor device of a second embodiment, and FIG. A partial bottom view showing another embodiment, FIGS. 4a and 4b show a bottom view and a sectional view of essential parts of a conventional semiconductor device. 2, 12, 22...semiconductor package, 4, 14
, 24...Lead pin, 6...Recess, 8...Protrusion, 10
, 20... semiconductor device, 16, 26... concave groove.
Claims (1)
該半導体パツケージの裏面内方向に折曲した半導
体デバイスにおいて、 前記リードピンの折曲部内方向に位置する半導
体パツケージにリードピンの折曲形状に沿つて突
部を設けるとともに、前記半導体パツケージのリ
ードピン先端部分に、リードピン先端を入れるよ
うに、リードピンの並列方向の凹溝を設けたこと
を特徴とする半導体デバイス。 ２ 前記凹溝の両端を閉塞したことを特徴とする
実用新案登録請求の範囲第１項記載の半導体デバ
イス。 ３ 前記凹溝の両端を開放したことを特徴とする
実用新案登録請求の範囲第１項記載の半導体デバ
イス。 ４ 前記凹溝を、複数に区別したリードピン群ご
とに区画したことを特徴とする実用新案登録請求
の範囲第１項および第２項記載の半導体デバイス
。[Claims for Utility Model Registration] 1. In a semiconductor device in which a lead pin extending from a semiconductor package is bent inward to the back surface of the semiconductor package, the bent shape of the lead pin is placed in the semiconductor package located inward of the bent portion of the lead pin. A semiconductor device characterized in that a protrusion is provided along the semiconductor package, and a recessed groove in the parallel direction of the lead pins is provided in the lead pin tip portion of the semiconductor package so as to receive the lead pin tip. 2. The semiconductor device according to claim 1, wherein both ends of the groove are closed. 3. The semiconductor device according to claim 1, wherein both ends of the groove are open. 4. The semiconductor device according to claims 1 and 2, wherein the groove is divided into a plurality of groups of lead pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9963685U JPS628639U (en) | 1985-06-28 | 1985-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9963685U JPS628639U (en) | 1985-06-28 | 1985-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS628639U true JPS628639U (en) | 1987-01-19 |
Family
ID=30968698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9963685U Pending JPS628639U (en) | 1985-06-28 | 1985-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS628639U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317276A (en) * | 1976-07-30 | 1978-02-17 | Amp Inc | Integrated circuit package and method of manufacture thereof |
| JPS55117263A (en) * | 1979-02-23 | 1980-09-09 | Amp Inc | Lead frame for integrated circuit |
-
1985
- 1985-06-28 JP JP9963685U patent/JPS628639U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317276A (en) * | 1976-07-30 | 1978-02-17 | Amp Inc | Integrated circuit package and method of manufacture thereof |
| JPS55117263A (en) * | 1979-02-23 | 1980-09-09 | Amp Inc | Lead frame for integrated circuit |
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