JPS6172865U - - Google Patents

Info

Publication number
JPS6172865U
JPS6172865U JP1984157881U JP15788184U JPS6172865U JP S6172865 U JPS6172865 U JP S6172865U JP 1984157881 U JP1984157881 U JP 1984157881U JP 15788184 U JP15788184 U JP 15788184U JP S6172865 U JPS6172865 U JP S6172865U
Authority
JP
Japan
Prior art keywords
semiconductor package
plane
electrical connection
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984157881U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984157881U priority Critical patent/JPS6172865U/ja
Publication of JPS6172865U publication Critical patent/JPS6172865U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はPIGGY・BACKピツケージの従来例の斜
視図、第２図〜第４図は本考案の実施例の各状態
外観図、第５図は本考案の一実施例のＩＣパツケ
ージの立面図、第６図は本考案の一実施例のＩＣ
パツケージの側断面図である。 ７，８……半導体パツケージ、９，１４……リ
ードピン、１０，１１……差し込みホール、１２
，１３……ピン。 Fig. 1 is a perspective view of a conventional example of a PIGGY/BACK pickcage, Figs. 2 to 4 are external views of each state of an embodiment of the present invention, and Fig. 5 is an elevational view of an IC package according to an embodiment of the present invention. Figure 6 shows an IC of an embodiment of the present invention.
FIG. 3 is a side sectional view of the package. 7, 8... Semiconductor package, 9, 14... Lead pin, 10, 11... Insertion hole, 12
, 13...Pin.

補正 昭６０．２．１３ 図面の簡単な説明を次のように補正する。 明細書第５ページ６行目の「PIGGY・BACKパツ
ケージ」を「ピギーバツクパツケージ」と補正し
ます。Amendment February 13, 1980 The brief description of the drawing is amended as follows. Correct "PIGGY BACK package" on page 5, line 6 of the statement to "piggy back package."

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電気的接続ピンが片側のみの縦形の半導体パツ
ケージの一平面に、外形が同様な別の半導体パツ
ケージを電気的接続するための接続部を有するこ
とを特徴とする半導体パツケージ。 1. A semiconductor package characterized in that a vertical semiconductor package having electrical connection pins on only one side has a connecting portion on one plane for electrically connecting another semiconductor package having a similar external shape.
JP1984157881U 1984-10-19 1984-10-19 Pending JPS6172865U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984157881U JPS6172865U (en) 1984-10-19 1984-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984157881U JPS6172865U (en) 1984-10-19 1984-10-19

Publications (1)

Publication Number Publication Date
JPS6172865U true JPS6172865U (en) 1986-05-17

Family

ID=30715871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984157881U Pending JPS6172865U (en) 1984-10-19 1984-10-19

Country Status (1)

Country Link
JP (1) JPS6172865U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63249362A (en) * 1987-04-04 1988-10-17 Ibiden Co Ltd Package for surface-mounting parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63249362A (en) * 1987-04-04 1988-10-17 Ibiden Co Ltd Package for surface-mounting parts

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