JPS626704Y2 - - Google Patents
Info
- Publication number
- JPS626704Y2 JPS626704Y2 JP1980182780U JP18278080U JPS626704Y2 JP S626704 Y2 JPS626704 Y2 JP S626704Y2 JP 1980182780 U JP1980182780 U JP 1980182780U JP 18278080 U JP18278080 U JP 18278080U JP S626704 Y2 JPS626704 Y2 JP S626704Y2
- Authority
- JP
- Japan
- Prior art keywords
- support member
- transparent window
- heat sink
- photoelectric conversion
- upper support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000006243 chemical reaction Methods 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Description
【考案の詳細な説明】
本考案は冷却型光電変換装置の改良に係り、特
に外囲器の溶着の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a cooled photoelectric conversion device, and particularly to an improvement in welding of an envelope.
従来の冷却型光電変換装置は第１図に示すよう
に構成されたものがある。図において１は透光
窓、２は透光窓支持部材、３は上部支持部材、４
は赤外線検知素子、５は電極導出線形成基板、６
は下部支持部材、７はヒートシンク支持部材、８
はヒートシンク、９は電子冷却素子、１０はリー
ドフレームである。このような構造で赤外線検知
素子４は電子冷却素子９によつて約200〓に冷却
され透光窓１よりの信号を検知して、該信号出力
を電極導出線形成基板５およびリードフレーム１
０を通して外部に導出している。一方透光窓１は
透光窓支持部材２に封着され、また中央部開口状
の電極導出線形成基板５は上部支持部材３および
下部支持部材６間にその外周部が外部に突出した
形でろう付され、さらにヒートシンク８はヒート
シンク支持部材７をろう付けしている。しかして
透光窓支持部材２と上部支持部材３ならびに下部
支持部材６とヒートシンク支持部材７とは溶着さ
れて外囲器を形成し、外囲器内は真空断熱のため
に10-6Torr程度の高真空に保持している。 Some conventional cooling type photoelectric conversion devices are constructed as shown in FIG. In the figure, 1 is a transparent window, 2 is a transparent window support member, 3 is an upper support member, and 4
5 is an infrared sensing element, 5 is an electrode lead line forming substrate, and 6 is an infrared sensing element.
7 is a lower support member, 7 is a heat sink support member, 8 is a lower support member.
9 is a heat sink, 9 is an electronic cooling element, and 10 is a lead frame. With this structure, the infrared detecting element 4 is cooled to about 200° by the electronic cooling element 9, detects the signal from the transparent window 1, and transmits the signal output to the electrode lead wire forming substrate 5 and the lead frame 1.
It is derived to the outside through 0. On the other hand, the light-transmitting window 1 is sealed to the light-transmitting window support member 2, and the electrode lead wire forming substrate 5 having an opening in the center has a shape in which its outer periphery protrudes outward between the upper support member 3 and the lower support member 6. The heat sink 8 is further brazed to the heat sink support member 7. Thus, the transparent window support member 2 and the upper support member 3 as well as the lower support member 6 and the heat sink support member 7 are welded to form an envelope, and the inside of the envelope is about 10 -6 Torr for vacuum insulation. It is kept in a high vacuum.
最近冷却型光電変換装置の小型化の要求が強く
たとえば全長１を20mmと要求された場合透光窓
と素子配設面との間隔２も必然的に小さくな
り、またレンズの焦点距離が小さくなると２は
５mm程度となる。この場合透光窓支持部材２と上
部支持部材３の溶着をアルゴン溶接で行なうと、
溶接時に発生するプラズマの一部がリードフレー
ム１０と短絡し赤外線検知素子４を破壊する。こ
のため第２図に示すようにステンレス製の保護カ
バー１２と絶縁のためテフロン等のカバー１１を
設けてトーチ１３よりのプラズマ１４により溶着
を行なう必要がある。そのため２の寸法は５mm
では保護カバー１２およびカバー１１を挿入する
ことが困難となり、その上どうしてもトーチ１３
の位置が斜上方となるため溶着にアンバランスを
生じ溶接不良の原因となり信頼性を低下する原因
となつた。 Recently, there has been a strong demand for miniaturization of cooled photoelectric conversion devices. For example, if the total length 1 is required to be 20 mm, the distance 2 between the light-transmitting window and the surface on which the elements are mounted will inevitably be small, and if the focal length of the lens is short, 2 will be about 5 mm. In this case, if the light-transmitting window support member 2 and the upper support member 3 are welded by argon welding,
A part of the plasma generated during welding shorts out the lead frame 10 and destroys the infrared detector element 4. For this reason, as shown in Fig. 2, it is necessary to provide a stainless steel protective cover 12 and a Teflon or other insulating cover 11, and perform welding using plasma 14 from a torch 13. For this reason, the dimension of 2 is 5 mm.
In this case, it becomes difficult to insert the protective cover 12 and the cover 11, and moreover, the torch 13 must be inserted.
Since the position of the welding point is diagonally upward, an imbalance occurs in the welding, which causes poor welding and reduces reliability.
本考案の目的は前述の欠点を解消し、外囲器の
溶着の信頼性を向上した新らしい冷却型光電変換
装置を提供することであつて、簡単にのべると透
光窓を中央の開口部上に封着する平板状の透光窓
支持部材の周辺端部は上方に突出した突設部を有
し、かつ上部支持部材は透光窓支持部材の突出部
周辺が嵌接するように形成された段付嵌合部を有
し、さらに突出部及び段付嵌合部は上端溶接部位
において左右対称となる形状を持つて、上方から
溶接されるようになつている。 The purpose of the present invention is to provide a new cooled photoelectric conversion device that eliminates the above-mentioned drawbacks and improves the reliability of welding the envelope. The peripheral end of the flat plate-shaped transparent window support member to be sealed on top has a protrusion that protrudes upward, and the upper support member is formed so that the periphery of the protrusion of the transparent window support member fits into it. Furthermore, the protrusion and the stepped fitting part have a shape that is bilaterally symmetrical at the upper end welding part, so that the protrusion part and the stepped fitting part are welded from above.
以下図面を参照しながら本考案に係る冷却型光
電変換装置について詳細に説明する。 The cooling type photoelectric conversion device according to the present invention will be described in detail below with reference to the drawings.
第３図は本考案に係る冷却型光電変換装置の一
実施例を示す要部断面図であつて、透光窓支持部
材２および上部支持部材３の構造が異なる以外は
第１図と同様で、同等の部分は同一符号が付して
ある。第４図の断面図は本考案に係る冷却型光電
変換装置の従来例との相違点を拡大したもので、
透光窓支持部材２の周辺端部は上方に突出した突
出部２ａを形成し、かつ上部支持部材３は前記透
光窓支持部材２の突出部周縁に嵌接するよう形成
された段付嵌合部３ａをそなえ、さらに透光窓支
持部材２の突出部２ａおよび上部支持部材３の嵌
合部３ａは上端溶着部位Ａにおいて左右（内外）
対象となるよう形成されている。 FIG. 3 is a cross-sectional view of a main part showing an embodiment of the cooling type photoelectric conversion device according to the present invention, which is the same as FIG. 1 except that the structures of the transparent window support member 2 and the upper support member 3 are different. , equivalent parts are given the same reference numerals. The cross-sectional view in FIG. 4 is an enlarged view of the differences between the cooling type photoelectric conversion device according to the present invention and the conventional example.
The peripheral end of the transparent window support member 2 forms a protrusion 2a that protrudes upward, and the upper support member 3 has a stepped fitting formed to fit into the periphery of the protrusion of the transparent window support member 2. Furthermore, the protruding part 2a of the transparent window support member 2 and the fitting part 3a of the upper support member 3 are located on the left and right (inside and outside) of the upper end welding part A.
It is designed to be targeted.
このような構造において、溶着部位Ａにおいて
溶着を行う場合第５図のようにステンレス製の保
護カバー１２とテフロン製のカバー１１を設け真
上からトーチ１３を垂直にあてることによつてプ
ラズマ１４が均等にあたり溶融が均等になり、溶
着の信頼度が高まり、さらに２の長さも数mm短
かくできて光学設計上自由度が増す効果がある。
さらに装置の外径も従来より小型となる効果もあ
る。 In such a structure, when welding is performed at the welding site A, a stainless steel protective cover 12 and a Teflon cover 11 are provided as shown in FIG. It applies evenly and melts evenly, increasing the reliability of welding.Furthermore, the length of 2 can be shortened by several mm, which has the effect of increasing the degree of freedom in optical design.
Furthermore, the outer diameter of the device also has the effect of being smaller than before.
また本実施例では、赤外線検知素子について詳
述したが赤外線検知素子に限らずレーザ素子等低
温の保持を必要とする外囲器全般に適用が可能で
ある。 Further, in this embodiment, the infrared sensing element is described in detail, but the present invention is applicable not only to infrared sensing elements but also to general envelopes that require maintenance at low temperatures, such as laser elements.
以上の説明で明らかなように本考案の冷却型光
電変換装置によれば、透光窓支持部材と上部支持
部材との接合部の形状を改良することにより小型
でかつ信頼性の高い冷却型光電変換装置の実現が
可能となる。 As is clear from the above description, according to the cooled photoelectric conversion device of the present invention, by improving the shape of the joint between the transparent window support member and the upper support member, the cooled photoelectric conversion device is small and highly reliable. It becomes possible to realize a conversion device.
第１図は従来の冷却型光電変換装置の構造を示
す要部断面図、第２図は従来の冷却型光電変換装
置の溶着説明図、第３図は本考案に係る冷却型光
電変換装置の一実施例を示す要部断面図、第４図
は本考案に係る冷却型光電変換装置の溶着部位の
拡大断面図、第５図は本考案に係る冷却型光電変
換装置の溶着説明図である。
図において１は透光窓、２は透光窓支持部材、
３は上部支持部材、４は赤外線検知素子、５は電
極導出線形成基板、６は下部支持部材である。
FIG. 1 is a cross-sectional view of the main parts showing the structure of a conventional cooled photoelectric conversion device, FIG. 2 is an explanatory diagram of welding of the conventional cooled photoelectric conversion device, and FIG. 3 is a diagram of a cooled photoelectric conversion device according to the present invention. FIG. 4 is an enlarged sectional view of a welding part of a cooled photoelectric conversion device according to the present invention, and FIG. 5 is an explanatory diagram of welding of a cooled photoelectric conversion device according to the present invention. . In the figure, 1 is a transparent window, 2 is a transparent window support member,
3 is an upper support member, 4 is an infrared detecting element, 5 is an electrode lead line forming substrate, and 6 is a lower support member.
Claims (1)
透光窓支持部材２、上部支持部材３、中央部開口
状の電極導出線形成基板５、下部支持部材６、ヒ
ートシンク支持部材７及びヒートシンク８を有
し、透光窓支持部材は上部支持部材の上端部に支
持され、電極導出線形成基板は上部支持部材３と
下部支持部材６間にその外周部が外部に突出した
形でろう付接合され、ヒートシンク８とろう付接
合されているヒートシンク支持部材は下部支持部
材と溶着されて、内部を真空に保持した外囲器を
形成し、外囲器内には光電変換素子が透光窓に対
向して且つ電子冷却素子上に配置された構造にお
いて、前記透光窓支持部材２の周辺端部は上方へ
突出した突出部２ａを有し、且つ上部支持部材３
は透光窓支持部材の突出部周辺が嵌接するように
形成された段付嵌合部３ａを有し、さらに前記突
出部２ａ及び段付嵌合部３ａは上端溶接部位Ａに
おいて左右（内外）対称となる形状を持つて上方
から溶接されていることを特徴とする冷却型光電
変換装置。 A flat transparent window support member 2 that seals the transparent window 1 onto the central opening, an upper support member 3, an electrode lead line forming substrate 5 with an opening in the center, a lower support member 6, and a heat sink support member 7. and a heat sink 8, the transparent window support member is supported by the upper end of the upper support member, and the electrode lead wire forming substrate is formed between the upper support member 3 and the lower support member 6 with its outer periphery protruding outward. The heat sink support member, which is brazed to the heat sink 8, is welded to the lower support member to form an envelope whose interior is kept in a vacuum, and a photoelectric conversion element is transparent inside the envelope. In the structure disposed opposite to the optical window and on the electronic cooling element, the peripheral end of the light-transmitting window support member 2 has a protrusion 2a projecting upward, and the upper support member 3
has a stepped fitting part 3a formed so that the periphery of the protruding part of the transparent window support member fits into it, and furthermore, the protruding part 2a and the stepped fitting part 3a are located on the left and right (inside and outside) of the upper end welding part A. A cooled photoelectric conversion device characterized by having a symmetrical shape and being welded from above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980182780U JPS626704Y2 (en) | 1980-12-18 | 1980-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980182780U JPS626704Y2 (en) | 1980-12-18 | 1980-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57104549U JPS57104549U (en) | 1982-06-28 |
| JPS626704Y2 true JPS626704Y2 (en) | 1987-02-16 |
Family
ID=30102518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980182780U Expired JPS626704Y2 (en) | 1980-12-18 | 1980-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS626704Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139589A (en) * | 1977-05-12 | 1978-12-05 | Fujitsu Ltd | Infrared ray detector |
-
1980
- 1980-12-18 JP JP1980182780U patent/JPS626704Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139589A (en) * | 1977-05-12 | 1978-12-05 | Fujitsu Ltd | Infrared ray detector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57104549U (en) | 1982-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5056929A (en) | Temperature compensation type infrared sensor | |
| US6821032B2 (en) | Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs | |
| EP0089044A2 (en) | A semiconductor device having a container sealed with a solder of low melting point | |
| US7545015B2 (en) | Photo-detection device and manufacturing method thereof | |
| JP2008298708A (en) | Infrared detector and manufacturing method thereof | |
| JPS626704Y2 (en) | ||
| CA1148668A (en) | Package for radiation triggered semiconductor device and method | |
| JP4862325B2 (en) | Vacuum package and manufacturing method thereof | |
| JPH10132654A (en) | Container for infrared detection element, and production thereof | |
| EP0076104B1 (en) | Package for semicondutor device and method of manufacturing it | |
| US4864582A (en) | Gas laser tube and method for manufacturing the same | |
| JPS62190776A (en) | Photoelectric conversion device | |
| JP5276458B2 (en) | Infrared sensor | |
| JPS6244706B2 (en) | ||
| JPH11351959A (en) | Can with window material, method for fixing and temperature sensor | |
| JPH10115556A (en) | Infrared detector | |
| JP3453989B2 (en) | Optical semiconductor device module | |
| JPS6012287Y2 (en) | semiconductor equipment | |
| JPS6237897B2 (en) | ||
| JPS6359059B2 (en) | ||
| JP2005223209A (en) | Vacuum package sensor element, wafer level vacuum package, and manufacturing method thereof | |
| JPS61267363A (en) | Image sensor | |
| US3702402A (en) | Method and apparatus for light detector fabrication without brazing | |
| JPS59214244A (en) | Semiconductor device | |
| JPH0581666U (en) | Chip type infrared sensor |