JPS6242370B2 - - Google Patents
Info
- Publication number
- JPS6242370B2 JPS6242370B2 JP56080535A JP8053581A JPS6242370B2 JP S6242370 B2 JPS6242370 B2 JP S6242370B2 JP 56080535 A JP56080535 A JP 56080535A JP 8053581 A JP8053581 A JP 8053581A JP S6242370 B2 JPS6242370 B2 JP S6242370B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum foil
- surface layer
- etching
- lead
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 42
- 239000011888 foil Substances 0.000 claims description 40
- 239000002344 surface layer Substances 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 15
- 229910052797 bismuth Inorganic materials 0.000 claims description 14
- 229910052738 indium Inorganic materials 0.000 claims description 14
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 13
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 description 25
- 230000007797 corrosion Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 238000005452 bending Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003359 percent control normalization Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Landscapes
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Description
産業上の利用分野
本発明は、アルミニウム箔の表層部分に不純物
元素を偏在させた新しい構成の電解コンデンサ用
特殊アルミニウム箔に関する。
尚、本明細書において“％”とあるのは、特に
規定しない限り、“重量％”を示すものとする。
従来技術とその問題点
電解コンデンサに使用されるアルミニウム箔と
しては、エツチング後の表面積拡大率が大きく且
つ耐折強度の大なることが必要である。従来、こ
の様な性質を有するアルミニウム箔として提案さ
れているものは、全て99.9％又はそれ以上の高純
度アルミニウム箔中に適当な合金成分を均一に存
在させた“アルミニウム合金箔”であつた。本発
明者は、電解コンデンサ用アルミニウム箔のエツ
チング特性及び耐折強度のみならず、コンデンサ
の特性に及ぼす合金成分の影響について種々研究
を重ねた結果、○イエツチド箔の表面積拡大には表
面部に存在する合金成分の影響が大きく、それら
は高密度にピツトたとえばトンネル状ピツトの開
始点となり得る、○ロ他方、箔のの内層部に存在す
る合金部分は、必ずしも表面積拡大に寄与するわ
けではなく、むしろエツチング時の腐食減量を増
大させるため耐折強度を低下させたり、且つエツ
チド箔の化成特性を悪化させる問題がある、○ハ更
に合金成分の種類によつては、金属組織的に耐折
強度を低下させたり、コンデンサの電気的特性を
損う場合もある、等の点を見出した。
問題点を解決するための手段
本発明者は、この様な知見に基いて更に鋭意研
究を重ねた結果、鉛、インジウム及びビスマスの
少なくとも１種を表層部分にのみ集中的に含有す
る特殊なアルミニウム箔が、エツチング後の表面
積拡大率が大きく且つ耐折強度に優れているのみ
ならず、腐食減量、化成特性、コンデンサ自体の
電気的特性においても、従来公知のアルミニウム
合金箔の欠点を解消し得ることを見出し、遂に本
発明を完成するにいたつたものである。即ち、本
発明は、表面から0.1μｍまでを表層部分とし、
該表層部分には、鉛、インジウム及びビスマスの
少なくとも１種が合計で0.005〜0.2％存在し、該
表層部分を除く内層部分では、鉛、インジウム及
びビスマスの存在量はそれぞれ0.0001％未満であ
り、上記表層部分と内層部分とを合わせた全体と
しての平均のアルミニウム純度が99.9％以上であ
ることを特徴とする電解コンデンサ用アルミニウ
ム箔を提供するものである。
本発明の電解コンデンサ用アルミニウム箔Ａ
は、第１図に概略的に示す如き構成を有してお
り、表面から0.1μｍまでの表層部分１，１′及び
内層部分３からなつている。酸化皮膜を含む厚さ
0.1μｍの表層部分１，１′の鉛、インジウム及び
ビスマスの少なくとも１種の濃度は、合計量で、
0.005〜0.2％程度である。表層部分における鉛等
の含有率が0.005％未満では、エツチング性が向
上せず、静電容量の増大効果が認められない。一
方、鉛等の含有量が0.2％を超えると、アルミニ
ウム表面の耐食性が著るしく低下する為、たとえ
表面腐食抑制タイプのエツチング液を使用したと
しても全面的に腐食が進行して、ピツトが形成さ
れ難くなるので、やはり静電容量の増大効果が低
下する。表層部分１，１′における鉛、インジウ
ム及びビスマスの少なくとも１種の含有量は、合
計量として0.01〜0.15％とすることがより好まし
い。尚。0.1μｍ未満の厚さの部分については、
含有成分を正確に定量することが困難であること
から、本発明では、鉛等の含有量は表面から0.1
μｍの厚さの部分までの表層部分における平均の
含有量として規定する。
内層部分３は、エツチド箔本体となるので、そ
の鉛、インジウム及びビスマスの含有量は、エツ
チング特性、化成特性、耐折強度、コンデンサの
電気的特性等に実質上影響しない量、より詳しく
は0.0001％未満に、さらに好ましくは0.00001％
未満に制御する。
本発明のアルミニウム箔は、鉛等を表層部分に
高濃度に含有するので、その表面酸化皮膜は非常
に欠陥の多いものとなつているものと思われる。
従つて、エツチング時、Cl-イオンの侵入は容易
であり且つ鉛等の含有成分はAl自体のイオン化
を促進する作用を有するので、エツチング初期の
段階に多数のピツトが形成される。エツチングの
進行に伴つて鉛等を含有する表層部分は溶出する
が、一旦ピツトが形成されると、その後は孔食牲
が持続されるため、ピツトは高純度アルミニウム
からなる内層部分に伸長し続け、表面積拡大率が
大きくなる。表層部分の溶出後は、通常の高純度
アルミニウム箔のエツチングと同様であるから、
腐食減量は増大しない。従つて得られるエツチド
箔は、高容量の電解コンデンサを与え、耐折強度
及び化成特性に優れたものとなるのである。
これに対して、0.1μｍを上回る厚さの部分に
も鉛、インジウム及びビスマスの少なくとも１種
が存在する場合には、エツチングによる表面積拡
大率がさらに大きくなることはほとんどなく、む
しろエツチング時の腐食減量を増大させて、アル
ミニウム箔の耐折強度を低下させたり、エツチン
グ後のアルミニウム箔の化成特性を悪化させるこ
とがあるので好ましくない。
本発明のアルミニウム箔では、鉛、インジウム
及びビスマスの少なくとも１種を含む表層部分
１，１′におけるアルミニウムの含有量、及びこ
れらを実質上含まない内層部分３におけるアルミ
ニウムの含有量をアルミニウム箔全体として平均
した量、即ち全体としての平均のアルミニウム純
度を99.9％以上とする。このアルミニウム純度が
99.9％未満の場合には公知の如く、電解エツチン
グによりエツチングピツトを生成させる場合に、
エツチングピツトの成長が不純物の存在により阻
害されるため所望のエツチングピツトを形成でき
ず、従つて静電容量の高いアルミニウム箔を得難
く、更に、エツチングピツト内壁に形成される化
成皮膜内部に多量の不純物が存在することとな
り、印圧時に過剰の漏洩電流が流れる等皮膜特性
が悪くなるので好ましくない。
尚、本発明の電解コンデンサ用特殊アルミニウ
ム箔は、種々の方法で製造し得ることが見出され
ているが、その一例を挙げれば以下の通りであ
る。アルミニウム箔の表面に鉛、インジウム及び
ビスマスの少なくとも１種を元素又は化合物の状
態で付与し、これ等金属の融点以上の温度で熱拡
散処理し、必要ならば常法に従つて焼鈍を行なつ
てもよい。
発明の効果
本発明アルミニウム箔は、エツチング時の腐食
減量が少なく、エツチング後の表面積拡大率が大
きく且つ耐折強度に優れており、更に、エツチド
箔としての化成特性も良好である。また、本発明
アルミニウム箔を使用するコンデンサは、優れた
電気的特性を発揮する。
実施例
実施例 １
厚さ100μｍの99.99％アルミニウム箔の表層部
分0.1μｍに鉛、インジウム及びビスマスを所定
量含有させた本発明特殊アルミニウム箔を下記第
１表に示す組成のエツチング液中で電解エツチン
グした。表中、conc.HClとあるのは36％HClであ
り、conc.H2SO4とあるのは97％H2SO4である。
なお、表層部分の鉛等の含有量は、以下の方法
により求めた。即ち、まず表面積が100cm2である
アルミニウム箔を60℃の0.5％NaOH水溶液中に
浸漬した、浸漬時間は、アルミニウム箔の重量減
少が2.7mgとなる時間とした。このときアルミニ
ウム箔の溶解した厚さは、表層部分のアルミニウ
ム箔の密度を高純度アルミニウムの20℃における
密度と同じ2.69ｇ／cm3として計算すると0.10μｍ
となる。次いで、アルミニウム箔の溶出液中の
Pb、In又はBiの濃度を原子吸光法により測定し
て、表層部分のPb、Bi又はIn量を求めた。
INDUSTRIAL APPLICATION FIELD The present invention relates to a special aluminum foil for electrolytic capacitors having a new structure in which impurity elements are unevenly distributed in the surface layer of the aluminum foil. In this specification, "%" means "% by weight" unless otherwise specified. Prior art and its problems Aluminum foil used in electrolytic capacitors must have a large surface area expansion rate after etching and a high folding strength. All of the aluminum foils proposed so far with such properties were "aluminum alloy foils" in which appropriate alloy components were uniformly present in 99.9% or higher purity aluminum foils. As a result of repeated research on the effects of alloy components on capacitor characteristics as well as the etching characteristics and bending strength of aluminum foil for electrolytic capacitors, the inventor found that: The alloy components present in the inner layer of the foil do not necessarily contribute to the expansion of the surface area; On the contrary, there is a problem that the corrosion loss during etching is increased, which reduces the bending strength, and also deteriorates the chemical conversion characteristics of the etched foil. It was discovered that there are cases where the capacitor's electrical characteristics are impaired. Means for Solving the Problems As a result of further intensive research based on such knowledge, the present inventor has developed a special aluminum that contains at least one of lead, indium, and bismuth concentrated only in the surface layer. The foil not only has a large surface area expansion rate after etching and excellent bending strength, but also overcomes the drawbacks of conventionally known aluminum alloy foils in terms of corrosion loss, chemical conversion properties, and electrical properties of the capacitor itself. This discovery led to the completion of the present invention. That is, the present invention defines the surface layer from the surface to 0.1 μm,
In the surface layer portion, at least one of lead, indium, and bismuth is present in a total of 0.005 to 0.2%, and in the inner layer portion excluding the surface layer portion, the amount of lead, indium, and bismuth is each less than 0.0001%, The present invention provides an aluminum foil for an electrolytic capacitor, characterized in that the average aluminum purity of the surface layer portion and the inner layer portion as a whole is 99.9% or more. Aluminum foil A for electrolytic capacitors of the present invention
has a structure as schematically shown in FIG. 1, and consists of surface layer portions 1, 1' up to 0.1 μm from the surface and an inner layer portion 3. Thickness including oxide film
The concentration of at least one of lead, indium and bismuth in the 0.1 μm surface layer portion 1, 1' is the total amount:
It is about 0.005 to 0.2%. If the content of lead or the like in the surface layer portion is less than 0.005%, the etching properties will not improve and the effect of increasing capacitance will not be observed. On the other hand, if the content of lead etc. exceeds 0.2%, the corrosion resistance of the aluminum surface will be significantly reduced, so even if an etching solution that suppresses surface corrosion is used, corrosion will progress over the entire surface and the pit will become damaged. Since it becomes difficult to form, the effect of increasing capacitance is also reduced. It is more preferable that the total content of at least one of lead, indium, and bismuth in the surface layer portions 1 and 1' is 0.01 to 0.15%. still. For parts with a thickness of less than 0.1 μm,
Since it is difficult to accurately quantify the contained components, in the present invention, the content of lead etc. is determined at 0.1% from the surface.
It is defined as the average content in the surface layer up to a thickness of μm. Since the inner layer portion 3 is an etched foil body, the content of lead, indium, and bismuth is an amount that does not substantially affect the etching characteristics, chemical conversion characteristics, bending strength, electrical characteristics of the capacitor, etc., more specifically, 0.0001. %, more preferably less than 0.00001%
control to less than Since the aluminum foil of the present invention contains lead and the like in a high concentration in the surface layer, the surface oxide film is considered to have many defects.
Therefore, during etching, Cl - ions easily penetrate, and components such as lead have the effect of promoting the ionization of Al itself, so that many pits are formed in the initial stage of etching. As etching progresses, the surface layer containing lead etc. is leached out, but once pits are formed, pitting corrosion continues, so the pits continue to extend into the inner layer made of high-purity aluminum. , the surface area expansion rate increases. After the surface layer is eluted, it is the same as etching ordinary high-purity aluminum foil.
Corrosion loss does not increase. Therefore, the etched foil obtained provides a high-capacity electrolytic capacitor with excellent bending strength and chemical properties. On the other hand, if at least one of lead, indium, and bismuth is present even in areas with a thickness exceeding 0.1 μm, the surface area expansion rate due to etching will hardly increase further, but rather corrosion during etching will occur. This is not preferable because it may increase the weight loss, lowering the bending strength of the aluminum foil, or deteriorating the chemical conversion characteristics of the aluminum foil after etching. In the aluminum foil of the present invention, the aluminum content in the surface layer portions 1 and 1' containing at least one of lead, indium, and bismuth, and the aluminum content in the inner layer portion 3 substantially free of these, are determined based on the aluminum foil as a whole. The average amount, that is, the overall average aluminum purity is 99.9% or more. This aluminum purity
If it is less than 99.9%, as is known, when generating etching pits by electrolytic etching,
The growth of etching pits is inhibited by the presence of impurities, making it impossible to form the desired etching pits, making it difficult to obtain aluminum foil with high capacitance, and furthermore, there are large amounts of impurities inside the chemical conversion film formed on the inner walls of the etching pits. This is not preferable because the film properties deteriorate, such as excessive leakage current flowing during printing. It has been discovered that the special aluminum foil for electrolytic capacitors of the present invention can be produced by various methods, one example of which is as follows. At least one of lead, indium, and bismuth is applied in the form of an element or a compound to the surface of the aluminum foil, and thermal diffusion treatment is performed at a temperature higher than the melting point of these metals, and if necessary, annealing is performed according to a conventional method. It's okay. Effects of the Invention The aluminum foil of the present invention has a small corrosion loss during etching, a large surface area expansion rate after etching, and excellent bending strength, and also has good chemical conversion properties as an etched foil. Further, a capacitor using the aluminum foil of the present invention exhibits excellent electrical characteristics. Examples Example 1 A special aluminum foil of the present invention containing a predetermined amount of lead, indium, and bismuth in the surface layer portion of 0.1 μm of a 99.99% aluminum foil having a thickness of 100 μm was electrolytically etched in an etching solution having the composition shown in Table 1 below. did. In the table, conc.HCl is 36% HCl, and conc.H 2 SO 4 is 97% H 2 SO 4 . The content of lead, etc. in the surface layer portion was determined by the following method. That is, first, an aluminum foil having a surface area of 100 cm 2 was immersed in a 0.5% NaOH aqueous solution at 60° C., and the immersion time was set so that the weight of the aluminum foil decreased by 2.7 mg. At this time, the melted thickness of the aluminum foil is 0.10 μm when calculated assuming that the density of the aluminum foil in the surface layer is 2.69 g/cm 3 , which is the same as the density of high-purity aluminum at 20°C.
becomes. Then, in the eluate of aluminum foil
The concentration of Pb, In, or Bi was measured by atomic absorption spectrometry to determine the amount of Pb, Bi, or In in the surface layer portion.
【表】
エツチングは、浴温80℃、直流電流密度30A／
ｄm2の条件下に６分間行ない、次いで38Ov化成
した。
99.99％のアルミニウム箔を上記と同一条件で
エツチングした場合の静電容量を100％とする
と、本発明アルミニウム箔の静電容量は、第２図
（エツチング液１）、第３図（エツチング液２）及
び第４図（エツチング液３）に示す通りであつ
た。
いずれの場合にも、鉛（曲線Ａ）、インジウム
（曲線Ｂ）又はビスマス（曲線Ｃ）を表層部分に
集中的に含む本発明アルミニウム箔の静電容量が
著るしく増大していることが明らかである。[Table] Etching is performed at a bath temperature of 80℃ and a DC current density of 30A.
The reaction was carried out for 6 minutes under the condition of dm 2 and then chemically formed at 38 Ov. Assuming that the capacitance when a 99.99% aluminum foil is etched under the same conditions as above is 100%, the capacitance of the aluminum foil of the present invention is as shown in Fig. 2 (etching solution 1) and Fig. 3 (etching solution 2). ) and FIG. 4 (etching solution 3). In either case, it is clear that the capacitance of the aluminum foil of the present invention containing lead (curve A), indium (curve B), or bismuth (curve C) concentrated in the surface layer portion is significantly increased. It is.
第１図は、本発明電解コンデンサ用アルミニウ
ム箔の拡大部分断面図、第２図、第３図及び第４
図は、本発明電解コンデンサ用アルミニウム箔の
静電容量増大の状態を示すグラフである。
１，１′……表層部分、３……内層部分。
FIG. 1 is an enlarged partial sectional view of the aluminum foil for electrolytic capacitors of the present invention, FIGS. 2, 3, and 4.
The figure is a graph showing the state of increase in capacitance of the aluminum foil for electrolytic capacitors of the present invention. 1, 1'...surface layer part, 3...inner layer part.
Claims (1)
層部分には、鉛、インジウム及びビスマスの少な
くとも１種が合計で0.005〜0.2％存在し、該表層
部分を除く内層部分では、鉛、インジウム及びビ
スマスの存在量はそれぞれ0.0001％未満であり、
上記表層部分と内層部分とを合わせた全体として
の平均のアルミニウム純度が99.9％以上であるこ
とを特徴とする電解コンデンサ用アルミニウム
箔。1 The surface layer extends from the surface to 0.1 μm, and in the surface layer, at least one of lead, indium, and bismuth is present in a total of 0.005 to 0.2%, and in the inner layer excluding the surface layer, lead, indium, and bismuth are present. The abundance of each is less than 0.0001%,
An aluminum foil for an electrolytic capacitor, characterized in that the average aluminum purity of the surface layer portion and the inner layer portion as a whole is 99.9% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8053581A JPS57194516A (en) | 1981-05-26 | 1981-05-26 | Aluminum foil for electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8053581A JPS57194516A (en) | 1981-05-26 | 1981-05-26 | Aluminum foil for electrolytic condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57194516A JPS57194516A (en) | 1982-11-30 |
| JPS6242370B2 true JPS6242370B2 (en) | 1987-09-08 |
Family
ID=13721037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8053581A Granted JPS57194516A (en) | 1981-05-26 | 1981-05-26 | Aluminum foil for electrolytic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57194516A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001043150A1 (en) * | 1999-12-08 | 2001-06-14 | Toyo Aluminium Kabushiki Kaisha | Aluminum alloy clad foil for intermediate- and high-voltage anode of electrolytic capacitor |
| JP2007016255A (en) * | 2005-07-05 | 2007-01-25 | Sachiko Ono | Aluminum material having superior etching characteristic for electrolytic capacitor electrode, manufacturing method therefor, electrode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5104525B2 (en) * | 2008-05-01 | 2012-12-19 | 日本軽金属株式会社 | Aluminum foil for electrolytic capacitors |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50104710A (en) * | 1974-01-25 | 1975-08-19 | ||
| JPS52120364A (en) * | 1976-04-02 | 1977-10-08 | Showa Aluminium Co Ltd | Aluminum foil for electrolytic capacitor and method of manufacture thereof |
| JPS542376A (en) * | 1977-06-08 | 1979-01-09 | Shiranechiyou Shiyoukoukai | Production of fruit juice containing bean jam and confectionery |
| JPS5443563A (en) * | 1977-09-12 | 1979-04-06 | Showa Aluminium Co Ltd | Aluminum arroy foil for electrolyte condenser |
| JPS5577986A (en) * | 1978-12-01 | 1980-06-12 | Alusuisse | Compound aluminum foil for improved condenser |
| JPS5834925A (en) * | 1981-08-25 | 1983-03-01 | Fujitsu Ltd | Liquid phase epitaxial growth device |
-
1981
- 1981-05-26 JP JP8053581A patent/JPS57194516A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50104710A (en) * | 1974-01-25 | 1975-08-19 | ||
| JPS52120364A (en) * | 1976-04-02 | 1977-10-08 | Showa Aluminium Co Ltd | Aluminum foil for electrolytic capacitor and method of manufacture thereof |
| JPS542376A (en) * | 1977-06-08 | 1979-01-09 | Shiranechiyou Shiyoukoukai | Production of fruit juice containing bean jam and confectionery |
| JPS5443563A (en) * | 1977-09-12 | 1979-04-06 | Showa Aluminium Co Ltd | Aluminum arroy foil for electrolyte condenser |
| JPS5577986A (en) * | 1978-12-01 | 1980-06-12 | Alusuisse | Compound aluminum foil for improved condenser |
| JPS5834925A (en) * | 1981-08-25 | 1983-03-01 | Fujitsu Ltd | Liquid phase epitaxial growth device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001043150A1 (en) * | 1999-12-08 | 2001-06-14 | Toyo Aluminium Kabushiki Kaisha | Aluminum alloy clad foil for intermediate- and high-voltage anode of electrolytic capacitor |
| JP2007016255A (en) * | 2005-07-05 | 2007-01-25 | Sachiko Ono | Aluminum material having superior etching characteristic for electrolytic capacitor electrode, manufacturing method therefor, electrode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57194516A (en) | 1982-11-30 |
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