JPS6240181A - Connection for flexible printed circuit board - Google Patents
Connection for flexible printed circuit boardInfo
- Publication number
- JPS6240181A JPS6240181A JP60180802A JP18080285A JPS6240181A JP S6240181 A JPS6240181 A JP S6240181A JP 60180802 A JP60180802 A JP 60180802A JP 18080285 A JP18080285 A JP 18080285A JP S6240181 A JPS6240181 A JP S6240181A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- printed board
- board
- flexible printed
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
フレキシブルプリント板と他のプリント板に形成されそ
れぞれ対向する多数個の導体パターンを、異方性導電性
シートを介して接続する方法は簡便な接続方法であるが
、導体パターンを異方性導電性シートに押付ける力が不
足すると接触不良が発生する。そこで押付圧力を導体パ
ターン部分に集中せしめ押付圧力の不足に伴う接触不良
の低減を図ったものである。[Detailed Description of the Invention] [Summary] A method of connecting a large number of opposing conductor patterns formed on a flexible printed board and another printed board through an anisotropic conductive sheet is a simple connection method. However, if there is insufficient force to press the conductor pattern against the anisotropic conductive sheet, poor contact will occur. Therefore, the pressing pressure is concentrated on the conductor pattern portion to reduce contact failures caused by insufficient pressing pressure.
本発明はフレキシブルプリント板（以下ＦＰ板と称する
）からなるシート状スイッチを具えたキーボードに係り
、特にＦＰ板を他のプリント板に接続する接続方法に関
する。The present invention relates to a keyboard equipped with a sheet-like switch made of a flexible printed board (hereinafter referred to as an FP board), and particularly to a connection method for connecting an FP board to another printed board.
片面に接点を含む導体パターンが形成された２枚のＦＰ
板を、接点同志が接点位置に孔を設けた絶縁性スペーサ
を介して対向するように構成したシート状スイッチは、
キーボードの小形化、軽量化と共に低価格化を実現する
スイッチング素子として広く利用されている。しかしＦ
Ｐｉは半導体集積回路やその他の電子部品を直接実装す
るのが困難で、シート状スイッチを用いたキーボードに
かかる半導体集積回路や電子部品を搭載する場合は、通
常のプリント板に半導体集積回路や電子部品を実装しＦ
Ｐ板をそのプリント板に接続するという方法が採られる
。Two FPs with a conductor pattern including contacts formed on one side
A sheet-like switch is constructed by configuring a plate so that the contacts face each other through an insulating spacer with a hole at the contact position.
It is widely used as a switching element to make keyboards smaller, lighter, and less expensive. But F
It is difficult to directly mount semiconductor integrated circuits and other electronic components on Pi, so when mounting semiconductor integrated circuits and electronic components on keyboards using sheet switches, it is necessary to mount semiconductor integrated circuits and other electronic components on a regular printed board. Mount the parts
A method is adopted in which the P board is connected to the printed board.
ＦＰ板とプリント板とを接続するための手段としてコネ
クタがあるが、現在開発されているコネクタは形状が大
きくキーボードに組込むのに適さない。そこで信頼性が
高くて形状が小さく取扱いの容易な接続方法の実現が望
まれている。Connectors are available as a means for connecting an FP board and a printed circuit board, but currently developed connectors are large in size and are not suitable for being incorporated into a keyboard. Therefore, it is desired to realize a connection method that is highly reliable, small in size, and easy to handle.
第５図は従来の接続方法を示す側断面図で、第５図（ａ
）は導体パターンと平行に切断した図、第５図（ｂｌは
導体パターンと直角に切断した図である。Figure 5 is a side sectional view showing the conventional connection method.
) is a diagram cut parallel to the conductor pattern, and FIG. 5 (bl is a diagram cut at right angles to the conductor pattern).
図においてＦ、Ｐ板１に形成された導体パターン１１と
他のプリント板２に形成された導体パターン２１とは、
厚さ方向に導電性を有する多数個の導電性繊維を平均的
に分布せしめてなる異方性導電性シート３を介して対向
しており、補強板４と挟着部材５との間にＦＰ板１、異
方性導電性シート３、およびプリント板２を装着し、両
側に設けた螺子６を締め付けることによって導体パター
ン１１と導体パターン２１とを異方性導電性シート３に
圧接させている。In the figure, the conductor pattern 11 formed on the F and P boards 1 and the conductor pattern 21 formed on the other printed board 2 are as follows.
They face each other with an anisotropic conductive sheet 3 formed by distributing a large number of conductive fibers evenly distributed in the thickness direction. The conductor pattern 11 and the conductor pattern 21 are pressed against the anisotropic conductive sheet 3 by mounting the board 1, the anisotropic conductive sheet 3, and the printed board 2, and tightening the screws 6 provided on both sides. .
しかし導体パターン１１および２１は極く薄く異方性導
電性シート３が可撓性を具えでいるために、第５図０１
１）に示す如く補強板４と挟着部材５とで締め付ける力
を導体パターン１１および２１と、絶縁基板１２および
２２とで略均等に受けることになり、導体パターン１１
と導体パターン２１とを異方性導電性シート３に圧接さ
せる力、即ち接触圧力は締め付ける力を増大してもそれ
ほど大きくならない。反対に補強板４や挟着部材５に反
りが生じて中間部においては接触圧力が低下し接触不良
が発生するという問題があった。However, since the conductor patterns 11 and 21 are extremely thin and the anisotropic conductive sheet 3 is flexible, as shown in FIG.
As shown in 1), the tightening force between the reinforcing plate 4 and the clamping member 5 is substantially equally received by the conductor patterns 11 and 21 and the insulating substrates 12 and 22, so that the conductor pattern 11
The force that brings the conductor pattern 21 into contact with the anisotropic conductive sheet 3, that is, the contact pressure, does not increase so much even if the tightening force is increased. On the other hand, there is a problem in that the reinforcing plate 4 and the clamping member 5 are warped, the contact pressure decreases at the intermediate portion, and contact failure occurs.
第１図は本発明になる接続方法の原理を示す図である。 FIG. 1 is a diagram showing the principle of the connection method according to the present invention.
なお企図を通し同じ対象物は同一記号で表している。The same objects are represented by the same symbols throughout the plan.
上記問題点は第１図に示す厚さ方向に導電性を有する多
数個の導電性繊維を平均的に分布せしめて宿る異方性導
電性シート３と、ＦＰ板板上上導体パターン１１と対応
する位置に突起７１を有する突起形成板７とを具え、Ｆ
Ｐ板１と他のプリント板２とを接続するに際し、ＦＰ板
１の導体パターン１１と他のプリイ゛ト板２の導体パタ
ーン２１との間に゛・ 異方性導電性シート３を装着し
、ＦＰ板１の反対側に当接せしめた突起形成板７の突起
７１を介して、導体パターン１１を異方性導電性シート
３に圧接させる本発明になるＦＰ板の接続方法によって
解決される。The above problem corresponds to the anisotropic conductive sheet 3 in which a large number of conductive fibers having conductivity are evenly distributed in the thickness direction and the upper conductor pattern 11 on the FP board shown in FIG. a protrusion forming plate 7 having a protrusion 71 at a position where F
When connecting the P board 1 and another printed board 2, an anisotropic conductive sheet 3 is attached between the conductive pattern 11 of the FP board 1 and the conductive pattern 21 of the other printed board 2. This problem is solved by the FP board connection method of the present invention in which the conductor pattern 11 is pressed against the anisotropic conductive sheet 3 via the protrusion 71 of the protrusion forming plate 7 brought into contact with the opposite side of the FP board 1. .
第１図においてＦＰ板の反対側に当接せしめた突起を介
して導体パターンを異方性導電性シートに圧接させるこ
とにより、突起形成板をＦＰ板に押付ける力が小さくて
もその力は導体パターン部分に集中される。その結果導
体パターンを異方性導電性シートに圧接させる力が大き
くなり、接触圧力不足に伴う接触不良を低減することが
できる。In Figure 1, by pressing the conductor pattern against the anisotropic conductive sheet through the protrusions that are brought into contact with the opposite side of the FP board, even if the force pressing the protrusion forming plate against the FP board is small, the force will be reduced. It is concentrated in the conductor pattern part. As a result, the force for pressing the conductor pattern into contact with the anisotropic conductive sheet increases, making it possible to reduce contact failures due to insufficient contact pressure.
〔実施例］
以下添付図により本発明の実施例について説明する。第
２図は本発明の第１の実施例を示す側断面図、第３図は
本発明の第２の実施例を示す側断面図、第４図は本発明
の変形例を示す側断面図である。[Examples] Examples of the present invention will be described below with reference to the accompanying drawings. FIG. 2 is a side sectional view showing a first embodiment of the invention, FIG. 3 is a side sectional view showing a second embodiment of the invention, and FIG. 4 is a side sectional view showing a modification of the invention. It is.
第２図に示す本発明の第１の実施例が第５図に示す従来
の接続方法と相違している点は、ＦＰ板１と挟着部材５
との間に突起形成板７を挟着していることにある。ＦＰ
板板上上導体パターン１１と対応する位置に突起７１を
有する、モールド樹脂よりなる突起形成板７をＦＰ板１
と決着部材５と０間に挟着することによって、螺子６を
締め付け２ことによって生じた突起形成板７をＦＰ板ｌ
にｉｌ付ける力が小さくてもその力は導体パターン部う
に集中される。The difference between the first embodiment of the present invention shown in FIG. 2 and the conventional connection method shown in FIG.
The protrusion forming plate 7 is sandwiched between the two. F.P.
A protrusion forming plate 7 made of molded resin and having a protrusion 71 at a position corresponding to the upper conductor pattern 11 on the plate is attached to the FP board 1.
By sandwiching between the fixing member 5 and 0, the protrusion forming plate 7 generated by tightening the screw 6 is attached to the FP plate l.
Even if the force applied to the conductor pattern is small, the force is concentrated on the conductor pattern.
また第３図に示す本発明の第２の実施例が第２図に示す
第１の実施例と相違している点は、侠ヤ部材５と突起形
成板７とを一体化していること６：ある。即ち挟着部材
８にはＦＰ板板上上導体パターン１１と対応する位置に
突起７１が形成されてお叱螺子６を締め付けることによ
って生じた決着部本８をＦＰ板１に押付ける力が小さく
てもその力む：導体パターン部分に集中される。The second embodiment of the present invention shown in FIG. 3 is different from the first embodiment shown in FIG. :be. That is, the protrusion 71 is formed on the clamping member 8 at a position corresponding to the upper conductor pattern 11 on the FP board, so that the force that presses the final part book 8 against the FP board 1, which is generated by tightening the screw 6, is small. However, the stress is concentrated on the conductor pattern.
更に第４図に示す本発明の変形例が第５図に力す従来の
接続方法と相違している点は、ＦＰＦｊ、１と他のプリ
ント板２に形成されている導体パターンにある。ＦＰＦ
ｉｌに形成された導体パターン１と他のプリント板２に
形成されている導体パターン２３は、めっき等の方法に
よって異方性導電性う一ト３と接する部分が肉盛りされ
ており、螺子（〉 を締め付けることによって生じた
挟着部材５をＦＰｔ＆１に押付けるカが小さくてもその
カは導体バ」 ターン部分に集中される。Furthermore, the modification of the present invention shown in FIG. 4 differs from the conventional connection method shown in FIG. FPF
The conductor pattern 1 formed on the il and the conductor pattern 23 formed on the other printed board 2 are overlaid at the portions that contact the anisotropic conductive plate 3 by a method such as plating, and are screwed ( Even if the force generated by tightening the clamping member 5 against the FPt&1 is small, the force is concentrated on the conductor bar turn portion.
ｉ 即ち上記の接続方法によって導体パターンを異
方性導電性シートに圧接させるカが大きくなり、接触圧
力不足に伴う接触不良を低減することかで１ きる。In other words, the above connection method increases the force of pressing the conductor pattern against the anisotropic conductive sheet, thereby reducing contact failures due to insufficient contact pressure.
上述の如く本発明によれば信頼性が高くて形状ト が
小さく取扱いの容易なＦＰ板の接続方法を提供に す
ることができる。As described above, according to the present invention, it is possible to provide a method for connecting FP boards that is highly reliable, has a small size, and is easy to handle.
第１図は本発明になる接続方法の原理を示す図、第２図
は本発明の第１の実施例を示す側断面図、３ 第３
図は本発明の第２の実施例を示す側断面図、第４図は本
発明の変形例を示す側断面図、第５図は従来の接続方法
を示す側断面図、である。図において
１はＦＰ板、
２はプリント板、
３は異方性導電性シート、
４は補強板、
５は挟着部材、
６は螺子、
７は突起形成板、
８は゛挟着部材、
１１．１３．２１．２３は導体パターン、７１は突起、
第３画FIG. 1 is a diagram showing the principle of the connection method according to the present invention, FIG. 2 is a side sectional view showing the first embodiment of the present invention, 3.
FIG. 4 is a side sectional view showing a second embodiment of the invention, FIG. 4 is a side sectional view showing a modification of the invention, and FIG. 5 is a side sectional view showing a conventional connection method. In the figure, 1 is an FP board, 2 is a printed board, 3 is an anisotropic conductive sheet, 4 is a reinforcing plate, 5 is a clamping member, 6 is a screw, 7 is a projection forming plate, 8 is a clamping member, 11. 13.21.23 is a conductor pattern, 71 is a protrusion, 3rd picture
Claims (1)
に分布せしめてなる異方性導電性シート（３）と、フレ
キシブルプリント板（１）上の導体パターン（１１）と
対応する位置に突起（７１）を有する突起形成板（７）
とを具え、 該フレキシブルプリント板（１）と他のプリント板（２
）とを接続するに際し、該フレキシブルプリント板（１
）の導体パターン（１１）と他のプリント板（２）の導
体パターン（２１）との間に該異方性導電性シート（３
）を装着し、 該フレキシブルプリント板（１）の反対側に当接せしめ
た該突起形成板（７）の突起（７１）を介して、導体パ
ターン（１１）を該異方性導電性シート（３）に圧接さ
せることを特徴とするフレキシブルプリント板の接続方
法。[Claims] An anisotropic conductive sheet (3) comprising a large number of conductive fibers evenly distributed in the thickness direction, and a conductor pattern (1) on a flexible printed board (1). A protrusion forming plate (7) having a protrusion (71) at a position corresponding to 11)
and the flexible printed board (1) and another printed board (2).
), when connecting the flexible printed board (1
) between the conductive pattern (11) of the printed board (2) and the conductive pattern (21) of the other printed board (2).
), and the conductor pattern (11) is attached to the anisotropic conductive sheet ( 3) A method for connecting flexible printed boards, which is characterized in that they are brought into pressure contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60180802A JPS6240181A (en) | 1985-08-17 | 1985-08-17 | Connection for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60180802A JPS6240181A (en) | 1985-08-17 | 1985-08-17 | Connection for flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240181A true JPS6240181A (en) | 1987-02-21 |
Family
ID=16089598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60180802A Pending JPS6240181A (en) | 1985-08-17 | 1985-08-17 | Connection for flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240181A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011249312A (en) * | 2010-04-28 | 2011-12-08 | Jsr Corp | Electronic component, connection method of electronic member, and circuit connection member |
-
1985
- 1985-08-17 JP JP60180802A patent/JPS6240181A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011249312A (en) * | 2010-04-28 | 2011-12-08 | Jsr Corp | Electronic component, connection method of electronic member, and circuit connection member |
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