JPH08307030A - Connection structure of circuit board - Google Patents
Connection structure of circuit boardInfo
- Publication number
- JPH08307030A JPH08307030A JP7111970A JP11197095A JPH08307030A JP H08307030 A JPH08307030 A JP H08307030A JP 7111970 A JP7111970 A JP 7111970A JP 11197095 A JP11197095 A JP 11197095A JP H08307030 A JPH08307030 A JP H08307030A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- anisotropic conductive
- conductive rubber
- electrically connected
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、複数のプリント基板を
互いに積層化して接続する回路基板の接続構造に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board connection structure in which a plurality of printed boards are laminated and connected to each other.
【０００２】[0002]
【従来の技術】従来から採用されている複数の回路基板
を互いに積層化して接続する接続構造として、本願出願
人が先に出願した実開昭６２−１３１３８５に開示され
た技術がある。これを以下に説明する。図４は、上記従
来技術の接続構造を示す断面図である。５１は本体、５
１ｂは本体５１に設けられたネジ穴、５１ｃは本体５１
と一体に形成された凸部、５３は本体５１から出ている
位置決めピン、５４は銅箔部５４ａ、位置決め穴５４
ｂ、ネジ穴５４ｃを有する片面フレキシブルプリント基
板、５５は表面銅箔部５５ａ、裏面銅箔部５５ｂ、位置
決め穴５５ｃ、ネジ穴５５ｄを有する両面フレキシブル
プリント基板、５６は銅箔部５６ａ、位置決め穴５６
ｂ、ネジ穴５６ｃを有する片面フレキシブルプリント基
板、５７は弾性部材、５８は立ち曲げ部５８ａ、位置決
め穴５８ｂ、ネジ穴５８ｃ、補強リブ５８ｄから成る押
さえ板５８、そして５９はビスである。2. Description of the Related Art A conventional connecting structure for stacking and connecting a plurality of circuit boards is disclosed in Japanese Utility Model Application Laid-Open No. 62-131385 filed by the applicant of the present application. This will be explained below. FIG. 4 is a cross-sectional view showing the connection structure of the above conventional technique. 51 is the main body, 5
1b is a screw hole provided in the main body 51, and 51c is a main body 51.
, 53 is a positioning pin protruding from the main body 51, 54 is a copper foil part 54a, and a positioning hole 54
b, a single-sided flexible printed circuit board having a screw hole 54c, 55 a front surface copper foil portion 55a, a back surface copper foil portion 55b, a positioning hole 55c, a double-sided flexible printed circuit board having a screw hole 55d, 56 a copper foil portion 56a, a positioning hole 56
b, a single-sided flexible printed circuit board having a screw hole 56c, 57 an elastic member, 58 a standing bent portion 58a, a positioning hole 58b, a screw hole 58c, a pressing plate 58 including a reinforcing rib 58d, and 59 a screw.
【０００３】図４に示すように、片面フレキシブルプリ
ント基板５４、両面フレキシブルプリント基板５５、片
面フレキシブルプリント基板５６を本体５１の一方の面
に対して重ねて配置する。そして、一番上のプリント基
板５６の更に上部から、弾性部材５７を介在させて押さ
え板５８を配置し、この押さえ板５８を本体５１に対し
て、ビス５９で締結する。As shown in FIG. 4, a single-sided flexible printed circuit board 54, a double-sided flexible printed circuit board 55, and a single-sided flexible printed circuit board 56 are arranged so as to overlap one surface of the main body 51. Then, a pressing plate 58 is arranged from above the uppermost printed board 56 with an elastic member 57 interposed, and the pressing plate 58 is fastened to the main body 51 with screws 59.
【０００４】この状態で、押さえ板５８をビスで締結す
ると、弾性部材５７の圧縮作用により、凸部５１ｃと弾
性部材５７との間は圧縮され、これらの間に挟まれてい
る片面フレキシブルプリント基板５４の銅箔部５４ａ
と、両面フレキシブルプリント基板５５の裏面銅箔部５
５ｂが圧接され導通する。同様に、両面フレキシブルプ
リント基板５５の表面銅箔部５５ａと、片面フレキシブ
ルプリント基板５６の銅箔部５６ｂも導通する。In this state, when the pressing plate 58 is fastened with screws, the elastic member 57 compresses to compress the space between the convex portion 51c and the elastic member 57, and the one-sided flexible printed circuit board sandwiched between them. 54 copper foil portion 54a
And the back side copper foil portion 5 of the double-sided flexible printed circuit board 55.
5b is pressed into contact and becomes conductive. Similarly, the front surface copper foil portion 55a of the double-sided flexible printed circuit board 55 and the copper foil portion 56b of the single-sided flexible printed circuit board 56 are also electrically connected.
【０００５】上記の様な構成によって、プリント基板
と、プリント基板の接続を行うことが知られている。It is known that the printed circuit board and the printed circuit board are connected to each other by the above-mentioned structure.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来技術においては、全てのプリント基板がフレキシブル
プリント基板（以下、ＦＰＣ：Flexible Printed Circu
itと略称する）であれば問題ないのだが、その中の一
部、もしくは全部にハード基板（以下、ＰＷＢ：Printe
d Wired Boardと略称する）を用いる場合には、その接
続構造に条件が出てくる。この条件とは、圧接コネクト
層が、ＰＷＢと弾性部材との間に挟まれ、かつＦＰＣで
構成されていなければならないということである。なぜ
ならば、ＰＷＢはその平面性が低く、かつ、剛体である
ために、ＰＷＢとＰＷＢとを重ね合わせて弾性部材の弾
性力を伝達させた場合には、圧接コネクト層において良
くて面圧むら、最悪には浮きを生じて簡単に圧接不良を
引き起こしてしまうからである。However, in the above prior art, all printed circuit boards are flexible printed circuit boards (hereinafter, referred to as FPC: Flexible Printed Circu).
There is no problem if it is abbreviated as "it", but some or all of them are hard boards (PWB: Printe
In the case of using d Wired Board), there are some requirements for the connection structure. This condition means that the press-connecting connection layer must be sandwiched between the PWB and the elastic member and composed of FPC. Because the PWB has a low flatness and is a rigid body, when the PWB and the PWB are superposed on each other to transmit the elastic force of the elastic member, the surface pressure unevenness at the pressure contact connecting layer is good. This is because in the worst case, floating is caused, which easily causes defective press contact.
【０００７】また、従来のプリント基板の接続構造にお
いては、ＰＷＢがＦＰＣと異なりフレシキブル性の低い
剛体であるが故に、弾性部材のような大きなもののレイ
アウトに対してその位置の自由度が少なくなるという欠
点があった。以上のような理由により、機器の小型化が
求められている昨今においては、ＰＷＢを用いると同時
に、上記条件を満たすことは困難である。In addition, in the conventional printed circuit board connection structure, the PWB is a rigid body having low flexibility unlike the FPC, so that the degree of freedom of its position is reduced with respect to the layout of a large object such as an elastic member. There was a flaw. Due to the above reasons, it is difficult to satisfy the above conditions at the same time as using the PWB in these days when the miniaturization of the device is required.
【０００８】本発明は、上記従来例の問題点を解決する
ために提案されたもので、その目的とするところは、プ
リント基板の材質等によりその配置が拘束されることな
く、自由なレイアウトで複数のプリント基板を接続でき
る回路基板の接続構造を提供することにある。The present invention has been proposed in order to solve the problems of the above-mentioned conventional example, and its purpose is to provide a free layout without the layout being restricted by the material of the printed circuit board or the like. It is to provide a circuit board connection structure capable of connecting a plurality of printed circuit boards.
【０００９】[0009]
【課題を解決するための手段】上述の問題点を解決し、
目的を達成するために、本発明に係わる回路基板の接続
構造は、以下の構成を備える。即ち、複数の回路基板を
互いに電気的に接続するための回路基板の接続構造にお
いて、第１の回路基板と第２の回路基板とは、それらの
間に介在させた異方性導電ゴムを押圧することにより電
気的に接続され、前記第２の回路基板と第３の回路基板
とは、前記異方性導電ゴムを押圧することにより発生す
る弾性力によって圧接されて電気的に接続されることを
特徴とする。[Means for Solving the Problems] The above problems are solved,
To achieve the object, a circuit board connection structure according to the present invention has the following configuration. That is, in the circuit board connection structure for electrically connecting a plurality of circuit boards to each other, the first circuit board and the second circuit board press the anisotropic conductive rubber interposed therebetween. The second circuit board and the third circuit board are electrically connected by being pressed against each other by an elastic force generated by pressing the anisotropic conductive rubber. Is characterized by.
【００１０】また、複数の回路基板を互いに電気的に接
続するための回路基板の接続構造において、第１の回路
基板と第２の回路基板とは、それらの間に介在させた第
１の異方性導電ゴムを押圧することにより電気的に接続
され、前記第２の回路基板と第３の回路基板とは、前記
第１の異方性導電ゴムを押圧することにより発生する弾
性力によって圧接されて電気的に接続され、前記第３の
回路基板の前記異方性導電ゴムが配置された面とは反対
側の面には、第４の回路基板と電気的に接続されるよう
に第１の圧接接続部が形成され、前記第３の回路基板と
第４の回路基板とは、それらの間に介在させた第２の異
方性導電ゴムを押圧することにより電気的に接続され、
前記第４の回路基板と第５の回路基板とは、前記第１及
び第２の異方性導電ゴムを押圧することにより発生する
弾性力によって圧接されて電気的に接続されることを特
徴とする。Further, in a circuit board connection structure for electrically connecting a plurality of circuit boards to each other, the first circuit board and the second circuit board have a first different structure interposed therebetween. It is electrically connected by pressing the anisotropic conductive rubber, and the second circuit board and the third circuit board are pressed against each other by an elastic force generated by pressing the first anisotropic conductive rubber. Is electrically connected to the third circuit board, and a surface of the third circuit board opposite to the surface on which the anisotropic conductive rubber is arranged is electrically connected to the fourth circuit board. And the third circuit board and the fourth circuit board are electrically connected by pressing the second anisotropic conductive rubber interposed between them.
The fourth circuit board and the fifth circuit board are electrically connected by being pressed against each other by an elastic force generated by pressing the first and second anisotropic conductive rubbers. To do.
【００１１】また、複数の回路基板を互いに電気的に接
続するための回路基板の接続構造において、第１の回路
基板と第２の回路基板とは、それらの間に介在させた第
１の異方性導電ゴムを押圧することにより電気的に接続
され、前記第２の回路基板と第３の回路基板とは、前記
第１の異方性導電ゴムを押圧することにより発生する弾
性力によって圧接されて電気的に接続され、前記第１の
回路基板の前記異方性導電ゴムが配置された面とは反対
側の面には、第４の回路基板と電気的に接続されるよう
に第１の圧接接続部が形成され、前記第１の回路基板と
第４の回路基板とは、その更に上部に配置された弾性物
質の押さえ板を押圧することにより発生する該弾性物質
の弾性力によって圧接されて電気的に接続されることを
特徴とする。Further, in a circuit board connection structure for electrically connecting a plurality of circuit boards to each other, the first circuit board and the second circuit board have a first different structure interposed therebetween. It is electrically connected by pressing the anisotropic conductive rubber, and the second circuit board and the third circuit board are pressed against each other by an elastic force generated by pressing the first anisotropic conductive rubber. And electrically connected to the surface of the first circuit board opposite to the surface on which the anisotropic conductive rubber is arranged, so as to be electrically connected to the fourth circuit board. One press-connecting portion is formed, and the first circuit board and the fourth circuit board are generated by the elastic force of the elastic substance generated by pressing the pressing plate of the elastic substance arranged on the upper side thereof. It is characterized by being pressed and electrically connected.
【００１２】[0012]
【作用】以上のように、本発明は構成されているので、
回路基板同士を導通するための接続部分となる弾性部材
に異方性導電ゴムを利用し、この異方性導電ゴムに隣接
した２つの回路基板間を異方性導電ゴムの導電性によっ
て導通すると共に、弾性部材を介在しない離れた位置に
配置された回路基板同士は、異方性導電ゴムの弾性を用
いて圧接して導通させるので、複数の回路基板を圧接し
て導通する際に、ＰＷＢを置く位置や、弾性部材のレイ
アウトに大幅な自由度を持たせることができ、機器の小
型化に役立つことになる。Since the present invention is constructed as described above,
Anisotropic conductive rubber is used as an elastic member that serves as a connecting portion for conducting circuit boards to each other, and conduction is established between two circuit boards adjacent to this anisotropic conductive rubber by the conductivity of the anisotropic conductive rubber. At the same time, since the circuit boards arranged at distant positions without interposing the elastic member are brought into pressure contact with each other by using the elasticity of the anisotropic conductive rubber to bring them into conduction, when the plurality of circuit boards are brought into contact with each other by pressure, the PWB is electrically connected. It is possible to give a great degree of freedom to the position where the is placed and the layout of the elastic member, which helps to miniaturize the device.
【００１３】[0013]
【実施例】以下に、本発明に係わる実施例につき、添付
の図面を参照して詳細に説明する。 ＜第１実施例＞図１は、本発明に基づく第１実施例の回
路基板の接続構造を示す図である。図１において、１は
基板の地板で、後述の各プリント基板等が取り付けられ
る。１ａは圧接の際のビス止めを行うビス穴、１ｂは後
述の各プリント基板が位置決めに用いる位置決めピンで
ある。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. <First Embodiment> FIG. 1 is a diagram showing a connection structure of a circuit board according to a first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a base plate of a board, on which various printed boards to be described later are attached. Reference numeral 1a is a screw hole for fixing a screw at the time of pressure contact, and 1b is a positioning pin used for positioning by each printed circuit board described later.
【００１４】２は片面ＦＰＣで、導体２ａ、位置決め穴
２ｂ、ネジ逃げ穴２ｃから構成されている。３は両面Ｆ
ＰＣで、導体３ａ及び３ｄ、位置決め穴３ｂ、ネジ逃げ
穴３ｃから構成されている。４は異方性導電ゴムであ
る。Reference numeral 2 denotes a single-sided FPC, which comprises a conductor 2a, a positioning hole 2b, and a screw escape hole 2c. 3 is double-sided F
The PC includes conductors 3a and 3d, a positioning hole 3b, and a screw escape hole 3c. 4 is an anisotropic conductive rubber.
【００１５】５は片面ＰＷＢで、導体５ａ、位置決め穴
５ｂ、ネジ逃げ穴５ｃから構成されている。６はネジで
ある。まず、片面ＦＰＣ２の導体２ａと、両面ＦＰＣの
導体３ａとは、剛体である基板地板１と、弾性部材であ
る異方性導電ゴム４とに挟まれていて、剛体である片面
ＰＷＢ５を介して基板地板１に対してネジ６で締め付け
て押さえられるので、一面に均一な圧力を受けて、圧接
され、第１の圧接導電層を形成する。Reference numeral 5 is a single-sided PWB, which is composed of a conductor 5a, a positioning hole 5b, and a screw escape hole 5c. 6 is a screw. First, the conductor 2a of the single-sided FPC 2 and the conductor 3a of the double-sided FPC are sandwiched between the substrate base plate 1 which is a rigid body and the anisotropic conductive rubber 4 which is an elastic member, and the one-sided PWB 5 which is a rigid body is interposed therebetween. Since the substrate base plate 1 is fastened by being tightened with the screw 6 and pressed, uniform pressure is applied to one surface of the substrate base plate 1 to press it to form the first press-contact conductive layer.
【００１６】次に、両面ＦＰＣ３の導体３ｄと、片面Ｐ
ＷＢ５の導体５ａは、異方性導電ゴム４を介して対向す
る位置に配されており、この異方性導電ゴム４は剛体で
ある基板地板１と片面ＰＷＢ５の基材とに挟持される。
このため、異方性導電ゴム４は、充分に押し潰されて導
電性を有することになり、導体３ｄと導体５ａとが導通
状態となる。Next, the conductor 3d of the double-sided FPC 3 and one side P
The conductors 5a of the WB 5 are arranged at positions facing each other with the anisotropic conductive rubber 4 interposed therebetween, and the anisotropic conductive rubber 4 is sandwiched between the base board 1 which is a rigid body and the base material of the one-sided PWB 5.
Therefore, the anisotropic conductive rubber 4 is sufficiently crushed to have conductivity, and the conductors 3d and 5a are brought into conduction.
【００１７】以上のように、第１実施例のプリント基板
の接続構造では、片面ＦＰＣ２の導体２ａと、両面ＦＰ
Ｃの導体３ａとは、剛体である基板地板１と、弾性部材
である異方性導電ゴム４とに挟まれ、一面に均一な圧力
を受けて圧接されると共に、両面ＦＰＣ３の導体３ｄ
と、片面ＰＷＢ５の導体５ａとは、異方性導電ゴム４を
介して剛体である基板地板１と片面ＰＷＢ５の基材とに
挟持されるので、複数のプリント基板を確実に圧接でき
る。このように、従来では片面ＰＷＢ５により上部から
弾性部材を介して押さえると共に、圧接導電層が剛体の
基板地板１と片面ＰＷＢ５とに挟持されるために、双方
の平面性に不良を発生させ、導通不良となる可能性が高
かったが、第１実施例のプリント基板の接続構造では、
異方性導電ゴムを用いることにより導体同士の確実な圧
接ができる。As described above, in the printed circuit board connection structure of the first embodiment, the conductor 2a of the single-sided FPC 2 and the double-sided FP are used.
The conductor 3a of C is sandwiched between the substrate base plate 1 which is a rigid body and the anisotropic conductive rubber 4 which is an elastic member, and is pressed against one surface under uniform pressure, and the conductor 3d of the double-sided FPC 3 is also included.
Since the conductor 5a of the one-sided PWB 5 is sandwiched between the substrate base plate 1 which is a rigid body and the base material of the one-sided PWB 5 through the anisotropic conductive rubber 4, it is possible to reliably press-contact a plurality of printed boards. As described above, conventionally, the one-sided PWB 5 is pressed from the upper side through the elastic member, and the pressure conductive layer is sandwiched between the rigid base plate 1 and the one-sided PWB 5, so that the planarity of both sides is deteriorated and the conduction is reduced. Although there is a high possibility that it will be defective, in the printed circuit board connection structure of the first embodiment,
By using the anisotropic conductive rubber, the conductors can be surely pressed against each other.
【００１８】＜第２実施例＞次に、本発明に基づく第２
実施例の回路基板の接続構造について説明する。図２
は、本発明に基づく第２実施例の回路基板の接続構造を
示す図である。図２において、２１は基板地板で、ネジ
穴２１ａ、位置決めピン２１ｂから成る。２２は片面Ｆ
ＰＣで、導体２２ａ、位置決め穴２２ｂ、ネジ逃げ穴２
２ｃで構成される。<Second Embodiment> Next, a second embodiment of the present invention will be described.
The connection structure of the circuit board of the embodiment will be described. Figure 2
FIG. 8 is a diagram showing a circuit board connection structure of a second embodiment according to the present invention. In FIG. 2, reference numeral 21 denotes a base plate of the substrate, which comprises screw holes 21a and positioning pins 21b. 22 is one side F
With PC, conductor 22a, positioning hole 22b, screw escape hole 2
2c.
【００１９】２３は両面ＦＰＣで、導体２３ａ、位置決
め穴２３ｂ、ネジ逃げ穴２３ｃ、導体２３ｄから構成さ
れている。２４は異方性導電ゴムである。２５は両面Ｐ
ＷＢであり、両面に導体２５ａ、２５ｄのパターンが形
成され、また、位置決め穴２５ｂ、ネジ逃げ穴２５ｃが
開けてある。A double-sided FPC 23 is composed of a conductor 23a, a positioning hole 23b, a screw escape hole 23c, and a conductor 23d. Reference numeral 24 is an anisotropic conductive rubber. 25 is P on both sides
WB, patterns of conductors 25a and 25d are formed on both surfaces, and a positioning hole 25b and a screw escape hole 25c are formed.
【００２０】２６は両面ＦＰＣで、導体２６ａ、２６
ｄ、位置決め穴２６ｂ、ネジ逃げ穴２６ｃから成る。２
７は異方性導電ゴムである。２８は片面ＰＷＢで、導体
２８ａ、位置決め穴２８ｂ、ネジ逃げ穴２８ｃが形成さ
れている。Reference numeral 26 is a double-sided FPC, which has conductors 26a, 26
d, a positioning hole 26b, and a screw escape hole 26c. Two
7 is an anisotropic conductive rubber. Reference numeral 28 denotes a single-sided PWB, in which a conductor 28a, a positioning hole 28b, and a screw escape hole 28c are formed.
【００２１】２９はネジである。まず、全体として、Ｆ
ＰＣ２２、２３、２６、ＰＷＢ２５、２８、異方性導電
ゴム２４、２７をネジ２９で基板地板２１のネジ穴２１
ａに対して締め付け、圧力が加えられる。その結果、片
面ＦＰＣ２２の導体２２ａと両面ＦＰＣ２３の導体２３
ａが異方性導電ゴム２４の弾性によって、全面に一様な
圧力で加圧密着し導通する。Reference numeral 29 is a screw. First, as a whole, F
PC 22, 23, 26, PWB 25, 28, anisotropic conductive rubbers 24, 27 are screwed into the screw hole 21 of the base plate 21 of the substrate 21.
Tightening and pressure are applied to a. As a result, the conductor 22a of the single-sided FPC 22 and the conductor 23 of the double-sided FPC 23
Due to the elasticity of the anisotropic conductive rubber 24, a is pressed and brought into close contact with the entire surface under a uniform pressure to conduct electricity.
【００２２】両面ＦＰＣ２３の導体２３ｄと両面ＰＷＢ
の導体２５ａは、異方性導電ゴム２４が圧縮され、導電
性を生じるために導通する。両面ＰＷＢ２５の導体２５
ｄと両面ＦＰＣ２６の導体２６ａは、剛体である両面Ｐ
ＷＢ２５の基材と、弾性を有する異方性導電ゴム２７の
間に挟まれて、均一な圧力で圧接されて導通する。Conductor 23d of double-sided FPC 23 and double-sided PWB
The anisotropic conductive rubber 24 is compressed, and the conductor 25a is electrically connected because it becomes conductive. Conductor 25 with double-sided PWB 25
d and the conductor 26a of the double-sided FPC 26 are a double-sided P that is a rigid body.
It is sandwiched between the base material of WB 25 and the anisotropic conductive rubber 27 having elasticity, and is brought into pressure contact with a uniform pressure to conduct electricity.
【００２３】また、両面ＦＰＣ２６の導体２６ｄと、片
面ＰＷＢ２８の導体２８ａとの間にも異方性導電ゴム２
７が介在され、均一な圧力で圧接されるために、導電性
を発生し、導体２６ｄと導体２８ａとが導通する。以上
のように、この第２実施例の構造では、４組の導体の圧
接が実現されるが、片面ＰＷＢ２８には２つの異方性導
電ゴム２４、２６の応力が付加されるために、材質によ
ってはたわみを生じてしまい、圧接不良を起こすとも考
えられる。この対策として片面ＰＷＢ２８の上面に補強
用に鉄などの押さえ板を重ねるとよい。The anisotropic conductive rubber 2 is also provided between the conductor 26d of the double-sided FPC 26 and the conductor 28a of the single-sided PWB 28.
Since 7 is interposed and pressed under uniform pressure, conductivity is generated and the conductor 26d and the conductor 28a are conducted. As described above, in the structure of the second embodiment, pressure contact of four sets of conductors is realized, but since the stress of the two anisotropic conductive rubbers 24 and 26 is applied to the one-sided PWB 28, the material is Depending on the situation, it may cause bending, resulting in poor pressure contact. As a countermeasure, a pressing plate made of iron or the like may be stacked on the upper surface of the single-sided PWB 28 for reinforcement.
【００２４】以上説明したように、本発明に基づく第２
実施例によれば、異方性導電ゴムを導体間に複数枚配置
してやることで、一つのコネクトスペースで、多数の回
路基板間の接続を実現することができ、また、従来の接
続構造とと比較して弾性部材や回路基板のレイアウトの
自由度が非常に大きくなる。 ＜第３実施例＞次に、本発明に基づく第３実施例の回路
基板の接続構造について説明する。図３は、本発明に基
づく第３実施例の回路基板の接続構造を示す図である。
図３において、３１はネジ穴３１ａ、位置決めピン３１
ｂから成る基板地板である。As described above, the second aspect of the present invention
According to the embodiment, by arranging a plurality of anisotropic conductive rubbers between the conductors, it is possible to realize the connection between a large number of circuit boards in one connect space, and the conventional connection structure. In comparison, the flexibility of layout of the elastic member and the circuit board is greatly increased. <Third Embodiment> Next, a circuit board connection structure according to a third embodiment of the present invention will be described. FIG. 3 is a diagram showing a circuit board connection structure according to a third embodiment of the present invention.
In FIG. 3, 31 is a screw hole 31a and a positioning pin 31.
It is a base plate made of b.
【００２５】３２は片面ＦＰＣで、導体３２ａ位置決め
穴３２ｂ、ネジ穴３２ｃから成る。３３は両面ＦＰＣ
で、基材の両面に導体３３ａ及び３３ｄのパターンがプ
リントされ、さらに位置決め穴３３ｂ、ネジ穴３３ｃが
開けられている。３４は異方性導電ゴムである。３５は
両面ＰＷＢであり、表裏に導体のパターン３５ａ、３５
ｄがプリントされ、また位置決め穴３５ｂ、ネジ穴３５
ｃが開けられている。Reference numeral 32 denotes a single-sided FPC, which comprises a conductor 32a, a positioning hole 32b, and a screw hole 32c. 33 is double-sided FPC
Then, the patterns of the conductors 33a and 33d are printed on both surfaces of the base material, and the positioning holes 33b and the screw holes 33c are formed. Reference numeral 34 is an anisotropic conductive rubber. 35 is a double-sided PWB, and conductor patterns 35a, 35 are provided on the front and back sides.
d is printed, positioning holes 35b, screw holes 35
c is open.
【００２６】３６は両面ＦＰＣで、導体３６ａ及び、３
６ｄ、位置決め穴３６、ネジ穴３６ｃから形成されてい
る。３７は片面ＦＰＣで、導体３７ａ、位置決め穴３７
ｂ、ネジ穴３７ｃから成っている。３８はコネクタ押さ
え板で、位置決め穴３８ａ、ネジ穴３８ｂが開けてあ
る。Reference numeral 36 is a double-sided FPC, which includes conductors 36a and 3
6d, a positioning hole 36, and a screw hole 36c. 37 is a single-sided FPC, which includes a conductor 37a and a positioning hole 37.
b, screw hole 37c. A connector pressing plate 38 has a positioning hole 38a and a screw hole 38b.
【００２７】３９は異方性導電ゴム３４を押圧すると共
に、各プリント基板の導体を圧接する押圧ゴムである。
４０は取付けネジである。まず、コネクタ押さえ板３８
の上からネジ４０で基板地板３に対してネジで締結して
その間に挟まれているプリント基板３２、３３、３５、
３６、３７、異方性導電ゴム３４、押圧ゴム３９は互い
に高い圧力で密着している。A pressing rubber 39 presses the anisotropic conductive rubber 34 and presses the conductor of each printed circuit board.
40 is a mounting screw. First, the connector pressing plate 38
The printed boards 32, 33, 35, which are fastened to the board base plate 3 with screws from above and sandwiched therebetween.
36, 37, the anisotropic conductive rubber 34, and the pressing rubber 39 are in close contact with each other with high pressure.
【００２８】このため、第１に片面ＦＰＣ３２の導体３
２ａと、両面ＦＰＣ３３の導体３３ａは剛体である基板
地板３１と、弾性部材である異方性導電ゴム３４の間に
挟持され、均一な圧力で圧着されて導通する。第２に両
面ＦＰＣ３３の導体３３ｄと、両面ＰＷＢ３５の導体３
５ａとは、その間に挟まれている異方性導電ゴム３４が
押圧され潰されるため、導電性を発生して電気的に導通
する。Therefore, firstly, the conductor 3 of the single-sided FPC 32 is
2a and the conductor 33a of the double-sided FPC 33 are sandwiched between the substrate base plate 31 which is a rigid body and the anisotropic conductive rubber 34 which is an elastic member, and are pressure-bonded with a uniform pressure to conduct electricity. Secondly, the conductor 33d of the double-sided FPC 33 and the conductor 3 of the double-sided PWB 35
Since the anisotropic conductive rubber 34 sandwiched between 5a and 5a is pressed and crushed, conductivity is generated and electrical conduction is established.
【００２９】第３に両面ＰＷＢ３５の導体３５ｄと、両
面ＦＰＣ３６の導体３６ａは、剛体である両面ＰＷＢ３
５の基材を受け部材として、反対面からは柔軟な片面Ｆ
ＰＣ３７を介して弾性部材である押圧ゴム３９の弾性力
が加わり、一様な圧力を持って密着し導通している。第
４に両面ＦＰＣ３６の導体３６ｄと、片面ＦＰＣ３７の
導体３７ａは、剛体である両面ＰＷＢ３５と弾性部材で
ある押圧ゴム３９の間に均一な圧力で圧着されて導通す
る。Thirdly, the conductor 35d of the double-sided PWB 35 and the conductor 36a of the double-sided FPC 36 are rigid body double-sided PWB3.
As a receiving member for the base material of No. 5, one side F is flexible from the opposite side
The elastic force of the pressing rubber 39, which is an elastic member, is applied via the PC 37, so that the rubber is in close contact with and conducts with a uniform pressure. Fourth, the conductor 36d of the double-sided FPC 36 and the conductor 37a of the single-sided FPC 37 are pressure-bonded between the double-sided PWB 35, which is a rigid body, and the pressing rubber 39, which is an elastic member, with a uniform pressure to be conductive.
【００３０】ここで、異方性導電ゴム３４は、通電抵抗
が比較的高いために、デジタル信号ラインの接続に関し
ては問題ないのであるが、アナログ信号ラインの接続の
際には電圧降下などの問題が生じる。また、異方性導電
ゴムであるゼブラゴムは、単純なゴムに比べて数倍コス
トが高いという問題もあるが、この問題に対しては使用
する異方性導電ゴムを必要最小限に抑えることで解決で
きる。Here, since the anisotropic conductive rubber 34 has a relatively high energization resistance, there is no problem in connection with the digital signal line, but there is a problem such as voltage drop in connection with the analog signal line. Occurs. Zebra rubber, which is an anisotropic conductive rubber, also has the problem that it is several times more expensive than simple rubber, but it is possible to minimize the amount of anisotropic conductive rubber used for this problem. Solvable.
【００３１】以上のように、本発明に基づく第３実施例
の構造によれば、異方性導電ゴムによる導体の接続を最
小限とし、代わりに通常のゴムで外側から押圧すること
で、接続される信号ラインの自由度アップ、コストダウ
ンを実現しつつ、４組のプリント基板の接続を実現して
いる。尚、本発明は、複数の機器から構成されるシステ
ムに適用しても、１つの機器から成る装置に適用しても
良い。また、本発明はシステム或は装置にプログラムを
供給することによって達成される場合にも適用できるこ
とはいうまでもない。As described above, according to the structure of the third embodiment of the present invention, the connection of the conductor by the anisotropic conductive rubber is minimized, and instead, the normal rubber is pressed from the outside to make the connection. The connection of four sets of printed circuit boards is realized while increasing the flexibility of the signal line and reducing the cost. The present invention may be applied to a system including a plurality of devices or an apparatus including a single device. Further, it goes without saying that the present invention can be applied to the case where it is achieved by supplying a program to a system or an apparatus.
【００３２】[0032]
【発明の効果】以上のように、本発明の回路基板の接続
構造によれば、回路基板同士を導通するための接続部分
となる弾性部材に異方性導電ゴムを利用し、この異方性
導電ゴムに隣接した２つの回路基板間を異方性導電ゴム
の導電性によって導通すると共に、弾性部材を介在しな
い離れた位置に配置された回路基板同士は、異方性導電
ゴムの弾性を用いて圧接して導通させるので、複数の回
路基板を圧接して導通する際に、ＰＷＢを置く位置や、
弾性部材のレイアウトに大幅な自由度を持たせることが
でき、機器の小型化に役立つことになる。As described above, according to the circuit board connection structure of the present invention, anisotropic conductive rubber is used for the elastic member that serves as a connection portion for conducting circuit boards to each other. The circuit board adjacent to the conductive rubber is electrically connected by the conductivity of the anisotropic conductive rubber, and the circuit boards arranged at distant positions without the elastic member use the elasticity of the anisotropic conductive rubber. Since they are brought into pressure contact with each other to make them conductive, when a plurality of circuit boards are brought into contact with each other by pressure, the position where the PWB is placed,
The layout of the elastic member can be given a great degree of freedom, which helps reduce the size of the device.
【図１】本発明に基づく第１実施例の接続構造を示す断
面図である。FIG. 1 is a sectional view showing a connection structure of a first embodiment according to the present invention.
【図２】本発明に基づく第２実施例の接続構造を示す断
面図である。FIG. 2 is a sectional view showing a connection structure of a second embodiment according to the present invention.
【図３】本発明に基づく第３実施例の接続構造を示す断
面図である。FIG. 3 is a cross-sectional view showing a connection structure of a third embodiment according to the present invention.
【図４】従来技術での接続構造を示す断面図である。FIG. 4 is a cross-sectional view showing a connection structure according to a conventional technique.
１、２１、３１…基板地板 ２、２２、３２、３７…片面ＦＰＣ ３、２３、２６、３３、３６…両面ＦＰＣ ４、２４、２７、３４…異方性導電ゴム ５、２８…片面ＰＷＢ ２５、３５…両面ＰＷＢ 1, 21, 31 ... Substrate base plate 2, 22, 32, 37 ... Single-sided FPC 3, 23, 26, 33, 36 ... Double-sided FPC 4, 24, 27, 34 ... Anisotropic conductive rubber 5, 28 ... Single-sided PWB 25 , 35 ... Double-sided PWB
Claims (9)
るための回路基板の接続構造において、 第１の回路基板と第２の回路基板とは、それらの間に介
在させた異方性導電ゴムを押圧することにより電気的に
接続され、前記第２の回路基板と第３の回路基板とは、
前記異方性導電ゴムを押圧することにより発生する弾性
力によって圧接されて電気的に接続されることを特徴と
する回路基板の接続構造。1. A circuit board connection structure for electrically connecting a plurality of circuit boards to each other, wherein the first circuit board and the second circuit board are anisotropic conductive materials interposed therebetween. The second circuit board and the third circuit board are electrically connected by pressing rubber, and
A connection structure of a circuit board, wherein the anisotropic conductive rubber is pressed and electrically connected by an elastic force generated by pressing the anisotropic conductive rubber.
板であり、前記第２の回路基板はフレキシブルな材質の
プリント基板であり、前記フレキシブルな材質のプリン
ト基板と前記第３の回路基板としての任意の材質のプリ
ント基板とは前記異方性導電ゴムを押圧することにより
発生する弾性力によって圧接されて電気的に接続される
ことを特徴とする請求項１に記載の回路基板の接続構
造。2. The first circuit board is a rigid printed circuit board, the second circuit board is a flexible printed circuit board, and the flexible printed circuit board and the third circuit board are used. 2. The circuit board connection structure according to claim 1, wherein the printed circuit board is made of any material and is electrically connected by being pressed into contact with the anisotropic conductive rubber by an elastic force generated by pressing the anisotropic conductive rubber. .
性導電ゴムを配置した面とは反対側の面には、前記第５
の回路基板と電気的に接続されるように第１の圧接接続
部が形成されていることを特徴とする請求項２に記載の
回路基板の接続構造。3. The surface of the first circuit board opposite to the surface on which the anisotropic conductive rubber is arranged is provided with the fifth
The circuit board connection structure according to claim 2, wherein the first press-connecting portion is formed so as to be electrically connected to the circuit board.
性導電ゴムを配置した面とは反対側の面には、前記第４
の回路基板と電気的に接続されるように第２の圧接接続
部が形成されていることを特徴とする請求項２に記載の
回路基板の接続構造。4. In the second circuit board, the surface of the second circuit board opposite to the surface on which the anisotropic conductive rubber is arranged is the fourth circuit board.
The circuit board connection structure according to claim 2, wherein the second pressure contact connection portion is formed so as to be electrically connected to the circuit board.
板と対向する面には、前記第２の圧接接続部に圧接され
て電気的に接続されるように第３の圧接接続部が形成さ
れていることを特徴とする請求項４に記載の回路基板の
接続構造。5. A third press-connecting connection portion is press-contacted with the second press-connecting connection portion and electrically connected to a surface of the third circuit board facing the second circuit board. The connection structure for a circuit board according to claim 4, wherein the connection structure is formed.
るための回路基板の接続構造において、 第１の回路基板と第２の回路基板とは、それらの間に介
在させた第１の異方性導電ゴムを押圧することにより電
気的に接続され、前記第２の回路基板と第３の回路基板
とは、前記第１の異方性導電ゴムを押圧することにより
発生する弾性力によって圧接されて電気的に接続され、
前記第３の回路基板の前記異方性導電ゴムが配置された
面とは反対側の面には、第４の回路基板と電気的に接続
されるように第１の圧接接続部が形成され、前記第３の
回路基板と第４の回路基板とは、それらの間に介在させ
た第２の異方性導電ゴムを押圧することにより電気的に
接続され、前記第４の回路基板と第５の回路基板とは、
前記第１及び第２の異方性導電ゴムを押圧することによ
り発生する弾性力によって圧接されて電気的に接続され
ることを特徴とする回路基板の接続構造。6. A circuit board connection structure for electrically connecting a plurality of circuit boards to each other, wherein the first circuit board and the second circuit board have a first difference interposed therebetween. It is electrically connected by pressing the anisotropic conductive rubber, and the second circuit board and the third circuit board are pressed against each other by an elastic force generated by pressing the first anisotropic conductive rubber. Is electrically connected,
A first press-connecting portion is formed on a surface of the third circuit board opposite to the surface on which the anisotropic conductive rubber is arranged so as to be electrically connected to the fourth circuit board. The third circuit board and the fourth circuit board are electrically connected to each other by pressing the second anisotropic conductive rubber interposed therebetween, and the fourth circuit board and the fourth circuit board are electrically connected to each other. What is the 5 circuit board?
A connection structure of a circuit board, wherein the first and second anisotropic conductive rubbers are pressed into contact with each other by an elastic force generated by pressing and are electrically connected.
ント基板であり、前記第２、第４の回路基板はフレキシ
ブルな材質のプリント基板であり、前記第４の回路基板
と前記第５の回路基板としての任意の材質のプリント基
板とは前記第１及び第２の異方性導電ゴムを押圧するこ
とにより発生する弾性力によって圧接されて電気的に接
続されることを特徴とする請求項６に記載の回路基板の
接続構造。7. The first and third circuit boards are rigid printed boards, the second and fourth circuit boards are flexible printed boards, and the fourth circuit board and the fourth circuit board 5. The printed circuit board of any material as the circuit board of 5 is electrically connected by being pressed by the elastic force generated by pressing the first and second anisotropic conductive rubbers. The circuit board connection structure according to claim 6.
るための回路基板の接続構造において、 第１の回路基板と第２の回路基板とは、それらの間に介
在させた第１の異方性導電ゴムを押圧することにより電
気的に接続され、前記第２の回路基板と第３の回路基板
とは、前記第１の異方性導電ゴムを押圧することにより
発生する弾性力によって圧接されて電気的に接続され、
前記第１の回路基板の前記異方性導電ゴムが配置された
面とは反対側の面には、第４の回路基板と電気的に接続
されるように第１の圧接接続部が形成され、前記第１の
回路基板と第４の回路基板とは、その更に上部に配置さ
れた弾性物質の押さえ板を押圧することにより発生する
該弾性物質の弾性力によって圧接されて電気的に接続さ
れることを特徴とする回路基板の接続構造。8. A circuit board connection structure for electrically connecting a plurality of circuit boards to each other, wherein the first circuit board and the second circuit board have a first difference interposed therebetween. It is electrically connected by pressing the anisotropic conductive rubber, and the second circuit board and the third circuit board are pressed against each other by an elastic force generated by pressing the first anisotropic conductive rubber. Is electrically connected,
A first press-connecting portion is formed on the surface of the first circuit board opposite to the surface on which the anisotropic conductive rubber is arranged so as to be electrically connected to the fourth circuit board. The first circuit board and the fourth circuit board are pressure-contacted and electrically connected by the elastic force of the elastic substance generated by pressing a pressing plate made of an elastic substance disposed further above the first circuit substrate and the fourth circuit substrate. A circuit board connection structure characterized in that:
板であり、前記第２、第４の回路基板はフレキシブルな
材質のプリント基板であり、前記第４の回路基板は任意
の材質のプリント基板である第５の回路基板と前記弾性
体を押圧することにより発生する弾性力によって圧接さ
れて電気的に接続されることを特徴とする請求項８に記
載の回路基板の接続構造。9. The first circuit board is a rigid printed board, the second and fourth circuit boards are printed boards made of a flexible material, and the fourth circuit board is made of a printed material made of an arbitrary material. 9. The circuit board connection structure according to claim 8, wherein the fifth circuit board, which is a board, is electrically pressed and connected by an elastic force generated by pressing the elastic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7111970A JPH08307030A (en) | 1995-05-10 | 1995-05-10 | Connection structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7111970A JPH08307030A (en) | 1995-05-10 | 1995-05-10 | Connection structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08307030A true JPH08307030A (en) | 1996-11-22 |
Family
ID=14574709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7111970A Withdrawn JPH08307030A (en) | 1995-05-10 | 1995-05-10 | Connection structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08307030A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030048744A (en) * | 2001-12-13 | 2003-06-25 | 김도형 | Connector holder for surface mount |
| WO2007138843A1 (en) | 2006-05-31 | 2007-12-06 | Nec Corporation | Circuit board device, method for connecting wiring boards, and circuit substrate module device |
| US8130511B2 (en) | 2006-05-22 | 2012-03-06 | Nec Corporation | Circuit board device, wiring board connecting method, and circuit board module device |
-
1995
- 1995-05-10 JP JP7111970A patent/JPH08307030A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030048744A (en) * | 2001-12-13 | 2003-06-25 | 김도형 | Connector holder for surface mount |
| US8130511B2 (en) | 2006-05-22 | 2012-03-06 | Nec Corporation | Circuit board device, wiring board connecting method, and circuit board module device |
| WO2007138843A1 (en) | 2006-05-31 | 2007-12-06 | Nec Corporation | Circuit board device, method for connecting wiring boards, and circuit substrate module device |
| US8144482B2 (en) | 2006-05-31 | 2012-03-27 | Nec Corporation | Circuit board device, wiring board interconnection method, and circuit board module device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020806 |