JPS623978B2 - - Google Patents

Info

Publication number
JPS623978B2
JPS623978B2 JP11418180A JP11418180A JPS623978B2 JP S623978 B2 JPS623978 B2 JP S623978B2 JP 11418180 A JP11418180 A JP 11418180A JP 11418180 A JP11418180 A JP 11418180A JP S623978 B2 JPS623978 B2 JP S623978B2
Authority
JP
Japan
Prior art keywords
tape
bonding
semiconductor
tape carrier
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11418180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5737866A (en
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11418180A priority Critical patent/JPS5737866A/ja
Publication of JPS5737866A publication Critical patent/JPS5737866A/ja
Publication of JPS623978B2 publication Critical patent/JPS623978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP11418180A 1980-08-20 1980-08-20 Tape carrier for semiconductor device Granted JPS5737866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11418180A JPS5737866A (en) 1980-08-20 1980-08-20 Tape carrier for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11418180A JPS5737866A (en) 1980-08-20 1980-08-20 Tape carrier for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5737866A JPS5737866A (en) 1982-03-02
JPS623978B2 true JPS623978B2 (pt) 1987-01-28

Family

ID=14631214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11418180A Granted JPS5737866A (en) 1980-08-20 1980-08-20 Tape carrier for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5737866A (pt)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020017071A1 (ja) 2018-07-18 2020-01-23 株式会社アスカネット 立体像結像装置の製造方法及び立体像結像装置
US11402654B2 (en) 2017-06-01 2022-08-02 Asukanet Company, Ltd. Method for manufacturing stereoscopic image forming device, and stereoscopic image forming device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
JPH0754813B2 (ja) * 1986-08-29 1995-06-07 株式会社東芝 フイルムキヤリア基板
JP2755229B2 (ja) * 1995-10-06 1998-05-20 セイコーエプソン株式会社 電子回路基板部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11402654B2 (en) 2017-06-01 2022-08-02 Asukanet Company, Ltd. Method for manufacturing stereoscopic image forming device, and stereoscopic image forming device
WO2020017071A1 (ja) 2018-07-18 2020-01-23 株式会社アスカネット 立体像結像装置の製造方法及び立体像結像装置
KR20210028698A (ko) 2018-07-18 2021-03-12 가부시키가이샤 아스카넷토 입체상 결상 장치의 제조 방법 및 입체상 결상 장치

Also Published As

Publication number Publication date
JPS5737866A (en) 1982-03-02

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