JPS62288638A - Structural member composed of polyether imide - Google Patents
Structural member composed of polyether imideInfo
- Publication number
- JPS62288638A JPS62288638A JP13173686A JP13173686A JPS62288638A JP S62288638 A JPS62288638 A JP S62288638A JP 13173686 A JP13173686 A JP 13173686A JP 13173686 A JP13173686 A JP 13173686A JP S62288638 A JPS62288638 A JP S62288638A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- structural member
- weight
- adhesive
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004697 Polyetherimide Substances 0.000 title claims abstract description 19
- 229920001601 polyetherimide Polymers 0.000 title claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 12
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 9
- 239000001257 hydrogen Substances 0.000 claims abstract description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920003244 diene elastomer Polymers 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract description 3
- 150000002431 hydrogen Chemical class 0.000 abstract description 3
- 239000004845 glycidylamine epoxy resin Substances 0.000 abstract 1
- 239000004849 latent hardener Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- -1 and among them Polymers 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 229920004770 ULTEM® 2200 Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
（産業上の利用分野）
本発明はポリエーテルイミドを主要成分とする構造部材
に関するものである。Detailed Description of the Invention 3. Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a structural member containing polyetherimide as a main component.
（従来の技術）
近年、高性能樹脂が金属に比し軽いという特性に加えて
、金属材料には見られない耐腐蝕性、絶縁性等を有する
為、従来金属材料の使用が一般的であった各種の構造部
材、例えば電気、電子機器、機械、自動車、航空機等の
フレームや駆動個所、或いは土木建築材料等に頻繁に使
われるようになってきた。(Conventional technology) In recent years, the use of metal materials has become less common because high-performance resins are lighter than metals and also have corrosion resistance and insulation properties that are not found in metal materials. It has come to be frequently used in various structural members, such as frames and driving parts of electrical and electronic equipment, machinery, automobiles, and aircraft, as well as civil engineering and construction materials.
高機能性樹脂として、各種のエンジニアリングプラスチ
ックが使用されているが、なかでもポリエーテルイミド
は機械的特性、熱的特性！：すくれた非晶質の熱可塑性
樹脂であり、この樹脂を基材とする構造部材の開発が各
積行われていた。構造部材とは通常の成形方法では成形
困難なもの、例えば厚板、大容量の部材、複雑な形状を
した部材等を示し、これ等は一般には各部品を寄せ集め
て接着層を介して成り立っているものである。例えば厚
板を製造する場合、通常の成型方法、例えば射出成型、
押出成型等により成型しうる厚みのものを成型し、然る
後、これを積層し、接着剤を介して所望する厚みの板を
える如きものである。このように部品と接着材を使用す
ることにより任意の構造を有する部材が製造できる。Various engineering plastics are used as high-performance resins, and among them, polyetherimide has excellent mechanical and thermal properties! : It is a hollow amorphous thermoplastic resin, and many efforts have been made to develop structural members using this resin as a base material. Structural components refer to items that are difficult to mold using normal molding methods, such as thick plates, large-capacity components, and components with complex shapes.These components are generally assembled by assembling individual components and using an adhesive layer. It is something that For example, when manufacturing thick plates, conventional molding methods such as injection molding,
A plate of a desired thickness is obtained by molding a sheet of a desired thickness by extrusion molding or the like, and then laminating the sheets with an adhesive. By using parts and adhesives in this manner, members having arbitrary structures can be manufactured.
従来、ポリエーテルイミドよりかかる構造部材を製造す
るには、ポリエーテルイミドよりなる部品を用いて、加
熱融着、超音波融着によるか、または接着しようとする
面に材料を一部溶解する溶媒を介して接合する方法等が
あった。加熱融着では形状の複雑なものの接合は不可能
であり、超音波融着では厚物の接合ができなかった。ま
た溶媒を使用する接合法では歿留溶媒による界面の劣化
、例えばクランク、接着強度の低下、外観変化が問題と
なっていた。Conventionally, such structural members have been manufactured from polyetherimide by using components made of polyetherimide and using heat fusion, ultrasonic fusion, or solvents that partially dissolve the material on the surfaces to be bonded. There were methods such as joining via. It is impossible to join objects with complicated shapes using heat fusion, and it is not possible to join thick objects using ultrasonic fusion. Furthermore, bonding methods using solvents have had problems such as deterioration of the interface due to residual solvent, such as cranking, reduction in adhesive strength, and changes in appearance.
さらには、エポキシ系接着材を使用する方法も試みられ
ている。エポキシ系接着剤は無溶媒型、あるいは常温硬
化型または加熱硬化型等各種のものがある為、接着方法
が容易となり、厚物および形状の複雑なものの接合が可
能となったが、しかしこの場合にも接合後の強度が十分
でなく、耐水性、耐熱水性等に問題があり、実用に供せ
られるに至っていなかった。Furthermore, methods using epoxy adhesives have also been attempted. Epoxy adhesives come in various types, such as solvent-free, room-temperature-curing, and heat-curing types, making the bonding method easier and making it possible to join thick objects and objects with complex shapes.However, in this case However, the strength after bonding was insufficient, and there were problems with water resistance, hot water resistance, etc., and it had not been put to practical use.
（発明が解決しようとする問題点）
本発明の目的は、ポリエーテルイミドを主要成分とする
構造部材において、新しいエポキシ系接着剤により接合
した構造部材を提供することにある。(Problems to be Solved by the Invention) An object of the present invention is to provide a structural member whose main component is polyetherimide, which is bonded using a new epoxy adhesive.
（問題点を解決するための手段）
本発明者らは前記目的を達成する為に、種々検討した結
果、本発明を完成するに至ったものであすなわち、本発
明の構造部材は、
（ｉ）１分子中に２個のエポキシ基を有する数平均分子
量が１５００〜４００００のエポキシ樹脂１００重量部
に対して、
（ｉｉ）１分子中に３個以上のエポキシ基を有するエポ
キシ樹脂２５〜７５重量部、
（ｉｉｉ）アクリルニトリルを１５〜３５重量％共重合
した末端にカルボキシ基を含育するジエンゴム７５〜１
３０重量部、
（ｉｖ）活性水素を有する潜在性硬化剤、をエポキシ基
／（カルボキシル基＋活性水素）の当量比が１／１〜１
１０．５の範囲となるように配合してなる接着剤により
接合したポリエーテルイミドを主要成分とする構造部材
である。(Means for Solving the Problems) In order to achieve the above object, the present inventors have completed the present invention as a result of various studies, that is, the structural member of the present invention is as follows: ) 100 parts by weight of an epoxy resin having two epoxy groups in one molecule and a number average molecular weight of 1,500 to 40,000; (ii) 25 to 75 parts by weight of an epoxy resin having three or more epoxy groups in one molecule; (iii) Diene rubber 75-1 containing a carboxy group at the end, which is copolymerized with 15 to 35% by weight of acrylonitrile.
30 parts by weight, (iv) latent curing agent having active hydrogen, with an equivalent ratio of epoxy group/(carboxyl group + active hydrogen) of 1/1 to 1.
This is a structural member whose main component is polyetherimide bonded with an adhesive compounded in a range of 10.5.
本発明でいうポリエーテルイミドとは、その構造中にエ
ーテル結合とイミド結合を共に有しているポリマーの総
称であるが、一般には（１）式で表される構造ををする
米国ゼネラル・エレクトリック社製の商品名ウルテムが
広く知られており、例えば特開昭５６−８２６号公報に
記載された方法によって容易に製造することができる。Polyetherimide as used in the present invention is a general term for polymers that have both ether bonds and imide bonds in their structure, and generally has the structure represented by formula (1). The product name Ultem, manufactured by Co., Ltd., is widely known and can be easily produced, for example, by the method described in JP-A-56-826.
このポリマーは、耐熱性、耐薬品性、難燃性、電気特性
および成形性の優れた非品性熱可塑性エンジニアリング
プラスチックとして注目を浴びており、電気、電子部品
、自動車部品、機械部品等の分野への幅広い適用が期待
されている。This polymer is attracting attention as a non-grade thermoplastic engineering plastic with excellent heat resistance, chemical resistance, flame retardance, electrical properties, and moldability, and is used in fields such as electrical, electronic parts, automobile parts, and mechanical parts. It is expected that it will be widely applied.
本発明に於いて１分子中に２個のエポキシ基を有する数
平均分子量が１５００〜４００００のエポキシ樹脂とし
ては、ビスフェノールＡ型、ビスフェノールＦ型のエポ
キシ樹脂、具体的には例えばエピコーＨ００４，１００
７，１００９（油化シェルエポキシ■製、商品名エピコ
ート）等が挙げられる。数平均分子量が１５００より小
さい時は耐熱性が劣る。又分子量が４０００よ、り大き
い時は、接着力が低下する。In the present invention, epoxy resins having two epoxy groups in one molecule and having a number average molecular weight of 1,500 to 40,000 include bisphenol A type and bisphenol F type epoxy resins, specifically, for example, Epicor H004, 100.
7,1009 (manufactured by Yuka Shell Epoxy ■, trade name Epicote), and the like. When the number average molecular weight is less than 1500, heat resistance is poor. Furthermore, when the molecular weight is greater than 4000, the adhesive strength decreases.
本発明に於いて１分子中に３個以上のエポキシ基を有す
るエポキシ樹脂としては、グリシジルアミン系エポキシ
樹脂、ノボラック型エポキシ樹脂、Ｏ−タレゾールノボ
ラック型エポキシ樹脂等が挙げられるが、特に接着性の
点からグリシジルアミン系エポキシ樹脂が望ましい。In the present invention, examples of epoxy resins having three or more epoxy groups in one molecule include glycidylamine-based epoxy resins, novolac-type epoxy resins, O-talesol novolak-type epoxy resins, etc. From this point of view, glycidylamine-based epoxy resins are preferable.
グリシジルアミン系エポキシ樹脂として、例えばテトラ
グリシジルジアミノジフェニルメタン、トリグリシジル
−パラアミノフェノール、トリグリシジル−メタアミノ
フェノール、テトラグリシジルメタキシレンジアミン、
テトラグリシジルビスアミノメチルシクロヘキサン等が
挙げられる。Examples of glycidylamine-based epoxy resins include tetraglycidyldiaminodiphenylmethane, triglycidyl-para-aminophenol, triglycidyl-methaminophenol, tetraglycidylmethaxylene diamine,
Examples include tetraglycidylbisaminomethylcyclohexane.
配合割合が２５重量部より少ない時は、耐熱性が劣る。When the blending ratio is less than 25 parts by weight, heat resistance is poor.
又７５重量部より多い時は、可撓性が低下する。Moreover, when the amount is more than 75 parts by weight, flexibility decreases.
本発明に於いて、アクリルニトリルの共重合量が１５〜
３５重量％である両末端にカルボキシル基を有するジエ
ンゴムのゴム成分としては、ブタジェンが一般的である
。アクリルニトリルの共重合量が１５重量％より少ない
時は、接着強度、耐熱性が低下する。アクリルニトリル
の共重合量が３５重量％より多い時は、可撓性が低下す
る。In the present invention, the copolymerization amount of acrylonitrile is 15 to
Butadiene is generally used as the rubber component of diene rubber having carboxyl groups at both ends, which is 35% by weight. When the copolymerized amount of acrylonitrile is less than 15% by weight, adhesive strength and heat resistance are reduced. When the copolymerized amount of acrylonitrile is more than 35% by weight, flexibility decreases.
具体的な例としては、例えば、ハイカー（ＣＴＢＮ−１
３００Ｘ１３、ＣＴＢ）ｌ−１３００Ｘ８、ＣＴＢＮ−
１３００Ｘ９（米国、ＢＦ、Ｇｏｏｄｒｉｃｈ社（製）
商品名）二ポール１０７２（日本ゼオン社（製）商品名
）等が挙げられる。ジエンゴムが７５重量部より少ない
時は、接着力が低下する。又１３０重量部より多い時は
耐熱性が劣る。As a specific example, for example, Hiker (CTBN-1
300X13,CTB)l-1300X8,CTBN-
1300X9 (USA, BF, manufactured by Goodrich)
(trade name) Nipol 1072 (trade name, manufactured by Nippon Zeon Co., Ltd.), etc. When the diene rubber is less than 75 parts by weight, the adhesive strength decreases. Moreover, when the amount is more than 130 parts by weight, the heat resistance is poor.
本発明に於いて活性水素を有する潜在性硬化剤として、
例えば、ジシアンジアミド、アジピン酸ジヒドラジド、
ダイマー酸ジヒドラジド、イソフタル酸ジヒドラジド、
セパチン酸ジヒドラジド等の有機酸ヒドラジド類等が挙
げられ、これらから成る群より選ばれた１種もしくは２
種以上のものが使用される。In the present invention, as a latent curing agent having active hydrogen,
For example, dicyandiamide, adipic acid dihydrazide,
dimer acid dihydrazide, isophthalic acid dihydrazide,
Examples include organic acid hydrazides such as cepatic acid dihydrazide, and one or two selected from the group consisting of these.
More than one species is used.
本発明に於けるエポキシ基に対するカルボキシル基と活
性水素との配合当量比は接着性、耐熱性、可撓性の点か
ら１７１〜１１０．５の範囲であり、上記潜在性硬化剤
の量は活性水素がこの範囲を満足するように選ばれる。In the present invention, the blending equivalent ratio of carboxyl group to active hydrogen to epoxy group is in the range of 171 to 110.5 from the viewpoint of adhesion, heat resistance, and flexibility, and the amount of the latent curing agent is in the range of 171 to 110.5. Hydrogen is selected to satisfy this range.
当量比が１より小さい時は接着力、可撓性が低下する。When the equivalence ratio is less than 1, adhesive strength and flexibility decrease.
当量比が２より大きい時は、可撓性が低下する。When the equivalence ratio is greater than 2, flexibility decreases.
本発明における接着剤は以上のように耐熱性、接着性、
可撓性にすぐれたものであるが、通常接着剤に使用され
る添加剤、無機フィラー等を本発明の硬化を妨げない範
囲で混合使用することが出来る。又、零発゛明の接着剤
は通常使用にあたっては溶剤に溶解させて使用するのが
一般的である。The adhesive in the present invention has heat resistance, adhesive properties,
Although it has excellent flexibility, additives, inorganic fillers, etc. commonly used in adhesives can be mixed and used within the range that does not interfere with the curing of the present invention. Furthermore, adhesives developed from scratch are generally used after being dissolved in a solvent.
使用される溶剤として、例えば、アセトン、メチルエチ
ルケトン、キシレン、トルエン、プクノール、セロソル
ブアセテート等エポキシを溶解する溶剤であれば何ら限
定するものではない。The solvent used is not particularly limited as long as it can dissolve epoxy, such as acetone, methyl ethyl ketone, xylene, toluene, Pukunor, cellosolve acetate, etc.
本発明による構造部材はポリエーテルイミドにより通常
公知の成型方法、例えば圧縮成型、移送成型、射出成型
、押出成型等により任意の形状を有する部品を製造し、
この部品を２個以上寄せ集めて所望する構造部材になる
ようにした後、各接着面に接着剤を用いて接合させる。The structural member according to the present invention is produced by manufacturing a component having an arbitrary shape from polyetherimide by a commonly known molding method such as compression molding, transfer molding, injection molding, extrusion molding, etc.
After two or more of these parts are assembled to form a desired structural member, they are joined together using an adhesive on each adhesive surface.
前述したエポキシ系接着剤は各部品の表面に１０〜１０
０μの厚みで塗布し、次いで接着面同志を重ね合わせ、
常圧好ましくは１．ＯＫｇ／ｃｎ１以上１００Ｋｇ／ｃ
ｊ以下の圧力をかけて常温下１０分以上、場合によって
は数日間この状態で保つか、あるいは接着したものを３
０℃以上２００℃以下の温度に保ってもよい。この場合
、接着時間は常温の場合に比べて大幅に短縮されるので
、作業時間が問題になる場合には加熱処理するとよい。The above-mentioned epoxy adhesive is applied to the surface of each part at a concentration of 10 to 10
Apply with a thickness of 0μ, then overlap the adhesive surfaces,
Normal pressure preferably 1. OKg/cn1 or more 100Kg/c
Apply a pressure of less than
The temperature may be maintained at 0°C or higher and 200°C or lower. In this case, the bonding time is significantly shorter than that at room temperature, so if working time is a problem, heat treatment is recommended.
ポリエーテルイミドよりなる部品はポリエーテルイミド
単独でなくてもよく、場合によってはポリエーテルイミ
ドに通常公知の充填材、例えば無機粉末、硝子繊維、炭
素繊維、チタン酸カリウム繊維等を含有してもよい。Parts made of polyetherimide do not need to be made of polyetherimide alone; in some cases, polyetherimide may contain commonly known fillers such as inorganic powder, glass fiber, carbon fiber, potassium titanate fiber, etc. good.
また構造部材を製造する場合目的とする用途によっては
ポリエーテルイミドを主要成分とする部品に一部他の材
料、例えば、ボリアリレート、ポリエーテルスルホン、
ポリサルホン等に代表されるガラス転移点１５０℃以上
の非晶質ポリマーや、ポリエーテルエーテルケトン、ポ
リフェニレンサルファイド等に代表されるガラス転移点
５０℃以上の結晶質ポリマーよりなる部品を併用しても
よい。In addition, when manufacturing structural members, depending on the intended use, some parts containing polyetherimide as a main component may be made of other materials such as polyarylate, polyether sulfone, etc.
Parts made of an amorphous polymer with a glass transition point of 150°C or higher, such as polysulfone, or a crystalline polymer with a glass transition point of 50°C or higher, such as polyetheretherketone or polyphenylene sulfide, may be used in combination. .
（実施例）
以下、実施例により本発明を更に具体的に説明する。な
お、実施例及び比較例で「部」又は「％」はそれぞれ重
量部、重量％を意味する。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples. Note that in Examples and Comparative Examples, "part" or "%" means part by weight or % by weight, respectively.
（実施例及び比較例）
第１表に示す配合処方に従って接着剤を調整した。尚、
粉末原料であるジシアンジアミドの分散は三本ロールに
て行った。(Examples and Comparative Examples) Adhesives were prepared according to the formulation shown in Table 1. still,
Dispersion of dicyandiamide, which is a powder raw material, was carried out using a triple roll.
第１表の原料の記号は次の通りである。The symbols of the raw materials in Table 1 are as follows.
Ａ：油化シェルエポキシ■製、商品名エピコート１００
７ （分子！２９００）をキジロール／セロソルブアセ
テート／ブタノール＝ ４０／４０／２０のｌ昆合２容
剤Ｈこ（容解させた固形分５０％のワニス
ＢＡＡと同様にエピコート１００４（分子量１６００）
を上記混合溶剤に溶解させた固形分５０％のワニスＣ：
Ａと同様にエピコート１００１（分子量９００）を上記
混合溶剤に溶解させた固形分５０％のワニスＤ：テトラ
グリシジルジアミノジフェニルメタンＥ：テトラグリシ
ジル−メタ−キシリレンジアミン
ＣＴＢＮ−１３００Ｘ１３ ：結合アクリルニトリル２
７ｚＣＴＢＮ−１３００Ｘ ８ ：結合アクリルニトリ
ＪＬｔ １７χＣＴＢＮ−１３００Ｘ３１ ：結合アク
リルニトリル１０χ実施例１〜４
ポリエーテルイミド樹脂ＵＬＴＥＭ１００Ｏ（ゼネラル
・エレクトリック社製）を使用し、型締カフ５ ｔｏｎ
の射出成型機により、成型温度３８０℃で１５０ ｘｉ
ｓ。A: Made by Yuka Shell Epoxy■, trade name Epicoat 100
7 (Molecular weight! 2900) is mixed with Kijirol/Cellosolve acetate/Butanol = 40/40/20 in 2 volumes H (dissolved 50% solids varnish BAA as well as Epicote 1004 (Molecular weight 1600)
Varnish C with a solid content of 50% dissolved in the above mixed solvent:
A varnish with a solid content of 50% in which Epicote 1001 (molecular weight 900) is dissolved in the above mixed solvent in the same manner as A: D: Tetraglycidyldiaminodiphenylmethane E: Tetraglycidyl-meta-xylylene diamine CTBN-1300X13: Bonded acrylonitrile 2
7zCTBN-1300X 8: Bonded acrylonitrile JLt 17χCTBN-1300X31: Bonded acrylonitrile 10χ Examples 1 to 4 Using polyetherimide resin ULTEM100O (manufactured by General Electric Company), mold clamping cuff 5 ton
150 xi at a molding temperature of 380℃ using an injection molding machine of
s.
×３１１Ｉ１１の平板を製造した。 この平板を１０枚
重ね合わせ、重ね合わせた部分に第１表に示す各接着剤
を２０μの厚みで塗布し、１００℃、１０にｇ／ｃ＋ａ
の圧力で３時間接着させ、厚み３０ｓｎの構造部材をえ
た。A flat plate of ×311I11 was manufactured. Stack 10 of these flat plates, apply each adhesive listed in Table 1 to the stacked part to a thickness of 20μ, and heat at 100°C to 10g/c+a.
The adhesive was bonded for 3 hours under a pressure of 30 nm to obtain a structural member with a thickness of 30 sn.
この構造部材を１００℃で熱水中に１０日間浸漬して接
着状況の変化を観察した。This structural member was immersed in hot water at 100° C. for 10 days, and changes in the adhesion state were observed.
結果を第２表に示す。The results are shown in Table 2.
実施例５
ポリエーテルイミド樹脂ＵＬＴＥＭ２２００ （ゼネラ
ル・エレクトリック社製、硝子繊維２０χ含有）を使用
し、型締カフ５ｔｏｎの射出成型機により、成型温度３
８０℃で１５０ Ｘ １５０ ｘ ３ａ＋ｍの平板を製
造した。Example 5 Polyetherimide resin ULTEM2200 (manufactured by General Electric Co., containing 20x glass fiber) was used, and an injection molding machine with a 5 ton clamping cuff was used at a molding temperature of 3.
A flat plate of 150 x 150 x 3a+m was produced at 80°C.
この平板を、実施例１と同様の方法で接着して厚み３０
ｓａ＋の構造部材を得た。実施例１と同様に熱水浸漬テ
スト後の状況変化を観察した。This flat plate was glued in the same manner as in Example 1 to a thickness of 30 mm.
A sa+ structural member was obtained. As in Example 1, changes in the situation after the hot water immersion test were observed.
結果を第２表に示す。The results are shown in Table 2.
比較例１〜７
ポリエーテルイミド樹脂ＵＬＴＥＭ１００Ｏ（ゼネラル
・エレクトリック社製）を使用し、型締カフ５ ｔｏｎ
の射出成型機により、成型温度３８０℃で１５０ ｘｔ
ｓ。Comparative Examples 1 to 7 Using polyetherimide resin ULTEM100O (manufactured by General Electric Company), mold clamping cuff 5 ton
150 xt at a molding temperature of 380℃ using an injection molding machine.
s.
×３Ｉ１ｍの平板を製造した。 この平板を１０枚重ね
合わせ、重ね合わせた部分に第１表に示す各接着剤を２
０μの厚みで塗布し、１００℃、１０Ｋｇ／−の加圧下
で３時間接合した。A flat plate of ×3I1m was manufactured. Stack 10 of these flat plates and apply 2 coats of each adhesive shown in Table 1 to the stacked area.
It was coated to a thickness of 0 μm and bonded for 3 hours at 100° C. under a pressure of 10 kg/−.
この構造部材を１００℃の熱水中に１０日間浸漬して接
着状況の変化を観察した。This structural member was immersed in hot water at 100° C. for 10 days, and changes in the adhesion state were observed.
結果を第２表に示す。The results are shown in Table 2.
（発明の効果）(Effect of the invention)
Claims (1)
量が１５００〜４００００のエポキシ樹脂１００重量部
に対して、 （ｉｉ）１分子中に３個以上のエポキシ基を有するエポ
キシ樹脂２５〜７５重量部、 （ｉｉｉ）アクリルニトリルを１５〜３５重量％共重合
した末端にカルボキシ基を含有するジエンゴム７５〜１
３０重量部、 （ｉｖ）活性水素を有する潜在性硬化剤をエポキシ基／
（カルボキシル基＋活性水素）の当量比が１／１〜０．
５の範囲となるように配合してなる接着剤により接合し
たポリエーテルイミドを主要成分とする構造部材。Scope of Claims: (i) For 100 parts by weight of an epoxy resin having two epoxy groups in one molecule and having a number average molecular weight of 1,500 to 40,000, (ii) Three or more epoxy groups in one molecule 25 to 75 parts by weight of an epoxy resin having the following: (iii) 75 to 1 diene rubber containing a carboxyl group at the end, which is copolymerized with 15 to 35% by weight of acrylonitrile.
30 parts by weight, (iv) a latent curing agent having active hydrogen with an epoxy group/
The equivalent ratio of (carboxyl group + active hydrogen) is 1/1 to 0.
A structural member whose main component is polyetherimide bonded with an adhesive having a composition within the range of 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13173686A JPS62288638A (en) | 1986-06-09 | 1986-06-09 | Structural member composed of polyether imide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13173686A JPS62288638A (en) | 1986-06-09 | 1986-06-09 | Structural member composed of polyether imide |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62288638A true JPS62288638A (en) | 1987-12-15 |
Family
ID=15064991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13173686A Pending JPS62288638A (en) | 1986-06-09 | 1986-06-09 | Structural member composed of polyether imide |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62288638A (en) |
-
1986
- 1986-06-09 JP JP13173686A patent/JPS62288638A/en active Pending
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