JPS62285498A - Multilayer printed interconnection board - Google Patents
Multilayer printed interconnection boardInfo
- Publication number
- JPS62285498A JPS62285498A JP12849786A JP12849786A JPS62285498A JP S62285498 A JPS62285498 A JP S62285498A JP 12849786 A JP12849786 A JP 12849786A JP 12849786 A JP12849786 A JP 12849786A JP S62285498 A JPS62285498 A JP S62285498A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- multilayer printed
- base material
- printed wiring
- impregnated base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 31
- 238000000465 moulding Methods 0.000 description 6
- -1 polyphenylene Polymers 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔技術分野〕
この発明は、電子機器等に用いられる多層プリント配線
基板に関するものである。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Technical Field] The present invention relates to a multilayer printed wiring board used in electronic equipment and the like.
従来の多層プリント配線基板は、内層材と外層材との間
に樹脂含浸基材を介在させて猜層成形して得られるもの
で、内層材表面の電４Ｘ回路の凹凸を充填するため樹脂
含浸基材の樹脂が流出し樹脂含浸基材自身の樹脂量が不
足し、多層プリント配＃Ｓｉ基板のハンダ加工時にミー
ズリング現象が多発し信頼性を低下させていたものであ
る。Conventional multilayer printed wiring boards are obtained by interposing a resin-impregnated base material between an inner layer material and an outer layer material, and then molding the resin into layers. The resin in the base material leaked out, resulting in an insufficient amount of resin in the resin-impregnated base material itself, and the measling phenomenon occurred frequently during soldering of multilayer printed #Si boards, reducing reliability.
本発明の目的とするところはミーズリング現象の発生し
ない多層プリント配線基板を提供することにある。An object of the present invention is to provide a multilayer printed wiring board in which the measling phenomenon does not occur.
本発明は所要枚数の内層材の各表面に樹脂層を介して樹
脂含浸基材層が存在し、更に最外側に外層材が配設され
てなることを特徴とする多層プリント配線基板のため、
内層材表面の電気回路の凹凸を樹脂充填しても樹脂含浸
基材自身の樹脂量も充分確保できるためミーズリング現
象の発生を大巾に域少させることかできたもので、以下
本発明の詳細な説明する。The present invention provides a multilayer printed wiring board characterized in that a resin-impregnated base material layer is present on each surface of a required number of inner layer materials via a resin layer, and an outer layer material is further disposed on the outermost side.
Even if the unevenness of the electric circuit on the surface of the inner layer material is filled with resin, the amount of resin in the resin-impregnated base material itself can be ensured, so the occurrence of the measling phenomenon can be greatly reduced. Detailed explanation.
本発明に用いる内層材としては片面又は両面金ＩＩｔ張
贋層板を加工して、片面又は両面に電電回路を形成した
もので必要とする回路層数に応じて所要枚数用いるもの
である。内層材の表面に配役される樹脂層としてはフェ
ノ−／Ｉ／ｓｉ脂、クレゾール樹脂、エポキシ樹脂、不
飽和ポリスルフォン樹脂、ポリイミド樹脂、ポリブタジ
ェン樹脂、ポリアミド樹脂、ポリスルフォン樹脂、ボリ
フエニレンサμファイド樹脂、ポリフェニレンオキサイ
ド樹脂、ポリブチレンテレフタレート樹脂、弗化ｍｍ等
の単独、変性物、混合物等が用いられ、液状樹脂の塗布
、フィルム或はシート状樹脂の載置、或は樹脂含浸基材
からの滲出樹脂による被覆等で樹脂？ｉｎを形成するも
のである。液状樹脂の塗布、フィルム或はシート状樹脂
の載置については好ましくは樹脂含浸基材に用いた樹脂
と同種の樹脂を用いることが接層性の点で望′ましいこ
とである。樹脂含浸基材からの滲出樹脂による被覆につ
いては、樹脂含浸基材の樹脂１を３〜５重漱％（以下単
に％と記す）増量して滲出樹脂量の増加を計ったり、樹
脂含浸基材のａｔ脂アフロ−３〜５％低下させ、漬５１
成形時の溶出樹脂量を抑制することによシ書出掴脂とし
て内１す材表面の凹凸充填が充分できるように計ったり
することができるものである。The inner layer material used in the present invention is one in which an electric circuit is formed on one or both sides by processing a single-sided or double-sided gold IIt clad plate, and the required number is used depending on the number of circuit layers required. The resin layer cast on the surface of the inner layer material includes phenol/I/si resin, cresol resin, epoxy resin, unsaturated polysulfone resin, polyimide resin, polybutadiene resin, polyamide resin, polysulfone resin, polyphenylene resin, Polyphenylene oxide resin, polybutylene terephthalate resin, fluorinated mm, etc. alone, modified products, mixtures, etc. are used, and liquid resin is applied, film or sheet resin is placed, or resin oozes from a resin-impregnated base material. Is it covered with resin? This is what forms the in. For coating the liquid resin and placing the film or sheet resin, it is preferable to use the same type of resin as the resin used for the resin-impregnated base material from the viewpoint of adhesion. For coating with exuded resin from a resin-impregnated base material, increase the amount of resin 1 in the resin-impregnated base material by 3 to 5 weight percent (hereinafter simply referred to as %) to measure the increase in the amount of exuded resin, or At fat afro-3-5% reduction, pickled 51
By suppressing the amount of eluted resin during molding, it is possible to sufficiently fill in the irregularities on the surface of the inner material as a gripping grease.
又、液状樹脂の塗布、シート或はシートの載置、樹脂含
浸基材での調整を夫々単独で実施してもよく、必要に応
じて組合せて５！ｉ！施してもよく任意である。樹脂層
の厚みは好ましくは１０〜５０ミクロンであることが望
ましいことである。即ち１０ミクロン未満では内層材表
面の電気回路の凹凸を充分充填でき難く、ωミクロンを
こえると積層成形時の溶融樹脂が多くなり気泡を巻き込
み易くなシ成形性が低下する傾向にあるからである。樹
脂含浸基材としては、８Ｎ脂としてはフェノ−、／Ｉ／
樹脂、りＶシー／ｌ／樹脂、エポキシ樹脂、不飽和ポリ
エステｙ樹脂、ポリイミド樹脂、ポリゲタジエン樹脂、
ポリアミド樹脂、ポリスルフォン樹脂、ポリフェニレン
サルファイド樹月旨、ポリフェニレンオキサイド樹脂、
ポリブチレンテレフタレート樹脂、弗化樹脂等の単独、
変性物、混合物等が用いられ、基材としては、ｉフス、
アスベスト等の無機繊維やポリエステ〃、ポリアミド、
ポリビニｙアｙコーρ、アクリμ等の有機合成繊維や木
綿等の天然繊維からなる織布、不織布、マプト或は紙又
はこれらの岨介せ基材等である。外Ａ材としては片面金
属張漬Ｊ板、両面金属張債層板の片面のみ回路形成した
費后板、銅、アμミニウム、真鍮、ニフグル、鉄等の金
属箔を用いることができるものである。以下本発明を実
施例にもとづいて説明する。Furthermore, applying the liquid resin, placing the sheet or sheets, and adjusting the resin-impregnated base material may be performed individually, or may be combined as necessary. i! It is optional. It is desirable that the thickness of the resin layer is preferably 10 to 50 microns. That is, if it is less than 10 microns, it is difficult to sufficiently fill the unevenness of the electric circuit on the surface of the inner layer material, and if it exceeds ω microns, there will be a large amount of molten resin during laminated molding, which tends to trap air bubbles and deteriorate moldability. . As the resin-impregnated base material, as the 8N resin, pheno-, /I/
Resin, RI V C/L/resin, epoxy resin, unsaturated polyester resin, polyimide resin, polygetadiene resin,
Polyamide resin, polysulfone resin, polyphenylene sulfide juzukiji, polyphenylene oxide resin,
Single polybutylene terephthalate resin, fluorinated resin, etc.
Modified products, mixtures, etc. are used, and the base materials include i-fus,
Inorganic fibers such as asbestos, polyester, polyamide,
These include woven fabrics, nonwoven fabrics, Maputo or paper, or base materials interposed therebetween, made of organic synthetic fibers such as polyvinyl, acrylic, and natural fibers such as cotton. As the outer A material, it is possible to use a single-sided metal-clad J board, a double-sided metal-clad bond board with a circuit formed on only one side, or metal foil such as copper, aluminum, brass, nifgel, or iron. be. The present invention will be explained below based on examples.
実施例１
！侶回鴨部の厚みが７０ミクロンである厚み １４の両
面に回路形成した内、響材のと、下面に、厚み０．１Ｆ
Ｊのガラス布にエポキシＪ！：Ｊ脂フェスを樹脂量４％
１、グ併ゴ旨フロー３２％（でなるように含浸、乾燥し
て得た樹脂含浸基材を２枚夫々配設し、更にその最外側
に厚みあミクロンのｖ４箔を配役した漬１ｑ体を成形圧
力４０ Ｌ９汐、１７０°Ｃで１２０分閲蹟想成形して
４ＰＪプリント配線基板を得た。Example 1! The thickness of the inner part is 70 microns.Among the circuits formed on both sides of 14, the thickness of the sounding material is 0.1F on the bottom surface.
Epoxy J on J glass cloth! ：Resin amount of J fat festival is 4%
1. Two sheets of resin-impregnated base material obtained by impregnating and drying so as to give a 32% flow, and a V4 foil with a thickness of micron on the outermost side. A 4PJ printed wiring board was obtained by molding under a molding pressure of 40 L9 at 170° C. for 120 minutes.
実施例２
実施例１の樹脂含浸基材の樹脂フローを都翠にした以外
は実施例１と同様に処理して４府プリント配Ｖ都基板を
渇た。Example 2 A 4-piece printed V-shaped board was dried in the same manner as in Example 1, except that the resin flow of the resin-impregnated base material in Example 1 was changed to Dusui.
実施例３
実施例１の樹脂含浸基材の樹脂フローを５０％、樹脂フ
ローを２８％にした以外は実施例１と同様に処理して４
層プリント配線基板を得た。Example 3 The resin-impregnated base material of Example 1 was treated in the same manner as in Example 1 except that the resin flow was 50% and the resin flow was 28%.
A layered printed wiring board was obtained.
実施例４
実施例１の内層材の表面にエポキシ樹脂フェノを４０ミ
クロン厚になるように塗布してから上、下面に、厚み０
．１ ｍのガラス布にエボキＶａ脂ワニスを樹月旨量４
５％、樹月旨フロー３２％になるように含浸、乾燥して
得た樹１１８也浸基材を２枚夫々配設し、更にその最外
側に厚み墨ミクロンの素箔を配設した積層体を成形圧力
４ｏ髪佃、１７０’Ｑで１２０分闇積Ｍ成形して４層プ
リント配線基板を得た。Example 4 Epoxy resin pheno was applied to the surface of the inner layer material of Example 1 to a thickness of 40 microns, and then a layer of 0 thickness was applied to the upper and lower surfaces.
．． Amount of Eboki Va fat varnish on 1 m glass cloth
A laminated layer in which two sheets of wood-impregnated substrates obtained by impregnating and drying to a flow rate of 5% and a flow of 32% are placed, and a bare foil of black micron in thickness is placed on the outermost side. The body was molded in the dark for 120 minutes at a molding pressure of 4°C and 170'Q to obtain a 4-layer printed wiring board.
比較例
実施例１の樹脂含浸基、材の樹脂１を４５％、樹脂フロ
ーを３２％にした以外は実施例１と同様に処理して４肩
プリント配線基板を得た。Comparative Example A four-shoulder printed wiring board was obtained in the same manner as in Example 1, except that the resin-impregnated base and resin 1 of Example 1 were changed to 45% and the resin flow was changed to 32%.
実施例１乃至４と比較例のプリント配線基板の’ＡＭｆ
Ａｍｔエツチングし、２６０’Ｃのハンダ浴にｊ秒間フ
ロートし、ハンダ処理面と反対側を水平研磨してミーズ
リングの有無を調べた結果１２第１表で明白なように本
発明のものの性能はよく、本発明の多層プリント配線基
板の優れていることを確認した。'AMf of printed wiring boards of Examples 1 to 4 and comparative example
Amt etched, floated in a solder bath at 260'C for j seconds, horizontally polished the side opposite to the soldered surface, and examined the presence or absence of measling. As is clear from Table 1, the performance of the present invention was We have confirmed that the multilayer printed wiring board of the present invention is excellent.
第 １ 表Chapter 1 Table
Claims (2)
含浸基材層が存在し、更に最外側に外層材が配設されて
なることを特徴とする多層プリント配線基板。(1) A multilayer printed wiring board characterized in that a resin-impregnated base material layer is present on each surface of a required number of inner layer materials via a resin layer, and an outer layer material is further disposed on the outermost side.
特徴とする特許請求の範囲第１項記載の多層プリント配
線基板。(2) The multilayer printed wiring board according to claim 1, wherein the resin layer has a thickness of 10 to 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12849786A JPS62285498A (en) | 1986-06-03 | 1986-06-03 | Multilayer printed interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12849786A JPS62285498A (en) | 1986-06-03 | 1986-06-03 | Multilayer printed interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62285498A true JPS62285498A (en) | 1987-12-11 |
Family
ID=14986205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12849786A Pending JPS62285498A (en) | 1986-06-03 | 1986-06-03 | Multilayer printed interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62285498A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750485A (en) * | 1993-08-05 | 1995-02-21 | Nec Corp | Manufacture of multilayer printed wiring board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6062194A (en) * | 1983-09-14 | 1985-04-10 | 松下電工株式会社 | Method of producing multilayer printed circuit board |
| JPS60107894A (en) * | 1983-11-17 | 1985-06-13 | 沖電気工業株式会社 | Method of producing multilayer printed circuit board |
| JPS60257598A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
| JPS60257592A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
-
1986
- 1986-06-03 JP JP12849786A patent/JPS62285498A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6062194A (en) * | 1983-09-14 | 1985-04-10 | 松下電工株式会社 | Method of producing multilayer printed circuit board |
| JPS60107894A (en) * | 1983-11-17 | 1985-06-13 | 沖電気工業株式会社 | Method of producing multilayer printed circuit board |
| JPS60257598A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
| JPS60257592A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750485A (en) * | 1993-08-05 | 1995-02-21 | Nec Corp | Manufacture of multilayer printed wiring board |
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