JPS62274791A - Wiring board structure - Google Patents
Wiring board structureInfo
- Publication number
- JPS62274791A JPS62274791A JP11947086A JP11947086A JPS62274791A JP S62274791 A JPS62274791 A JP S62274791A JP 11947086 A JP11947086 A JP 11947086A JP 11947086 A JP11947086 A JP 11947086A JP S62274791 A JPS62274791 A JP S62274791A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- terminal
- screw
- protruding
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 発明の詳細な説明 〔産業上の利用分野〕 本発明は突起状の端子分設けた配線基板に関する。[Detailed description of the invention] Detailed description of the invention [Industrial application field] The present invention relates to a wiring board provided with protruding terminals.
ｒ従来の技術〕
従来、配線基板の端子を突起状にする場合、この突起端
子を設ける場所以外をレジスト等によりマスキングし、
厚メ・ツキ等により、突起状に剛体の端子を形成するこ
とにより実施していた。rPrior art] Conventionally, when making terminals on a wiring board protruding, areas other than the locations where the protruding terminals are provided are masked with a resist or the like.
This was done by forming a rigid terminal in the shape of a protrusion using thick metal or lugs.
上述した従来の突起端子は、厚メッキにより製造してい
たので、第６図に示すように、絶縁基板１′上の端子導
体層３′に突起端子１６を設けていたが、凹部１７が突
起端子１６上部中央にでき易いことや、ピンホール及び
端子端部の直角性がでにくい等の形状的な問題点が多か
った。これらの問題点により、接触子を端子に当てたと
き、十分に接触できず接触不良を起すという欠点もあり
、さらに、端子を厚メッキにより突起状に形成していた
ので、手間と時間が非常にががり、その結果、価格も非
常に高いという欠点があった。Since the conventional protruding terminals described above were manufactured by thick plating, the protruding terminals 16 were provided on the terminal conductor layer 3' on the insulating substrate 1' as shown in FIG. There were many problems with the shape of the terminal 16, such as a tendency to form at the center of the upper part of the terminal 16, and difficulty in obtaining pinholes and perpendicularity at the ends of the terminal. Due to these problems, when a contactor is applied to a terminal, it cannot make sufficient contact and may cause a contact failure.Furthermore, since the terminal was formed into a protruding shape using thick plating, it was very time consuming and time consuming. As a result, the price was very high.
本発明の目的は、これらの欠点を解決し、接触不良をな
くし、製作工数を少くし、高品質で安価な配線基板構造
を提供することにある。An object of the present invention is to solve these drawbacks, eliminate poor contact, reduce the number of manufacturing steps, and provide a high-quality and inexpensive wiring board structure.
本発明の配線基板構造の構成は、配線層と端子導体層と
を有する配線基板と、この配線基板上の前記端子導体層
に設けられた端子挿入穴に挿入さして固定され表面にメ
ッキ導体層が形成された剛体の突起端子とからなること
を特徴とする。The structure of the wiring board structure of the present invention includes a wiring board having a wiring layer and a terminal conductor layer, which is inserted into a terminal insertion hole provided in the terminal conductor layer on the wiring board and fixed, and has a plated conductor layer on the surface. and a rigid projecting terminal formed therein.
本発明の配線基板構造は、突起端子がビス状の剛体から
なり、このビス状体の足部が端子挿入穴に挿入され、か
しめあるいは接着により固定される構成とすることがで
きる。In the wiring board structure of the present invention, the protruding terminal may be made of a screw-like rigid body, and the foot portion of the screw-like body may be inserted into a terminal insertion hole and fixed by caulking or adhesive.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図、第２図は本発明の第１および第２の実施例の縦
断面図、第３図は第１図のビス状の突起端子の平面図、
第４図、第５図は本実施例の突起端子を複数個有する絶
縁基板の表面および裏面の平面図である。1 and 2 are longitudinal cross-sectional views of the first and second embodiments of the present invention, and FIG. 3 is a plan view of the screw-shaped protruding terminal of FIG. 1.
4 and 5 are plan views of the front and back surfaces of an insulating substrate having a plurality of protruding terminals according to this embodiment.
第１図のように、ガラスエポキシ、またはトリアジン樹
脂等の絶縁基板１上に配線層２を設け、この配線層２に
接続して端子導体層３にを設け、この端子導体層３にス
ルーホール４を設ける。次に、第３図に示す様な、ニッ
ケルまたは４２合金等の金属材料、あるいはガラスエポ
キシまたは１〜リアジン等の樹脂材料からなるビス状の
剛体材５を準備し、この剛体材料の足部７をスルーホー
ル４に挿入する。このビス状剛体材５の足部７が配線基
板の厚さよりも長い場合は、第１図のように、配線基板
から突出した足部７をすぶし、底部８を形成し、配線基
板１とビス状剛体材５を固定する。As shown in Figure 1, a wiring layer 2 is provided on an insulating substrate 1 made of glass epoxy or triazine resin, a terminal conductor layer 3 is provided connected to this wiring layer 2, and a through hole is provided in this terminal conductor layer 3. 4 will be provided. Next, as shown in FIG. 3, a screw-shaped rigid material 5 made of a metal material such as nickel or 42 alloy, or a resin material such as glass epoxy or 1 to riazine is prepared, and the leg portion 7 of this rigid material is prepared. Insert into through hole 4. If the legs 7 of the screw-like rigid material 5 are longer than the thickness of the wiring board, the legs 7 protruding from the wiring board are passed over to form the bottom 8 and the wiring board 1 is connected to the wiring board 1, as shown in FIG. The screw-like rigid member 5 is fixed.
また、配線基板１の厚さよりも、ビス状剛体材５の足部
７が短い場合は、第２図に示すように、銀ペーストまた
は半田等の接着材１３を介して、配線基板１とビス状剛
体材料５とを固定する。次に、配線基板に固定されたビ
ス状剛体材５の頭部６にビス状剛体材５が絶縁材料で作
られている場合は無電解メッキを、またビス状剛体材５
が導体材料で作られている場合は電解メッキ等の金属７
を設けた後に、所望の電解メッキを行うことによって、
突起状の端子が形成される。In addition, if the legs 7 of the screw-like rigid material 5 are shorter than the thickness of the wiring board 1, as shown in FIG. The shaped rigid material 5 is fixed. Next, if the rigid screw material 5 is made of an insulating material, electroless plating is applied to the head 6 of the rigid screw material 5 fixed to the wiring board.
If it is made of conductive material, metal 7 such as electrolytic plating
By performing the desired electrolytic plating after providing the
A protruding terminal is formed.
この電解メッキとしては、例えば、１５μ程度の銅メッ
キ９、次に７μ程度のニッケルメッキ１０、最後に１μ
程度の金メッキ１１を施せばよい。This electrolytic plating includes, for example, copper plating 9 of about 15μ, then nickel plating 10 of about 7μ, and finally 1μ
It is sufficient to apply gold plating 11 to a certain extent.
なお、第４図、第５図に示す如く、複数個の端子を設け
てもよく、また円柱および角柱状の端子１４としてもよ
く、特に、端子や形状に制限はない。As shown in FIGS. 4 and 5, a plurality of terminals may be provided, and the terminals 14 may be cylindrical or prismatic, and there are no particular limitations on the terminals or their shapes.
以上説明したように、本発明は、ビス状の剛体材を配線
基板の端子導体層上に設けられたスルーホールに挿入し
て突起端子とすることにより、従来の厚メツキ法により
設けられた突起端子のような、端子上部中央に凹部がで
きる問題をなくし、また製造に時間がかかり、価格が高
いという問題点を解決し、高品質、低価格の突起端子を
得られるという効果がある。As explained above, the present invention provides a method for inserting a screw-like rigid material into a through hole provided on a terminal conductor layer of a wiring board to form a protruding terminal. This has the effect of eliminating the problem of a recessed portion in the center of the upper part of the terminal, solving the problems of long manufacturing time and high price, and obtaining a high-quality, low-cost protruding terminal.
第１図、第２図は、本発明の第１および第２の実施例の
突起電極の縦断面図、第３図は第１図に用いるビス状の
剛体材５の正面図、第４図、第５図は本実施例が複数の
突起端子を有する場合の絶縁基板の表面および裏面の平
面図、第６図は従来の突起電極の一例の縦断面図である
。
１．１′・・・絶縁基板、２・・・配線層、３．３′・
・・端子導体層、４・・・スルーホール、５・・・ビス
状剛体材、６・・・ビス状剛体材の頭部、７・・・ビス
状剛体材の足部、８．１５・・・ビス状剛体材の底部、
９・・・無電解銅メ・ツキ、１０・・・電解銅メッキ、
１１・・・電解ニッケルメ・ツキ、１２・・・電解金メ
ッキ、１３・・・接着剤、１４．１６・・・突起端子、
１７・・・凹部。
′−１′・＼
＼＋ ５
噴に図β任枦ノ1 and 2 are longitudinal sectional views of protruding electrodes according to the first and second embodiments of the present invention, FIG. 3 is a front view of the screw-shaped rigid member 5 used in FIG. 1, and FIG. , FIG. 5 is a plan view of the front and back surfaces of an insulating substrate in the case where the present embodiment has a plurality of protruding terminals, and FIG. 6 is a longitudinal sectional view of an example of a conventional protruding electrode. 1.1'... Insulating substrate, 2... Wiring layer, 3.3'.
...Terminal conductor layer, 4... Through hole, 5... Screw-shaped rigid material, 6... Head of screw-shaped rigid material, 7... Foot part of screw-shaped rigid material, 8.15.・Bottom part of screw-like rigid material,
9... Electroless copper plating, 10... Electrolytic copper plating,
11... Electrolytic nickel plating, 12... Electrolytic gold plating, 13... Adhesive, 14.16... Protruding terminal,
17... Concavity. ′−1′・＼ ＼＋ 5 Figure β in the fountain
Claims (1)
線基板上の前記端子導体層に設けられた端子挿入穴に挿
入して固定され表面にメッキ導体層が形成された剛体の
突起端子とからなるこれを特徴とする配線基板構造。 ２、突起端子がビス状の剛体材からなり、このビス状体
の足部が端子挿入穴に挿入され、かしめあるいは接着に
より固定される特許請求の範囲第１項記載の配線基板構
造。[Scope of Claims] 1. A wiring board having a wiring layer and a terminal conductor layer, and a plated conductor layer formed on the surface of the wiring board by being inserted and fixed into a terminal insertion hole provided in the terminal conductor layer on the wiring board. A wiring board structure characterized by this, consisting of rigid protruding terminals. 2. The wiring board structure according to claim 1, wherein the protruding terminal is made of a screw-like rigid material, and the foot of the screw-like body is inserted into the terminal insertion hole and fixed by caulking or adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11947086A JPS62274791A (en) | 1986-05-23 | 1986-05-23 | Wiring board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11947086A JPS62274791A (en) | 1986-05-23 | 1986-05-23 | Wiring board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62274791A true JPS62274791A (en) | 1987-11-28 |
Family
ID=14762115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11947086A Pending JPS62274791A (en) | 1986-05-23 | 1986-05-23 | Wiring board structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62274791A (en) |
-
1986
- 1986-05-23 JP JP11947086A patent/JPS62274791A/en active Pending
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