JPS62270959A - Mask frame - Google Patents
Mask frameInfo
- Publication number
- JPS62270959A JPS62270959A JP61113473A JP11347386A JPS62270959A JP S62270959 A JPS62270959 A JP S62270959A JP 61113473 A JP61113473 A JP 61113473A JP 11347386 A JP11347386 A JP 11347386A JP S62270959 A JPS62270959 A JP S62270959A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- frame
- frame plate
- masks
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 abstract description 8
- 230000003287 optical effect Effects 0.000 abstract description 3
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の分野］
本発明は半導体製造プロセスまたは液晶装置製造プロセ
ス等で用いる露光装置に関し、特にパターン焼付は用マ
スクフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to an exposure apparatus used in a semiconductor manufacturing process or a liquid crystal device manufacturing process, and particularly relates to a mask frame for pattern printing.
［発明の背景］
半導体リソグラフィ工程においては、パターンを形成し
たマスクまたはレチクル等の原版（以下本明細書中にお
いて隼にマスクという）を介してウニ八等の基板を露光
しパターン転写を行なっている。露光装置としてはコン
タクト露光方式、プロキシミティ露光方式、反射型また
は縮小投影露光方式等が用いられる。縮小投影露光装置
においては光学系を用いてマスクを縮小投影するための
倍率に応じた大型のマスクが用いられる。また、大画面
の液晶表示基板のバターニングを一括投影露光で行なう
場合等にも大型のマスクが用いられる。マスクはマスク
フレームに取付けられ露光装置に装着される。[Background of the Invention] In a semiconductor lithography process, a pattern is transferred by exposing a substrate such as a sea urchin to light through an original plate such as a mask or reticle on which a pattern is formed (hereinafter referred to as a mask in this specification). . As the exposure apparatus, a contact exposure method, a proximity exposure method, a reflection type, a reduction projection exposure method, etc. are used. In a reduction projection exposure apparatus, a large mask is used in accordance with the magnification for reducing and projecting the mask using an optical system. A large mask is also used when patterning a large-screen liquid crystal display substrate by batch projection exposure. The mask is attached to a mask frame and mounted on an exposure device.
［従来の技術］
従来のマスクは取扱時の傷や汚れを防止するためおよび
パターン形成面積を有効に広げるために１つのマスクを
１つのマスクフレームに取付けていた。したがって、大
型マスクを伴用する投影露光装置において、小さなマス
クを使用することができず、汎用性が小さかった。[Prior Art] In order to prevent scratches and stains during handling and to effectively expand the pattern formation area, a conventional mask is attached to a single mask frame. Therefore, in a projection exposure apparatus that uses a large mask, a small mask cannot be used, and versatility is limited.
［発明の目的］
本発明は、前記従来技術の欠点に鑑みなされたものであ
って、小さなマスクを大画面一括投影露光装置に装着可
能とし、また複数のマスクを同時に投影露光装置に装着
可能としパターンの分割露光を可能とするマスクフレー
ムの提供を目的とする。[Object of the Invention] The present invention has been made in view of the drawbacks of the prior art, and it is possible to attach a small mask to a large-screen batch projection exposure apparatus, and also to make it possible to attach a plurality of masks to a projection exposure apparatus at the same time. The purpose of the present invention is to provide a mask frame that enables divisional exposure of a pattern.
［実施例］ 第１図は本発明に係るマスクフレームの平面図である。[Example] FIG. 1 is a plan view of a mask frame according to the present invention.
転写すべきパターン（図示しない）が形成された４つの
マスク１が枠板４に取付けられマスクフレーム２０を構
成する。枠板４は金属またはセラミックにより形成され
る。第２図は別の実施例の平面図であり、異る形状のマ
スク１，２．．３が同一の枠板４に取付けられている。Four masks 1 on which patterns to be transferred (not shown) are formed are attached to a frame plate 4 to constitute a mask frame 20. The frame plate 4 is made of metal or ceramic. FIG. 2 is a plan view of another embodiment, showing masks 1, 2, . ．． 3 are attached to the same frame plate 4.
第３図は小さなマスク１を大きな枠板４に取付けた例で
あり、大画面露光用の露光装置に小さな形状のマスクを
使用できる。第４図は、複数のマスク１を取付けたマス
クフレーム２０において、使用するマスク以外のマスク
を遮光板１２で覆った例を示す。各遮光板１２はねじ７
で枠板４に固定される。FIG. 3 shows an example in which a small mask 1 is attached to a large frame plate 4, and the small-shaped mask can be used in an exposure apparatus for large-screen exposure. FIG. 4 shows an example of a mask frame 20 to which a plurality of masks 1 are attached, in which masks other than the mask to be used are covered with a light shielding plate 12. Each light shielding plate 12 has a screw 7
is fixed to the frame plate 4.
マスクの枠板４への取付構造の例を第５図から第７図ま
でに示す。枠板４のマスク取付位置には開口部１４が形
成されている。第５図の例では、開口部１４の下側から
マスク１が装着され、マスク１の下面側に押え板５を設
けて、マスク１の周縁部を開口部１４の上部突縁部１４
ａと下部の押え板５との間に挟持している。押え板５は
ねじ７により枠板４の下面に固定される。開口部１４の
上部突縁部１４ａおよび側面部にはマスク１の位置調整
用押しねじ６が設けられる。マスク１のパターン形成面
（下面）ａは枠板４の下面のステージ取付用基準面すと
同一面となるようにマスク１が枠板４に取８上に搭載さ
れ、図示しない真空吸着装置によりマスクフレーム２０
はマスクステージ８上に固定保持される。これによりマ
スク１のパターン形成面ａは所定位置に位置合せされる
。Examples of the structure for attaching the mask to the frame plate 4 are shown in FIGS. 5 to 7. An opening 14 is formed in the frame plate 4 at the mask mounting position. In the example shown in FIG. 5, the mask 1 is attached from the bottom side of the opening 14, and a presser plate 5 is provided on the bottom side of the mask 1, so that the peripheral edge of the mask 1 is attached to the upper protrusion 14 of the opening 14.
It is held between a and the lower pressing plate 5. The presser plate 5 is fixed to the lower surface of the frame plate 4 with screws 7. A push screw 6 for adjusting the position of the mask 1 is provided on the upper edge 14a and side surface of the opening 14. The mask 1 is mounted on the frame plate 4 on the tray 8 so that the pattern forming surface (lower surface) a of the mask 1 is on the same plane as the stage mounting reference surface on the lower surface of the frame plate 4. mask frame 20
is fixedly held on the mask stage 8. Thereby, the pattern forming surface a of the mask 1 is aligned at a predetermined position.
第６図はマスク１の別の取付構造例である。この例では
マスク１は枠板４の開口部１４の側面に接着剤１５によ
り接合されている。この例においても第５図の例と同様
にマスク１のパターン形成面ａは枠板４のステージ取付
用基準面すと同一面である。FIG. 6 shows another example of the mounting structure for the mask 1. In this example, the mask 1 is bonded to the side surface of the opening 14 of the frame plate 4 with an adhesive 15. In this example as well, the pattern forming surface a of the mask 1 is the same surface as the stage mounting reference surface of the frame plate 4, as in the example of FIG.
第７図はマスク１のさらに別の取付構造例である。この
例ではマスク１は枠板４の開口部１４の上面周縁部に搭
載支持され取付具９によりねじ７を用いて枠板４上に固
定保持される。この例では、マスク１のパターン形成面
ａは枠板４の上面ｄと同一面であり、この上面ｄはステ
ージ取付用基準面すから所定距離だけ隔たるように枠板
４の板厚が定められている。これにより、マスクフレー
ム２０をマスクステージ上に装着すればマスクのパター
ン形成面積ａは所宇位看に位置合せされる−第８図に本
発明に係るマスクフレームの使用例を示す。形成すべき
パターン１７を４つに分割した４枚のマスク１が枠板４
に取付けられ１板のマスクフレーム２０を構成している
。図示しない光源より照明光１６が矢印ｆのようにスリ
ット照射される。１１は遮光板（シャッター）であり、
マスクアライメント後にマスク１を照射するように移動
可能である。１３は投影光学系であり、マスク１を照射
した光を基板１０上に導きパターン１７を形成する。マ
スクフレーム２０は図示しないアライメント機構により
Ｘ方向およびＹ方向に各々矢印ｇ、 ｈのように移動可
能であり、分割された４枚のマスク１を順次露光位置に
移動させる。アライメント調整中ばシャッター１１によ
り照明光１６は遮られている。４枚のマスク１を順次露
光位置に移動しマスク１と基板１０をｉ方向に直線走査
することにより、基板１０上に１つの大きなパターン１
７を合成して転写形成する。FIG. 7 shows yet another example of the mounting structure of the mask 1. In this example, the mask 1 is mounted and supported on the periphery of the upper surface of the opening 14 of the frame plate 4, and is fixedly held on the frame plate 4 by a fixture 9 using screws 7. In this example, the pattern forming surface a of the mask 1 is the same as the upper surface d of the frame plate 4, and the thickness of the frame plate 4 is determined so that this upper surface d is separated by a predetermined distance from the reference surface for mounting the stage. It is being As a result, when the mask frame 20 is mounted on the mask stage, the pattern forming area a of the mask is aligned with the desired position. FIG. 8 shows an example of the use of the mask frame according to the present invention. The four masks 1, which are obtained by dividing the pattern 17 to be formed into four parts, are attached to the frame plate 4.
It is attached to the mask frame 20 of one plate. Illumination light 16 is emitted from a light source (not shown) into the slit as indicated by an arrow f. 11 is a light shielding plate (shutter);
It is movable to irradiate the mask 1 after mask alignment. Reference numeral 13 denotes a projection optical system, which guides the light irradiated onto the mask 1 onto the substrate 10 to form a pattern 17. The mask frame 20 is movable in the X and Y directions as indicated by arrows g and h by an alignment mechanism (not shown), and sequentially moves the four divided masks 1 to the exposure position. During alignment adjustment, the illumination light 16 is blocked by the shutter 11. By sequentially moving the four masks 1 to the exposure position and linearly scanning the masks 1 and the substrate 10 in the i direction, one large pattern 1 is formed on the substrate 10.
7 is synthesized and transferred.
なお、マスクフレームの枠板の外形形状は取扱性等を考
慮して任意の形状とすることができる。Note that the outer shape of the frame plate of the mask frame can be any shape in consideration of ease of handling and the like.
また各マスクにパターン保護用ペリクルを設けてもよい
。ペリクルは複数のマスクに対し一括して設けてもよい
。また、第５図の実施例におけるマスク位置調整用押し
ねじの代りにバネを用いてマスクを一定方向に押圧して
位置決めを行なってもよい。Further, each mask may be provided with a pellicle for pattern protection. Pellicles may be provided for multiple masks at once. Further, instead of the mask position adjustment push screw in the embodiment shown in FIG. 5, a spring may be used to press the mask in a certain direction for positioning.
［発明の効果］
以上説明したように、本発明に係るマスクフレームは、
１つまたは複数のマスクを各マスクに比べ充分大きな形
状の１枚の枠板に取付けて１枚のマスクフレームとして
一体化しているため、大画面のマスクを使用する一括投
影露光装置に対し小さなマスクを使用することが可能と
なり露光装置の汎用性が増大する。また、複数のマスク
を同時に１枚のウェハ上に焼付けることができる。また
、複数のマスクを順次露光することにより、大きなパタ
ーンを合成して形成することができ、大型パターンの分
割マスクによる形成が容易に行なわれる。[Effects of the Invention] As explained above, the mask frame according to the present invention has the following effects:
One or more masks are attached to a single frame plate that is sufficiently large compared to each mask, and are integrated as a single mask frame, so it is possible to use a small mask in contrast to a batch projection exposure system that uses large-screen masks. This increases the versatility of the exposure apparatus. Also, multiple masks can be printed on a single wafer at the same time. Further, by sequentially exposing a plurality of masks, a large pattern can be formed by combining them, and a large pattern can be easily formed using divided masks.
第１図から第４図までは各々本発明に係るマスクフレー
ムの各別の実施例の平面図、第５図から第７図までは各
々マスクの取付構造の各別の例を示すマスクフレーム断
面図、第８図は本発明に係るマスクフレームの使用例の
説明図である。
１．２，３：マスク、
４：枠板、
８：マスクステージ、
１４：開口部。
特許出願人 キャノン株式会社
代理人 弁理士 伊 東 辰 雄
代理人 弁理士 伊 東 哲 小
筒１ｖ！Ｊ 第２図
第３図 第４図1 to 4 are plan views of different embodiments of the mask frame according to the present invention, and FIGS. 5 to 7 are cross-sectional views of the mask frame showing different examples of the mask mounting structure. FIG. 8 is an explanatory diagram of an example of use of the mask frame according to the present invention. 1.2, 3: Mask, 4: Frame plate, 8: Mask stage, 14: Opening. Patent Applicant Canon Co., Ltd. Agent Patent Attorney Tatsuo Ito Agent Patent Attorney Satoshi Ito Kozutsu 1v! J Figure 2 Figure 3 Figure 4
Claims (1)
部に装着可能な形状に形成され、前記マスクより小さい
任意の形状の露光用マスクを装着する１つまたは複数の
開口部を有する枠板よりなることを特徴とする露光用マ
スクフレーム。 ２、前記開口部の枠板上面側にマスク押え用突縁部を形
成し、該開口部の枠板下面側にマスク保持用押え板を設
け、該突縁部および押え板間にマスク周縁部を挟持した
ことを特徴とする特許請求の範囲第１項記載のマスクフ
レーム。 ３、前記各開口部の突縁部および側縁部にマスクの位置
調整用押しねじを設けたことを特徴とする特許請求の範
囲第２項記載のマスクフレーム。 ４、前記各開口部の突縁部および側縁部にマスクの位置
決め用押圧用バネを設けたことを特徴とする特許請求の
範囲第２項記載のマスクフレーム。 ５、前記マスクは前記開口部側面に対し接着剤を介して
接合されたことを特徴とする特許請求の範囲第１項記載
のマスクフレーム。 ６、前記マスク下面は枠板下面のステージ取付用基準面
と同一面であることを特徴とする特許請求の範囲第１項
記載のマスクフレーム。 ７、前記マスクは、前記開口部周縁に支持して枠板上面
に搭載し、押え部材により該枠板上に固定したことを特
徴とする特許請求の範囲第１項記載のマスクフレーム。 ８、前記マスク下面は枠板下面のステージ取付用基準面
に対し所定距離だけ間隔を有するように前記枠板の板厚
が定められたことを特徴とする特許請求の範囲第７項記
載のマスクフレーム。 ９、前記枠板は金属からなることを特徴とする特許請求
の範囲第１項記載のマスクフレーム。 １０、前記枠板はセラミックからなることを特徴とする
特許請求の範囲第１項記載のマスクフレーム。[Scope of Claims] 1. One or more masks formed in a shape that can be attached to a mounting portion for mounting an exposure mask of a substantially specific shape, and to which an exposure mask of an arbitrary shape smaller than the mask is mounted. An exposure mask frame comprising a frame plate having an opening. 2. A mask holding protrusion is formed on the upper side of the frame plate of the opening, a mask holding presser plate is provided on the lower side of the frame plate of the opening, and a mask peripheral edge is formed between the protruding edge and the presser plate. 2. The mask frame according to claim 1, wherein the mask frame is sandwiched between the mask frames. 3. The mask frame according to claim 2, characterized in that push screws for adjusting the position of the mask are provided on the projecting edges and side edges of each of the openings. 4. The mask frame according to claim 2, wherein a pressing spring for positioning the mask is provided on the projecting edge and side edge of each of the openings. 5. The mask frame according to claim 1, wherein the mask is bonded to the side surface of the opening via an adhesive. 6. The mask frame according to claim 1, wherein the lower surface of the mask is flush with a reference surface for mounting a stage on the lower surface of the frame plate. 7. The mask frame according to claim 1, wherein the mask is supported on the periphery of the opening, mounted on the upper surface of the frame plate, and fixed onto the frame plate by a presser member. 8. The mask according to claim 7, wherein the thickness of the frame plate is determined such that the lower surface of the mask is spaced by a predetermined distance from a reference surface for mounting a stage on the lower surface of the frame plate. flame. 9. The mask frame according to claim 1, wherein the frame plate is made of metal. 10. The mask frame according to claim 1, wherein the frame plate is made of ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61113473A JPS62270959A (en) | 1986-05-20 | 1986-05-20 | Mask frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61113473A JPS62270959A (en) | 1986-05-20 | 1986-05-20 | Mask frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62270959A true JPS62270959A (en) | 1987-11-25 |
Family
ID=14613148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61113473A Pending JPS62270959A (en) | 1986-05-20 | 1986-05-20 | Mask frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62270959A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008107955A1 (en) * | 2007-03-02 | 2008-09-12 | Advantest Corporation | Mask for multicolumn electron beam exposure, electron beam exposure device and exposure method employing mask for multicolumn electron beam exposure |
| JP2008218769A (en) * | 2007-03-06 | 2008-09-18 | Nikon Corp | Mask holding device, mask adjustment method, exposure equipment, and exposure method |
-
1986
- 1986-05-20 JP JP61113473A patent/JPS62270959A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008107955A1 (en) * | 2007-03-02 | 2008-09-12 | Advantest Corporation | Mask for multicolumn electron beam exposure, electron beam exposure device and exposure method employing mask for multicolumn electron beam exposure |
| US8196067B2 (en) | 2007-03-02 | 2012-06-05 | Advantest Corp. | Mask for multi-column electron beam exposure, and electron beam exposure apparatus and exposure method using the same |
| JP5175713B2 (en) * | 2007-03-02 | 2013-04-03 | 株式会社アドバンテスト | Multi-column electron beam exposure mask, electron beam exposure apparatus and exposure method using multi-column electron beam exposure mask |
| JP2008218769A (en) * | 2007-03-06 | 2008-09-18 | Nikon Corp | Mask holding device, mask adjustment method, exposure equipment, and exposure method |
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