JPS62267356A - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS62267356A
JPS62267356A JP10939386A JP10939386A JPS62267356A JP S62267356 A JPS62267356 A JP S62267356A JP 10939386 A JP10939386 A JP 10939386A JP 10939386 A JP10939386 A JP 10939386A JP S62267356 A JPS62267356 A JP S62267356A
Authority
JP
Japan
Prior art keywords
weight
parts
polyoxyethylene sorbitan
resin composition
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10939386A
Other languages
Japanese (ja)
Inventor
Muraharu Nishioka
群晴 西岡
Kazuhiko Takasugi
高杉 一彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP10939386A priority Critical patent/JPS62267356A/en
Publication of JPS62267356A publication Critical patent/JPS62267356A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a resin composition outstanding in strength and adhesive force to surface-treating material, capable of giving molded articles of improved surface appearance, by incorporating a polyamide with inorganic filler and fatty acid ester of polyoxyethylene sorbitan. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of a polyamide (pref. nylon 6) with (B) 30-100pts.wt of inorganic filler with an average particle size <=20mum and (C) 0.05-0.6pt.wt. of monoester(s) of formula I and/or II (R is 10-20C alkyl or alkenyl, pref. of formula III or IV; n1-n3 are each 1-20) prepared by the following process; an aliphatic ester of polyoxyethylene sorbitan (pref. sorbitol) is heated to effect ring formation to form a sorbitan having furanol ring and/or pyranose ring, which is then esterified with monocarboxylic acid followed by reaction with ethylene oxide.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明は、ポリアミド樹脂組成物に関し、更に訂しくは
、表面外観の改良された成形品を成形することが可能な
ポリアミド樹脂組成物に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a polyamide resin composition, and more particularly to a polyamide resin composition that can be molded into a molded article with improved surface appearance.

イ従来の技術及び発明が解決しようとする問題点]ポリ
アミド樹脂を成形する場合、無機充填材料を含有させる
と成形品の強度が強くなることが知られている。しかし
ながら一般に無機充填材料で強化されたポリアミド樹脂
を成形品に加工した場合、成形品の表面に成形材料が不
規則に流れた形跡を示すフローマークやシルバー(白い
縞状の模様)が生じ、成形品の外観を著しく損なう、ま
たこれらの成形品にメッキあるいは塗装といった表面二
次加工を施す場合にあっても、表面処理材と成形品との
密着力が低下し、加工後の表面に外観不良が残存すると
いう問題点があった。
B. Prior Art and Problems to be Solved by the Invention] When molding a polyamide resin, it is known that the strength of the molded product will be increased if an inorganic filler material is included. However, when a polyamide resin reinforced with an inorganic filler is processed into a molded product, flow marks and silver (white striped patterns), which indicate the irregular flow of the molding material, appear on the surface of the molded product. In addition, when secondary surface processing such as plating or painting is applied to these molded products, the adhesion between the surface treatment material and the molded product decreases, resulting in poor appearance of the processed surface. There was a problem that remained.

[問題点を解決するための手段] 本発明者らは、上述した問題点を解消すべく鋭意検討を
重ねた結果、成形品の外観上の欠陥をなくすことに成功
し1本発明を完成するに到った。
[Means for Solving the Problems] As a result of intensive studies to solve the above-mentioned problems, the present inventors succeeded in eliminating defects in the appearance of molded products and completed the present invention. reached.

即ち、本発明は、ポリアミド100重量部に対し、平均
粒径20μm以下の無機充填材料30〜100重量部と
、ポリオキシエチレンソルビタンの脂肪酸エステル0.
05〜0.6重量部とを含有してなるポリアミド樹脂組
成物に係るものである。
That is, in the present invention, based on 100 parts by weight of polyamide, 30 to 100 parts by weight of an inorganic filler material having an average particle diameter of 20 μm or less and 0.00 parts by weight of fatty acid ester of polyoxyethylene sorbitan.
The present invention relates to a polyamide resin composition containing 0.05 to 0.6 parts by weight.

本発明にあって、プリオキシエチレンソルビタンの脂肪
酸エステルは、好ましくは、次式0式%) [式中、Rは炭素原子数10〜20のアルキル基又は炭
素原子filo〜20のフルケニル基を表わし、n工、
n2及びn3はそれぞれ独立に1〜20の整数を表わす
、] の少なくとも一で示されるモノエステルがよく、Rは具
体的にはn−デシル基、n−ウンデシル基、n−ラウリ
ル基、n−トリデシル基、n−ミリスチル基、n−ペン
タデシル基、n−パルミチル基、n−ヘプタデシル基、
n−ステアリル基。
In the present invention, the fatty acid ester of preoxyethylene sorbitan preferably has the following formula: , n engineering,
n2 and n3 each independently represent an integer of 1 to 20,] A monoester represented by at least one of the following is preferred, and R is specifically an n-decyl group, n-undecyl group, n-lauryl group, n- tridecyl group, n-myristyl group, n-pentadecyl group, n-palmityl group, n-heptadecyl group,
n-stearyl group.

n−/+デシル基及びn−ランデシレニル基。n-/+decyl group and n-landecylenyl group.

n−オレイニル、n−エライジニル基等が挙げられ、ま
たこれらの分岐した異性体であってもよく、更に好まし
くは、Rはn−CLLH23−1n−CBH,1−1n
−Cr7H3s−及びCH3(CH2)7 CH=CH
(CHz )t−の少なくとも一で示される基であるの
がよい。
Examples include n-oleinyl and n-elaidinyl groups, and branched isomers thereof may be used. More preferably, R is n-CLLH23-1n-CBH, 1-1n
-Cr7H3s- and CH3(CH2)7 CH=CH
It is preferable that it is a group represented by at least one of (CHz)t-.

かかるポリオキシエチレンソルビタンの脂肪酸モノエス
テルは、例えば、下記の図式によって示されるようにソ
ルビトールを出発物質として製造することができる。
Such fatty acid monoesters of polyoxyethylene sorbitan can be produced using sorbitol as a starting material, for example, as shown by the scheme below.

■ H−C−OH −C−OH 「 −C−OH −C−OH H20H 即ち、ソルビトールを約140−150’C!で加熱処
理するとZ及び/又は旦で示される環化したフラノース
環及び/又はピラノース環を有するソルビタンが得られ
る。このようにして得られたソルビタンをモノカルボン
酸でエステル化し、次いでエチレンオキシドと反応させ
るとA及び/又は5で示されるポリオキシソルビタンの
脂肪酸モノエステルが得られる。尚、得られるポリオキ
シソルビタンの脂肪酸モノエステルは黄褐色油状でH,
L、B、が14.9〜16.7である。
■ H-C-OH -C-OH " -C-OH -C-OH H20H That is, when sorbitol is heat-treated at about 140-150'C!, the cyclized furanose ring shown by Z and/or Dan and/or Alternatively, a sorbitan having a pyranose ring is obtained.When the sorbitan thus obtained is esterified with a monocarboxylic acid and then reacted with ethylene oxide, a fatty acid monoester of polyoxysorbitan represented by A and/or 5 is obtained. The fatty acid monoester of polyoxysorbitan obtained is a yellowish brown oil containing H,
L and B are 14.9 to 16.7.

次に本発明で用いることのできるポリアミドとしては、
ナイロン6、ナイロン66、ナイロン12及びこれらの
混合物若しくは共重合体で数平均分子量10.000〜
30,000のものがよく、好ましくは、ナイロン6が
よい。
Next, polyamides that can be used in the present invention include:
Nylon 6, nylon 66, nylon 12, and mixtures or copolymers thereof with a number average molecular weight of 10.000 to
30,000, preferably nylon 6.

また本発明で用いる無機充填材料としては、石英 アス
ベスト、珪藻土、雲母などの天然珪素化合物、硫酸カル
シウム、炭酸カルシウム、珪酸カルシウム(ワテストナ
イト)、炭酸マグネシウム、珪耐マグネシウム(タルク
)などの金属塩、カオリン、クレーなどの混合物があり
、これらの無機充填材料は単独又は2種以上を組合せて
混合して使用することができる。
Inorganic fillers used in the present invention include natural silicon compounds such as quartz, asbestos, diatomaceous earth, and mica, and metal salts such as calcium sulfate, calcium carbonate, calcium silicate (watestonite), magnesium carbonate, and silica-resistant magnesium (talc). , kaolin, clay and the like, and these inorganic fillers can be used alone or in combination of two or more.

無機充填材料の粒径は20g+w以下がよく、20μm
より大きいと成形品の表面平滑性が低下し好ましくない
The particle size of the inorganic filler material is preferably 20g+w or less, and is 20μm.
If it is larger, the surface smoothness of the molded product will deteriorate, which is not preferable.

無機充填材料の含有量はポリアミド100重州部に対し
、30−100重量部とするのがよい。その理由は含有
量が30重量部未満であるとポリアミドの充分な強度が
得られず、100重量部を超えると成形品の物性及び表
面平滑性が低下し、ポリエチレンソルビタンの脂肪酸エ
ステルを添加する効果が十分に得られないからである。
The content of the inorganic filler material is preferably 30 to 100 parts by weight per 100 parts by weight of the polyamide. The reason for this is that if the content is less than 30 parts by weight, sufficient strength of the polyamide cannot be obtained, and if it exceeds 100 parts by weight, the physical properties and surface smoothness of the molded product will deteriorate, and the effect of adding fatty acid ester of polyethylene sorbitan This is because they cannot obtain enough.

本発明にあって、ポリオキシエチレンソルビタンの脂肪
酸エステルの添加量はポリアミド100重量部に対し、
0.05〜0.6重量部とするのがよい。その理由は、
添加量が0.05重量部未満であると表面外観改良効果
が小さく、また添加量が0.6重量部を超えても表面外
観改良効果はさほど大きくならず、しかもメンキや塗装
を施す場合の表面処理材と成形品との密着力が低下する
からである。
In the present invention, the amount of fatty acid ester of polyoxyethylene sorbitan added is as follows with respect to 100 parts by weight of polyamide.
The amount is preferably 0.05 to 0.6 parts by weight. The reason is,
If the amount added is less than 0.05 part by weight, the effect of improving the surface appearance will be small, and if the amount added exceeds 0.6 part by weight, the effect of improving the surface appearance will not be so great, and moreover, it will be difficult to improve the surface appearance when polishing or painting. This is because the adhesion between the surface treatment material and the molded product decreases.

本発明で用いるポリアミドに無機充填材料及びポリオキ
シエチレンソルビタンの脂肪耐エステルを配合する方法
については特に制限はなく、公知の配合方法のいずれを
も採用することができる。
There are no particular restrictions on the method of blending the inorganic filler material and the fat-resistant ester of polyoxyethylene sorbitan into the polyamide used in the present invention, and any known blending method may be employed.

例えばポリアミドのペレットと無機充填材料、ポリオキ
シエチレンソルビタンの脂肪酸エステルを同時に溶融混
練しペレット化する方法、ポリアミドペレットと無機充
填材料を溶融混練ペレット化し、ポリオキシエチレンソ
ルビタンの脂肪酸エステルを添加する方法などがある。
For example, a method in which polyamide pellets, an inorganic filler material, and a fatty acid ester of polyoxyethylene sorbitan are simultaneously melt-kneaded and pelletized, a method in which polyamide pellets and an inorganic filler material are melt-kneaded and pelletized, and a fatty acid ester of polyoxyethylene sorbitan is added. There is.

尚、本発明のポリアミド樹脂組成物には、ポリオキシエ
チレンソルビタンの脂肪酸エステルによる表面外観改良
効果を損なわない限り、他の成分、例えば、ステアリン
酸塩等の離型剤、銅塩、ハロゲン化合物等の耐熱剤など
を含有させることもできる。
The polyamide resin composition of the present invention may contain other ingredients, such as a mold release agent such as stearate, copper salts, halogen compounds, etc., as long as they do not impair the surface appearance improvement effect of the fatty acid ester of polyoxyethylene sorbitan. It is also possible to contain a heat resistant agent and the like.

[実施例] 以下、実施例及び比較例に基づき本発明2更に詳細に説
明する。
[Example] The present invention 2 will be described in more detail below based on Examples and Comparative Examples.

実施例1 相対粘度2.6のナイロン6(宇部興産M製UBEナイ
ロン1013B)100重量部、平均粒径5ルのワラス
トナイト67重量部を二軸混練機で混練し成形用ペレッ
トを得た。次にこのペレットを真空乾燥した後、ポリオ
キシエチレンソルビタンモノラウレート(商品名バルー
7220丸菱油化工業株製)を0.25重量部添加混合
し成形用ペレットを調製した。
Example 1 100 parts by weight of nylon 6 (UBE nylon 1013B manufactured by Ube Industries M) having a relative viscosity of 2.6 and 67 parts by weight of wollastonite having an average particle size of 5 l were kneaded in a twin-screw kneader to obtain pellets for molding. . Next, the pellets were vacuum-dried, and then 0.25 parts by weight of polyoxyethylene sorbitan monolaurate (trade name: Valu 7220, manufactured by Marubishi Yuka Kogyo Co., Ltd.) was added and mixed to prepare pellets for molding.

この成形用ペレットを使用して射出成形(成形温度28
0℃)を行いプレート(125ma+X 75mmX 
3 am)を成形した。
Using this molding pellet, injection molding (molding temperature 28
0°C) and plate (125ma+X 75mmX
3 am) was molded.

実施例2 実施例1のポリオキシエチレンソルビタンモノラウレー
トをポリオキシエチレンソルビタンモノパルミテートに
かえた以外は、実施例1と同様にプレートを成形した。
Example 2 A plate was molded in the same manner as in Example 1, except that polyoxyethylene sorbitan monolaurate in Example 1 was replaced with polyoxyethylene sorbitan monopalmitate.

実施例3 実施例1のポリオキシエチレンソルビタンモノラウレー
トをポリオキシエチレンソルビタンモノステアレートに
かえた以外は、実施例1と同様にプレートを成形した。
Example 3 A plate was molded in the same manner as in Example 1, except that polyoxyethylene sorbitan monolaurate in Example 1 was replaced with polyoxyethylene sorbitan monostearate.

実施例4 実施例1のポリオキシエチレンソルビタンモノラウレー
トをポリオキシエチレンソルビタンモノオレエートにか
えた以外は実施例1と同様にプレートを成形した。
Example 4 A plate was molded in the same manner as in Example 1, except that polyoxyethylene sorbitan monolaurate in Example 1 was replaced with polyoxyethylene sorbitan monooleate.

比較例1 相対粘度2.6のナイロン6(宇部興産株製UBEナイ
ロン1013B)100重量部、平均粒径5終のワラス
トナイト67重量部を実施例と同様に混練乾燥して成形
ペレットを得た。
Comparative Example 1 100 parts by weight of nylon 6 (UBE nylon 1013B manufactured by Ube Industries, Ltd.) with a relative viscosity of 2.6 and 67 parts by weight of wollastonite with an average particle size of 5 were kneaded and dried in the same manner as in the example to obtain molded pellets. Ta.

この成形用ペレットを使用して実施例と同条件でプレー
トを成形した。
A plate was molded using this molding pellet under the same conditions as in the example.

比較例2 相対粘度2.6のナイロン6(宇部興産株製UBE+イ
0)lO13B)100重量部、平均粒径5濤のワラス
トナイト67重量部を実施例と同様に混練乾燥した後ス
テアリン酸亜鉛を0.05重量部添加混合し成形ペレッ
トを調製した。
Comparative Example 2 100 parts by weight of nylon 6 (manufactured by Ube Industries, Ltd., UBE+I0 1O13B) with a relative viscosity of 2.6 and 67 parts by weight of wollastonite with an average particle size of 5 mm were kneaded and dried in the same manner as in Example, and then stearic acid was added. 0.05 parts by weight of zinc was added and mixed to prepare molded pellets.

この成形用ペレットを使用して実施例と同条件でプレー
トを成形した。
A plate was molded using this molding pellet under the same conditions as in the example.

4以下に実施例1.2.3.4.比較例1及び比較例2
の結果を表にして示す。
4 Below are Examples 1.2.3.4. Comparative example 1 and comparative example 2
The results are shown in a table.

[発明の効果] 以上述べた通り本発明によれば、強度のみならず表面処
理材との密着力に優れしかも成形品表面外観の改良され
た成形品を成形することが可能なポリアミド樹脂組成物
を提供することができる。
[Effects of the Invention] As described above, the present invention provides a polyamide resin composition that can be molded into a molded product that has not only strength but also excellent adhesion to a surface treatment material and has an improved surface appearance. can be provided.

Claims (3)

【特許請求の範囲】[Claims] (1)ポリアミド100重量部に対し、 平均粒径20μm以下の無機充填材料30〜100重量
部と、 ポリオキシエチレンソルビタンの脂肪酸エステル0.0
5〜0.6重量部とを含有してなるポリアミド樹脂組成
物。
(1) For 100 parts by weight of polyamide, 30 to 100 parts by weight of an inorganic filler material with an average particle size of 20 μm or less and 0.0 parts by weight of fatty acid ester of polyoxyethylene sorbitan.
5 to 0.6 parts by weight.
(2)前記ポリオキシエチレンソルビタンの脂肪酸エス
テルが次式 ▲数式、化学式、表等があります▼ 及び ▲数式、化学式、表等があります▼ [式中、Rは炭素原子数10〜20のアルキル基又は炭
素原子数10〜20のアルケニル基を表わし、n_1、
n_2及びn_3はそれぞれ独立に1〜20の整数を表
わす。] の少なくとも一で示される特許請求の範囲第1項記載の
ポリアミド樹脂組成物。
(2) The fatty acid ester of polyoxyethylene sorbitan has the following formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ and ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [In the formula, R is an alkyl group having 10 to 20 carbon atoms] or represents an alkenyl group having 10 to 20 carbon atoms, n_1,
n_2 and n_3 each independently represent an integer from 1 to 20. ] The polyamide resin composition according to claim 1, which is represented by at least one of the following.
(3)Rがn−C_1_1H_2_3−、n−C_1_
5H_3_1−、n−C_1_7H_3_5−及びCH
_3(CH_2)_7CH=CH(CH_2)_7−の
少なくとも一で示される基である特許請求の範囲第2項
記載のポリアミド樹脂組成物。
(3) R is n-C_1_1H_2_3-, n-C_1_
5H_3_1-, n-C_1_7H_3_5- and CH
The polyamide resin composition according to claim 2, wherein the polyamide resin composition is a group represented by at least one of _3(CH_2)_7CH=CH(CH_2)_7-.
JP10939386A 1986-05-15 1986-05-15 Polyamide resin composition Pending JPS62267356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10939386A JPS62267356A (en) 1986-05-15 1986-05-15 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10939386A JPS62267356A (en) 1986-05-15 1986-05-15 Polyamide resin composition

Publications (1)

Publication Number Publication Date
JPS62267356A true JPS62267356A (en) 1987-11-20

Family

ID=14509099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10939386A Pending JPS62267356A (en) 1986-05-15 1986-05-15 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS62267356A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5065555A (en) * 1973-10-04 1975-06-03
JPS5111833A (en) * 1974-07-20 1976-01-30 Idemitsu Kosan Co

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5065555A (en) * 1973-10-04 1975-06-03
JPS5111833A (en) * 1974-07-20 1976-01-30 Idemitsu Kosan Co

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