JPS6226061U - - Google Patents
Info
- Publication number
- JPS6226061U JPS6226061U JP11798085U JP11798085U JPS6226061U JP S6226061 U JPS6226061 U JP S6226061U JP 11798085 U JP11798085 U JP 11798085U JP 11798085 U JP11798085 U JP 11798085U JP S6226061 U JPS6226061 U JP S6226061U
- Authority
- JP
- Japan
- Prior art keywords
- pattern portion
- land
- electronic component
- bonding
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す平面図であつ
て、ａ図乃至ｄ図はその変形例を示す図、第２図
は従来例を示す平面図である。
３……ランド、４……パターン部、５……結合
パターン部、６……スリツト部。
FIG. 1 is a plan view showing an embodiment of the present invention, figures a to d are views showing modified examples thereof, and FIG. 2 is a plan view showing a conventional example. 3...Land, 4...Pattern section, 5...Joining pattern section, 6...Slit section.
Claims (1)
する電子部品が、半田付けにより装着されるプリ
ント基板において、前記端子部品の端子が電気的
に接続されるランドと、前記電子部品が装着され
た状態で、前記電子部品の下面に配される電源ラ
イン、あるいは、アースライン等のパターン部と
、前記一のランドと前記パターン部とを結合する
結合パターン部と、前記パターン部と結合パター
ン部の接合部近傍に形成され、前記パターン部内
部へ延在するスリツト部とを有し、前記スリツト
部によつてパターン部への熱伝導度を小さくした
ことを特徴とするプリント基板。 In a printed circuit board on which an electronic component having a plurality of terminals such as a flat package IC is attached by soldering, a land to which the terminal of the terminal component is electrically connected and a land with the electronic component attached thereto are provided. , a pattern portion such as a power line or a ground line arranged on the lower surface of the electronic component, a bonding pattern portion coupling the first land and the pattern portion, and a bonding portion between the pattern portion and the bonding pattern portion. 1. A printed circuit board comprising: a slit portion formed near the pattern portion and extending into the inside of the pattern portion; the slit portion reducing thermal conductivity to the pattern portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11798085U JPH0319238Y2 (en) | 1985-07-31 | 1985-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11798085U JPH0319238Y2 (en) | 1985-07-31 | 1985-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6226061U true JPS6226061U (en) | 1987-02-17 |
| JPH0319238Y2 JPH0319238Y2 (en) | 1991-04-23 |
Family
ID=31004003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11798085U Expired JPH0319238Y2 (en) | 1985-07-31 | 1985-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0319238Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016100497A (en) * | 2014-11-25 | 2016-05-30 | 富士通株式会社 | Wiring board and manufacturing method of the same |
-
1985
- 1985-07-31 JP JP11798085U patent/JPH0319238Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016100497A (en) * | 2014-11-25 | 2016-05-30 | 富士通株式会社 | Wiring board and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0319238Y2 (en) | 1991-04-23 |