JPS62252693A - Solder for ceramics - Google Patents
Solder for ceramicsInfo
- Publication number
- JPS62252693A JPS62252693A JP9321086A JP9321086A JPS62252693A JP S62252693 A JPS62252693 A JP S62252693A JP 9321086 A JP9321086 A JP 9321086A JP 9321086 A JP9321086 A JP 9321086A JP S62252693 A JPS62252693 A JP S62252693A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ceramics
- accuracy
- component
- ferrule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 33
- 239000000919 ceramic Substances 0.000 title claims abstract description 27
- 238000005476 soldering Methods 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 230000007423 decrease Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052787 antimony Inorganic materials 0.000 abstract 3
- 229910052797 bismuth Inorganic materials 0.000 abstract 3
- 229910052718 tin Inorganic materials 0.000 abstract 3
- 229910052725 zinc Inorganic materials 0.000 abstract 3
- 230000002950 deficient Effects 0.000 abstract 1
- 239000006260 foam Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910002059 quaternary alloy Inorganic materials 0.000 abstract 1
- 239000013307 optical fiber Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明はセラミック用はんだに関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to solder for ceramics.
（従来の技術）
セラミック、ガラス等の部材は、通常のｐｂ−８ｎ共晶
はんだで接続することは困難である。このような部材を
接続できる従来のセラミック用はんだとしては、例えば
ｐｂ−ｓｎ−ｚｎ系、Ｐｂ−８ｎ−７ｎ−１３ｉ系、ま
たこれらにさらに微量成分を添加したものが知られてい
る。(Prior Art) It is difficult to connect members such as ceramics and glass with ordinary PB-8N eutectic solder. Conventional solders for ceramics that can connect such members include, for example, pb-sn-zn type solder, Pb-8n-7n-13i type solder, and those to which trace components are added.
ところでセラミック、ガラス等の部材は、たとえば光、
電気の分野の装置部品等として多用されるものであるが
、このような装置部品では、通常正確な寸法精度で接続
できるとともに、その後温度変動下で使用しても初期の
寸法精度が確実に維持されることが望まれる。By the way, members such as ceramics and glass are sensitive to light,
Often used as equipment parts in the electrical field, these equipment parts can usually be connected with exact dimensional accuracy, and the initial dimensional accuracy can be reliably maintained even after subsequent use under temperature fluctuations. It is hoped that this will be done.
（発明が解決しようとする問題点）
しかしながらＰｂ−８ｎ−Ｚｎ系、Ｐｂ−８ｎ−２ｎ−
Ｂｉ系のセラミック用はんだによる接続部は、その後の
温度変動で寸法変化が生じ易く初期の寸法精度が維持さ
れないという難点があった。(Problem to be solved by the invention) However, Pb-8n-Zn system, Pb-8n-2n-
Connections using Bi-based ceramic solder have the disadvantage that dimensional changes tend to occur due to subsequent temperature fluctuations, and initial dimensional accuracy cannot be maintained.
この発明は上記事情に基づいてなされたもので、比較的
低温で接続できて正確な初期の寸法精度が得られるとと
もに、接続後に温度変動を受けても初期の寸法精度を確
実に維持することのできるセラミック用はんだを提供す
ることを目的とする。This invention was made based on the above circumstances, and it is possible to connect at a relatively low temperature and obtain accurate initial dimensional accuracy, and also to ensure that the initial dimensional accuracy is maintained even if the temperature changes after connection. The purpose is to provide solder for ceramics that can be used.
［発明の構成］
（問題点を解決するための手段と作用）本発明は、上記
問題点を解決するために、重量％表示で、Ｂｉ２５〜８
５．５ｎ１８〜６８、Ｚｎｏ、、１〜１０、およびＳｂ
０．１〜１０の組成からなることを特徴とする。[Structure of the Invention] (Means and Effects for Solving the Problems) In order to solve the above problems, the present invention provides Bi25 to 8
5.5n18-68, Zno, 1-10, and Sb
It is characterized by having a composition of 0.1 to 10.
はんだ組成を上記のように限定した理由は次の通りであ
る。The reason for limiting the solder composition as described above is as follows.
［３ｉは低融はんだとするために加えられる。Ｂｉは８
５％を越えると、はんだ材料として靭性が低下し強度劣
化を生じるので好ましくなく、また２５％未満では凝固
時に収縮が大きくはんだ内部または接着界面に気泡を生
じるために好ましくないａ Ｂ ｉは上記の範囲中４６
〜６６％の範囲が上記の特性を抑える効果がより顕著に
生じて望ましい。[3i is added to make it a low melting solder. Bi is 8
If it exceeds 5%, it is undesirable because the toughness of the solder material decreases and strength deteriorates, and if it is less than 25%, it shrinks during solidification and causes bubbles inside the solder or at the bonding interface, which is undesirable. 46 in range
A range of 66% is desirable because the effect of suppressing the above characteristics is more pronounced.
３ｎは６８％より多いとはんだ内部または接着界面に気
泡が生じるので好ましくなく、また１８％未満では、融
点および粘性が高くなり接着不良を生じ易く好ましくな
い。Ｓｎは上記範囲中２８〜４８％の範囲が上記の特性
を抑える効果がより顕著に生じて望ましい。If 3n is more than 68%, air bubbles will be generated inside the solder or at the bonding interface, which is undesirable. If it is less than 18%, the melting point and viscosity will become high, which tends to cause poor adhesion, which is undesirable. It is preferable for Sn to be in the range of 28 to 48% in the above range because the effect of suppressing the above characteristics is more pronounced.
ｚｎはセラミックに対する接着力を付与するために含有
される。ｚｎは１０％を越えると緻密な１１織の合金が
得られ難くなり接着不良を生じるので好ましくなく、ま
た０、１％未満では接着力が低下するので好ましくない
。Ｚｎは上記範囲中２〜４％の範囲がセラミックに対す
る接着力がより大になるので望ましい。Zn is contained to provide adhesive strength to ceramics. If zn exceeds 10%, it becomes difficult to obtain a dense 11-weave alloy, resulting in poor adhesion, which is not preferable, and if it is less than 0.1%, the adhesive strength decreases, which is not preferable. It is desirable that Zn be in the range of 2 to 4% of the above range because the adhesion to ceramic becomes stronger.
Ｓｂははんだの耐水性、耐候性を向上させるために添加
される。ｓｂは１０％を越えると均質な組織の合金が得
られ難くなるので好ましくなく、０．１％未満では上記
特性を十分に向上させることができないので好ましくな
い。ｓｂは上記範囲中１〜３％の範囲が上記の特性が顕
著に向上するのでより好ましい。Sb is added to improve the water resistance and weather resistance of the solder. If sb exceeds 10%, it becomes difficult to obtain an alloy with a homogeneous structure, which is not preferable, and if it is less than 0.1%, the above characteristics cannot be sufficiently improved, which is not preferable. It is more preferable for sb to be in the range of 1 to 3% since the above characteristics are significantly improved.
かかるセラミック用はんだを調整するに当っては各成分
が所定割合になるように混合し、真空中、不活性雰囲気
中または還元性雰囲気中で溶融し合金にする。In preparing such a solder for ceramics, each component is mixed in a predetermined ratio and melted to form an alloy in a vacuum, an inert atmosphere, or a reducing atmosphere.
本発明のセラミック用はんだは、セラミック物品同士、
ガラスとセラミック、ガラスとガラス、セラミックと酸
化被膜を有する金属等のはんだ付けであって、正確な寸
法精度で接続でき、且つその後に温度変動が生じても初
期の寸法精度を維持する必要のある装置物品に適してい
る。The ceramic solder of the present invention can be used between ceramic articles,
Soldering of glass and ceramic, glass and glass, ceramic and metal with an oxide film, etc., which can be connected with accurate dimensional accuracy and must maintain the initial dimensional accuracy even if temperature changes occur afterwards. Suitable for equipment articles.
（実施例）
セラミック用はんだは、重湯％でＢ１５６．５ｎ３８、
Ｚｎ３、Ｓｂ３で、融点は１３５℃のものを準備した。(Example) Solder for ceramics is B156.5n38 in terms of heavy hot water%.
Zn3 and Sb3 with a melting point of 135°C were prepared.
第１図に示す装置を用いて、石英製の光ファイバー１と
、このコネクターであるＺｒＯ２製のフェルール２との
はんだ付けを行ない、はんだ付は後温度変化を与えて寸
法変化を調べた。Using the apparatus shown in FIG. 1, an optical fiber 1 made of quartz and a ferrule 2 made of ZrO2, which is a connector thereof, were soldered together, and after soldering, temperature changes were applied to examine dimensional changes.
装置を説明すると、台３上に次のような各部材が配設さ
れている。To explain the device, the following members are arranged on the table 3.
即ち、４は超音波装置で、超音波チップ５の後端にホー
ン６を介して超音波振動子７が接続されている。ｍ音波
チップ５にはヒータ８が取付けられている。超音波装置
４は保持具９に保持され、保持具９はスライドロッド１
１にスライド可能に装着されている。That is, 4 is an ultrasonic device, and an ultrasonic vibrator 7 is connected to the rear end of an ultrasonic chip 5 via a horn 6. A heater 8 is attached to the m-sonic wave chip 5. The ultrasonic device 4 is held by a holder 9, and the holder 9 is connected to the slide rod 1.
It is slidably attached to 1.
１２はフェルール保持具で、フェルール保持具１２はス
ライドロッド１１にスライド可能に装着されている。１
３はフェルール２を加熱するリングヒータ、１４はファ
イバー保持具である。12 is a ferrule holder, and the ferrule holder 12 is slidably attached to the slide rod 11. 1
3 is a ring heater that heats the ferrule 2, and 14 is a fiber holder.
はんだ付けに当っては、ファイバー保持具１４、および
フェルール保持具１２にそれぞれ光ファイバー１、およ
びフェルール２をそれぞれ保持させる。フェルール保持
具１２を図の左方へスライドさせ、リングヒーター１３
にフェルール２を挿入して加熱する。一方、超音波チッ
プ５の先端にセラミックはんだ１５を接触させ、溶融は
んだとして保持する。During soldering, the fiber holder 14 and the ferrule holder 12 hold the optical fiber 1 and the ferrule 2, respectively. Slide the ferrule holder 12 to the left in the figure and remove the ring heater 13.
Insert ferrule 2 into and heat it. On the other hand, ceramic solder 15 is brought into contact with the tip of the ultrasonic chip 5 and held as molten solder.
次いで超音波振動子７を作動させつつ保持與９を右方に
スライドさせ超音波チップ５の先端をフェルール２の端
面に当接させる。これによってフェルール２の中心部に
設けた貫通孔にセラミックはんだ１５が充填される。は
んだ充填後、保持具９を左側にスライドさせフェルール
２から超音波チップ５を離す。Next, while operating the ultrasonic vibrator 7, the holding rod 9 is slid to the right to bring the tip of the ultrasonic tip 5 into contact with the end surface of the ferrule 2. As a result, the through hole provided in the center of the ferrule 2 is filled with the ceramic solder 15. After filling the solder, the holder 9 is slid to the left to separate the ultrasonic chip 5 from the ferrule 2.
そして光ファイバー１を右側からフェルール２の貫通孔
に挿入し、光ファイバー１の先端が若干突出するように
する。次いでフェルール保持具１２を右方にスライドさ
せてフェルール２を保持具から取出す。Then, the optical fiber 1 is inserted into the through hole of the ferrule 2 from the right side so that the tip of the optical fiber 1 slightly protrudes. Next, slide the ferrule holder 12 to the right and take out the ferrule 2 from the holder.
最後にフェルール２の先端面を研磨し付着したはんだお
よび突出した光ファイバー１を除去しはんだ付けを終了
する。Finally, the tip surface of the ferrule 2 is polished to remove the adhered solder and the protruding optical fiber 1, thereby completing the soldering.
このはんだ付けを終了したフェルール２に次のような温
度サイクルを与えた。The ferrule 2 that had been soldered was subjected to the following temperature cycle.
即ち、７０℃に１時間保持した後、９５℃／時の降温速
度でマイナス２５℃まで冷却し、その温度で１時間保持
した。次に９５℃／時の昇温速度で７０℃まで昇温した
。That is, after being held at 70°C for 1 hour, it was cooled to minus 25°C at a cooling rate of 95°C/hour, and held at that temperature for 1 hour. Next, the temperature was raised to 70°C at a rate of 95°C/hour.
この渇度普ナイクルを６サイクル行なった後、フェルー
ル２先喘而よりの光ファイバー１の突出量を測定した。After six cycles of this dry cycle, the amount of protrusion of the optical fiber 1 from the end of the ferrule 2 was measured.
その結果を、テスト初期と温瓜変動を加えた後について
示したのが第２図である。Figure 2 shows the results at the initial stage of the test and after adding the temperature variation.
比較例として、重量％でＰｂ９１、Ｓｎ５、Ｚｎ３、Ｓ
ｂｌで、融点が２９７℃のセラミック用はんだを用いて
上記と同様のはんだ付けを行ない、同様のテストを行な
ったものの結果を第３図に示した。As a comparative example, Pb91, Sn5, Zn3, S
Soldering was carried out in the same manner as above using a ceramic solder having a melting point of 297° C., and a similar test was conducted, and the results are shown in FIG.
はんだ付は部の引張強度は本発明のセラミック用はんだ
、比較例のセラミック用はんだとも約２Ｋｇで有意差は
なく、十分な強度を有していた。The tensile strength of the soldered portion was approximately 2 kg between the ceramic solder of the present invention and the ceramic solder of the comparative example, with no significant difference and sufficient strength.
しかし、第２図と第３図の比較から明らかなように、温
度変動を加えた侵の光ファイバーの突出量については、
本発明のセラミック用はんだによるものは、比較例のも
のよりも極めて少なく、初期の寸法精度を確実に維持で
きる点で顕著に優れている。However, as is clear from the comparison between Figures 2 and 3, the amount of protrusion of the optical fiber when subjected to temperature fluctuations is
The solder for ceramics of the present invention is significantly less than that of the comparative example, and is significantly superior in that the initial dimensional accuracy can be reliably maintained.
［発明の効果］
以上説明したように本発明の構成によれば、比較的低温
度ではんだ付けを行なうことができて正確な初期の寸法
精度を得ることができ、またその後温度変動を受けても
合金の特性により初期の寸法精度を確実に維持すること
ができるという利点がある。[Effects of the Invention] As explained above, according to the configuration of the present invention, soldering can be performed at a relatively low temperature and accurate initial dimensional accuracy can be obtained, and the soldering can be performed at a relatively low temperature, and it is possible to obtain accurate initial dimensional accuracy. It also has the advantage that initial dimensional accuracy can be reliably maintained due to the properties of the alloy.
第１図は本発明に係わるセラミック用はんだの実施例を
用いて接続を行なうための装置例を示す一部断面側面図
、第２図は本発明の実施例を用いて同上装置により接続
した物品に温度変動を加えたときの寸法変化特性を示す
図、第３図は従来例を用いて前記の装置により接続した
物品に温度変動を加えたときの寸法変化特性を示す図で
ある。
１：石英製の光ファイバー、
２：ＺｒＯ２製のフェルール、
１５：セラミック用はんだ。
第１図Fig. 1 is a partially sectional side view showing an example of a device for making connections using an embodiment of the ceramic solder according to the present invention, and Fig. 2 shows an article connected by the same device using an embodiment of the present invention. FIG. 3 is a diagram showing dimensional change characteristics when a temperature change is applied to an article connected by the above-mentioned device using a conventional example. 1: Optical fiber made of quartz, 2: Ferrule made of ZrO2, 15: Ceramic solder. Figure 1
Claims (2)
セラミック用はんだ。(2) The solder for ceramics according to claim 1, characterized in that it consists of Bi46-66 Sn28-48 Zn2-4 Sb1-3 expressed in weight %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321086A JPH06102579B2 (en) | 1986-04-24 | 1986-04-24 | Solder for ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321086A JPH06102579B2 (en) | 1986-04-24 | 1986-04-24 | Solder for ceramic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62252693A true JPS62252693A (en) | 1987-11-04 |
| JPH06102579B2 JPH06102579B2 (en) | 1994-12-14 |
Family
ID=14076204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9321086A Expired - Lifetime JPH06102579B2 (en) | 1986-04-24 | 1986-04-24 | Solder for ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06102579B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
| KR20030012963A (en) * | 2001-08-06 | 2003-02-14 | 이도재 | Lead free solder composed of Sn-Bi-Zn-In |
| KR100743190B1 (en) | 2005-12-26 | 2007-07-27 | 재단법인 포항산업과학연구원 | Lead-free solder with low boiling point and method of producing same |
| JP2010167472A (en) * | 2009-01-26 | 2010-08-05 | Fujitsu Ltd | Solder, soldering method, and semiconductor device |
| JP2012157873A (en) * | 2011-01-31 | 2012-08-23 | Fujitsu Ltd | Solder, soldering method and semiconductor device |
| JP5679094B1 (en) * | 2013-08-05 | 2015-03-04 | 千住金属工業株式会社 | Lead-free solder alloy |
| TWI646203B (en) * | 2016-07-15 | 2019-01-01 | 日商Ｊｘ金屬股份有限公司 | Solder alloy |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
-
1986
- 1986-04-24 JP JP9321086A patent/JPH06102579B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
| KR20030012963A (en) * | 2001-08-06 | 2003-02-14 | 이도재 | Lead free solder composed of Sn-Bi-Zn-In |
| KR100743190B1 (en) | 2005-12-26 | 2007-07-27 | 재단법인 포항산업과학연구원 | Lead-free solder with low boiling point and method of producing same |
| JP2010167472A (en) * | 2009-01-26 | 2010-08-05 | Fujitsu Ltd | Solder, soldering method, and semiconductor device |
| JP2012157873A (en) * | 2011-01-31 | 2012-08-23 | Fujitsu Ltd | Solder, soldering method and semiconductor device |
| US8673762B2 (en) | 2011-01-31 | 2014-03-18 | Fujitsu Limited | Solder, soldering method, and semiconductor device |
| JP5679094B1 (en) * | 2013-08-05 | 2015-03-04 | 千住金属工業株式会社 | Lead-free solder alloy |
| TWI646203B (en) * | 2016-07-15 | 2019-01-01 | 日商Ｊｘ金屬股份有限公司 | Solder alloy |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06102579B2 (en) | 1994-12-14 |
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