CN110695565B - Indium-based active brazing filler metal for brazing quartz and kovar alloy and brazing process - Google Patents
Indium-based active brazing filler metal for brazing quartz and kovar alloy and brazing process Download PDFInfo
- Publication number
- CN110695565B CN110695565B CN201910869379.2A CN201910869379A CN110695565B CN 110695565 B CN110695565 B CN 110695565B CN 201910869379 A CN201910869379 A CN 201910869379A CN 110695565 B CN110695565 B CN 110695565B
- Authority
- CN
- China
- Prior art keywords
- brazing
- quartz
- filler metal
- brazing filler
- indium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The invention relates to an indium-based active solder for soldering quartz and kovar alloy and a soldering process, wherein the solder comprises the following chemical components in percentage by weight: 20.0-25.0% of Ag, 1.5-4.5% of Ti and the balance of In. In the brazing filler metal, In and Ag are used as a matrix, Ti is used as an active element, quartz glass and kovar alloy can be well wetted, and the brazing filler metal is prevented from being stripped from quartz under the action of residual stress of joints by utilizing the characteristics of high plasticity and low hardness of the brazing filler metal. By utilizing the brazing filler metal, the welding between a large-size quartz window body with the diameter exceeding 100mm and the kovar alloy flange can be realized at 650 ℃.
Description
Technical Field
The invention discloses an indium-based active brazing filler metal for brazing quartz and kovar alloy and a brazing process, and belongs to the technical field of ceramic connection.
Background
The quartz glass has low density, small thermal expansion coefficient, excellent dielectric property, higher mechanical strength, heat-resisting temperature and excellent thermal shock resistance and corrosion resistance, so that the quartz glass is widely applied to the high-tech fields of optics, photoelectronic devices, microwave dielectric materials, refractory materials and the like. In the 50-60 s of the 20 th century, fused quartz ceramic materials were applied to missile-dielectric heat-proof antenna windows, and in the 70-80 s, U.S. general companies developed three-dimensionally woven quartz composite materials and applied to missile antenna covers. In recent years, materials with good wave-transmitting property such as fused quartz and the like are applied to the development of the radome of the missile.
Since the coefficient of thermal expansion of quartz is very low (0.5X 10)-6and/K), the brazing filler metal with excellent plasticity is required to reduce the residual stress in the joint. In addition, the conventional solder does not wet quartz, and in order to connect quartz itself or quartz and metal, a proper amount of active elements need to be added into the solder, and the reaction between the active elements and the quartz at high temperature is utilized to promoteAnd (5) wetting the brazing filler metal.
Medium-temperature active solders are mostly adopted for brazing quartz glass and metal in China, active solders AgCuTi and TiZrNiCu are adopted for brazing connection of SiO2 ceramic and TC4 titanium alloy as reported in documents, and both the two solders can achieve connection of SiO2 ceramic and TC4 titanium alloy. When the brazing temperature is 880 ℃ and the heat preservation time is 5min, the highest shear strength of the SiO2/TiZrNiCu/TC4 joint is 23 MPa; the highest shear strength of the SiO2/AgCuTi/TC4 joint was 27MPa (Liuduo, Zhangiuxia, Hepeng, Von Jicai.) for active brazing of SiO2glass ceramics with TC4 titanium alloy, proceedings of welding 2009, 30 (2): 117-. According to the research results reported in domestic and foreign literature, most solders for brazing quartz and metal are Ag-Cu-Ti system solders, the welding temperature is usually over 850 ℃, and the yield strength of the solder is high, so that it is difficult to effectively relieve the residual thermal stress in large-sized joints (A. guidelines, A. Pinto, M.Vieira, et Al. the effect of brazing temperature on the titanium/glass-ceramic bonding. journal of materials processing technology,1999:102-106.H.B.Liu, L.X.Zhang, L.Z.Wu, et Al. vacuum brazing of SiO2glass ceramic and Ti-6Al-4V alloy using materials Cu. Ti filler and materials Science and materials A,2008,498: 321)
In the patent aspect, few low-temperature active solders specially used for connection of quartz glass and metal are available, and most researches are applied to the electronic field. In view of the components of the brazing filler metal, most of the brazing filler metals of the present invention contain a volatile element, Zn, etc., and thus the connection of parts cannot be performed by a vacuum brazing method.
Disclosure of Invention
The invention provides an indium-based active solder for brazing quartz and kovar alloy and a brazing process aiming at the prior art, and aims to realize vacuum brazing of quartz and kovar alloy.
The purpose of the invention is realized by the following technical scheme:
the technical scheme of the invention provides an indium-based active solder for brazing quartz and kovar alloy, which is characterized in that: the brazing filler metal comprises the following chemical components in percentage by weight: 20.0-25.0% of Ag, 1.5-4.5% of Ti and the balance of In.
In one implementation, the brazing filler metal comprises the following chemical components in percentage by weight: 24.0 percent of Ag, 2.0 percent of Ti and 74.0 percent of In.
In one implementation, the brazing filler metal comprises the following chemical components in percentage by weight: ag 22.0%, Ti 1.5%, In 76.5%
The technical scheme of the invention also provides a brazing process of the indium-based active brazing filler metal for brazing the quartz and the kovar alloy, wherein the process is vacuum brazing, the brazing temperature is 650-700 ℃, the heat preservation time is 5-30 min, and the cooling speed is 3-5 ℃/min.
In one implementation, the brazing temperature is 650 ℃, the holding time is 10min, and the cooling rate is 5 ℃/min.
In one implementation, the brazing temperature is 700 ℃, the holding time is 10min, and the cooling rate is 4 ℃/min.
In one implementation, after welding is completed, the workpiece is furnace cooled to room temperature and discharged.
In one implementation, in the brazing process, the workpieces to be welded are a quartz window and a kovar alloy welding flange, and the welding size is 100 mm.
The technical scheme of the invention has the advantages that:
(1) the solder matrix consists of two elements of In and Ag, and the ratio of In to Ag is about 3:1, which is a more ideal ratio. If the content of Ag is increased, the brittleness of the matrix of the brazing filler metal is increased, the plasticity is reduced, and cohesive type cracking is easily formed on the surface of quartz; if the In content is increased, the melting point of the solder is further lowered, resulting In a simultaneous decrease In joint strength and temperature resistance.
(2) Active element Ti is added into an In-Ag matrix, so that the wetting and interface reaction of the solder on quartz and kovar alloy can be promoted, the Ti content is controlled to be 1.5-4.5%, the brittleness of the solder is not excessively increased on the premise of ensuring the activity of the solder, and the solder can be prepared into wires or sheets to meet the use requirement.
(3) The In-Ag-Ti brazing filler metal can be used for brazing quartz and kovar alloy dissimilar materials at 650-750 ℃, residual thermal stress of joints can be effectively relieved by utilizing the characteristics of good plasticity and low hardness of the brazing filler metal, and a large-size quartz window body with the diameter exceeding 100mm and a kovar alloy flange can be effectively connected by matching with a post-welding slow cooling process. The shear strength of the joint at room temperature reaches 40-50 MPa
Detailed Description
The technical solution of the present invention will be further described with reference to the following examples:
the first embodiment is as follows:
(1) preparing a brazing filler metal: the brazing filler metal is prepared from metal raw materials according to the following components in percentage by weight: 24.0 percent of Ag, 2.0 percent of Ti and 74.0 percent of In, weighing each elementary substance element according to the proportion, and then mixing;
(2) arc melting is carried out on the mixed metal in an argon filling box, the melting frequency is not less than 5 times, and the mixed metal is turned over every 1 time of melting to obtain a brazing alloy ingot;
(3) processing the brazing alloy ingot into a proper size by using a wire cutting method;
(4) after the quartz window body and the kovar alloy flange are assembled, sufficient brazing filler metal is filled in a welded area, then the welded area is flatly placed in a vacuum furnace for brazing, the brazing specification is 650 ℃/10min, the cooling speed is 5 ℃/min, the furnace is cooled when the furnace temperature is cooled to be below 400 ℃, and the furnace is taken out when the furnace temperature is cooled to be normal temperature.
Example two:
(1) preparing a brazing filler metal: the brazing filler metal is prepared from metal raw materials according to the following components in percentage by weight: 22.0% of Ag, 1.5% of Ti and 76.5% of In, weighing the elementary substances according to the proportion, and then mixing;
(2) arc melting is carried out on the mixed metal in an argon filling box, the melting frequency is not less than 5 times, and the mixed metal is turned over every 1 time of melting to obtain a brazing alloy ingot;
(3) processing the brazing filler metal into a proper size by a method of rolling into sheets and then cutting;
(4) after the quartz window body and the kovar alloy flange are assembled, sufficient brazing filler metal is filled in a welded area, then the welded area is flatly placed in a vacuum furnace for brazing, the brazing specification is 700 ℃/10min, the cooling speed is 4 ℃/min, the furnace is cooled when the furnace temperature is cooled to be below 400 ℃, and the furnace is taken out when the furnace temperature is cooled to be normal temperature.
Claims (5)
1. An indium-based active solder for brazing quartz and kovar alloy is characterized in that: the brazing filler metal comprises the following chemical components in percentage by weight: 20.0-25.0% of Ag, 1.5-4.5% of Ti and the balance of In;
the brazing process of the brazing filler metal is vacuum brazing, the workpiece to be welded is a flange formed by assembling a quartz window body and kovar alloy together, the diameter of the workpiece to be welded reaches 100mm, the brazing temperature is 650-700 ℃, the heat preservation time is 5-30 min, and the cooling speed is 3-5 ℃/min.
2. The indium-based reactive solder for brazing quartz to kovar alloys according to claim 1, wherein: the brazing filler metal comprises the following chemical components in percentage by weight: 24.0 percent of Ag, 2.0 percent of Ti and 74.0 percent of In.
3. The indium-based reactive solder for brazing quartz to kovar alloys according to claim 1, wherein: the brazing filler metal comprises the following chemical components in percentage by weight: 22.0% of Ag, 1.5% of Ti and 76.5% of In.
4. The indium-based reactive solder for brazing quartz to kovar alloys according to claim 1, wherein: the brazing temperature of the brazing filler metal is 650 ℃, the heat preservation time is 10min, and the cooling speed is 5 ℃/min.
5. The indium-based reactive solder for brazing quartz to kovar alloys according to claim 1, wherein: the brazing temperature of the brazing filler metal is 700 ℃, the heat preservation time is 10min, and the cooling speed is 4 ℃/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910869379.2A CN110695565B (en) | 2019-09-12 | 2019-09-12 | Indium-based active brazing filler metal for brazing quartz and kovar alloy and brazing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910869379.2A CN110695565B (en) | 2019-09-12 | 2019-09-12 | Indium-based active brazing filler metal for brazing quartz and kovar alloy and brazing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110695565A CN110695565A (en) | 2020-01-17 |
| CN110695565B true CN110695565B (en) | 2021-08-03 |
Family
ID=69196076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910869379.2A Active CN110695565B (en) | 2019-09-12 | 2019-09-12 | Indium-based active brazing filler metal for brazing quartz and kovar alloy and brazing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110695565B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103270809A (en) * | 2011-05-10 | 2013-08-28 | 法国圣戈班玻璃厂 | Pane having an electrical connection element |
| CN106312220A (en) * | 2016-10-12 | 2017-01-11 | 哈尔滨工业大学（威海） | Ceramic substrate copper cladding low-temperature connection method for power module |
| SK8133Y1 (en) * | 2017-08-14 | 2018-06-01 | Slovenska Technicka Univerzita V Bratislave | Soft lead-free active solder and method of soldering |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1749315B1 (en) * | 2004-05-04 | 2009-12-09 | S-Bond Technologies LLC | Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium |
| US20070292072A1 (en) * | 2006-06-15 | 2007-12-20 | Ainissa Gweneth Ramirez | Solder alloys |
-
2019
- 2019-09-12 CN CN201910869379.2A patent/CN110695565B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103270809A (en) * | 2011-05-10 | 2013-08-28 | 法国圣戈班玻璃厂 | Pane having an electrical connection element |
| CN106312220A (en) * | 2016-10-12 | 2017-01-11 | 哈尔滨工业大学（威海） | Ceramic substrate copper cladding low-temperature connection method for power module |
| SK8133Y1 (en) * | 2017-08-14 | 2018-06-01 | Slovenska Technicka Univerzita V Bratislave | Soft lead-free active solder and method of soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110695565A (en) | 2020-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4602731A (en) | Direct liquid phase bonding of ceramics to metals | |
| CN108640522B (en) | Microcrystalline glass solder and method for welding porous silicon nitride and compact silicon nitride by using same | |
| CN113478040B (en) | Active brazing method for improving performance of graphite/copper dissimilar material joint | |
| CN102489813A (en) | Vacuum active brazing process of molybdenum-copper alloys and stainless steel | |
| CN101722380A (en) | High volume fraction grain enhanced aluminum-base compound material brazing filler metal and preparation method thereof | |
| CN100409996C (en) | Oxidation resistance tin-based no-lead solder capable of proceeding welding without welding flux in air | |
| US5102621A (en) | Ternary brazing alloy for carbon or graphite | |
| US4859531A (en) | Method for bonding a cubic boron nitride sintered compact | |
| CN114769940A (en) | AgCuTi-based composite solder and soldering method for connecting AlN ceramic and Cu by using same | |
| CN110695565B (en) | Indium-based active brazing filler metal for brazing quartz and kovar alloy and brazing process | |
| US3196536A (en) | Method of connecting graphite articles to one another or to articles of different materials | |
| CN102699571A (en) | Moderate-temperature brazing filler metal for graphite-base composite material connection and preparation method thereof | |
| CN1027626C (en) | Weldable ceramic Sn base active medium solder | |
| CN108422058B (en) | For Al2O3Gold-based brazing filler metal for connecting ceramic and metal and welding method thereof | |
| CN115625394A (en) | Active brazing method for large-size graphite/copper dissimilar material joint | |
| CN108480876A (en) | A kind of silver-base solder for zirconia ceramics and solder bonding metal | |
| CN109986232B (en) | Sn-Ti-Cu ternary alloy solder for sealing quartz glass | |
| CN105397339B (en) | A kind of brazing material for TiC Ceramic brazings | |
| JPH0672779A (en) | Method for joining carbon member | |
| CN112299869B (en) | Laser welding method for silicon carbide and composite material thereof | |
| CN116810211A (en) | Low-temperature lead-free active solder alloy and preparation method thereof | |
| SK500792017U1 (en) | Soft lead-free active solder and method of soldering | |
| CN110977239B (en) | Gold-copper-based brazing filler metal and welding method thereof | |
| CN111151915B (en) | Composite brazing filler metal for SiC ceramic low-stress brazing and preparation method thereof | |
| JPH0460947B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |