JPS6224976U - - Google Patents
Info
- Publication number
- JPS6224976U JPS6224976U JP11389585U JP11389585U JPS6224976U JP S6224976 U JPS6224976 U JP S6224976U JP 11389585 U JP11389585 U JP 11389585U JP 11389585 U JP11389585 U JP 11389585U JP S6224976 U JPS6224976 U JP S6224976U
- Authority
- JP
- Japan
- Prior art keywords
- container
- adhesive
- fixed part
- movable part
- needle attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11389585U JPH066508Y2 (ja) | 1985-07-25 | 1985-07-25 | 接着剤収納容器保持装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11389585U JPH066508Y2 (ja) | 1985-07-25 | 1985-07-25 | 接着剤収納容器保持装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6224976U true JPS6224976U (fr) | 1987-02-16 |
| JPH066508Y2 JPH066508Y2 (ja) | 1994-02-16 |
Family
ID=30996123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11389585U Expired - Lifetime JPH066508Y2 (ja) | 1985-07-25 | 1985-07-25 | 接着剤収納容器保持装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066508Y2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010013475A1 (fr) * | 2008-07-31 | 2010-02-04 | 武蔵エンジニアリング株式会社 | Mécanisme de correction de position de buse et dispositif d'application le comportant |
-
1985
- 1985-07-25 JP JP11389585U patent/JPH066508Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010013475A1 (fr) * | 2008-07-31 | 2010-02-04 | 武蔵エンジニアリング株式会社 | Mécanisme de correction de position de buse et dispositif d'application le comportant |
| JP2010036070A (ja) * | 2008-07-31 | 2010-02-18 | Musashi Eng Co Ltd | ノズル位置補正機構およびそれを備える塗布装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH066508Y2 (ja) | 1994-02-16 |