JPS62247585A - Reinforcement of printed board - Google Patents
Reinforcement of printed boardInfo
- Publication number
- JPS62247585A JPS62247585A JP9048386A JP9048386A JPS62247585A JP S62247585 A JPS62247585 A JP S62247585A JP 9048386 A JP9048386 A JP 9048386A JP 9048386 A JP9048386 A JP 9048386A JP S62247585 A JPS62247585 A JP S62247585A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- reinforcing
- reinforcing member
- reinforcement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 title description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子筐体等に収容する、プリント基板の補強
方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for reinforcing a printed circuit board housed in an electronic housing or the like.
従来の技術
従来、この種の補強方法は特に大型の基板の場合に第３
図及び第４図に示すように、プリント基板１上に、Ｌ字
又はコの字形のアングル６を絶縁板７を介して、複数の
ビス８により固定し、ディップハンダ時の熱により発生
したプリント基板のソリの橋正をし、且つ震動又は衝撃
によるプリント基板のタワミを防止した状態で補強が行
われている。Conventional technology Traditionally, this type of reinforcement method has been used especially in the case of large substrates.
As shown in the figure and FIG. 4, an L-shaped or U-shaped angle 6 is fixed on a printed circuit board 1 via an insulating plate 7 with a plurality of screws 8. Reinforcement is performed to correct warpage of the board and to prevent deflection of the printed board due to vibration or impact.
発明が解決しようとする問題点
しかしながら、上記従来の基板の補強方法では、高密度
実装が望まれるプリント基板上において、スペースの無
駄が多いい。又、従来の基板補強方法では、ディップハ
ンダ付けの後、補強部材が取り付けに用いられる方法で
あり、ディップハンダ付は時の基板のソリについては対
策されていなかった０
本発明はこのような従来の問題点を解決するものであり
、少ないス、ペースで、また取付けた状態で、ディップ
ハンダ付けも可能であり、しかも、安価で組立ても容易
なプリント基板の補強方法を提供するものである。Problems to be Solved by the Invention However, the conventional board reinforcing method described above wastes a lot of space on a printed board where high-density mounting is desired. In addition, in the conventional board reinforcing method, a reinforcing member is used for attachment after dip soldering, and dip soldering does not take measures against warping of the board. To solve these problems, and to provide a method for reinforcing a printed circuit board that requires less space and space, allows dip soldering in the mounted state, and is inexpensive and easy to assemble.
問題点を解決するための手段
本発明は上記目的を達成するために、プリント基板上に
補強部材を設け、前記補強部材の複数個所を、クリップ
状の金具で挾み、その先端部を前記プリント基板に設け
た穴に挿入の上裏面で半田付固定することにより補強部
材の固定をするように構成したものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a reinforcing member on a printed circuit board, a plurality of parts of the reinforcing member are held between clip-like metal fittings, and the tips of the reinforcing members are attached to the printed circuit board. The reinforcing member is fixed by soldering and fixing the reinforcing member on the upper back surface of the reinforcing member inserted into a hole provided in the board.
作 用
本発明は上記のように構成したので、ネジ止めのだめの
スペースが不要となり、また回路部品と同時にディップ
半田付けすることによりソリ防止の効果を得ることが出
来る。Function Since the present invention is constructed as described above, there is no need for a space for screw fixing, and the effect of preventing warping can be obtained by dip soldering at the same time as the circuit components.
実施例
第１図及び第２図は本発明の一実施例の構成を示す図で
ある。これらの図で、１１は裏面にプリントパターン１
２を有するプリント基板、１３は板状の細長い補強部材
で、上部に凹部１４を有している。１５は断面コの字状
の金属板より成るクリップ、１６ａ 、 １６ｂはクリ
ップ１６の先端部１７ａ。Embodiment FIGS. 1 and 2 are diagrams showing the configuration of an embodiment of the present invention. In these figures, 11 is printed pattern 1 on the back side.
2, a printed circuit board 13 is a plate-like elongated reinforcing member, and has a recess 14 in the upper part. 15 is a clip made of a metal plate having a U-shaped cross section; 16a and 16b are tip portions 17a of the clip 16;
１７ｂを貫挿するためのスリット状の孔、１８はプリン
トパターン１２、先端部１７ａ 、 １７ｂとを結合す
る半田層である。A slit-like hole 17b is inserted through the hole, and 18 is a solder layer that connects the printed pattern 12 and the tips 17a and 17b.
上記構成で、り’Ｊ ｙプ１５で補強部材１３を挾み、
凹部１４で位置決めの上、孔１６ａに先端部１７ａを、
また孔１６ｂに先端部１７ｂを挿入し、先端部１７ａ。With the above configuration, the reinforcing member 13 is sandwiched between the ribbons 15,
After positioning with the recess 14, insert the tip 17a into the hole 16a.
Further, the tip portion 17b is inserted into the hole 16b, and the tip portion 17a is inserted.
１７ｂをそれぞれ内側に曲げて半固定し、次にディップ
ハンダ（半田）等による半田層１８よりプリントパター
ン１２に先端部１７ａ 、 １７ｂを固定する。17b are bent inward and semi-fixed, and then the tip portions 17a and 17b are fixed to the printed pattern 12 using a solder layer 18 using dip solder or the like.
なおりリップ１５は補強部材１３の複数個所に設ける。The folding lips 15 are provided at a plurality of locations on the reinforcing member 13.
また補強部材１３の材質としては耐熱性を有する絶縁体
等が用いられる。Further, as the material of the reinforcing member 13, a heat-resistant insulator or the like is used.
発明の効果
本発明は上記実施例のように、ディップハンダを行なう
と同時に、補強部材の固定が可能なことから、ディップ
ハンダ時の熱によるプリント基板のソリを防止すること
が出来るという利点がある。Effects of the Invention The present invention has the advantage that, as in the above embodiment, it is possible to fix the reinforcing member at the same time as performing dip soldering, thereby preventing warping of the printed circuit board due to heat during dip soldering. .
又最小のスペースで、プリント基板上の有効スペースの
拡張が可能であり、且つ、安価でしかも組立てをも容易
にすることが出来る。Furthermore, the effective space on the printed circuit board can be expanded using a minimum space, and it is also inexpensive and easy to assemble.
第１図は本発明の一実施例におけるプリント基板の補強
方法での構成を示す断面図、第２図は同分解斜視図、第
３図は従来の補強方法の上面斜視図、第４図は同側面図
である。
１１・・・プリント基板、１２・・・プリントパターン
、１３・・・補強部材、１５・・・クリップ、１６ａ
、 １６ｂ・・・孔、１７ａ 、 １７ｂ・・・先端部
、１８・・・半田層。
代理人の氏名 弁理士 中 尾 敏 男 はか１名Ｍ
２ 図FIG. 1 is a sectional view showing the configuration of a printed circuit board reinforcing method according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the same, FIG. 3 is a top perspective view of a conventional reinforcing method, and FIG. It is the same side view. DESCRIPTION OF SYMBOLS 11... Printed circuit board, 12... Print pattern, 13... Reinforcement member, 15... Clip, 16a
, 16b...hole, 17a, 17b...tip, 18...solder layer. Name of agent: Patent attorney Toshi Nakao (1 person)
2 figure
Claims (1)
するための細長い形状の補強部材を配置し、前記補強部
材の複数個所をコの字状の金属製のクリップで挾み、前
記クリップの先端部を前記プリント基板に設けた孔を経
由して裏面に貫挿し、前記プリント基板のプリントパタ
ーンの一部を用いてディップ半田付により固定するよう
にしたプリント基板の補強方法。An elongated reinforcing member for reinforcing the printed circuit board is arranged along the surface of the printed circuit board, multiple parts of the reinforcing member are held between U-shaped metal clips, and the tip of the clip is A method for reinforcing a printed circuit board, the method comprising penetrating the back surface of the printed circuit board through a hole provided in the printed circuit board, and fixing by dip soldering using a part of the printed pattern of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9048386A JPS62247585A (en) | 1986-04-18 | 1986-04-18 | Reinforcement of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9048386A JPS62247585A (en) | 1986-04-18 | 1986-04-18 | Reinforcement of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62247585A true JPS62247585A (en) | 1987-10-28 |
Family
ID=13999807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9048386A Pending JPS62247585A (en) | 1986-04-18 | 1986-04-18 | Reinforcement of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62247585A (en) |
-
1986
- 1986-04-18 JP JP9048386A patent/JPS62247585A/en active Pending
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