JPS62232466A - Electrically conductive paint composition - Google Patents
Electrically conductive paint compositionInfo
- Publication number
- JPS62232466A JPS62232466A JP7507186A JP7507186A JPS62232466A JP S62232466 A JPS62232466 A JP S62232466A JP 7507186 A JP7507186 A JP 7507186A JP 7507186 A JP7507186 A JP 7507186A JP S62232466 A JPS62232466 A JP S62232466A
- Authority
- JP
- Japan
- Prior art keywords
- vinyl chloride
- resin
- electrically conductive
- conductive coating
- vinyl acetate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003973 paint Substances 0.000 title abstract description 6
- 239000000203 mixture Substances 0.000 title description 3
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000000843 powder Substances 0.000 claims abstract description 23
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 claims description 17
- 238000006116 polymerization reaction Methods 0.000 claims description 12
- 239000003960 organic solvent Substances 0.000 claims description 7
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract description 34
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract description 14
- 239000011230 binding agent Substances 0.000 abstract description 11
- 239000004014 plasticizer Substances 0.000 abstract description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- 229920006026 co-polymeric resin Polymers 0.000 abstract description 6
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract description 6
- 229910001887 tin oxide Inorganic materials 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 description 37
- 239000011248 coating agent Substances 0.000 description 35
- 239000008199 coating composition Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 ethylhexyl Chemical group 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- DJDSLBVSSOQSLW-UHFFFAOYSA-N mono(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(O)=O DJDSLBVSSOQSLW-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
及肌例玄血尤！
本発明は、軟質塩化ビニル系樹脂面に高導電性を付与す
るとともに密着性に優れた導電性を形成しうる導電性塗
料組成物に関する。[Detailed description of the invention] And skin example Genketsu! The present invention relates to a conductive coating composition that can impart high conductivity to a soft vinyl chloride resin surface and form conductivity with excellent adhesion.
発明の技術的背景ならびにその問題点
可塑剤を含む軟質塩化ビニル系樹脂たとえば塩化ビニル
系フィルムあるいはシートに導電性を付与することが、
近年電子産業の発展に伴なって求められている。たとえ
ば半導体’ＪＡ造至でのクリーンルームのカーテンには
、導電性を有し帯電しないフィルムあるいはシートが求
められており、またＩＣ製品を包装するにも上記のよう
な導電性を有するフィルムあるいはシートが求められて
いる。Technical background of the invention and its problems It is possible to impart conductivity to a soft vinyl chloride resin containing a plasticizer, such as a vinyl chloride film or sheet.
In recent years, it has been required with the development of the electronic industry. For example, conductive and non-static films or sheets are required for clean room curtains at Semiconductor's JA Manufacturing Company, and conductive films or sheets such as those described above are also required for packaging IC products. It has been demanded.
ところで軟質塩化ビニル系樹脂からなるフィルムあるい
はシートに導電性を付与するには、従来、有機溶媒に導
電性粉末とバインダー樹脂とを分散あるいは溶解してな
る導電性塗料組成物を軟質塩化ビニル系樹脂面に塗布す
ることが行なわれてきた。上記のような導電性塗料にお
けるバインダー樹脂としては、塩化ビニル樹脂、酢酸ビ
ニル樹脂あるいは重合度が４００〜８００程度であり、
酢酸ビニル含量が１０〜１５モル％程度の塩化ビニル−
酢酸ビニル共重合体樹脂などが主として用いられてきた
。By the way, in order to impart conductivity to a film or sheet made of a soft vinyl chloride resin, conventionally, a conductive paint composition prepared by dispersing or dissolving a conductive powder and a binder resin in an organic solvent is used to coat the soft vinyl chloride resin. It has been applied to the surface. The binder resin in the conductive paint as described above is vinyl chloride resin, vinyl acetate resin, or a polymerization degree of about 400 to 800,
Vinyl chloride with a vinyl acetate content of about 10 to 15 mol%
Vinyl acetate copolymer resins and the like have been mainly used.
このような導電性塗料組成物を軟質塩化ビニル系樹脂上
に塗布して導電性塗膜を形成すると、得られる導電性塗
膜は塩化ビニル系樹脂との密着性は良好であるが、時間
経過とともに導電性が箸しく低下してくるという重大な
間ｍ点があった。この原因としては、種々考えられるが
、本発明者らの研究によれば、基材としての軟質塩化ビ
ニル系樹脂に含まれているフタル酸ジオクチル、フタル
酸く２−エチルヘキシル）、フタル酸ジブチル、リン酸
トリクレジルなどの可塑剤が導電性塗膜に移行するため
でおろうと推測される。When such a conductive coating composition is applied onto a soft vinyl chloride resin to form a conductive coating film, the resulting conductive coating film has good adhesion to the vinyl chloride resin, but There was a critical point at which the conductivity significantly decreased as the temperature increased. There are various possible causes for this, but according to research by the present inventors, dioctyl phthalate, 2-ethylhexyl phthalate), dibutyl phthalate, It is speculated that this is because plasticizers such as tricresyl phosphate migrate to the conductive coating.
このような基材としての軟質塩化ビニル系樹脂に含まれ
る可塑剤の導電性塗膜への移行を防止するためには、こ
の導電性塗膜を形成するに先立って、基材にプライマー
処理を施こす方法あるいはバインダー樹脂を他の樹脂に
置換える方法などが考えられる。ところが基材にプライ
マー処理を施こす方法では、工程が複雑となりコスト高
となるため好ましくなく、一方バインダー樹脂を他の樹
脂に代える方法では、導電性塗膜と基材との密着性が低
下するため好ましくないという問題点があった。In order to prevent the plasticizer contained in the soft vinyl chloride resin used as the base material from migrating to the conductive coating, the base material must be treated with a primer before forming the conductive coating. Possible methods include applying the binder resin or replacing the binder resin with another resin. However, the method of applying primer treatment to the base material is undesirable because it complicates the process and increases costs, while the method of replacing the binder resin with another resin reduces the adhesion between the conductive coating film and the base material. Therefore, there was a problem that it was not desirable.
本発明者らは、上記のような問題点を解決するため鋭意
研究したところ、特定の重合度を有する塩化ビニル−酢
酸ビニル共重合樹脂を導電性塗料組成物のバインダー樹
脂として用いれば、基体である塩化ビニル系樹脂中に含
まれる可塑剤が導電性塗膜に移行するのを防止でき、し
たがって導電性塗膜の導電性が低下するのを防止できる
ことを見出して本発明を完成するに至った。The present inventors conducted intensive research to solve the above-mentioned problems and found that if a vinyl chloride-vinyl acetate copolymer resin having a specific degree of polymerization is used as a binder resin for a conductive coating composition, The present invention was completed by discovering that it is possible to prevent the plasticizer contained in a certain vinyl chloride resin from migrating to the conductive coating film, thereby preventing the conductivity of the conductive coating film from decreasing. .
発明の目的
本発明は、上記のような従来技術に伴なう問題点を解決
しようとするものであって、軟質塩化ビニル系樹脂上に
、長期間経過しても導電率が低下することなく、しかも
密着性に優れた導電性塗膜を形成しうるような導電性塗
料組成物を提供することを目的としている。Purpose of the Invention The present invention is an attempt to solve the problems associated with the prior art as described above, and the purpose of the present invention is to provide a flexible polyvinyl chloride resin with no reduction in conductivity even after a long period of time. Moreover, it is an object of the present invention to provide a conductive coating composition that can form a conductive coating film with excellent adhesion.
及星少且遷
本発明に係る軟質塩化ビニル樹脂用の導電性塗料組成物
は、（ａ）導電性粉末および（ｂ）重合度が１０００〜
３，５００である塩化ビニル−酢酸ビニル共重合体樹脂
が、有機溶媒に溶解あるいは分散されてなることを特徴
としている。The conductive coating composition for soft vinyl chloride resin according to the present invention comprises (a) conductive powder and (b) a degree of polymerization of 1000 to 1000.
3,500 vinyl chloride-vinyl acetate copolymer resin is dissolved or dispersed in an organic solvent.
本発明では、特定の重合度を有する塩化ビニル−酢酸ビ
ニル共重合体樹脂をバインダー樹脂として含む導電性塗
料組成物により、軟質塩化ビニル樹脂上に導電性塗膜が
形成されるので、軟質塩化ビニル樹脂中に含まれる可塑
剤が導電性塗膜に移行することがなく、したかって導電
性塗膜の導電性が低下することがない。しかも導電性塗
膜の基体との接着性も良好である。In the present invention, a conductive coating film is formed on a soft vinyl chloride resin using a conductive coating composition containing a vinyl chloride-vinyl acetate copolymer resin having a specific degree of polymerization as a binder resin. The plasticizer contained in the resin does not transfer to the conductive coating, and therefore the conductivity of the conductive coating does not decrease. Moreover, the adhesion of the conductive coating film to the substrate is also good.
Ｒ里の貝盗煎基旦
以下本発明に係る導電性塗料組成物について具体的に説
明する。Hereinafter, the conductive coating composition according to the present invention will be specifically explained.
まず本発明に係る導電性塗料組成物が塗布される基体は
、軟質塩化ビニル系樹脂である。この軟質塩化ビニル系
樹脂は、一般に、フタル酸ジオクチル、フタル酸（２−
エチルヘキシル）、フタル酸ジブチル、リン酸トリクレ
ジルなどの可塑剤を、１０〜６０重量％の量で含んでお
り、フィルム状、シート状などの任意の形状とされてい
る。また軟質塩化ビニル系樹脂のベースとなる樹脂は、
塩化ビニルの単独重合体であるが、塩化ビニルと伯のモ
ノマーとの共重合体たとえば塩化ビニルと酢酸ビニル、
塩化ビニリデン、アクリル酸エステル、アクリロニトリ
ル、プロピレンなどとの共重合体であってもよく、この
共重合体では塩化ビニルと共重合可能な他の七ツマ−は
２０モル％以下であることが好ましい。First, the substrate to which the conductive coating composition according to the present invention is applied is a soft vinyl chloride resin. This soft vinyl chloride resin is generally made of dioctyl phthalate, phthalic acid (2-
It contains a plasticizer such as ethylhexyl), dibutyl phthalate, and tricresyl phosphate in an amount of 10 to 60% by weight, and is in any shape such as a film or a sheet. In addition, the base resin for soft vinyl chloride resin is
Although it is a homopolymer of vinyl chloride, copolymers of vinyl chloride and other monomers such as vinyl chloride and vinyl acetate,
It may also be a copolymer with vinylidene chloride, acrylic acid ester, acrylonitrile, propylene, etc. In this copolymer, the content of other heptamers copolymerizable with vinyl chloride is preferably 20 mol % or less.
このような軟質塩化ビニル系樹脂に塗布される本発明に
係る導電性塗料組成物は、（ａ） Ｉ電性粉末および（
ｂ）特定の塩化ビニル・酢酸ビニル共重合体樹脂が、有
機溶媒に溶解あるいは分散されて形成されている。The conductive coating composition according to the present invention to be applied to such a soft vinyl chloride resin contains (a) I-conductive powder and (
b) It is formed by dissolving or dispersing a specific vinyl chloride/vinyl acetate copolymer resin in an organic solvent.
本発明で用いられる（ａ）導電性粉末としては、塗膜に
導電性を与えうるちのであればよく、たとえば酸化スズ
、あるいは酸化スズにアンチモン、リン、フッ素、亜鉛
、テルル
ウムなどの元素を１種または２種以上ドープした粉末が
用いられる。また酸化インジウム、あるいは酸化インジ
ウムにスズなどの元素をドープした粉末も用いられる。The conductive powder (a) used in the present invention may be any powder as long as it imparts conductivity to the coating film, such as tin oxide or tin oxide mixed with elements such as antimony, phosphorus, fluorine, zinc, or tellurium. A seed or powder doped with two or more types is used. Also used is indium oxide or a powder obtained by doping indium oxide with an element such as tin.
ざらに、酸化チタン系粉末、酸化亜鉛系粉末、導電性金
属粉末なども用いることができる。In addition, titanium oxide powder, zinc oxide powder, conductive metal powder, etc. can also be used.
本発明でバインダー樹脂として用いられる（ｂ）塩化ビ
ニル−酢酸ビニル共重合体樹脂は、その重今度が１００
０〜３５００好ましくは”ｌ ５００〜３０００である
。この共重合体の重合度が１０００未満であると、基体
である軟質塩化ビニル系樹脂中に含まれる可塑剤の導電
性塗膜への移行を防止することができず、このため導電
性塗膜の導電性が茗しく低下してしまうため好ましくな
く、−六組今度が３５００を越えると、この共重合体を
溶解しうる有機溶媒の選定が困Ｉ′１１に４ｊるととも
に、得られる塗料組成物の粘度が高くなりすぎて基体上
への塗布法が著しく制限されるため好ましくない。The vinyl chloride-vinyl acetate copolymer resin (b) used as the binder resin in the present invention has a polymer weight of 100
0 to 3,500, preferably 500 to 3,000. If the degree of polymerization of this copolymer is less than 1,000, the plasticizer contained in the soft vinyl chloride resin that is the base may not migrate to the conductive coating. This is undesirable because the conductivity of the conductive coating film deteriorates slowly. In addition, the viscosity of the resulting coating composition becomes too high, which significantly limits the method of coating it on a substrate, which is undesirable.
また前記共重合体樹脂中の酢酸ビニル含有量は、特に制
限はないが、１．０モル％未満になると、可塑剤の導電
性塗膜への移行の防止効果が若干低下する。一方酢酸ビ
ニル含有量が７．０モル％を越えると導電性塗膜の透明
性が著しく低下するため透明性が要求されるような用途
には使えないので用途が限定される。The vinyl acetate content in the copolymer resin is not particularly limited, but when it is less than 1.0 mol %, the effect of preventing the plasticizer from transferring to the conductive coating film is slightly reduced. On the other hand, if the vinyl acetate content exceeds 7.0 mol %, the transparency of the conductive coating film will be markedly reduced, so that it cannot be used in applications that require transparency, and its applications will be limited.
上記のような（ａ） 導電−Ｍｌ粉末と（ｂ）塩化ビニ
ル−酢酸ビニル共重合体樹脂との混合割合に関しては、
（ａ）導電性粉末は、（ａ）、（＋））両者の合計重量
に対して、５０．０〜８５．０ｆｆｉｉ％の量で用いら
れる。（ａ）導電性粉末が５０．０重量％未満であると
、得られる塗膜の導電性が低下するため好ましくなく、
一方８５．０重伍％を越えると塗膜と軟質塩化ビニル系
基材との密着性が低下するため好ましくない。Regarding the mixing ratio of (a) conductive Ml powder and (b) vinyl chloride-vinyl acetate copolymer resin as described above,
(a) The conductive powder is used in an amount of 50.0 to 85.0 ffii% based on the total weight of both (a) and (+). (a) If the content of the conductive powder is less than 50.0% by weight, the conductivity of the resulting coating film will decrease, which is undesirable.
On the other hand, if it exceeds 85.0% by weight, the adhesion between the coating film and the soft vinyl chloride base material decreases, which is not preferable.
本発明に係る導電性塗料組成物では、上記の（ａ）導電
性粉末と（ｂ）塩化ビニル−酢酸ビニル共重合体樹脂は
、有機溶媒に溶解あるいは分散されるが、この有機溶媒
としては、塩化ビニル−酢酸ビニル共重合体樹脂を溶解
しうるちのであれば用いることができ、具体的には、た
とえばメチルエチルケトン、メチルイソブチルケトン、
トルエン、シクロヘキサンなどが単独あるいは組合せて
用いられる。このような有機溶媒は、導電性塗料組成物
を基体上に塗布しうるような粘度となるような量で用い
られるが、一般的には、塗料組成物全量に対して５０〜
９５重量％程度の量で用いられる。In the conductive coating composition according to the present invention, (a) the conductive powder and (b) the vinyl chloride-vinyl acetate copolymer resin are dissolved or dispersed in an organic solvent, and the organic solvent includes: Any vinyl chloride-vinyl acetate copolymer resin can be used as long as it can be dissolved therein. Specifically, for example, methyl ethyl ketone, methyl isobutyl ketone,
Toluene, cyclohexane, etc. are used alone or in combination. Such an organic solvent is used in an amount that provides a viscosity that allows the conductive coating composition to be coated on a substrate, but generally it is used in an amount of 50 to 50% based on the total amount of the coating composition.
It is used in an amount of about 95% by weight.
本発明に係る導電性塗料組成物中に、上記の（ａ）導電
性粉末および（ｂ）塩化ビニル−酢酸ビニル共重合体樹
脂に加えて、導電性粉末の分散性を向上させ、粒子同士
の再凝集を防止するため、界面活性剤を添加することが
好ましく、界面活性剤としてはアニオン系、ノニオン系
、カチオン系などのものが広く用いられうる。また必要
に応じては、導電性塗料組成物中に、紫外線吸収剤、安
定剤、難燃剤、無機充填剤、シランカップリング剤、チ
タンカップリング剤などを添加することもできる。In addition to the above-mentioned (a) conductive powder and (b) vinyl chloride-vinyl acetate copolymer resin, the conductive coating composition according to the present invention improves the dispersibility of the conductive powder and improves the dispersibility of the particles. In order to prevent re-aggregation, it is preferable to add a surfactant, and anionic, nonionic, cationic, etc. surfactants can be widely used. Further, if necessary, ultraviolet absorbers, stabilizers, flame retardants, inorganic fillers, silane coupling agents, titanium coupling agents, and the like may be added to the conductive coating composition.
本発明に係る導電性塗料組成物は、軟質塩化ビニル系樹
脂からなる基体上に、従来公知の塗布法たとえばバーコ
ード法、スプレー法、ロールコート法などの方法によっ
て塗布され、次いで乾燥されて導電性塗膜が得られる。The conductive coating composition according to the present invention is applied onto a substrate made of a soft vinyl chloride resin by a conventional coating method such as a barcode method, a spray method, a roll coating method, etc., and then dried to make it conductive. A transparent coating film is obtained.
発明の効果
本発明では、特定の重合度を有する塩化ビニル−酢酸ビ
ニル共重合体樹脂をバインダー樹脂として含む導電性塗
料組成物によって、軟質塩化ビニル樹脂上に導電性塗膜
が形成されるので、軟質塩化ビニル樹脂中に含まれる可
塑剤が導電性塗膜に−〇 −
移行することがなく、したがって導電性塗膜の導電性が
低下することがない。しかも導電性塗膜と基体との接着
性も良好である。Effects of the Invention In the present invention, a conductive coating film is formed on a soft vinyl chloride resin using a conductive coating composition containing a vinyl chloride-vinyl acetate copolymer resin having a specific degree of polymerization as a binder resin. The plasticizer contained in the soft vinyl chloride resin does not migrate to the conductive coating, and therefore the conductivity of the conductive coating does not decrease. Moreover, the adhesion between the conductive coating film and the substrate is also good.
以下本発明を実例により説明するが、本発明はこれら実
施例に限定されるものではない。The present invention will be explained below using examples, but the present invention is not limited to these examples.
叉里■ユ
（ａ）アンチモンを１０重用量ドープした粒径０．８μ
ｍの酸化スズ粉末２０９と、（ｂ）重合度が１６００で
あり、酢酸ビニル含有量が５モル％である塩化ビニル−
酢酸ビニル共重合体樹脂８．５ｇとを、メチルエチルケ
トンとトルエンの混合溶媒（容量比’ｌ／１）７１．５
ｇに混合し、次いでサンドミルで３時間粉砕混合して塩
化ビニル−酢酸ビニルが溶媒に溶解されるとともに酸化
スズ粉末が均一分散された導電性塗料組成物を調製した
。この導電性塗料組成物をバーコーターく＃６）にて、
可塑剤としてのフタル酸ジオクチルが３５ＰＨＲ含まれ
た軟質塩化ビニルフィルムに塗布し、室温で５分間静置
後、６０’Ｃで３分間乾燥して導電性塗膜を得た。Kariri Yu (a) Particle size 0.8μ doped with 10 heavy doses of antimony
m tin oxide powder 209, and (b) vinyl chloride having a polymerization degree of 1600 and a vinyl acetate content of 5 mol%.
8.5 g of vinyl acetate copolymer resin was mixed with a mixed solvent of methyl ethyl ketone and toluene (volume ratio 'l/1) 71.5
g, and then pulverized and mixed in a sand mill for 3 hours to prepare a conductive coating composition in which vinyl chloride-vinyl acetate was dissolved in the solvent and tin oxide powder was uniformly dispersed. This conductive paint composition is coated with a bar coater #6).
It was applied to a soft vinyl chloride film containing 35 PHR of dioctyl phthalate as a plasticizer, allowed to stand at room temperature for 5 minutes, and then dried at 60'C for 3 minutes to obtain a conductive coating.
このようにして得られた導電性塗膜の表面抵抗（Ω／口
）を電極セル（Ｙ ｌ−Ｉ Ｐ製）を用いて測定し、ま
た塗膜と基体との密着性をＪＩＳ Ｋ５４００−１９
７９に準拠してセロテープテストおよび基盤目テストに
よって評価した。The surface resistance (Ω/hole) of the conductive coating film thus obtained was measured using an electrode cell (manufactured by Yl-I P), and the adhesion between the coating film and the substrate was measured according to JIS K5400-19.
Evaluation was carried out by the sellotape test and the base test in accordance with 79.
結果を表１に示す。The results are shown in Table 1.
大鬼■２
実施例１において、実施例１の塩化ビニル−酢酸ビニル
共重合体の代わりに、重合度が３０００であり、酢酸ビ
ニル含有量が５モル％である塩化ビニル−酢酸ビニル共
重合体樹脂８．５ｇを用いた以外は、実施例１と同様に
して導電性塗膜を形成し、その表面抵抗および密着性を
測定した。Ooni ■2 In Example 1, instead of the vinyl chloride-vinyl acetate copolymer of Example 1, a vinyl chloride-vinyl acetate copolymer having a degree of polymerization of 3000 and a vinyl acetate content of 5 mol% was used. A conductive coating film was formed in the same manner as in Example 1, except that 8.5 g of resin was used, and its surface resistance and adhesion were measured.
結果を表１に示す。The results are shown in Table 1.
衷凰■旦
実施例１において、導電性粉末として、実施例１の酸化
スズ粉末の代わりに、スズを１０重最％ドープした粒径
０．４μｍの酸化インジウム粉末を３０９用いた以外は
、実施例１と同様にして導電性塗膜を形成し、この表面
抵抗および密着性を測定した。In Example 1, in place of the tin oxide powder of Example 1, indium oxide powder with a particle size of 0.4 μm doped with tin at a maximum of 10% was used as the conductive powder. A conductive coating film was formed in the same manner as in Example 1, and its surface resistance and adhesion were measured.
結果を表１に示す。The results are shown in Table 1.
比較例１
実施例１において、実施例１の塩化ビニル−酢酸ビニル
共重合体の代わりに、重合度が８００であり、酢酸ビニ
ル含有量が５モル％である塩化ビニル−酢酸ビニル共重
合体樹脂３．６ｇを用いた以外は、実施例１と同様にし
て導電性塗膜を形成し、その表面抵抗および密着性を測
定した。Comparative Example 1 In Example 1, instead of the vinyl chloride-vinyl acetate copolymer of Example 1, a vinyl chloride-vinyl acetate copolymer resin having a polymerization degree of 800 and a vinyl acetate content of 5 mol% was used. A conductive coating film was formed in the same manner as in Example 1 except that 3.6 g was used, and its surface resistance and adhesion were measured.
結果を表１に示す。The results are shown in Table 1.
比較例２
実施例１において、実施例１の塩化ビニル−酢酸ビニル
共重合体の代わりに、重合度が７００であり、酢酸ビニ
ル含有量が５モル％である塩化ビニル−酢酸ビニル共重
合体樹脂８．５ｇを用いた以外は、実施例１と同様にし
て導電性塗膜を形成し、その表面抵抗および密着性を測
定した。Comparative Example 2 In Example 1, instead of the vinyl chloride-vinyl acetate copolymer of Example 1, a vinyl chloride-vinyl acetate copolymer resin having a polymerization degree of 700 and a vinyl acetate content of 5 mol% was used. A conductive coating film was formed in the same manner as in Example 1, except that 8.5 g was used, and its surface resistance and adhesion were measured.
結果を表１に示す。The results are shown in Table 1.
表−１
この表から、導電性塗料組成物のバインダー樹脂として
、特定の重合度を有する塩化ビニル−酢酸ビニル共重合
体樹脂を用いると、得られる導電性塗膜の導電性が低下
することなく、しかも導電性塗膜と基体との接着性も良
好であることがわかる。Table 1 From this table, it can be seen that when a vinyl chloride-vinyl acetate copolymer resin having a specific degree of polymerization is used as the binder resin of a conductive coating composition, the conductivity of the resulting conductive coating film will not decrease. Moreover, it can be seen that the adhesion between the conductive coating film and the substrate is also good.
Claims (1)
３，５００である塩化ビニル−酢酸ビニル共重合体樹脂
が、有機溶媒に溶解あるいは分散されてなることを特徴
とする導電性塗料組成物1) (a) conductive powder and (b) polymerization degree of 1000 to
3,500, a vinyl chloride-vinyl acetate copolymer resin dissolved or dispersed in an organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61075071A JPH0648602B2 (en) | 1986-04-01 | 1986-04-01 | Substrate with conductive coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61075071A JPH0648602B2 (en) | 1986-04-01 | 1986-04-01 | Substrate with conductive coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62232466A true JPS62232466A (en) | 1987-10-12 |
| JPH0648602B2 JPH0648602B2 (en) | 1994-06-22 |
Family
ID=13565592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61075071A Expired - Lifetime JPH0648602B2 (en) | 1986-04-01 | 1986-04-01 | Substrate with conductive coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648602B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196270A (en) * | 1982-05-13 | 1983-11-15 | Toppan Printing Co Ltd | Preparation of electrically conductive paint |
| JPS60226569A (en) * | 1984-04-24 | 1985-11-11 | Shin Etsu Chem Co Ltd | Electrically-conductive coating compound |
-
1986
- 1986-04-01 JP JP61075071A patent/JPH0648602B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196270A (en) * | 1982-05-13 | 1983-11-15 | Toppan Printing Co Ltd | Preparation of electrically conductive paint |
| JPS60226569A (en) * | 1984-04-24 | 1985-11-11 | Shin Etsu Chem Co Ltd | Electrically-conductive coating compound |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648602B2 (en) | 1994-06-22 |
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