JPH11227740A - Conductive plate having transparent conductive film, and manufacture thereof - Google Patents
Conductive plate having transparent conductive film, and manufacture thereofInfo
- Publication number
- JPH11227740A JPH11227740A JP3779198A JP3779198A JPH11227740A JP H11227740 A JPH11227740 A JP H11227740A JP 3779198 A JP3779198 A JP 3779198A JP 3779198 A JP3779198 A JP 3779198A JP H11227740 A JPH11227740 A JP H11227740A
- Authority
- JP
- Japan
- Prior art keywords
- conductive plate
- thermoplastic resin
- transparent conductive
- conductive film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、透明導電膜を有す
るとともに、透明性および導電性に優れた導電性板の製
造法及び導電性板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a conductive plate having a transparent conductive film and having excellent transparency and conductivity, and a conductive plate.
【０００２】[0002]
【従来の技術】特開昭６３−１５８７０９号公報には、
（ａ）スズ化合物またはインジウム化合物の水溶液を、
８〜１２のｐＨ条件下に保持して液中の化合物を徐々に
加水分解して、コロイド粒子を含有するゾルを生成させ
た後に、このゾルを乾燥、焼成して得られた導電微粉末
と、（ｂ）バインダー樹脂とを溶剤に分散させてなる導
電性塗料から形成された透明導電膜を、表面に有する導
電性板が開示されている。そして、塗料中での導電性微
粉末の平均粒径は、約０．２〜０．４μｍで、塗料の乾
燥温度として１１０℃等が記載されている。2. Description of the Related Art JP-A-63-158709 discloses that
(A) an aqueous solution of a tin compound or an indium compound,
After maintaining the pH condition of 8 to 12 and gradually hydrolyzing the compound in the liquid to form a sol containing colloidal particles, the sol is dried and calcined to obtain a conductive fine powder. And (b) a conductive plate having on its surface a transparent conductive film formed from a conductive paint obtained by dispersing a binder resin in a solvent. The average particle size of the conductive fine powder in the paint is about 0.2 to 0.4 μm, and the drying temperature of the paint is 110 ° C. or the like.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記方
法では、透明電極、電磁波遮蔽等に必要とされる表面抵
抗値Ｒｓ、１０2〜１０4Ω／ロを有する導電性板を得る
ことは容易ではなかった。However, according to the above-mentioned method, it is not easy to obtain a conductive plate having a surface resistance Rs of 10 2 to 10 4 Ω / b required for a transparent electrode, electromagnetic wave shielding and the like. Did not.
【０００４】よって、本発明の目的は、低い表面抵抗値
を有するとともに、複雑な工程を必要としない、透明導
電膜を有する導電性板の製造法および導電性板を提供す
ることにある。Accordingly, an object of the present invention is to provide a method of manufacturing a conductive plate having a transparent conductive film, which has a low surface resistance and does not require complicated steps, and to provide a conductive plate.
【０００５】[0005]
【課題を解決するための手段】前記課題は、平均粒径が
０．１μｍ以下の錫ドープ酸化インジウム微粉末と熱可
塑性樹脂とを含有する塗料を基板の上に塗布して形成し
た塗膜を、前記熱可塑性樹脂の軟化点以上の温度で加熱
処理することで解決される。また、平均粒径が０．１μ
ｍ以下の錫ドープ酸化インジウム微粉末と熱可塑性樹脂
とを含有する塗料を、ポリエチレンテレフタレートから
なる基板の上に塗布して形成した塗膜を、１５０゜Ｃ〜
２１０゜Ｃで加熱処理することが好ましい。The object of the present invention is to provide a coating film formed by applying a coating containing a tin-doped indium oxide fine powder having an average particle diameter of 0.1 μm or less and a thermoplastic resin on a substrate. The problem can be solved by performing heat treatment at a temperature equal to or higher than the softening point of the thermoplastic resin. The average particle size is 0.1μ
m or less of a tin-doped indium oxide fine powder and a thermoplastic resin, on a substrate made of polyethylene terephthalate.
The heat treatment is preferably performed at 210 ° C.
【０００６】[0006]
【発明の実施の形態】錫ドープ酸化インジウム微粉末と
は、錫をドープした酸化インジウム（ＩＴＯ）の微粉末
であって、平均粒径が０．１μｍ以下のＩＴＯ微粉末の
ものを用いる。平均粒径が０．１μｍを越えるＩＴＯ微
粉末を用いる場合は、透明導電膜の光線透過率、へイズ
が不充分となり、透明性が低下し易い。平均粒径が０．
１μｍ以下のＩＴＯ微粉末は、一般に知られた方法で製
造できる。錫ドープ酸化インジウム微粉末中の錫量が、
Ｓｎ０2として１〜１０重量％程度であれば、透明導電
膜は高い導電性を示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS Tin-doped indium oxide fine powder refers to fine powder of tin-doped indium oxide (ITO) having an average particle diameter of 0.1 μm or less. When ITO fine powder having an average particle size of more than 0.1 μm is used, the light transmittance and haze of the transparent conductive film become insufficient, and the transparency tends to be reduced. The average particle size is 0.
ITO fine powder of 1 μm or less can be produced by a generally known method. Tin amount in the tin-doped indium oxide fine powder,
It is about 1 to 10% by weight Sn0 2, the transparent conductive film exhibits high conductivity.
【０００７】熱可塑性樹脂は、その種類、構造によって
種々の軟化点をもつため、基板の耐熱性に合わせて適宜
選択することが好ましい。熱可塑性樹脂として、一般に
知られた熱可塑性樹脂を用いることができるが、軟化点
以上の温度から室温までの冷却による体積収縮が大き
く、また、高い軟化点を有するものが好ましい。熱可塑
性樹脂として、アルキッド樹脂、不飽和ポリエステル、
線状ポリエステル、飽和ポリエステル等のポリエステル
樹脂、メタクリル樹脂等のアクリル樹脂、フッ素系樹脂
が特に好ましい。前記ポリエステル樹脂として、分子量
が５０００〜５００００で、軟化点が１００〜１８０゜
Ｃのものが好ましい。[0007] Since the thermoplastic resin has various softening points depending on its type and structure, it is preferable to appropriately select it according to the heat resistance of the substrate. As the thermoplastic resin, a generally known thermoplastic resin can be used, but a resin having a large volume shrinkage by cooling from a temperature higher than the softening point to room temperature and having a high softening point is preferable. As thermoplastic resins, alkyd resins, unsaturated polyesters,
Particularly preferred are polyester resins such as linear polyester and saturated polyester, acrylic resins such as methacrylic resin, and fluororesins. The polyester resin preferably has a molecular weight of 5,000 to 50,000 and a softening point of 100 to 180 ° C.
【０００８】ＩＴＯ微粉末と熱可塑性樹脂との混合割合
として、ＩＴＯ微粉末と熱可塑性樹脂との合計量１００
重量部に対して、ＩＴＯ微粉末が７０〜８５重量部、熱
可塑性樹脂が３０〜１５重量部の割合が好ましい。ＩＴ
Ｏ微粉末の配合量が８５重量部を超える場合は透明導電
膜の強度が十分でなく、７０重量部未満の場合は透明導
電膜の導電性が十分でない。The mixing ratio of the fine ITO powder and the thermoplastic resin is 100% of the total amount of the fine ITO powder and the thermoplastic resin.
It is preferable that the ITO fine powder has a ratio of 70 to 85 parts by weight and the thermoplastic resin has a ratio of 30 to 15 parts by weight with respect to parts by weight. IT
When the amount of the O fine powder exceeds 85 parts by weight, the strength of the transparent conductive film is not sufficient, and when it is less than 70 parts by weight, the conductivity of the transparent conductive film is not sufficient.
【０００９】ＩＴＯ微粉末及び熱可塑性樹脂は、溶剤に
分散或いは溶解されて、塗料とされる。該塗料を基板の
上に塗布し塗膜を加熱処理すれば、基板の上に透明導電
膜が形成された導電性板が得られる。このような溶剤と
して、ベンゼン、トルエン等のベンゾール類、塩化メチ
レン、トリクレン、２塩化プロピレン等のハロゲン化炭
化水素類、メチルエチルケトン（ＭＥＫ）、シクロヘキ
サノン等のケトン類、酢酸セルソルブ、ジオキサン、テ
トラヒドロフランなどのエーテル類、酢酸エチル等のエ
ステル類、２一ニトロプロパン、スチレンモノマー等の
単独又はこれらを２種以上混合した混合溶剤が挙げら
れ、これら溶剤を用いる熱可塑性樹脂の種類等に応じて
適宜選択する。溶剤中の約３０重量％以上が、常圧（１
ａｔｍ）で沸点が１００〜２００゜Ｃの溶剤であると、
塗料を基板の上に室温で塗布し易いし、透明導電膜の厚
み等が均一となり易い。[0009] The ITO fine powder and the thermoplastic resin are dispersed or dissolved in a solvent to form a paint. By applying the coating material on a substrate and subjecting the coating film to heat treatment, a conductive plate having a transparent conductive film formed on the substrate can be obtained. Examples of such a solvent include benzenes such as benzene and toluene, halogenated hydrocarbons such as methylene chloride, trichlene and propylene chloride, ketones such as methyl ethyl ketone (MEK) and cyclohexanone, and ethers such as cellosolve acetate, dioxane, and tetrahydrofuran. , An ester such as ethyl acetate, 21-nitropropane, a styrene monomer, or the like, or a mixed solvent of a mixture of two or more thereof. The solvent is appropriately selected depending on the type of the thermoplastic resin to be used. About 30% by weight or more of the solvent is at normal pressure (1
atm), the solvent having a boiling point of 100 to 200 ° C.
The paint is easily applied on the substrate at room temperature, and the thickness and the like of the transparent conductive film tend to be uniform.
【００１０】塗料の分散性、安定性等あるいは透明導電
膜の成膜性等を向上させるために、一般に使用されてい
る界面活性剤、分散剤等を塗料に更に添加することもで
きる。In order to improve the dispersibility, stability, etc. of the paint or the film-forming properties of the transparent conductive film, generally used surfactants, dispersants and the like can be further added to the paint.
【００１１】塗料は、スピンコート法、ロールコート
法、スプレー法、バーコート法、ディップ法、メニカス
コート法、グラビア印刷法などの通常の薄膜形成方法等
により、基板の上に塗布される。The coating material is applied on a substrate by a usual thin film forming method such as a spin coating method, a roll coating method, a spray method, a bar coating method, a dip method, a menis coat method, a gravure printing method and the like.
【００１２】基板として透明性板が好ましく、基板とし
てポリエチレンテレフタレート（ＰＥＴ）、アクリル樹
脂、ポリカーボネート、酢酸セルロース（タック）等の
プラスチックの板若しくはフィルム、或いは無機ガラス
板などが挙げられる。特に、耐熱温度の点から、基板が
ＰＥＴ、無機ガラスから構成されることが好ましい。基
板がＰＥＴ等のプラスチックからなると、基板が無機ガ
ラスからなる場合に比較して、切断加工等の加工性に優
れた導電性板が得られる。なお、ＰＥＴは、テレフタル
酸又はその誘導体とエチレングリコールとを主成分と
し、これらを重縮合することで得られる。The substrate is preferably a transparent plate, and the substrate may be a plastic plate or film such as polyethylene terephthalate (PET), acrylic resin, polycarbonate, cellulose acetate (tack), or an inorganic glass plate. In particular, it is preferable that the substrate is made of PET or inorganic glass from the viewpoint of heat resistance. When the substrate is made of plastic such as PET, a conductive plate having excellent workability such as cutting can be obtained as compared with the case where the substrate is made of inorganic glass. PET is obtained by using terephthalic acid or a derivative thereof and ethylene glycol as main components and polycondensing them.
【００１３】次に、基板の上に形成された塗膜を高温で
加熱処理する効果について説明する。一般に、熱可塑性
樹脂はガラス転移点（Ｔｇ）以上の温度で体積増加率が
大きくなり、軟化点（Ｔｍ）以上の温度では体積増加率
が少なくなる。このため、本発明のように塗膜を高温で
加熱処理すれば、加熱処理により塗膜中の溶剤が完全に
揮発するという理由と、熱可塑性樹脂の軟化点以上の加
熱処理温度から室温まで冷却することにより体積収縮を
起こさせるという理由とから、ＩＴＯ微粉末どうしの接
触が強くなり、透明導電膜の導電性の向上が達成できる
ものと推定される。Next, the effect of heat-treating the coating film formed on the substrate at a high temperature will be described. Generally, the rate of volume increase of a thermoplastic resin increases at a temperature higher than the glass transition point (Tg), and decreases at a temperature higher than the softening point (Tm). For this reason, if the coating film is heat-treated at a high temperature as in the present invention, the reason that the solvent in the coating film is completely volatilized by the heat treatment, and the temperature is reduced from the heating temperature higher than the softening point of the thermoplastic resin to room temperature It is presumed that the contact between the ITO fine powders is strengthened and the conductivity of the transparent conductive film can be improved because the volume shrinkage is caused by doing so.
【００１４】基板の耐熱性、熱可塑性樹脂の軟化点、溶
剤の沸点等を考慮して、加熱処理温度を適宜選択するこ
とが好ましい。例えば、塗料が常圧下の沸点１００〜２
００゜Ｃの化合物を溶剤として含み、基板がＰＥＴから
なる場合、塗膜を１５０゜Ｃ〜２１０゜Ｃの高温で加熱
することが好ましい。１５０℃未満では、導電性板の表
面抵抗値が小さくなり難いし、２１０゜Ｃを超えると、
ＰＥＴ製基板の熱変形量が大きくなり過ぎて導電性板が
不良品となる。基板がＰＥＴから構成されていれば、１
５０℃〜２１０゜Ｃに加熱しても、熱変形の殆どない導
電性板が得られる。なお、ＰＥＴ製基板に若干の外力を
加えるようにして加熱処理すれば、ＰＥＴ製基板の熱変
形を防止できる。It is preferable to appropriately select the heat treatment temperature in consideration of the heat resistance of the substrate, the softening point of the thermoplastic resin, the boiling point of the solvent, and the like. For example, when the paint has a boiling point of 100 to 2 under normal pressure.
When the substrate contains PET and contains a compound of 00 ° C as a solvent, it is preferable to heat the coating film at a high temperature of 150 ° C to 210 ° C. If the temperature is lower than 150 ° C., the surface resistance of the conductive plate is hardly reduced, and if it exceeds 210 ° C.,
The thermal deformation of the PET substrate becomes too large, and the conductive plate becomes defective. If the substrate is made of PET, 1
Even if heated to 50 ° C. to 210 ° C., a conductive plate with almost no thermal deformation can be obtained. If the PET substrate is subjected to heat treatment by applying a slight external force, thermal deformation of the PET substrate can be prevented.
【００１５】本発明の導電性板の好ましい例を、図２に
基づいて説明すれば、平均粒径０．１μｍ以下の錫ドー
プ酸化インジウム微粉末と熱可塑性樹脂とを含有する塗
料を基板１の上に塗布して形成した塗膜を、前記熱可塑
性樹脂の軟化点以上の温度で加熱処理する導電性板の製
造法によって得られた導電性板１０であって、錫ドープ
酸化インジウム微粉末５を結合するバインダ３の一成分
である熱可塑性樹脂がポリエステル樹脂、アクリル樹
脂、フッ素樹脂のうちのいずれかである導電性板であ
る。A preferred example of the conductive plate of the present invention will be described with reference to FIG. 2. A coating containing a tin-doped indium oxide fine powder having an average particle diameter of 0.1 μm or less and a thermoplastic resin is applied to the substrate 1. A conductive plate 10 obtained by a method for manufacturing a conductive plate, in which a coating film formed by applying the above is heated at a temperature not lower than the softening point of the thermoplastic resin, the tin-doped indium oxide fine powder 5 Is a conductive plate in which the thermoplastic resin, which is one component of the binder 3 that binds, is any one of a polyester resin, an acrylic resin, and a fluororesin.
【００１６】[0016]
【実施例】ＰＥＴフィルムを基板１とし、該基板１の片
面に透明導電膜７が接着された、図２に示す導電性板１
０を以下のように作製した。そして、塗膜の加熱処理温
度と導電性板１０の表面抵抗値との関係を調べた。導電
性板１０の製造法；線状飽和ポリエステル樹脂（軟化点
１５５゜Ｃ）を溶剤に溶解し、これに分散剤を添加し、
更に錫ドープ酸化インジウム微粉末を添加して分散せし
めることで、透明導電膜７の形成用塗料を作製した。こ
の塗料をバーコート法によりＰＥＴフィルムの上に塗布
して塗膜を形成し、該塗膜を１０分間、１００゜Ｃ〜２
００゜Ｃで加熱することで、図２に示す導電性板１０を
得た。なお、透明導電膜７の厚みは１μｍであった。EXAMPLE A conductive plate 1 shown in FIG. 2 in which a PET film was used as a substrate 1 and a transparent conductive film 7 was adhered to one surface of the substrate 1 was used.
0 was made as follows. Then, the relationship between the heat treatment temperature of the coating film and the surface resistance value of the conductive plate 10 was examined. Method for producing conductive plate 10: dissolving linear saturated polyester resin (softening point: 155 ° C.) in a solvent, adding a dispersant thereto,
Further, a tin-doped indium oxide fine powder was added and dispersed to prepare a coating for forming the transparent conductive film 7. This paint is applied on a PET film by a bar coating method to form a coating film, and the coating film is applied at 100 ° C. to 2 ° C. for 10 minutes.
By heating at 00 ° C., the conductive plate 10 shown in FIG. 2 was obtained. Note that the thickness of the transparent conductive film 7 was 1 μm.
【００１７】前記塗料の配合を示す。 錫ドープ酸化インジウム微粉末：平均粒径０．０８μｍ
のＩＴＯ微粉末、２４重量部 熱可塑性樹脂：ポリエステル樹脂で、軟化点が１５５℃
のもの、５重量部 溶剤：シクロヘキサノン（沸点、１５５゜Ｃ／１ａｔ
ｍ）：ＭＥＫ（沸点、７９．６゜Ｃ／１ａｔｍ）＝１：
１の混合溶剤、７０重量部 分散剤：フッ素樹脂系分散剤、１重量部The composition of the paint is shown below. Tin-doped indium oxide fine powder: average particle size 0.08 μm
ITO fine powder, 24 parts by weight Thermoplastic resin: polyester resin, softening point 155 ° C
Solvent, cyclohexanone (boiling point, 155 ° C./1at)
m): MEK (boiling point, 79.6 ° C./1 atm) = 1:
1 mixed solvent, 70 parts by weight Dispersant: fluororesin-based dispersant, 1 part by weight
【００１８】なお、ＩＴＯ微粉末の平均粒径は、レ−ザ
−粒径解析システム（大塚電子社製）を用いて、動的光
散乱法により２０゜Ｃで測定し、並進拡散係数を求め、
Ｅｉｎｓｔｅｉｎ−Ｓｔｏｋｅｓ式（アインシュタイン
−スト−クス式）より算出した。また、前記ポリエステ
ル樹脂の軟化点は、ＪＩＳ Ｋ２５３１（環球法）によ
り測定した。導電性板１０の表面抵抗値Ｒｓは、レスタ
（三菱化学社製）を用い、２０゜Ｃで測定した。The average particle size of the ITO fine powder was measured at 20 ° C. by a dynamic light scattering method using a laser particle size analysis system (manufactured by Otsuka Electronics Co., Ltd.) to determine the translational diffusion coefficient. ,
It was calculated from the Einstein-Stokes equation (Einstein-Stokes equation). The softening point of the polyester resin was measured according to JIS K2531 (ring and ball method). The surface resistance Rs of the conductive plate 10 was measured at 20 ° C. using Resta (manufactured by Mitsubishi Chemical Corporation).
【００１９】以上のようにして測定した導電性板１０に
ついての表面抵抗値Ｒｓの測定結果と加熱処理温度との
関係を図１に示す。図１から、ＰＥＴフィルムを基板１
として用い、熱可塑性樹脂として軟化点が１５５℃のポ
リエステル樹脂を用いた場合、塗膜を１６０゜Ｃ〜２０
０゜Ｃで加熱処理すれば、約（２〜３）×１０3Ω／□
の表面抵抗値Ｒｓを有する導電性板１０（厚み約１μｍ
の透明導電膜７を有する）が得られ、一方、塗膜を１２
０゜Ｃ以下で加熱処理すると、導電性板１０の表面抵抗
値Ｒｓは１０4Ω／□を超えることが分かった。即ち、
塗膜を１６０゜Ｃ〜２００゜Ｃの高温で加熱処理するこ
とで、低い表面抵抗値Ｒｓを有する導電性板１０が容易
に製造できることが分かった。FIG. 1 shows the relationship between the measurement result of the surface resistance Rs of the conductive plate 10 measured as described above and the heat treatment temperature. As shown in FIG.
When the polyester resin having a softening point of 155 ° C. is used as the thermoplastic resin,
If heat treatment is performed at 0 ° C., about (2-3) × 10 3 Ω / □
Conductive plate 10 (with a thickness of about 1 μm
Having a transparent conductive film 7).
When the heat treatment was performed at 0 ° C. or less, it was found that the surface resistance Rs of the conductive plate 10 exceeded 10 4 Ω / □. That is,
It was found that the conductive plate 10 having a low surface resistance value Rs can be easily manufactured by subjecting the coating film to heat treatment at a high temperature of 160 ° C. to 200 ° C.
【００２０】次に、透明導電膜７の膜厚と、導電性板１
０の表面抵抗値Ｒｓ、全光線透過率Ｔｔ、ヘイズＨとの
関係を調べた。このための試料として、塗膜の加熱処理
温度を１８０℃一定とし、塗料の塗布厚みを変えた以外
は、前記と同様にして、膜厚が２μｍ、４μｍの透明導
電膜７を有する導電性板１０を作製した。なお、導電性
板１０の全光線透過率Ｔｔ、ヘイズＨはヘーズコンピュ
ーター（スガ試験機社製）を用いて測定した。以上の測
定結果を表１に示す。Next, the thickness of the transparent conductive film 7 and the conductive plate 1
The relationship between the surface resistance Rs of 0, the total light transmittance Tt, and the haze H was examined. As a sample for this, a conductive plate having a transparent conductive film 7 having a film thickness of 2 μm or 4 μm was prepared in the same manner as described above, except that the heat treatment temperature of the coating film was kept at 180 ° C. and the coating thickness of the coating material was changed. 10 was produced. The total light transmittance Tt and haze H of the conductive plate 10 were measured using a haze computer (manufactured by Suga Test Instruments Co., Ltd.). Table 1 shows the above measurement results.
【００２１】[0021]
【表１】 [Table 1]
【００２２】塗膜の加熱処理温度が１８０℃であれば、
膜厚１〜４μｍの透明導電膜７を有する導電性板１０の
表面抵抗値Ｒｓは２×１０3Ω／□以下となり、且つ、
導電性板１０は透明性に優れていることが表１から分か
る。また、ＰＥＴフィルムは塗膜とともに１８０℃に加
熱されたが、反り変形等は導電性板１０に認められなか
った。If the heat treatment temperature of the coating film is 180 ° C.,
The surface resistance Rs of the conductive plate 10 having the transparent conductive film 7 having a thickness of 1 to 4 μm is 2 × 10 3 Ω / □ or less, and
Table 1 shows that the conductive plate 10 is excellent in transparency. Further, the PET film was heated to 180 ° C. together with the coating film, but no warpage or the like was observed on the conductive plate 10.
【００２３】[0023]
【発明の効果】以上説明したように、本発明によれば、
表面抵抗値として１０2〜１０4Ω／ロを有し、しかも透
明性に優れた導電性板が容易に製造できる。このような
導電性板は、エレクトロ・ルミネッセント（ＥＬ）ディ
スプレイ、液晶ディスプレイ、タッチパネル、太陽電池
等の透明電極、病院等の窓材料や陰極線管の前面パネル
等の電磁波シールド性材料等として有用である。As described above, according to the present invention,
A conductive plate having a surface resistance of 10 2 to 10 4 Ω / b and excellent transparency can be easily manufactured. Such a conductive plate is useful as an electroluminescent (EL) display, a liquid crystal display, a touch panel, a transparent electrode such as a solar cell, a window material for a hospital or the like, an electromagnetic wave shielding material for a front panel of a cathode ray tube, and the like. .
【図１】 塗膜の加熱処理温度と導電性板の表面抵抗値
との関係を示すグラフである。FIG. 1 is a graph showing a relationship between a heat treatment temperature of a coating film and a surface resistance value of a conductive plate.
【図２】 導電性板の例を示す断面図である。FIG. 2 is a cross-sectional view illustrating an example of a conductive plate.
１・・基板、３・・バインダー、５・・ＩＴＯ微粉末、
７・・透明導電膜、１０・・導電性板1. substrate, 3. binder, 5. fine ITO powder,
7. Transparent conductive film, 10 Conductive plate
Claims (4)
化インジウム微粉末と熱可塑性樹脂とを含有する塗料を
基板の上に塗布して形成した塗膜を、前記熱可塑性樹脂
の軟化点以上の温度で加熱処理することを特徴とする透
明導電膜を有する導電性板の製造法。1. A coating film formed by applying a coating material containing tin-doped indium oxide fine powder having an average particle size of 0.1 μm or less and a thermoplastic resin on a substrate, and forming a coating film having a softening point of the thermoplastic resin. A method for producing a conductive plate having a transparent conductive film, characterized by performing a heat treatment at the above temperature.
クリル樹脂、フッ素樹脂のいずれかであることを特徴と
する請求項１記載の透明導電膜を有する導電性板の製造
法。2. The method for producing a conductive plate having a transparent conductive film according to claim 1, wherein the thermoplastic resin is any one of a polyester resin, an acrylic resin, and a fluororesin.
化インジウム微粉末と熱可塑性樹脂とを含有する塗料
を、ポリエチレンテレフタレートからなる基板の上に塗
布して形成した塗膜を、１５０゜Ｃ〜２１０゜Ｃで加熱
処理することを特徴とする透明導電膜を有する導電性板
の製造法。3. A coating film formed by applying a coating material containing fine particles of tin-doped indium oxide having an average particle size of 0.1 μm or less and a thermoplastic resin on a substrate made of polyethylene terephthalate to form a coating film having a thickness of 150 °. A method for producing a conductive plate having a transparent conductive film, wherein a heat treatment is performed at C to 210 ° C.
明導電膜を有する導電性板の製造法により製造された透
明導電膜を有する導電性板。4. A conductive plate having a transparent conductive film manufactured by the method for manufacturing a conductive plate having a transparent conductive film according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3779198A JPH11227740A (en) | 1998-02-19 | 1998-02-19 | Conductive plate having transparent conductive film, and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3779198A JPH11227740A (en) | 1998-02-19 | 1998-02-19 | Conductive plate having transparent conductive film, and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11227740A true JPH11227740A (en) | 1999-08-24 |
Family
ID=12507327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3779198A Withdrawn JPH11227740A (en) | 1998-02-19 | 1998-02-19 | Conductive plate having transparent conductive film, and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11227740A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108008A (en) * | 2004-10-08 | 2006-04-20 | Sumitomo Metal Mining Co Ltd | Transparent conductive substrate and its manufacturing method |
| JP2007193992A (en) * | 2006-01-17 | 2007-08-02 | Osaka City | Paste composition for forming transparent conductive film containing metal oxide ultrafine particle |
| JP2011187286A (en) * | 2010-03-08 | 2011-09-22 | Hitachi Maxell Ltd | Transparent conductive film and method of manufacturing the same |
-
1998
- 1998-02-19 JP JP3779198A patent/JPH11227740A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108008A (en) * | 2004-10-08 | 2006-04-20 | Sumitomo Metal Mining Co Ltd | Transparent conductive substrate and its manufacturing method |
| JP2007193992A (en) * | 2006-01-17 | 2007-08-02 | Osaka City | Paste composition for forming transparent conductive film containing metal oxide ultrafine particle |
| JP2011187286A (en) * | 2010-03-08 | 2011-09-22 | Hitachi Maxell Ltd | Transparent conductive film and method of manufacturing the same |
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| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050510 |