JPS6222466A - Manufacture of lead frame for integrated circuit device - Google Patents

Manufacture of lead frame for integrated circuit device

Info

Publication number
JPS6222466A
JPS6222466A JP16223185A JP16223185A JPS6222466A JP S6222466 A JPS6222466 A JP S6222466A JP 16223185 A JP16223185 A JP 16223185A JP 16223185 A JP16223185 A JP 16223185A JP S6222466 A JPS6222466 A JP S6222466A
Authority
JP
Japan
Prior art keywords
lead frame
internal
holder
leads
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16223185A
Other languages
Japanese (ja)
Inventor
Naohiro Kitamura
北村　直大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP16223185A priority Critical patent/JPS6222466A/en
Publication of JPS6222466A publication Critical patent/JPS6222466A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To mount easily a holder at a high precision in a given position on a lead frame, by providing an inner short rod, and removing the inner short rod after the holder is molded. CONSTITUTION:Under a condition in which inner leads 1 are connected by inner short rods 8 provided so as to surround the base stand 2, outer short rods 6, dam rods 5 and leads (the tips of the inner leads 1 and the base stand 2 are cut and separated), the lead frame is punched. Under this condition, since the inner leads 1 are fixed by the inner short rods 8, they are secured at designed positions even after press punching. After a pour of fluid insulating holder 7 is made by using a mold, it is cooled and hardened to hold the inner leads 1. Again by punching, the inner short rods 8 are cut. Where bonding onto the lead frame is done, the bonding may be done onto the inner leads 1 around the holder 7.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 用リードフレームの製造方法ｉこ関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a lead frame for use in the present invention.

（従来の技術〕 素材を、リードフレームに加工する方法としてはマスキ
ング法と、プレス打ち抜き法がある。両者は共に一長一
短がある。特にプレス打ち抜き法は、長所として、加工
コストが安く、かつ、生産能力が高いことから量産に適
している。プレス打抜き法の短所としては、金型の寸法
を設計通りに製作し製造に充分の注意を払ったとしても
、打ち抜き後のリードフレームの形状が、設計寸法と異
なった状態に形成される場合があることである。(Conventional technology) There are two methods for processing materials into lead frames: the masking method and the press punching method. Both have their advantages and disadvantages. The press punching method in particular has the advantages of low processing costs and easy production. It is suitable for mass production due to its high capacity.The disadvantage of the press punching method is that even if the dimensions of the die are made according to the design and sufficient attention is paid to manufacturing, the shape of the lead frame after punching may not match the design. The problem is that it may be formed in a state different from the dimensions.

具体的には、金属内部の残留応力や打ち抜き加工曇こよ
る歪のため、打抜いたリードフレームの内部リード先端
部が、水平方向や垂直方向に移動する不具合がある。Specifically, due to residual stress inside the metal and distortion caused by the punching process, there is a problem in that the tips of the internal leads of the punched lead frame move horizontally or vertically.

近年、集積回路装置の軽薄短小化が進み、回路集積度が
高くなるに伴い部用リードフレームのリード本数が多く
なりリードの集積度も高゛くなって来た。そのため、内
部リードは細く、かつ長く、成形する必要が出てきた。In recent years, integrated circuit devices have become lighter, thinner, shorter and smaller, and as the degree of circuit integration has increased, the number of leads in lead frames for parts has increased and the degree of lead integration has also become higher. Therefore, it has become necessary to mold the internal leads to be thin and long.

細く、かつ長い内部リード番どなる程、打ち抜き加工に
おいて、前述の不具合が生じ易くなる。The thinner and longer the internal lead number, the more likely the above-mentioned problems will occur during punching.

従って、その対策として、従来、次の様な集積回路装置
用リードフレームの製造方法が示唆されている。Therefore, as a countermeasure against this problem, the following method of manufacturing a lead frame for an integrated circuit device has been suggested.

第５図〜第７図は、従来の集積回路装置のり一ドフレｉ
ムの製造方法で製造されるリードフレームを工程順に示
した図であり、ｇｇ８図は第６図に示す保持体３０部分
の断面図である。まず、第５図ζこ示すようにリードフ
レームを内部リード１と台部２を連結した状態まで加工
する。その後、第６図及び第８図に示すように台部２の
第６図に２ける上下の辺に連結する内部リード１にポリ
イミドフィルム等の保持体３を貼付ける。次に、第７図
に示すように内部リードｌと、台部２とを切り離す。た
だし台部２を支持するリードは切らずに残す。Figures 5 to 7 show conventional integrated circuit devices.
6 is a diagram illustrating a lead frame manufactured by the method for manufacturing a lead frame in the order of steps, and FIG. First, the lead frame is processed to a state in which the internal leads 1 and the base portion 2 are connected as shown in FIG. Thereafter, as shown in FIGS. 6 and 8, a holder 3 such as a polyimide film is attached to the internal lead 1 connected to the upper and lower sides of the base 2 in FIG. 6. Next, as shown in FIG. 7, the internal lead 1 and the base 2 are separated. However, the leads supporting the base 2 are left uncut.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の集積回路装置用リードフレームでは、第
９図に示すように保持体３を内部リード１の少しの部分
にのみ貼付けるのは、効果が少く、第１０図に示すよう
番こ出来るだけ多くの内部リード１を保持して、初めて
その効果がある。一方、軽薄短小化が図られているため
、非常に巾がせまくなっている。In the above-mentioned conventional lead frame for an integrated circuit device, attaching the holder 3 to only a small portion of the internal lead 1 as shown in FIG. It is effective only when as many internal leads 1 are retained. On the other hand, as efforts are being made to make them lighter, thinner, and smaller, their width has become extremely narrow.

従りて、第１０図に示すような多（の内部リード１を保
持するように大きな保持体３を取付ける０、場合、保持
体３が集積回路素子を封止する樹脂からはみ出さぬよう
に、高い精度をもって保持体３の堆付けを行う必要があ
り、多くの工数を要するという欠点がある。何故なら、
保持体３が封止樹脂からはみ出した場合は、保持体３か
ら、水分が封止内部に浸入し、電極面を腐食させるため
、品質上、信頼性上問題となるからである。Therefore, when a large holder 3 is installed to hold the internal leads 1 of a multilayer structure as shown in FIG. , it is necessary to deposit the holder 3 with high precision, which has the disadvantage of requiring a large number of man-hours.
If the holder 3 protrudes from the sealing resin, moisture will enter the sealing interior from the holder 3 and corrode the electrode surface, causing problems in terms of quality and reliability.

また第６図に示す場合でも台部２の左右の辺に対応する
内部リード１は保持体３により保持されず設計寸法と異
って（る恐れがある。Further, even in the case shown in FIG. 6, the internal leads 1 corresponding to the left and right sides of the base portion 2 are not held by the holder 3 and may differ from the designed dimensions.

また、最近の集積回路装置用リードフレームでは、内部
リード１か細くなって来たため、ポリイミドシート等の
保持体３を用いる従来方式では内部リード１の保持力に
限界があり、後工程まで保持しきれない問題がある。In addition, in recent lead frames for integrated circuit devices, the internal leads 1 have become thinner, so the conventional method using a holder 3 such as a polyimide sheet has a limit to the holding power of the internal leads 1, and cannot hold them until the subsequent process. There is no problem.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、ペレットを搭載するための台部の周辺に複数
の内部リードの先端が配置された集積回路用リードフレ
ームの製造方法において、前記台部と先端が前記台部の
周辺に位置するように配置されかつ前記台部から切離さ
れた複数の内部リードと前記台部の周辺で前記内部リー
ドを連結する内部シｍ）棒を打抜き加工により成形する
第１の工程と、この第１の工程の後に前記台部と前記内
部シ冒−ト棒の間で前記内部リードの先端部を保持する
絶縁性の保持体を型を用いて成形する第２の工程と、こ
の第２の工程の後に前記内部シ冒−ト棒を除去する第３
の工程とを含んで構成される。The present invention provides a method for manufacturing an integrated circuit lead frame in which the tips of a plurality of internal leads are arranged around a pedestal for mounting a pellet, in which the pedestal and the tips are located around the pedestal. a first step of forming, by punching, an internal shim that connects the plurality of internal leads arranged in the base and separated from the base and the internal leads around the base; After the step, a second step of molding an insulating holder for holding the tip of the internal lead between the base and the internal sheet rod using a mold; After the third step of removing the inner sheet rod
It consists of the following steps.

〔実施例〕〔Example〕

左右方向の切断面に２ける断面図である。 FIG. 2 is a sectional view taken along a cross section in the left-right direction.

まず＠１図に示すようにリード、ダム棒５、外部シ■−
ト棒６のほかに台部２を囲むようにして設けた内部シ望
−ト棒で内部リード１を連結した状態（台部２を支持す
るためのリードを除き内部リード１の先端と台部２は切
り離されている。）まで、リードフレームの打ち抜き加
工を行う。この状態番こ３いて、内部リード１は、内部
シ、−）棒８で固定されているため、プレス打抜き後で
も設計上の位置に確保されている。First, as shown in Figure @1, the lead, dam rod 5, and external shield
In addition to the seat rod 6, the internal lead 1 is connected by an internal sheet rod provided to surround the base 2 (excluding the lead for supporting the base 2, the tip of the internal lead 1 and the base 2 are The lead frame is punched until it is separated. In this state, since the internal lead 1 is fixed by the internal rod 8, it is secured at the designed position even after press punching.

次に第２図及び第４図に示すよ、うに、成形金型を用い
て流動性の絶縁性保持体７を流し込んだ後、冷却硬化さ
せ内部リード１を保持してしまう。Next, as shown in FIGS. 2 and 4, a fluid insulating holder 7 is poured into the mold using a mold, and then cooled and hardened to hold the internal lead 1.

さらに第３図ζこ示すように、再び打ち抜き加工により
、内部シｖａ　−）棒８を切断する。Furthermore, as shown in FIG. 3, the internal shiva rod 8 is cut by punching again.

な２、第３図に示すリードフレームにポンディングする
時は、内部リード１上の保持体７の周辺にボンディング
すればよい。2. When bonding to the lead frame shown in FIG. 3, it is sufficient to bond around the holder 7 on the internal lead 1.

〔考案の効果〕[Effect of idea]

以上説明したように、本発明の集積回路装置用ト棒を除
去することにより、リードフレームの所定の位置に高い
精度で容易に、保持体を取付けることができる効果があ
る。As explained above, by removing the integrated circuit device tong rod of the present invention, the holder can be easily attached to a predetermined position of the lead frame with high precision.

更に内部リード全体を均一に保持することも容易番とで
きる。Furthermore, it is easy to hold the entire internal lead uniformly.

従って、内部リードが共に平らな状態に２かれ、又正し
く間隔をあけられ、パッケージの巾が狭い集積回路装置
にも適用できるリードフレーム＆容易にかつ安価に製造
できる。Therefore, the internal leads are flattened together and properly spaced, making the lead frame applicable to integrated circuit devices with narrow package widths and easily and inexpensively manufactured.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図〜第３図は本発明の一実施例により製造された集
積回路装置用リードフレームを工程順に示す平面図、Ｎ
４図は第２図に示す保持体７の断面図、第５図〜第７図
は従来の集積回路装置用リードフレームの製造方法によ
り製造されたリードフレームを工程順に示す平面図、第
８図は第６図に示す保持体３の部分の断面図、第９図２
よび第１０図は第１図〜第３図疹こ示す従来の集積回路
装置用リードフレームの製造方法により製造されたリー
ドフレームの平面図でそれぞれ保持体３が少しの内部リ
ード１を保持する場合と保持部３が多くの内部リード１
を保持する場合である。 １・−・・・・内部リード、２・・・・・・台部、３．
７・・・・・・保持体、４・・・・−・モールド樹脂で
封止したパッケージ、５・・・・・・ダム棒、６・・・
・・・外部シ嘗−ト棒、８・・・・・・内部シ■−ト棒
。 代理人　弁理士　　内　原　　　晋１−゛′ンＸＩ＋１ ′（− 第１図　　　　　　　　　第３図 第５図　　　　　　　　第７図 柴８図 東６図 第９図 第１０図1 to 3 are plan views showing a lead frame for an integrated circuit device manufactured according to an embodiment of the present invention in the order of steps;
4 is a sectional view of the holder 7 shown in FIG. 2, FIGS. 5 to 7 are plan views showing a lead frame manufactured by a conventional method for manufacturing a lead frame for an integrated circuit device in order of process, and FIG. is a sectional view of the portion of the holder 3 shown in FIG. 6, and FIG.
1 to 10 are plan views of lead frames manufactured by the conventional manufacturing method of lead frames for integrated circuit devices shown in FIGS. and the holding part 3 has many internal leads 1
This is the case when holding . 1.--Internal lead, 2.--Base part, 3.
7...Holding body, 4...--Package sealed with molded resin, 5...Dam rod, 6...
...External seat rod, 8...Internal seat rod. Agent Patent Attorney Susumu Uchihara1-゛'nXI+1'(- Figure 1 Figure 3 Figure 5 Figure 7 Shiba Figure 8 Figure East 6 Figure 9 Figure 10

Claims (1)

【特許請求の範囲】[Claims] ペレットを搭載するための台部の周辺に複数の内部リー
ドの先端が配置された集積回路装置用リードフレームの
製造方法において、前記台部と先端が前記台部の周辺に
位置するように配置されかつ前記台部から切離された複
数の内部リードと前記台部の周辺で前記内部リードを連
結する内部シヨート棒を打抜き加工により成形する第１
の工程と、この第１の工程の後に前記台部と前記内部シ
ョート棒の間で前記内部リードの先端部を保持する絶縁
性の保持体を型を用いて成形する第２の工程と、この第
２の工程の後に前記内部シヨート棒を除去する第３の工
程とを含むことを特徴とする集積回路装置用リードフレ
ームの製造方法。In a method for manufacturing a lead frame for an integrated circuit device, in which tips of a plurality of internal leads are arranged around a pedestal for mounting pellets, the pedestal and the tips are arranged around the pedestal. and a first step of forming by punching a plurality of internal leads separated from the base part and an internal short rod connecting the internal leads around the base part.
a second step of molding an insulating holder that holds the tip of the internal lead between the base and the internal short rod using a mold after the first step; A method for manufacturing a lead frame for an integrated circuit device, comprising a third step of removing the internal shot rod after the second step.
JP16223185A 1985-07-22 1985-07-22 Manufacture of lead frame for integrated circuit device Pending JPS6222466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16223185A JPS6222466A (en) 1985-07-22 1985-07-22 Manufacture of lead frame for integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16223185A JPS6222466A (en) 1985-07-22 1985-07-22 Manufacture of lead frame for integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6222466A true JPS6222466A (en) 1987-01-30

Family

ID=15750461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16223185A Pending JPS6222466A (en) 1985-07-22 1985-07-22 Manufacture of lead frame for integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6222466A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554908A (en) * 1978-06-26 1980-01-14 Hitachi Ltd Lead frame
JPS55154757A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Smiconductor device and manufacture of the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554908A (en) * 1978-06-26 1980-01-14 Hitachi Ltd Lead frame
JPS55154757A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Smiconductor device and manufacture of the same

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