JPS62213486A - Solid-state image pickup device - Google Patents
Solid-state image pickup deviceInfo
- Publication number
- JPS62213486A JPS62213486A JP61054787A JP5478786A JPS62213486A JP S62213486 A JPS62213486 A JP S62213486A JP 61054787 A JP61054787 A JP 61054787A JP 5478786 A JP5478786 A JP 5478786A JP S62213486 A JPS62213486 A JP S62213486A
- Authority
- JP
- Japan
- Prior art keywords
- members
- solid
- ceramic
- reference holes
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 238000003384 imaging method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は固体撮像装置に係り、特ｆこ固体撮像素子を接
着配置したセラミック枠体を光学レンズ系の光軸とに位
置合せするための基準孔の設定構造１ｒ−関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a solid-state imaging device, and in particular, to a method for aligning a ceramic frame on which a solid-state imaging device is bonded and arranged with an optical axis of an optical lens system. Regarding the reference hole setting structure 1r.
従来の固体撮像装置として、例えば特開昭５８−８４５
７２号公報、特開昭５８−８８９７５号公報に示すもの
が知られている。As a conventional solid-state imaging device, for example, Japanese Patent Application Laid-Open No. 58-845
72 and JP-A-58-88975 are known.
この構造は、固体撮像素子を接着配置したセラミック枠
体の両端部ｔこ穿孔を設け、この穿孔に基準孔を有する
スリーブよりなる位置決め部材を銀ろうで埋設固定して
なる。In this structure, holes are provided at both ends of a ceramic frame on which a solid-state image sensor is bonded and arranged, and a positioning member made of a sleeve having a reference hole is embedded and fixed in the holes with silver solder.
また上記公報には、従来例として、複数個の基準孔が形
成された一枚の底板をセラミック枠体に銀ろうで接着固
定した構造も示されている。The above-mentioned publication also discloses, as a conventional example, a structure in which a single bottom plate in which a plurality of reference holes are formed is adhesively fixed to a ceramic frame with silver solder.
上記従来例の前者の構造においては、位置決め部材はセ
ラミック枠体の穿孔に埋設されるので、穿孔の孔及び位
置精度によって位置決め部材の基準孔の位置精度が決る
。In the former structure of the conventional example, the positioning member is embedded in the perforation of the ceramic frame, so the positional accuracy of the reference hole of the positioning member is determined by the hole and positional accuracy of the perforation.
ところで、セラミック容器は、複数枚の薄板状のセラミ
ック枠体を積層し焼成して一体成形されるので、前記焼
成時に位置決め部材埋設用の穿孔の位置精度が低下し、
これによって基準孔の位置精度が低下するという問題点
があった。By the way, since a ceramic container is integrally formed by laminating and firing a plurality of thin plate-shaped ceramic frames, the positional accuracy of the hole for embedding the positioning member decreases during the firing.
This poses a problem in that the positional accuracy of the reference hole decreases.
前記後者の構造は、前記公報にも述べられているように
、セラミックパッケージの製造工程において、セラミッ
ク枠体と底板との両者間で熱膨張係数の差により、セラ
ミック枠体が反ったり、クラックを生じたりして生産性
を低下させるという問題点があった。As stated in the above publication, the latter structure prevents the ceramic frame from warping or cracking due to the difference in thermal expansion coefficient between the ceramic frame and the bottom plate during the manufacturing process of the ceramic package. There has been a problem in that productivity has been reduced due to this.
本発明の目的は、基準孔の位置精度の向上が図れると共
に、生産性に優れた固体撮像装置を提供することにある
。An object of the present invention is to provide a solid-state imaging device that can improve the positional accuracy of a reference hole and has excellent productivity.
上記問題点は、複数個の基準孔にそれぞれ対応して打抜
きによって金属板からなる位置決め部材を複数個形成し
、これらの位置決め部材をセラミック枠体の該当面上に
接着固定することにより解決される。The above problem can be solved by forming a plurality of positioning members made of metal plates by punching corresponding to a plurality of reference holes, respectively, and adhesively fixing these positioning members on the corresponding surface of the ceramic frame. .
〔作用〕
セラミック枠体上に接着固定するので、基準孔の位置精
度が低下することもない。また各基準孔に対応した複数
の位置決め部材よりなるので、セラミック枠体船こ悪影
響を及ぼすこともない。[Function] Since it is adhesively fixed onto the ceramic frame, the positional accuracy of the reference hole does not deteriorate. Furthermore, since it is composed of a plurality of positioning members corresponding to each reference hole, there is no adverse effect on the ceramic frame body.
以下、本発明の一実施例を第１図及び第２図番こより説
明する。固体撮像素子１が接着固定された積層構造より
なるセラミック枠体２の両側部には、後記する位置決め
部材３．４の基準孔３ａ、４ａより大きな幅の切欠き溝
２ａが形成され、更Ｅここの切欠き溝２ａの上面側には
該切欠き＠２ａより大きい幅の切欠き部２ｂが形成され
ている。前記切欠き部２ｂの段差２Ｃの面上はタングス
テン等でメタライズされており、この段差２Ｃ上ｆこは
位置決め用の基準孔３ａ、４ａが形成された金属板から
なる位置決め部材３．４が高融点半田５で接着固定され
ている。前記位置決め部材３．４は打抜きによって高精
度に製作できる。またセラミック枠体２の前面側には透
光性ガラス面板６が図示しないシール材を介して気密封
着されている。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. A notch groove 2a having a width larger than reference holes 3a and 4a of a positioning member 3.4, which will be described later, is formed on both sides of a ceramic frame body 2 having a laminated structure to which a solid-state image sensor 1 is adhesively fixed. A notch portion 2b having a width larger than the notch @2a is formed on the upper surface side of the notch groove 2a. The surface of the step 2C of the notch 2b is metallized with tungsten or the like, and a positioning member 3.4 made of a metal plate in which positioning reference holes 3a, 4a are formed is placed on the step 2C. It is adhesively fixed with melting point solder 5. The positioning member 3.4 can be manufactured with high precision by stamping. Further, a translucent glass face plate 6 is hermetically sealed to the front side of the ceramic frame 2 via a sealant (not shown).
前記セラミック容器２への位置決め部材３．４の固定は
、組立治具にセラミック容器２を載置して位置決めする
。位置決め部材３．４には予めペースト状の高融点半田
５を塗布しておき、組立治具の基準ピンに位置決め部材
３．４の基準孔３ａ、４ａを挿入して位置決め部材３．
４を段差２Ｃ上ｆこ載置する。そして、約３５０’Ｃ１
こ加熱すると、位置決め部材３．４はセラミック容器２
に接合される。The positioning members 3.4 are fixed to the ceramic container 2 by placing the ceramic container 2 on an assembly jig and positioning it. The positioning member 3.4 is coated with paste-like high melting point solder 5 in advance, and the reference holes 3a, 4a of the positioning member 3.4 are inserted into the reference pins of the assembly jig.
4 is placed f times on the step 2C. And about 350'C1
When heated, the positioning member 3.4 is placed in the ceramic container 2.
is joined to.
そこで、位置決め部材３．４の基準孔３ａ、４ａを基準
に固体撮像素子１を付けることにより、高精度のぺＶッ
ト付けが可能である。またＶンズ系を保持した取付本体
の取付ピンに基準孔３ａ、４ａが高精度で取付けられる
こと１こより、Ｖ／ズ系の中心軸と固体撮像素子１の中
心軸とを一致させることができる。Therefore, by attaching the solid-state image sensor 1 using the reference holes 3a, 4a of the positioning member 3.4 as a reference, highly accurate PEV attachment is possible. Furthermore, since the reference holes 3a and 4a are mounted with high precision on the mounting pins of the mounting body holding the V/Z system, the central axis of the V/Z system can be aligned with the central axis of the solid-state image sensor 1. .
このように、成形されたセラミック容器２の上面に取付
本体の各取付ピンに対応してそれぞれ基準孔３ａ、４ａ
を有する位置決め部材３．４を取付けてなるので、基準
孔３ａ、４ａの位置は高精度に位置決めされる。また高
価な銀ろうを使用する必要がなくなり、コストダウンが
図れる。更ｆこ複数個の位置決め部材３．４を接着固定
してなるので、セラミック容器２の反り、クランクの発
生が皆無となり、歩留りが向上する。In this way, reference holes 3a and 4a are formed on the top surface of the molded ceramic container 2, corresponding to each mounting pin of the mounting body.
Since the positioning member 3.4 having a positioning member 3.4 is attached, the positions of the reference holes 3a, 4a can be determined with high precision. Furthermore, there is no need to use expensive silver solder, which reduces costs. Furthermore, since the plurality of positioning members 3.4 are adhesively fixed, there is no warping or cranking of the ceramic container 2, and the yield is improved.
なお、上記実施例においては、高融点半田５１こよる接
着ｆこついて説明したが、本発明はこれに限定されるも
のではなく、例えば銀ペースト等のような導電性接着剤
あるいは単なるエポキシ系の接着剤等で接着しても同様
の効果が得られる。ただし、固体撮像装置を組立る工程
において、その工穆全ての熱履歴で溶融しない接着剤が
最も好ましいことはいうまでもない。また上記実施例に
おいては、位置決め部材３．４をセラミック容器２の上
面に固定した場合について説明したが、セラミック枠体
２の下面に接着してもよいことは勿論である。In the above embodiments, it has been explained that the adhesive is bonded by the high melting point solder 51, but the present invention is not limited to this, and for example, a conductive adhesive such as silver paste or a simple epoxy adhesive may be used. A similar effect can be obtained by adhering with an adhesive or the like. However, it goes without saying that in the process of assembling a solid-state imaging device, it is most preferable to use an adhesive that does not melt during the entire thermal history of the process. Further, in the above embodiment, a case has been described in which the positioning member 3.4 is fixed to the upper surface of the ceramic container 2, but it goes without saying that it may be adhered to the lower surface of the ceramic frame 2.
また位置決め部材３．４を接着する際、基準孔３ａ、４
ａｊこ接着剤が入り込むと、基準孔３ａ。Also, when bonding the positioning member 3.4, the reference holes 3a, 4
When the adhesive enters the reference hole 3a.
４ａの精度がでなくなるので、位置決め部材３．４の外
径と内径の差をできるだけ大きくし、また切欠き溝２ａ
と位置決め部材３．４の内径の差をできるだけ大きくと
っておくのが好ましい。また位置決め部材３．４を段差
２Ｃ１こ高融点中１ｌｌｌｌｌＩ５で接着するような場
合には、レーザ加熱等の自動機を用いて接着すれば大片
生産が可能である。4a, the difference between the outer diameter and inner diameter of the positioning member 3.4 should be made as large as possible, and the notch groove 2a
It is preferable to keep the difference between the inner diameters of the positioning member 3.4 and the positioning member 3.4 as large as possible. Further, in the case where the positioning member 3.4 is bonded to the step 2C1 at a high melting point of 1llllI5, it is possible to produce large pieces by bonding using an automatic machine such as laser heating.
本発明によれば、基準孔の位置精度が向上すると共に、
低コストで、しかも生産性が向上する。According to the present invention, the positional accuracy of the reference hole is improved, and
Low cost and improved productivity.
第１図は本発明の一実施例を示す平面図、第２図は第１
図のＡ−Ａ線断面図である。
１・・・固体撮像素子、 ２・・・セラミック容
器、２ａ゛・・・切欠き溝、 ２ｂ・・・切欠
き部、２Ｃ・・・段差、 ３．４・・・位
置決め部材、３ａ、４ａ・・・基準孔、 ５・・・半
田。
第１図
第２図Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
It is a sectional view taken along the line AA in the figure. DESCRIPTION OF SYMBOLS 1... Solid-state image sensor, 2... Ceramic container, 2a'... Notch groove, 2b... Notch part, 2C... Step, 3.4... Positioning member, 3a, 4a ...Reference hole, 5...Solder. Figure 1 Figure 2
Claims (1)
のセラミック枠体に固定され、光学レンズ系の光軸に位
置合せするための基準孔が形成された位置決め部材とを
備え、前記基準孔が複数個からなる固体撮像装置におい
て、前記基準孔が形成された前記位置決め部材は、前記
複数個の基準孔にそれぞれ対応して打抜きによつて形成
された複数個の金属板よりなり、前記セラミック枠体の
該当面上に接着固定されていることを特徴とする固体撮
像装置。1. A ceramic frame on which a solid-state image sensor is bonded and arranged, and a positioning member fixed to the ceramic frame and having a reference hole for alignment with the optical axis of an optical lens system, the reference hole being In the solid-state imaging device including a plurality of solid-state imaging devices, the positioning member in which the reference holes are formed is made of a plurality of metal plates formed by punching corresponding to the plurality of reference holes, respectively, and A solid-state imaging device characterized in that it is adhesively fixed on a corresponding surface of the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61054787A JPS62213486A (en) | 1986-03-14 | 1986-03-14 | Solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61054787A JPS62213486A (en) | 1986-03-14 | 1986-03-14 | Solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62213486A true JPS62213486A (en) | 1987-09-19 |
Family
ID=12980468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61054787A Pending JPS62213486A (en) | 1986-03-14 | 1986-03-14 | Solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62213486A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015045711A (en) * | 2013-08-27 | 2015-03-12 | 株式会社東芝 | Image pickup device fixing method, positioning tool, and positioning component |
| US11574888B2 (en) | 2017-12-15 | 2023-02-07 | Panasonic Intellectual Property Management Co., Ltd. | Component joining apparatus, component joining method and mounted structure |
-
1986
- 1986-03-14 JP JP61054787A patent/JPS62213486A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015045711A (en) * | 2013-08-27 | 2015-03-12 | 株式会社東芝 | Image pickup device fixing method, positioning tool, and positioning component |
| US11574888B2 (en) | 2017-12-15 | 2023-02-07 | Panasonic Intellectual Property Management Co., Ltd. | Component joining apparatus, component joining method and mounted structure |
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