JPS62213299A - Parts feeder - Google Patents
Parts feederInfo
- Publication number
- JPS62213299A JPS62213299A JP61057219A JP5721986A JPS62213299A JP S62213299 A JPS62213299 A JP S62213299A JP 61057219 A JP61057219 A JP 61057219A JP 5721986 A JP5721986 A JP 5721986A JP S62213299 A JPS62213299 A JP S62213299A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- transfer path
- component
- transfer
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000605 extraction Methods 0.000 claims description 4
- 230000032258 transport Effects 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Automatic Assembly (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はチップ型抵抗、チップ型Ｂｔ層フンデンサやＩ
Ｃ等に代表される電子部品を、電子回路を構成する基板
上に装着する電子部品ｉ着礪においで主に利用される部
品供給装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to chip-type resistors, chip-type Bt layer capacitors, and I
The present invention relates to a component supply device that is mainly used in electronic component mounting, in which electronic components such as C are mounted onto a substrate constituting an electronic circuit.
従来の技術
電子部品装着機において、特開昭５５−１１８６９８号
公報に示されているように、テープ本体に一列に多数の
収容凹部を形成して電子部品を収容するとともに、被覆
テープをテープ本体の表面に貼着して成るテープ状部品
集合体を用いた部品供給装置が従来から知られでいる。In a conventional electronic component mounting machine, as shown in Japanese Patent Application Laid-Open No. 55-118698, a large number of accommodating recesses are formed in a line in a tape body to accommodate electronic components, and a covering tape is inserted into the tape body. A component supply device using a tape-shaped component assembly that is adhered to the surface of a component is conventionally known.
その部品供給装置は、ｔＢｓ図に示すように、所定の移
送経路の前端部に配置された歯輪を備えた移送装ｆｉｆ
にでテープ状部品集合体Ｐを一方向に間欠的に移送し、
前記移送経路上を移送される間に、テープ剥離装ｒａｇ
にて被覆テープｄを剥離して巻き取り、収容口部すに収
容された電子部品Ｃを部品取出装置りによって吸着して
取り出すとともに、この部品取出装置１１にて基板ｉ上
の所定位置にｖｃ着するように構成されている。電子部
品Ｃを取り出した後のテープ本体ａは移送装置「の歯輪
に巻き付けて反転させ、後方に移送して適宜巻き取った
り、切断したりして処分するように構成されている。As shown in the tBs diagram, the parts supply device is a transfer device equipped with a toothed ring disposed at the front end of a predetermined transfer path.
The tape-shaped parts assembly P is intermittently transferred in one direction,
While being transported on the transport path, a tape peeling device rag
The covering tape d is peeled off and wound up, and the electronic component C accommodated in the housing opening is sucked and taken out by the component ejecting device 11, and the electronic component C is placed at a predetermined position on the board i by the component ejecting device 11. It is configured to be worn. After the electronic component C has been taken out, the tape body a is wound around the gear wheels of a transfer device, reversed, transferred to the rear, and disposed of by winding or cutting as appropriate.
ところで、前記テープ状部品集合体Ｐの具体的なりＩ戊
としては従米次のようなものが用いられている。By the way, as a specific material for the tape-shaped parts assembly P, the following one is used.
電子部品が小さい場合には、上記特開昭５５−１１８Ｇ
９８号公報に■示されているように肉厚のテープ本体に
電子部品の収容凹部を形成する切欠を形成し、その裏面
に支持テープを貼着するとともに表面に被覆テープを貼
着したものが用いられている。また、比較的大きい電子
部品の場合は、必要な強度を持たせるために、第４図に
示すように、合成樹脂製テープに所定ピッチで一列に多
数の収容口ｇｂをエンボス成形したテープ本体ａを用い
、その収容凹部すに電子部品（図示せず）を収容すると
ともに、テープ本体ａの表面に被覆テープｄを貼着する
ことにより前記電子部品を保持するようにしたものが用
いられている。また、テープ本体ａの両側には移送装置
「の送り歯が係合する送り穴ｅが形成されている。When electronic parts are small, the above-mentioned Japanese Patent Application Laid-Open No. 55-118
As shown in Publication No. 98, a notch is formed in a thick tape body to form a recess for housing an electronic component, a supporting tape is attached to the back side of the cutout, and a covering tape is attached to the front side. It is used. In addition, in the case of relatively large electronic components, in order to provide the necessary strength, as shown in Fig. 4, a tape body a is formed by embossing a large number of storage holes gb in a line at a predetermined pitch on a synthetic resin tape. An electronic component (not shown) is housed in the housing recess, and a covering tape d is attached to the surface of the tape body a to hold the electronic component. . Further, on both sides of the tape body a, there are formed feed holes e into which the feed teeth of the transfer device engage.
発明が解決しようとする問題、α
ところが、第３図のような部品供給装置においては、前
記移送経路の前端部に配ｒａされた移送装置ｆの歯輪に
、電子部品Ｃを取り出された後のテープ本体ａが滑らか
に巻き付かないとテープ状部品集合体Ｐを安定して移送
することができないのである。しかし、第４図に示すよ
うな合成Ｉ（脂製のテープ本体ａを用いたテープ状部品
集合体Ｐの場合は、前記移送装置１ｆ部分で小さな曲率
半径で山が９難いため、滑らかに巻き付かず、送り穴ｅ
と移送装置ｆの送り歯との保合が外れ易く、確実に移送
することができない虞れがある。そして、これを回避す
るためには移送装置ｆ部分の曲率半径を大きくしなけれ
ばならず、装置が大型化するばかりでなく他のテープ状
部品集合体の移送装置と共用化でトないという問題があ
る。Problem to be Solved by the Invention: α However, in the component supply device as shown in FIG. 3, after the electronic component C is taken out, it is Unless the tape body a is wound smoothly, the tape-like parts assembly P cannot be stably transported. However, in the case of composite I (tape-shaped parts assembly P using a tape body a made of fat) as shown in FIG. Not attached, sprocket hole e
There is a possibility that the feed teeth of the transfer device f are easily disengaged from each other, and the transfer cannot be performed reliably. In order to avoid this, it is necessary to increase the radius of curvature of the f section of the transfer device, which not only increases the size of the device, but also makes it impossible to use it in common with other transfer devices for tape-shaped component assemblies. There is.
本発明は上記間ｍａを解消することを目的とするもので
ある。The present invention aims to eliminate the above-mentioned gap ma.
問題点を解決するための手段
本発明は上記目的を達成するため、テープ状部品集合体
を所定の移送経路に沿って間欠移送する移送装置を設け
、前記移送経路には、前記被覆テープを剥離するテープ
剥離装置と、収容凹部開口から部品を取り出して所定位
置に供給する部品取出装置と、部品を取り出した後のテ
ープ本体を切断する切断装置とを移送経路の前方に向か
って順次配設し、前記移送経路の下部にテープ本体の切
断片を後方に移送する排出ｙ！ｃｒ！１を配設したこと
を特徴とするものである。Means for Solving the Problems In order to achieve the above object, the present invention is provided with a transfer device that intermittently transfers a tape-shaped component assembly along a predetermined transfer path, and in the transfer path, the covering tape is peeled off. A tape peeling device for removing the components from the housing recess opening and supplying the components to a predetermined position, and a cutting device for cutting the tape body after removing the components are sequentially arranged toward the front of the transfer path. , a discharge y! that transports the cut pieces of the tape body backwards to the lower part of the transport path! CR! 1 is provided.
作用
本発明は上記した構成を有するので、テープ状部品集合
体から部品を取り出した後のテープ本体を移送経路の前
端で切断処理し、歯輪等に巻き掛けて反転させるように
していないので、比較的大きな部品を収容したテープ状
部品集合体に適用した場合にも装置がコンパクトになる
。さらに、切断片は排出装置にて後方に移送して処理す
るようにしているので、取り出した部品を装着したりす
る作業テーブル上にくず等が落下する虞れがなく、かつ
作業テーブル等から離れた後方位置に切断片を排出でき
るので大きな処理空間を容易に確保することがでべろ。Function Since the present invention has the above-described configuration, the tape body after taking out the parts from the tape-like parts assembly is not cut at the front end of the transfer path and is not wound around a gear ring or the like and reversed. The device can also be made compact when applied to a tape-shaped component assembly containing relatively large components. Furthermore, since the cut pieces are transferred to the rear using a discharge device and disposed of, there is no risk of scraps falling onto the work table where the removed parts are mounted, and the cut pieces are kept away from the work table. Since cut pieces can be discharged to the rear position, a large processing space can be easily secured.
実施例
以下、本発明の一笑、施例について、第１図を参照しな
がら説明する。EXAMPLES Hereinafter, examples of the present invention will be explained with reference to FIG.
第１図に示す部品供給装置において、テープ状部品集合
体１は、テープ本体３に形成された収容！！１部４内に
電子部品２を収容し、被覆テープ５で被覆してｍｔされ
ている。前記テープ本体３は、第４図に示した従米例と
同様に、合成樹虞製テープに所定ピッチで一列に多数の
収容凹部４がエンボス成形され、その両側縁部には所定
ピッチで送り穴が多数形成されている。In the component supply device shown in FIG. 1, a tape-shaped component assembly 1 is housed in a tape body 3. ! The electronic component 2 is housed in the first part 4 and covered with a covering tape 5. Similar to the conventional example shown in FIG. 4, the tape body 3 has a large number of embossed accommodation recesses 4 arranged in a row at a predetermined pitch on a synthetic resin tape, and has perforations formed at a predetermined pitch on both side edges thereof. are formed in large numbers.
部品供給装置には、このテープ状部品集合体１を一直線
状に移送案内する案内部材６が配設されて所定の移送経
路７が構成されている。この移送経路７の適宜位置に、
前記テープ本体３に形成された送り穴に係合する歯輪８
を備えた移送装置９が配設されている。又、前記移送経
路７上には、前方に向かって、前記被覆テープ５を剥離
して巻き取るテープ剥離装置１０と、前記収容凹部４内
の電子部品２を吸着して取り出し、プリント基板１１の
所定位置に装着する部品取出装置１２と、電子部品２を
取り出した直後にテープ本体３を切断する切断装置１３
が配設されでいる。前記切断装置１３の前部には切断片
１５を下方に押し下げで落下させる押圧片１４が昇降可
能に配設されている。また、切断片１５の落下経路を前
方の空間から区画する仕切５！１６が設けられ、その下
端部から後方に、切断片１５を後方に排出するベルトコ
ンベア等の排出装置１７が前記移送経路７の下方に配設
されている。この排出装置１７の後端部には、切断片１
５を収容する切断片処理箱１８が配設されている。The parts supply device is provided with a guide member 6 for transporting and guiding the tape-shaped parts assembly 1 in a straight line, thereby forming a predetermined transport path 7. At an appropriate position on this transfer route 7,
A tooth ring 8 that engages with a feed hole formed in the tape body 3
A transfer device 9 is provided. Further, on the transfer path 7, there is a tape peeling device 10 that peels off and winds up the covering tape 5 toward the front, and a tape peeling device 10 that sucks and takes out the electronic component 2 in the housing recess 4 and removes the electronic component 2 from the printed circuit board 11. A component extraction device 12 that is attached to a predetermined position, and a cutting device 13 that cuts the tape body 3 immediately after the electronic component 2 is extracted.
is provided. At the front of the cutting device 13, a pressing piece 14 for pushing the cut piece 15 downward and dropping it is disposed so as to be movable up and down. Further, a partition 5!16 is provided to separate the fall path of the cut pieces 15 from the space in front, and a discharge device 17 such as a belt conveyor for discharging the cut pieces 15 backward from the lower end of the partition 5!16 is installed on the transfer path 7. It is located below. At the rear end of this ejection device 17, a cut piece 1 is provided.
A cut piece processing box 18 containing 5 is provided.
尚、前記排出Ｉｔｃ置１７はベルトコンベア以外にもエ
アによって吹き飛ばす等、適宜手段を採用することがで
きる。In addition to the belt conveyor, the discharge Itc station 17 may be provided with any suitable means such as blowing off with air.
以上の構成において、テープ状部品集合体１は、移送波
＠９によって移送経路７上をＰｔ５１図の矢印１９方向
に１ピツチづつ間欠移送される。そして、移送経路７上
を移動する間に、まずテープ剥離装ｒａ１０で被覆テー
プ５が剥離され、次いで収容凹部４内の電子゛部品２が
部品取出装置１２にて＠着して取り出され、この部品取
出波［２が第１図の矢印２０．２１．２２の如く移動し
てプリント基板１１に装着される０次に、テープ本体３
の電子部品２を取り出された収容凹部４の部分が直ちに
切断装置ｉ１３にて切断され、その切断片１５は下方に
落下した後排出［ｉ１７にで後方に移送され、切断片処
理箱１８内に廃棄される。In the above configuration, the tape-shaped component assembly 1 is intermittently transferred one pitch at a time on the transfer path 7 in the direction of the arrow 19 in the diagram Pt51 by the transfer wave @9. While moving on the transfer path 7, the covering tape 5 is first peeled off by the tape peeling device RA10, and then the electronic component 2 in the housing recess 4 is picked up and taken out by the component takeout device 12. The component extraction wave [2 moves as shown by the arrows 20, 21, and 22 in FIG.
The part of the accommodation recess 4 from which the electronic component 2 was taken out is immediately cut by the cutting device i13, and the cut piece 15 falls downward and is then discharged [i17] to the rear and placed in the cut piece processing box 18. Will be discarded.
このように、移送経路７の前端でテープ本体３を切断処
理してしまうので、部品供給装置をコンパクトにｖＩ成
でき、またその切断片１５を後方で処理できるので広い
処理空間を確保でさて容易に処分することができ、また
プリント基４ｉ！１１等を配置された作業テーブル上に
切断片１５が落下することもないのである。In this way, since the tape body 3 is cut at the front end of the transfer path 7, the parts supply device can be made compact, and the cut pieces 15 can be processed at the rear, ensuring a wide processing space and making it easy. Can be disposed of and also printed base 4i! There is no possibility that the cut pieces 15 will fall onto the work table on which the cut pieces 11 and the like are placed.
なお、上記実施例では移送装置！！９としてテープ本体
３の送り穴に係合する歯輪８を傾１えたものを例示した
が、第２図に示すように矩形状に移動する送り爪２５を
前記送り穴に係合させて間欠移送するようにすることら
できる。第２図において、移送波ｃ９は、一対の送り爪
２５を突設された動作板２６を上下駆動用のソレノイド
２７の出力軸の上端に取付け、このツレ／イド２７を移
送経路の前後方向に移動可能な移動体２８に取付けると
ともにこの移動体２８をシリンダー装置１ｉ２９または
ツレ／イドにて駆動するように構成され、ソレノイ）＃
２７とシリング−装置２９の出退動作を組み合わせで送
り爪２５を矩形状に移動させるように構成されている。In addition, in the above embodiment, the transfer device! ! As shown in FIG. 9, the tooth ring 8 that engages with the feed hole of the tape body 3 is tilted, but as shown in FIG. It is also possible to transport it. In FIG. 2, the transfer wave c9 is generated by attaching an operating plate 26, on which a pair of feed pawls 25 are protruded, to the upper end of the output shaft of a solenoid 27 for vertical driving, and moving this tread/id 27 in the front-rear direction of the transfer path. It is attached to a movable moving body 28 and is configured to drive this moving body 28 with a cylinder device 1i29 or a solenoid).
The feed pawl 25 is configured to move in a rectangular shape by a combination of the retracting and retracting operations of the silling device 27 and the shilling device 29.
また、この移送装置９の動作板２６とツレ／イド２７か
らなる構成と同様の構成の位置規制装置３０が部品取出
波ｒａ１２の近傍位置に配設されている。Further, a position regulating device 30 having a configuration similar to that of the movement plate 26 and the slide/id 27 of the transfer device 9 is arranged in the vicinity of the component removal wave ra12.
発明の効果
本発明部品供給装置によれば、以上のようにテープ状部
品集合体を歯輪等に巻き掛けて反転させる必要がないの
で、比較的大きな部品を収容したテープ状部品集合体に
適用した場合にも装置をコンパクトにすることができる
。さらに、部品を取り出した後のテープ本体を移送経路
の前端で切断処理し、切断片を排出装置にて後方に移送
して処理するようにしているので、取り出した部品を装
着したりする作業テーブル上にくず等が落下する虞れが
なく、かつ作業テーブル等から離れた後方位置に切断片
を排出できるので大きな処理空間を容易に確保すること
ができるという効果がある。Effects of the Invention According to the parts feeding device of the present invention, there is no need to wrap the tape-shaped parts assembly around a gear ring or the like and turn it over as described above, so it is applicable to a tape-shaped parts assembly containing relatively large parts. Even in this case, the device can be made more compact. Furthermore, after the parts have been taken out, the tape body is cut at the front end of the transfer path, and the cut pieces are transferred to the rear by the discharge device for processing, so that the work table where the taken out parts can be mounted is not necessary. There is no risk of debris etc. falling on top, and the cut pieces can be discharged to a rear position away from the work table etc., so there is an effect that a large processing space can be easily secured.
第１図は本発明の一実施例を示す［断正面図、ｆｊｓ２
図は他の実施例の要部の縦断正面図、第３図は従来例の
断面正面図、第４図は従来のテープ状部品集合体を電子
部品を省略して示した斜視図である。
１・・・・・・・・・・・・・・・テープ状部品集合体
２・・・・・・・・・・・・・・・電子部品３・・・・
・・・・・・・・・・・テープ本体４・・・・・・・・
・・・・・・・収容凹部５・・・・・・・・・・・・・
・・被覆テープ９・・・・・・・・・・・・・・・移送
装置１０・・・・・・・・・・・・・・・テープ剥離装
置１２・・・・・・・・・・・・・・・部品取出装置１
３・・・・・・・・・・・・・・・切断装置１７・・・
・・・・・・・・・・・・排出装置。
代理人の嶋弁理士 中尾敏男 ほか１名１ ７一フ′状
部品菓合体
１１・・・・排出員！FIG. 1 shows an embodiment of the present invention [cross-sectional front view, fjs2
3 is a sectional front view of a main part of another embodiment, FIG. 3 is a sectional front view of a conventional example, and FIG. 4 is a perspective view of a conventional tape-shaped component assembly with electronic components omitted. 1......Tape-shaped parts assembly 2......Electronic parts 3...
......Tape body 4...
・・・・・・Accommodation recess 5・・・・・・・・・・・・・・・
・・Coating tape 9 ・・・・・・・・・・・ Transfer device 10 ・・・・・・・・・・・ Tape peeling device 12 ・・・・・...... Parts extraction device 1
3・・・・・・・・・・・・・・・ Cutting device 17...
・・・・・・・・・・・・Ejection device. Agent Shima Patent Attorney Toshio Nakao and 1 other person 71 Fu' shaped parts confectionery combination 11... Discharger!
Claims (1)
部品を収容し、被覆テープで収容凹部の開口を閉鎖して
なるテープ状部品集合体を用いる部品供給装置であって
、前記テープ状部品集合体を所定の移送経路に沿って間
欠移送する移送装置を設け、前記移送経路には、前記被
覆テープを剥離するテープ剥離装置と、収容凹部開口か
ら部品を取り出して所定位置に供給する部品取出装置と
、部品を取り出した後のテープ本体を切断する切断装置
とを移送経路の前方に向かって順次配設し、前記移送経
路の下部にテープ本体の切断片を後方に移送する排出装
置を配設したことを特徴とする部品供給装置。A component supply device using a tape-shaped component assembly formed by accommodating components in a plurality of accommodating recesses formed in a longitudinal direction of a tape body and closing openings of the accommodating recesses with a covering tape, the tape-shaped component assembly comprising: A transfer device that intermittently transfers the body along a predetermined transfer path is provided, and the transfer path includes a tape peeling device that peels off the covering tape, and a component extraction device that takes out the component from the opening of the storage recess and supplies it to a predetermined position. and a cutting device for cutting the tape body after taking out the parts are sequentially arranged toward the front of the transfer path, and a discharge device for transferring the cut pieces of the tape body backwards is arranged at the bottom of the transfer path. A parts supply device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057219A JPH0682950B2 (en) | 1986-03-14 | 1986-03-14 | Parts feeder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057219A JPH0682950B2 (en) | 1986-03-14 | 1986-03-14 | Parts feeder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62213299A true JPS62213299A (en) | 1987-09-19 |
| JPH0682950B2 JPH0682950B2 (en) | 1994-10-19 |
Family
ID=13049416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61057219A Expired - Lifetime JPH0682950B2 (en) | 1986-03-14 | 1986-03-14 | Parts feeder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0682950B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0544419U (en) * | 1991-11-28 | 1993-06-15 | 三洋電機株式会社 | Parts feeder |
| JPH0546098U (en) * | 1991-11-21 | 1993-06-18 | 太陽誘電株式会社 | Electronic component supply device |
| WO2019116416A1 (en) * | 2017-12-11 | 2019-06-20 | ヤマハ発動機株式会社 | Component mounting machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536702A (en) * | 1976-07-08 | 1978-01-21 | Mitsubishi Motors Corp | Combustion chamber with gas injector of internal combustion engine |
| JPS5737282U (en) * | 1980-08-12 | 1982-02-27 | ||
| JPS60245300A (en) * | 1984-05-21 | 1985-12-05 | 株式会社日立製作所 | Taping part supplying device |
-
1986
- 1986-03-14 JP JP61057219A patent/JPH0682950B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536702A (en) * | 1976-07-08 | 1978-01-21 | Mitsubishi Motors Corp | Combustion chamber with gas injector of internal combustion engine |
| JPS5737282U (en) * | 1980-08-12 | 1982-02-27 | ||
| JPS60245300A (en) * | 1984-05-21 | 1985-12-05 | 株式会社日立製作所 | Taping part supplying device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0546098U (en) * | 1991-11-21 | 1993-06-18 | 太陽誘電株式会社 | Electronic component supply device |
| JPH0544419U (en) * | 1991-11-28 | 1993-06-15 | 三洋電機株式会社 | Parts feeder |
| WO2019116416A1 (en) * | 2017-12-11 | 2019-06-20 | ヤマハ発動機株式会社 | Component mounting machine |
| US11310949B2 (en) | 2017-12-11 | 2022-04-19 | Yamaha Hatsudoki Kabushiki Kaisha | Component mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0682950B2 (en) | 1994-10-19 |
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