JPS62191597A - Base paper for laminated board - Google Patents
Base paper for laminated boardInfo
- Publication number
- JPS62191597A JPS62191597A JP3198886A JP3198886A JPS62191597A JP S62191597 A JPS62191597 A JP S62191597A JP 3198886 A JP3198886 A JP 3198886A JP 3198886 A JP3198886 A JP 3198886A JP S62191597 A JPS62191597 A JP S62191597A
- Authority
- JP
- Japan
- Prior art keywords
- base paper
- laminate
- insulation resistance
- electrical insulation
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000460 chlorine Substances 0.000 claims description 8
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000011575 calcium Substances 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 239000000123 paper Substances 0.000 description 34
- 238000010292 electrical insulation Methods 0.000 description 22
- 150000001875 compounds Chemical class 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 150000002500 ions Chemical class 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 150000001805 chlorine compounds Chemical class 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 150000003388 sodium compounds Chemical class 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 2
- 238000004061 bleaching Methods 0.000 description 2
- 229940043430 calcium compound Drugs 0.000 description 2
- 150000001674 calcium compounds Chemical class 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- -1 psium Chemical compound 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- OEYOHULQRFXULB-UHFFFAOYSA-N arsenic trichloride Chemical compound Cl[As](Cl)Cl OEYOHULQRFXULB-UHFFFAOYSA-N 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 150000003112 potassium compounds Chemical class 0.000 description 1
- 238000004537 pulping Methods 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Paper (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はコンピュータなどの電子機器、テレビ・ラジオ
などの家庭電気製品あるいは各種の計測機器などに利用
されるプリント配線基板、電源などのスイッチボックス
内の基板およヒ配電盤などの基板（これらの基板は一般
にベーク板と呼ばれる）に利用される積層板を製造する
だめの積層板原紙に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applied to printed wiring boards used in electronic equipment such as computers, home appliances such as televisions and radios, and various measuring instruments, switch boxes for power supplies, etc. The present invention relates to laminate base paper for manufacturing laminates used for internal circuit boards and circuit board boards (these boards are generally called baked boards).
従来から積層板と呼ばれるものには、ガラス布にエポキ
シ樹脂などの合成樹脂を含浸し圧締硬化したもの、コツ
Ｆンリンター紙にエポキシ樹脂やフェノール樹脂などの
合成樹脂を含浸し圧締硬化したもの、および紙（通常晒
しクラフト紙）にフェノール樹脂などの合成樹脂を含浸
し圧締硬化したものなどがある。この中で紙にフェノー
ル樹脂を含浸圧締硬化したものは比較的安価で良好な性
能を有する為、家庭電気製品を中心に多く利用されてい
る。紙・フェノール樹脂積層板はガラス・エポキシ樹脂
積層板やリンター・エポキシ樹脂積層板などに比較する
と電気絶縁抵抗が低く、家庭電気製品より高性能を必要
とするコンピュータや計測機器には用いることが出来ず
、限定された用途に比較的下級の商品として使用される
に過ぎなかった。Conventionally, laminates are made by impregnating glass cloth with synthetic resin such as epoxy resin and hardening it by pressing, and by impregnating KotsuFunlinter paper with synthetic resin such as epoxy resin or phenolic resin and hardening it by pressing. , and paper (usually bleached kraft paper) impregnated with synthetic resin such as phenol resin and hardened by pressing. Among these, paper made by impregnating phenolic resin and pressing and hardening it is relatively inexpensive and has good performance, so it is widely used mainly in household electrical appliances. Paper/phenol resin laminates have lower electrical insulation resistance than glass/epoxy resin laminates or linter/epoxy resin laminates, so they cannot be used in computers and measuring equipment that require higher performance than home appliances. However, it was only used as a relatively low-grade product for limited purposes.
また、Ｊ工Ｓ ０ ６４８５に記載されている様に、
紙・フェノール樹脂積層板のグレードは電気絶縁抵抗に
よっても数多くのランクに分けられて繁り、電気絶縁抵
抗を上げることは、前述の限定された使用範囲を広げる
と同時に、もっと直接的に積層板の商品価値を高めるこ
とになる。従って電気絶縁抵抗の向上のため、各種の改
良が加えられたが、未だ満足な品質の積層板原紙は得ら
れていない。In addition, as stated in J Eng S 0 6485,
The grades of paper/phenolic resin laminates are divided into many ranks based on their electrical insulation resistance, and increasing the electrical insulation resistance not only expands the limited scope of use mentioned above, but also directly improves the laminate's performance. This will increase the product value. Therefore, various improvements have been made to improve the electrical insulation resistance, but a laminated board base paper of satisfactory quality has not yet been obtained.
そこで本発明の発明者は紙・フェノール樹脂積層板の電
気絶縁抵抗に影響を及ぼす要因について種々検討した結
果、積層板原紙中に残留する各種の化合物が電気絶縁抵
抗を低下させていることを見出し、この検討結果から本
発明者は積層板原紙中の各種の化合物の含有率を、一定
の量販下に限定することにより電気絶縁抵抗が高く安定
した、商品価値の高い積層板を製造し得る積層板原紙を
提供するものである。Therefore, the inventor of the present invention investigated various factors that affect the electrical insulation resistance of paper/phenolic resin laminates, and found that various compounds remaining in the laminate base paper reduce the electrical insulation resistance. Based on the results of this study, the present inventors have determined that by limiting the content of various compounds in the laminate base paper to a certain level of mass sales, it is possible to produce laminates with high electrical insulation resistance, stability, and high commercial value. It provides board paper.
本発明は、原紙中に存在するナトリウム、カルシウム及
び塩素の量が、重量でパルプ繊維量に対して夫々２００
ｐｐｍ以下、１０００ ｐｐｍ以下及び１５０ ｐｐ
ｍ以下であることを特徴とする積層板原紙である。In the present invention, the amount of sodium, calcium and chlorine present in the base paper is 200% by weight relative to the amount of pulp fiber.
ppm or less, 1000 ppm or less and 150 ppm
This is a laminated board base paper characterized by having a diameter of less than m.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
積層板の電気絶縁抵抗
積層板の電気絶縁抵抗は一般に含浸される樹脂の特性に
よりほとんど決定されると考えられていたが、本発明の
発明者は積層板を構成するもう一つの要素である積層板
原紙の中に残留する各種の化合物が、積層板の電気絶縁
抵抗に大きく影響を及ぼすことを見出した。Electrical insulation resistance of laminates The electrical insulation resistance of laminates was generally thought to be mostly determined by the characteristics of the resin impregnated with it, but the inventor of the present invention discovered that the electrical insulation resistance of laminates is determined by the characteristics of the resin that is impregnated with it. It has been found that various compounds remaining in the board base paper greatly affect the electrical insulation resistance of the laminate.
積層板の電気絶縁抵抗に直接影響を与える化合物として
はナトリウム化合物、カリウム化合物、カルシウム化合
物、塩素化合物、硫酸化合物等があるが、特にナトリウ
ム化合物、力ｌレシウム化合物および塩素化合物の影響
が大きい。Compounds that directly affect the electrical insulation resistance of the laminate include sodium compounds, potassium compounds, calcium compounds, chlorine compounds, sulfuric compounds, etc., but sodium compounds, lesium compounds, and chlorine compounds have a particularly large influence.
これらの化合物は、夫々ナトリウムイオン（Ｎａ＋）、
力μシウムイオン（Ｃａ”）およヒ塩素イオン（ＣＡ−
） として積層板中に存在して積層板の電気絶縁抵抗
に影響を及ぼしているものと考えられる。これら以外の
化合物も積層板原紙中には数多く存在するが、通常の方
法で＠層板原紙を抄造する場合、もともとその量は少な
く、積層板の電気絶縁抵抗にはほとんど影響を与えない
。These compounds are sodium ion (Na+),
Force μsium ion (Ca”) and arsenic chloride ion (CA-
) is present in the laminate and is thought to have an effect on the electrical insulation resistance of the laminate. There are many compounds other than these in the laminate base paper, but when the laminate base paper is made by a normal method, their amount is originally small and has almost no effect on the electrical insulation resistance of the laminate.
ここで述べる電気絶縁抵抗とはＪＩＳ ０６４８１に
記載されている絶縁抵抗であり、実用上特に問題となる
のは、その中の煮沸後絶縁抵抗であって、この値は上記
イオンの残留量により大きく変動する。The electrical insulation resistance mentioned here is the insulation resistance described in JIS 06481, and what is particularly problematic in practical terms is the insulation resistance after boiling, and this value increases depending on the amount of residual ions. fluctuate.
許容残留化合物量
本発明の効果は、上記ナトリウム化合物、カルシウム化
合物および塩素化合物の原紙中への残存量を、ナトリウ
ム、力ｐシウムおよび塩素として一定値以下にすること
により達成しうる。Permissible amount of residual compounds The effects of the present invention can be achieved by controlling the residual amounts of the above-mentioned sodium compounds, calcium compounds, and chlorine compounds in the base paper to below certain values in terms of sodium, psium, and chlorine.
この場合原紙の導電率も同時に低下するが、特に５０μ
ｓ／ｃｍ以下にすることにより本発明の効果が一層発揮
できることを見いだした。In this case, the conductivity of the base paper also decreases at the same time.
It has been found that the effects of the present invention can be further exhibited by setting the thickness to s/cm or less.
本発明の発明者は各種の化合物について、原紙中の残留
化合物量と積層板に成型加工後の煮沸後電気絶縁抵抗の
関係を検討した結果原紙中に残留するナトリウムは対パ
ルプ２００ ｐｐｍ以下、カルシウムは対パルプ１００
０ ｐｐｍ以下、そして塩素は対バμプ１５０ ｐｐｍ
以下に限定することにより、極めて電気絶縁抵抗が高く
、しかも安定した抵抗値を持つ積層板を製造し得る積層
板原紙を作ることが出来ることを見出した。The inventor of the present invention investigated the relationship between the amount of residual compounds in the base paper and the electrical insulation resistance after boiling after molding into a laminate for various compounds, and found that the sodium remaining in the base paper was less than 200 ppm relative to the pulp, and the calcium is vs. pulp 100
0 ppm or less, and chlorine is 150 ppm against vapor.
It has been found that by limiting the conditions as follows, it is possible to produce a base paper for a laminate board that can produce a laminate board with extremely high electrical insulation resistance and a stable resistance value.
残留元素の測定法
１）ナトリウムおよび力ｐシウム：絶乾約３ｇの試料を
３００−ビーカーに精秤し、ＨＣＡ（１：１０）１００
ｒｎｌを加え、時計皿で蓋をし、ウォーターバス（９５
〜１００℃）中で１時間加熱した後、約２０℃に冷却す
る。その後ガラス沢過器ＩＧ２でｒ過し、熱抽出を完了
する。この抽出液を原子吸光分析にかけ、前もって各種
イオン標準液より作成した検量線から原紙中の元素量を
算出する。Measuring method for residual elements 1) Sodium and psium: Accurately weigh about 3 g of an absolutely dry sample into a 300-cm beaker, and add HCA (1:10) 100
Add rnl, cover with a watch glass, and place in a water bath (95
~100°C) for 1 hour, then cooled to about 20°C. Thereafter, it is passed through a glass filter IG2 to complete heat extraction. This extract is subjected to atomic absorption spectrometry, and the amount of elements in the base paper is calculated from a calibration curve prepared in advance from various ion standard solutions.
２）塩素
絶乾約５ｇの試料を３００ｒｎｌビーカーに精秤し、純
水１５０ゴを加えて時計皿で蓋をし、ウォーターバス（
９５〜１００℃）中で１時間加熱した後、約２０℃に冷
却する。その後、ガラス沢過器ＩＧ２で沢過し熱抽出を
完了する。この抽出液をＪＩＳ Ｋ ０１０１に記
載の吸光光度法により塩素イオン量を測定する。2) Accurately weigh approximately 5g of a sample of absolutely dry chlorine into a 300rnl beaker, add 150ml of pure water, cover with a watch glass, and place in a water bath (
95-100°C) for 1 hour, then cooled to about 20°C. Thereafter, the glass filter IG2 completes the heat extraction. The amount of chlorine ions in this extract is measured by the spectrophotometric method described in JIS K 0101.
各種イオンの除去法
前述した様に本発明の発明者は積層板の電気絶縁抵抗を
高く安定化させるためには積層板原紙中の各種元素含有
率を限定する必要のあることを見出した。Method for Removal of Various Ions As mentioned above, the inventor of the present invention has found that it is necessary to limit the content of various elements in the base paper for the laminate in order to stabilize the electrical insulation resistance of the laminate.
上記本発明を達成するだめの方法として特に制限はない
が、例えばその−例として、積層板原紙製造中に用いる
用水中の各種イオンを極力少なくすること、および洗浄
工程における洗浄を強化することが挙げられる。用水中
の各種イオンを除去する方法としては周知のイオン交換
法や蒸留法を用いることができる。またパルプ化工程や
漂白工程で薬品として添加されるイオンに関しては、洗
浄の強化により除去することが有効である。There are no particular limitations on the method for achieving the above-mentioned present invention, but examples thereof include minimizing the amount of various ions in the water used during the production of laminate board base paper, and strengthening the cleaning in the cleaning process. Can be mentioned. As a method for removing various ions in the water, well-known ion exchange methods and distillation methods can be used. In addition, it is effective to remove ions added as chemicals during the pulping process and bleaching process by strengthening washing.
以下に実施例を示し、本発明をよシ具体的に説明する。EXAMPLES The present invention will be explained in more detail with reference to Examples below.
実施例１
北海道産り材チップを原料とし、８リツターオートクン
−ブにて収率約４５チのクラフトパルプを作り、スクリ
ーンを通した後、テスト晒し装置により白色度約８０％
の原料パルプを作成した。この原料パルプを使用して、
抄紙幅３００ｍのテストマシンにより、坪量１３０ｇ／
−１ｒＬ２、厚さ２６０μの積層板原紙を抄造した。Example 1 Using wood chips produced in Hokkaido as raw materials, kraft pulp with a yield of about 45 liters was made in an 8-liter auto sieve, and after passing through a screen, the whiteness was reduced to about 80% using a test bleaching device.
The raw material pulp was created. Using this raw material pulp,
Using a test machine with a paper making width of 300 m, the basis weight was 130 g/
-1rL2, a laminate board base paper with a thickness of 260μ was made.
この時蒸解から抄造までに用いる用水として、イオン交
換水を用いた。まだこの時洗浄の程度を変化させ、表１
に示す様な残留元素量の原紙を抄造した。At this time, ion exchange water was used as the water used from cooking to papermaking. Still at this time, the degree of cleaning was varied, and Table 1
A base paper with the amount of residual elements shown in was made.
この様にして抄造した積層板原紙にフェノール樹脂（Ｐ
Ｒ９４８Ｑ、住友ベークライト社製）を重量で紙：樹脂
−１：１となる様に含浸・乾燥して、プリプレグと呼ば
れる含浸紙を作成した後、このプレプレグを８枚積層し
て加熱圧締し、積層板を製造した。この時の積層板成型
条件は、温度１５０℃、圧力９０ｋｇ／ｃｒｎ２、成型
時間１２０分間であった。Phenol resin (P
R948Q, manufactured by Sumitomo Bakelite Co., Ltd.) was impregnated and dried so that the ratio of paper:resin was 1:1 by weight to create impregnated paper called prepreg, and then 8 sheets of this prepreg were laminated and heat-pressed. A laminate was manufactured. The laminated plate molding conditions at this time were a temperature of 150°C, a pressure of 90 kg/crn2, and a molding time of 120 minutes.
この様にして製造した積層板の煮沸後電気絶縁抵抗を、
ＪＩＳ ０ ６４８１に従い測定した。結果は比較例
と共に表１に示した。The electrical insulation resistance of the laminate manufactured in this way after boiling is
Measured according to JIS 06481. The results are shown in Table 1 along with comparative examples.
表１から明らかな様に、積層板原紙中に残留する元素量
を、ナトリウム２００ ｐｐｍ 、力μシウム１１００
０ｐｐ、および塩素１５０ ｐｐｍ以下にすることによ
り、電電絶縁抵抗値の高い積層板を作ることができた。As is clear from Table 1, the amount of elements remaining in the laminated board base paper was 200 ppm for sodium and 1100 ppm for μsium.
By reducing the amount of chlorine to 0 ppm and 150 ppm or less of chlorine, it was possible to produce a laminate with high electrical insulation resistance.
比較例
実施例と全く同様にして、但し用いる用水として一般の
水道水を用いて、洗浄も極一般的条件で行い、積層板原
紙を抄造した。この積層板原紙から実施例１と全く同様
にして積層板を製造した。Comparative Example A laminated board base paper was made in exactly the same manner as in the example, except that ordinary tap water was used as the water and washing was performed under very general conditions. A laminate was produced from this laminate board base paper in exactly the same manner as in Example 1.
この様にして製造した積層板の煮沸後電気絶縁抵抗につ
いて、実施例と全く同様の測定を行った。その結果は表
１に示した。The electrical insulation resistance of the laminate thus manufactured after boiling was measured in exactly the same manner as in the examples. The results are shown in Table 1.
表１から明らかな様に、全く各種イオン除去の処理を施
さなかった比較例は、積層板原紙中に残存する各種元素
量が本発明の範囲を大きく越えて訃り、その原紙から製
造した積層板の煮沸後電気絶縁抵抗は極めて低く、本発
明の実施例に比較し明らかに見劣りのするものであった
。As is clear from Table 1, in the comparative example in which no treatment for removing various ions was performed, the amount of various elements remaining in the laminated board base paper far exceeded the range of the present invention, and the laminated board manufactured from the base paper The electrical insulation resistance of the plate after boiling was extremely low, and was clearly inferior to the examples of the present invention.
Claims (1)
の量が、重量でパルプ繊維量に対して夫々２００ｐｐｍ
以下、１０００ｐｐｍ以下及び１５０ｐｐｍ以下である
ことを特徴とする積層板原紙1. The amount of sodium, calcium and chlorine present in the base paper is 200 ppm each based on the amount of pulp fiber by weight
Hereinafter, laminated board base paper characterized by having a content of 1000 ppm or less and 150 ppm or less
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3198886A JPS62191597A (en) | 1986-02-18 | 1986-02-18 | Base paper for laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3198886A JPS62191597A (en) | 1986-02-18 | 1986-02-18 | Base paper for laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62191597A true JPS62191597A (en) | 1987-08-21 |
Family
ID=12346300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3198886A Pending JPS62191597A (en) | 1986-02-18 | 1986-02-18 | Base paper for laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62191597A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0734396A (en) * | 1993-07-15 | 1995-02-03 | Nippon Paper Ind Co Ltd | Base paper for laminated sheet |
| JPH07300791A (en) * | 1994-04-25 | 1995-11-14 | Nippon Paper Ind Co Ltd | Substratum for laminate |
| JPH07300792A (en) * | 1994-04-26 | 1995-11-14 | Nippon Paper Ind Co Ltd | Substratum for laminate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49101673A (en) * | 1973-02-07 | 1974-09-26 |
-
1986
- 1986-02-18 JP JP3198886A patent/JPS62191597A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49101673A (en) * | 1973-02-07 | 1974-09-26 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0734396A (en) * | 1993-07-15 | 1995-02-03 | Nippon Paper Ind Co Ltd | Base paper for laminated sheet |
| JPH07300791A (en) * | 1994-04-25 | 1995-11-14 | Nippon Paper Ind Co Ltd | Substratum for laminate |
| CN1073651C (en) * | 1994-04-25 | 2001-10-24 | 日本制纸株式会社 | Lanminate base stock |
| JPH07300792A (en) * | 1994-04-26 | 1995-11-14 | Nippon Paper Ind Co Ltd | Substratum for laminate |
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