JPS62168689A - Cutting method using laser beam - Google Patents
Cutting method using laser beamInfo
- Publication number
- JPS62168689A JPS62168689A JP61008562A JP856286A JPS62168689A JP S62168689 A JPS62168689 A JP S62168689A JP 61008562 A JP61008562 A JP 61008562A JP 856286 A JP856286 A JP 856286A JP S62168689 A JPS62168689 A JP S62168689A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- processed
- laser
- vertical
- torch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 16
- 239000000463 material Substances 0.000 claims abstract description 61
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000003462 Bender reaction Methods 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野:
本発明は、レーザビームを用いる切断加工におい゛C1
切断された被加工物をレーザビームの影響を受けない状
態で取出し、被加工物が損傷を受けることを防ぎ、効率
よく板状体に対する切断加工が行なえる方法に係るもの
である。[Detailed description of the invention] Industrial application field: The present invention is applicable to cutting processing using a laser beam.
The present invention relates to a method in which a cut workpiece is taken out without being affected by a laser beam, the workpiece is prevented from being damaged, and a plate-shaped body can be efficiently cut.
従来技術;
現在、レーザビームを用いる一般的な2次元の切断加ニ
ジステムでは、たとえば[プレス技術:第23巻第6号
41ベージ」に開示されるように、加工材料(被加工対
象物)を水平にして行なうのが周知手段で、載置する台
にはNCテーブルが慣用されている。いま、これを第7
図又は第8図についてみれば、加工材料(6)を水平に
セットし、上方のレーザトーチH1からレーザビーム(
2)を、照射して切断加工されていた。しかし、この従
来法は次にあげるふうな問題点があった。すなわち、(
イ)加工材料全水平状態で取扱うため、広い設置スペー
スが必要となる、
(ロ)(イ)と関連し、大面積の加工材料に対しては、
テーブルのサイズが過大になる傾向がある、(ハ)加工
材料の支持治具(たとえば尖頭をもつ小INヲ多数植設
したもの、以下剣山と称する。)が必要であり、これら
は加工材料の面域全体を支、えるために使用される。従
つC1これらは所要の強度金もったものが多数必要であ
る。また、支持治具の適当な個数は生産技術面から多様
であり、さらに加工材料の形状との関連で任意の個所に
植設できず汎用性に欠ける、
に) 第7図に示すように、たとえば剣山(3)で支持
される加工材料16)から切断処理されて製品(6)は
落下するが、アクリルのような材質の場合は落下すると
同時に製品がレーザビーム!21の照射を受は表面が傷
付けられることがある。こa’l防止するために、切断
の進み王台を見ながらタイミングをはかつ°C落下防止
又は位置ずれ防止のため、第8図に示すように適当な位
置で製品と加工材料とを保持テープ(4)等で係止し〔
いるのが現状である、
(ホ) 製品を連続的に得る場合に、レーザビームが、
たとえばテープ・し下のコンベア等の取出し機構に落下
した製品?:照射し、これらに損傷金蔓えるの全防止す
るため、加工済製品をレーザビームの照射から保護する
機能を敗出し機構にもたせる必要がある、
(へ)剣山等の支持治具にレーザビームが当ると顔部が
加熱され、熱せられた支持治具により製品(材質が合成
樹脂等のとき。)が傷付けられることがあるので、製品
の形状や大きさを充分考慮した上で支持治具の位置分設
定しなければならない。Prior art: Currently, in the general two-dimensional cutting system using a laser beam, the material to be processed (workpiece) is A well-known method is to horizontally carry out the process, and an NC table is commonly used as the stand on which it is placed. Now, this is the 7th
Referring to the figure or Fig. 8, the material to be processed (6) is set horizontally, and the laser beam (
2) was irradiated and cut. However, this conventional method has the following problems. That is, (
(b) In relation to (a), for large area processing materials,
The size of the table tends to become excessively large. (c) A supporting jig for the processed material (for example, one in which many small INs with sharp points are planted, hereinafter referred to as kenzan) is required; It is used to support the entire surface area. Accordingly, C1 requires a large number of these having the required strength and gold. In addition, the appropriate number of supporting jigs varies from the viewpoint of production technology, and furthermore, due to the shape of the material to be processed, it is not possible to plant them at arbitrary locations, resulting in a lack of versatility.2) As shown in Figure 7, For example, the product (6) falls after being cut from the workpiece 16) supported by the tsurugi (3), but in the case of a material like acrylic, the product is exposed to a laser beam at the same time as it falls! 21 irradiation, the surface may be damaged. To prevent this, check the timing while watching the progress of cutting. To prevent falling or shifting, hold the product and the processed material at appropriate positions as shown in Figure 8. Secure it with tape (4) etc.
(e) When obtaining products continuously, the laser beam
For example, a product that has fallen into a take-out mechanism such as a conveyor under the tape or a tray? : In order to completely prevent damage caused to these items by irradiation, it is necessary to provide the removal mechanism with a function to protect the processed products from laser beam irradiation. If the support jig hits the face, it will heat up and the heated support jig may damage the product (when the material is made of synthetic resin, etc.), so please carefully consider the shape and size of the product before using the support jig. The position must be set.
(ト) 加工材料を剣山等の支持治具に1度載置する
と、何かの理由で加工材料ft動かしたくても、剣山が
乱立しでいるため、水平方向に移動させ難く、剣山に手
が触れ゛〔危険である、(7)加工材料を載置するとき
、現実には持ちEげCから定位置に収卸すという迂回が
あり、ポテンシャルロスにより効率が悪い、
等につき解決が望まれ°Cいた。(g) Once the material to be processed is placed on a support jig such as a mount, even if you want to move the material for some reason, the mounts are scattered all over the place, making it difficult to move it horizontally, making it difficult to touch the mount. (7) When placing processed materials, there is actually a detour to unload them from the carrier E to a fixed position, which is inefficient due to potential loss. A solution is desired. It was °C.
発明の課題:
本発明は上記のごとき問題点全解決するためになされた
もので、切断加工でつくりだされる製品が、加工材料に
ひつ掛つ°Cいるか又はレーザビームが照射される光束
域よりも必ず下方全通つ′〔落下する状態を確保するこ
とに着目しCいる。そしC1その具体的方法として加工
材料を垂直或いは垂直に近い角度で保挿し、切断処理す
ること(il−提案するのが1郎」である。Problem to be solved by the invention: The present invention has been made to solve all of the above-mentioned problems, and the present invention is aimed at solving all of the above-mentioned problems. The focus is on ensuring that the object falls completely downward. And C1, as a concrete method, the material to be processed is held vertically or at an angle close to vertical, and then cut (il-proposed by Ichiro).
@川の構成:
従来法によれば、加工材料は水平に保持され、上方から
垂直方向に照射されるレーザビームにより切断加工され
るものを、本発明方法にあっては加工材料′f:垂直又
は垂直に近い角度で保持し、レーザトーチは水平方向を
保つご切断加工を行なうのである。加工材料とレーザビ
ームとの相対関係は、
(a) %直(垂直に近い角度も含み、以下同様とす
る。)に保持された加工材料はそのままで、レーザトー
チを目的製品の形状に従って同一平面内で移uノさせる
、
(b) レーザトーチは水平方向を保つでそのまま静
止させ、加工材料を目的製品の形状に従つて垂直面内で
移動させる、
(c)垂直に保持された加工材料を同−垂白面内で水平
に往復運動が可能な工うにし、一方、レーザトーチは垂
直方向の往復運動が可能なようにし、目的製品の形状ど
おりのパターンを加工材料面に現出させる、
(d) 加工材料とレーザトーチとの運動の相対関係
を(c)の逆にする、
04通りがある。これらの各関係のうち、切断加工の対
象となる材料の物質・組成又は厚さ等の要素或いは加工
材料に適合するレーザ発振器の容量等により、上記の4
通りの相対関係のうちから好適な態様を選択できる。@ River configuration: According to the conventional method, the workpiece is held horizontally and cut by a laser beam irradiated vertically from above, whereas in the method of the present invention, the workpiece 'f: vertically Alternatively, the laser torch is held at a nearly vertical angle and the cutting process is performed while maintaining the horizontal direction. The relative relationship between the processed material and the laser beam is as follows: (a) The laser torch is moved in the same plane according to the shape of the target product while the processed material is held vertically (including angles close to perpendicular, and the same shall apply hereinafter). (b) The laser torch remains stationary in a horizontal direction, and the material to be processed is moved in a vertical plane according to the shape of the target product. (c) The material to be processed, which is held vertically, is moved in the same direction. The laser torch is designed to be capable of reciprocating horizontally within a vertical plane, while the laser torch is capable of reciprocating vertically to create a pattern on the surface of the material to be processed in accordance with the shape of the target product. (d) Processing There are 04 ways to reverse the relative motion of the material and the laser torch to (c). Among these relationships, the above 4 depend on factors such as the substance, composition, or thickness of the material to be cut, or the capacity of the laser oscillator that is compatible with the material to be processed.
A suitable aspect can be selected from among the various relative relationships.
本発明方法では、レーザビームによる切断加工時の発生
ドロスは1部垂れ下ることもあるが、レーザトーチから
吹付けるアシストゲスの気流方向と製品の落下方向とが
直角をなし、ドロスの飛散方向が製品の移動線を回避す
ることになるので、切断処理が生成ドロスに支障される
懸念はない。In the method of the present invention, a portion of the dross generated during cutting with a laser beam may hang down, but the direction of the air flow of the assist gas blown from the laser torch and the direction in which the product falls are at right angles, and the direction in which the dross is scattered is aligned with the product. Since the movement line of the cutter is avoided, there is no concern that the cutting process will be hindered by the generated dross.
従って、一部の金属たと、tViSS41のごとき構造
用銅材でドロスが大量に出る材質の加工材料であっても
切断処理が可能である。Therefore, it is possible to cut even materials that produce a large amount of dross, such as some metals and structural copper materials such as tViSS41.
実施例:
次に本発明の具体的な1実施例を図面に基づき説す」す
る。第1図に示すように架台(10)上にレーザ発振器
(11)を載置し、投射されるレーザビーム12)は内
定ビームベンダーt121%可動ビームベンダー(1四
により屈折し、集光レンズ(I4)によジ光束を合され
て加工材料(61面上の所要個所を照射する。彌はレー
ザビーム(2)の拡散を防止する遮光パネルである。Embodiment: Next, a specific embodiment of the present invention will be explained based on the drawings. As shown in Fig. 1, a laser oscillator (11) is placed on a pedestal (10), and the projected laser beam 12) is refracted by a predetermined beam bender t121% movable beam bender (14), and is refracted by a condensing lens ( The laser beam (I4) is combined with the laser beam to irradiate a desired location on the surface of the processing material (61).The mirror is a light-shielding panel that prevents the laser beam (2) from diffusing.
そし゛C1町動ビームベンダー(18は垂直方向Mに往
復運動全可能としである。すなわち、集光レンズ14)
及びレーザトーチ(1〜は、可[IdJビームベンダー
iISの光軸上に占位するから、可動ビームベンダー;
1司の垂直運動(ト)によりレーザトーチ(1句はY軸
方向の運U)をする。また、後記のごとき適宜手段によ
り垂直に保持される加工材料16)は水平方向(ロ)に
往復運動e El能としである。すなわち、レーザトー
チ傾は相対的にX軸方向の運動をする。Then, C1 is a moving beam bender (18 is fully capable of reciprocating in the vertical direction M. In other words, the condenser lens 14)
and laser torch (1~ is possible [as it is located on the optical axis of IdJ beam bender iIS, it is a movable beam bender;
The vertical movement (g) of the first axis causes a laser torch (one line is movement U in the Y-axis direction). Further, the workpiece 16), which is held vertically by appropriate means as described later, is capable of reciprocating in the horizontal direction (b). That is, the laser torch tilt relatively moves in the X-axis direction.
従って、hJ動ビームベンダー圃のY軸運動及び状の製
品全切断することができる。Therefore, it is possible to move the Y-axis of the hJ dynamic beam bender field and to cut all shaped products.
加工材料16)の当直保持及び水平方向卸の往復運動を
円滑に行なうには、たと7tば第2図に示すような機構
を用いることができる。すなわち、ボールネジをもつ駆
動台(7)Eに、このボールネジに保合して水平方向(
6)に往復運動が可能な下部支持具間を載せCある。上
記ボールネジと係合子との組合せにより微細な往復運動
が可能な下部支持具シ1の1端には固定側支持具固金立
没し、さらしてこの固定側支持具@に対し所要の間隔を
保つ所定の位置で定立する可動側支持具@を設ける。固
定及び可動の両支持具の頂端は、共に/7’イドヘッド
μs錘に形成し、両刃゛イドヘッドに共1I11にグイ
トレール−を低める。固定側支持具機側のゲイトヘッド
(至)とグイトレール蓼勺とは固着し、可vJ(iII
J支持具内側のゲイトヘッド彌とガイドレール(財)と
は摺動可能となし、可動側支持具輸は固定側支持具(イ
)に対し、保持せんとする加工材料)6)に適応するス
パンを保つで安定した状餓で定立することができる。そ
して、同定側支n具固及び可動側支持具−にはそれぞれ
適当数のクランプ@を配設し、支保せんとする加工材料
15+ ’に緊締保持する。In order to smoothly carry out the on-duty holding of the workpiece 16) and the horizontal reciprocating movement, a mechanism such as the one shown in FIG. In other words, the drive base (7) E having a ball screw is attached to the ball screw in a horizontal direction (
6) C is equipped with a lower support that is capable of reciprocating motion. At one end of the lower support 1, which is capable of fine reciprocating motion due to the combination of the ball screw and the engager, a fixed side support is raised and recessed, and is exposed to maintain a required distance from the fixed side support @. A movable support @ is provided that stands in a predetermined position. The top ends of both the fixed and movable supports are both formed with a /7' id head μs weight, and the guide rails are lowered to 1111 on the double-edged id head. The gate head (to) on the fixed side support machine side and the guide rail are firmly attached, making it possible to
The gate head inside the J support and the guide rail are designed to be able to slide, and the movable side support is compatible with the fixed side support (A) and the processed material to be held (6). By maintaining the span, it can be established in a stable state. Then, an appropriate number of clamps are provided on each of the identification side support and the movable side support to tighten and hold the workpiece 15+' to be supported.
第3図又は第4図に例示するのは、他の実施例で、 #
、tl+台の上面に清つC往復運#J1’tする下部支
持共!211に設けた加工材料(6)の支持方式が異つ
°〔いる。第3図に示すものは、加工材料が薄板のとき
に好適で、可動側支持具■は導磁性の平板体とし、固定
側支持具との中間に撓み防止片銘をもつCいる。そして
、加工材料は可動側支持具(機及び撓み防止片(ハ)K
添わせ、マグネット四により定着保持する。第4図に示
すものは、加工材料が厚板のときに好適で、下部支持具
!21)面に長さ方向に随うVノツチ271′J&:刻
設したものである。What is illustrated in FIG. 3 or FIG. 4 is another embodiment, #
, tl + The bottom support that cleans C reciprocating #J1't on the top surface of the stand! The support method for the processed material (6) provided at 211 is different. The one shown in FIG. 3 is suitable when the material to be processed is a thin plate, and the movable side support (2) is a magnetically permeable flat plate body, and there is a deformation prevention plate (C) between the movable side support and the fixed side support. The processing material is the movable side support (machine and deflection prevention piece (c) K).
Attach it and hold it fixed with magnet 4. The one shown in Figure 4 is suitable when the material to be processed is a thick plate, and is a lower support! 21) A V-notch 271'J&: is carved along the length of the surface.
以上のように各構成要素は、加工材料の材質、厚さ等の
多様性に自在な対応が5T[であり、それら全集約した
1具体例が第5図に示されている。As mentioned above, each component is 5T[ which can be freely adapted to the variety of materials, thicknesses, etc. of processed materials, and one specific example of all of them is shown in FIG.
この装置例では、レーザ発振器(11)から投射される
レーザビームをコントロールする固定ビームベンダー+
12J 、可動ビームベンダー霞、集光レンズI等が光
学系ゲイトUηに数編められ、レーザトーチ霞は適正な
光束を保ちつつ円滑に垂直(Y軸)運動する。そして、
加工材料15)の水平(X軸)運動と協働し゛〔切断加
工処理を行ない、品質上の欠点がない製品f、得ること
ができる。In this device example, a fixed beam bender +
12J, a movable beam bender haze, a condensing lens I, etc. are arranged in the optical system gate Uη, and the laser torch haze smoothly moves vertically (Y axis) while maintaining an appropriate luminous flux. and,
By cooperating with the horizontal (X-axis) movement of the processed material 15), it is possible to perform the cutting process and obtain a product with no quality defects.
発明の作用:
被加工母材である加工材料を垂直又は垂直に近い起立角
度で保持すると共にレーザビームの投射方向は水平を保
って上記加工材料を指向させ、加工材料とレーザトーチ
とを相対的に運動させることとした本発明方法によると
きは、第6図に示すように加工材料16)から所要形状
の製品(6)をつくりだすことが可能である。すなわち
、第6図(8)に示すように、先づレーザビーム12)
を照射してピアス+71 ft穿孔し、下方に回って切
断を開始し゛〔スタートポイント(8)に達する。次い
で第6図cA)Q3)に示すように切断線(9)を形成
し、同じ<(C)に示すような製品を得ることができる
のである。Effect of the invention: The workpiece material, which is the workpiece base material, is held at a vertical or nearly vertical upright angle, and the projection direction of the laser beam is directed toward the workpiece while keeping it horizontal, so that the workpiece and the laser torch are aligned relative to each other. When using the method of the present invention in which motion is applied, it is possible to create a product (6) of a desired shape from the processed material 16), as shown in FIG. That is, as shown in FIG. 6 (8), first the laser beam 12)
pierce +71 ft, turn downward and start cutting until reaching the starting point (8). Next, a cutting line (9) is formed as shown in FIG. 6cA)Q3), and a product as shown in the same <(C) can be obtained.
発明の効果:
本発明では、加工材料を垂直又は垂直に近い角度で保持
し切断加工するので、次に挙げるような利点を有してい
る。Effects of the Invention: The present invention has the following advantages because the material to be processed is held and cut at a vertical or nearly vertical angle.
(D 具体的な装置例の設置スペースは、占有面積が最
小にできる。(D) The installation space of the specific device can be minimized in area.
■ 駆動台上に立てで保持する方式は、大面積の加工材
料に対しても、設計上の観点からは支持する駆動台の長
さを焚くするだけで済む。■ The method of holding the material vertically on a drive table only requires the length of the drive table to be supported, even when processing a large area of material, from a design standpoint.
側 加工材料の支持については、倒れ止め防止のために
、垂直又は垂直に近い角度方向の辺を支持するというだ
けで充分であるから(材料自体の重量を、面に直角な方
向で支持するという考え方ではないから。)剣山のごと
き支持治具は必要ない。As for supporting the processed material, it is sufficient to support the vertical or nearly vertical sides to prevent it from falling (supporting the weight of the material itself in a direction perpendicular to the surface) is sufficient. (This is not a way of thinking.) There is no need for a support jig like a tsurugi.
(ト) 上記の支持治具をもたないから、それの調節、
調整に要した工数が一切不要となる。(g) Since we do not have the above support jig, we cannot adjust it.
The man-hours required for adjustment are completely unnecessary.
(V) 切断後の製品は、加工材料からの除脱に際し
”Cレーザビーム中を横切ることがないから、製品を傷
付けないようにする特別な取出し機構が不要である。(V) Since the cut product does not cross the C laser beam when being removed from the processed material, there is no need for a special ejection mechanism to prevent damage to the product.
(6) 下部支持具から上部が、加工材料の大きさに合
せて適当な寸法に設定できるから、一度保持した加工材
料を微差1させる必要がない。(6) Since the upper part from the lower support can be set to an appropriate size according to the size of the workpiece, there is no need to slightly change the workpiece once held.
■ 加工材料を下部支持具上に載置するときは、押込む
という作業になり持上げる必要がない。■ When placing the processed material on the lower support, the work is done by pushing it in and there is no need to lift it.
帽 加工材料に対する切断処理は、垂直方向で考えたと
き、はぼ一平面内で加工を行なっていることになり、製
品の落下個所のコントロールがし易い。Cutting the material to be processed is performed in approximately one plane when considered in the vertical direction, making it easier to control where the product falls.
以上のごとく本発明は従来の方法に比べて、その得られ
る効果は顕著であり、産業上の利用性は大きい。As described above, the present invention has remarkable effects compared to conventional methods, and has great industrial applicability.
第1図は本発明の1実施例を示す説明図、第2図は加工
材料の保持及び水平往復運動する部分の斜視図、第3図
は加工材料の保持部の薄物に好適な実施例、第4図は加
工材料の保持部の厚物に好適な実施例、第5図は具体的
装置の1例を示す斜視図、第6図囚@(Qは加工材料か
ら製品を切断するときの切断線の進みを示す図、第7図
と第8図は従来例を示す図で第7図は保持テープを使用
する場合、第8図はレーザビームが製品を傷付ける状態
である。
ft)・・・レーザトーチ ;2)・・・レーザビ
ーム(3)・・・剣 山 (4)・・・保持
テープ(6)・・・加工材料 (6)・・製 品
(7)・・・ピ ア ス (8)・・・スター
トポイント(9)・・・切断線 (1o)・・・架
台:■)・・・レーザ発振器 a匂・・・固定ビー
ムベンダt11・・・可動ビームベンダー (14・・
・集光レンズ傾・・・遮光パネル 四・・・レー
・ザトーチαη・・・光学系ゲイト (7)・・
・駆 動 台@υ・・・下部支持具 (社)・・
・固定側支持具(2)・・・可動側支持具 (財)
・・・グイトレール四川ゲイトヘッド 弼・・
・り ラ ンプ覇・・・V/ ソチ (財)・・
・撓み防止片開用マグネットFIG. 1 is an explanatory diagram showing one embodiment of the present invention, FIG. 2 is a perspective view of a part that holds the processed material and makes horizontal reciprocating motion, and FIG. 3 is an embodiment suitable for thin objects of the holding part of the processed material. Fig. 4 shows an example of a holding part for processing material suitable for thick materials, Fig. 5 is a perspective view showing one example of a specific device, Fig. 6 Figures 7 and 8 are diagrams showing the progress of the cutting line, and Figures 7 and 8 are diagrams showing conventional examples. Figure 7 shows a case where a holding tape is used, and Figure 8 shows a state in which the laser beam damages the product. ft)・...Laser torch ;2) ...Laser beam (3) ...Kenzan (4) ...Holding tape (6) ...Processing material (6) ...Product (7) ...Pier (8)...Start point (9)...Cutting line (1o)...
Stand:■)...Laser oscillator a...Fixed beam bender t11...Movable beam bender (14...
・Condensing lens tilt... Light shielding panel 4... Laser the torch αη... Optical system gate (7)...
・Drive table @υ...lower support (company)...
・Fixed side support (2)...Movable side support (Foundation)
...Guitrail Sichuan Gate Head 2...
・Ramp victory...V/ Sochi (Foundation)...
・Magnet for single opening to prevent deflection
Claims (1)
所要の製品を切断加工する方法において; 加工材料を垂直又は垂直に近い角度で保持し、レーザト
ーチは水平方向を保つた状態とし、加工材料とレーザビ
ームとを相対的に運動させることにより所要の形状に従
つた切断線を形成して製品をつくりだすようにしたこと
を特徴とするレーザビームを用いる切断加工法。 2 加工材料を垂直又は垂直に近い角度に保持し、レー
ザトーチを目的製品の形状に従つて移動させるようにし
た特許請求の範囲第1項記載のレーザビームを用いる切
断加工法。3 レーザトーチは水平方向を保つてそのま
ま静止させ、加工材料を目的製品の形状に従つて移動さ
せるようにした特許請求の範囲第1項記載のレーザビー
ムを用いる切断加工法。 4 垂直又は垂直に近い角度で保持された加工材料を水
平方向に往復運動が可能なようにし、レーザトーチは垂
直方向の往復運動が可能なようにして目的製品の形状ど
うりのパターンを加工材料面に現出させるようにした特
許請求の範囲第1項記載のレーザビームを用いる切断加
工法。 5 垂直又は垂直に近い角度で保持された加工材料を垂
直方向に往復運動が可能なようにし、レーザトーチは水
平方向の往復運動が可能なようにして目的製品の形状ど
うりのパターンを加工材料面に現出させるようにした特
許請求の範囲第1項記載のレーザビームを用いる切断加
工法。[Claims] 1. Irradiating a laser beam to a processed material to be cut,
In a method of cutting a desired product; the material to be processed is held vertically or at an angle close to vertical, the laser torch is kept in a horizontal direction, and the desired shape is achieved by moving the material to be processed and the laser beam relative to each other. A cutting method using a laser beam, characterized in that a product is created by forming a cutting line according to the following. 2. A cutting method using a laser beam according to claim 1, in which the material to be processed is held at a vertical or near-vertical angle, and the laser torch is moved according to the shape of the target product. 3. A cutting method using a laser beam according to claim 1, wherein the laser torch remains stationary while maintaining a horizontal direction, and the material to be processed is moved according to the shape of the target product. 4. The material to be processed, which is held vertically or at a near-vertical angle, can be reciprocated in the horizontal direction, and the laser torch can be reciprocated in the vertical direction to create a pattern in the shape of the target product on the surface of the material to be processed. A cutting method using a laser beam according to claim 1, wherein the laser beam is made to appear as follows. 5 The material to be processed, which is held vertically or at a nearly vertical angle, can be reciprocated in the vertical direction, and the laser torch can be reciprocated in the horizontal direction to create a pattern in the shape of the target product on the surface of the material to be processed. A cutting method using a laser beam according to claim 1, wherein the laser beam is made to appear as follows.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61008562A JPS62168689A (en) | 1986-01-17 | 1986-01-17 | Cutting method using laser beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61008562A JPS62168689A (en) | 1986-01-17 | 1986-01-17 | Cutting method using laser beam |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62168689A true JPS62168689A (en) | 1987-07-24 |
Family
ID=11696521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61008562A Pending JPS62168689A (en) | 1986-01-17 | 1986-01-17 | Cutting method using laser beam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62168689A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04228282A (en) * | 1990-04-23 | 1992-08-18 | Bystronic Laser Ag | Method and apparatus for cutting off flat material |
WO1998040185A1 (en) * | 1997-03-12 | 1998-09-17 | Amada Company, Limited | Equipment for the laser-cutting of metal sheets |
JP2001521443A (en) * | 1997-04-24 | 2001-11-06 | 株式会社アマダ | How to cut holes in vertical plate material, especially sheet metal |
WO2010059595A2 (en) * | 2008-11-19 | 2010-05-27 | Applied Materials, Inc. | Laser-scribing tool architecture |
US8129658B2 (en) | 2009-08-06 | 2012-03-06 | Applied Materials, Inc. | Systems for thin film laser scribing devices |
-
1986
- 1986-01-17 JP JP61008562A patent/JPS62168689A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04228282A (en) * | 1990-04-23 | 1992-08-18 | Bystronic Laser Ag | Method and apparatus for cutting off flat material |
WO1998040185A1 (en) * | 1997-03-12 | 1998-09-17 | Amada Company, Limited | Equipment for the laser-cutting of metal sheets |
US6310316B1 (en) | 1997-03-12 | 2001-10-30 | Amada Company Limited | Equipment for the laser-cutting of metal sheets |
JP2001521443A (en) * | 1997-04-24 | 2001-11-06 | 株式会社アマダ | How to cut holes in vertical plate material, especially sheet metal |
WO2010059595A2 (en) * | 2008-11-19 | 2010-05-27 | Applied Materials, Inc. | Laser-scribing tool architecture |
WO2010059595A3 (en) * | 2008-11-19 | 2010-08-12 | Applied Materials, Inc. | Laser-scribing tool architecture |
US8129658B2 (en) | 2009-08-06 | 2012-03-06 | Applied Materials, Inc. | Systems for thin film laser scribing devices |
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