JPS62165994A - Electronic parts mounting apparatus - Google Patents
Electronic parts mounting apparatusInfo
- Publication number
- JPS62165994A JPS62165994A JP61008211A JP821186A JPS62165994A JP S62165994 A JPS62165994 A JP S62165994A JP 61008211 A JP61008211 A JP 61008211A JP 821186 A JP821186 A JP 821186A JP S62165994 A JPS62165994 A JP S62165994A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- suction head
- push
- electronic components
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004308 accommodation Effects 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はチップ型抵抗、チップ型積層コンデンサに代表
される電子部品を、電子回路を構成する基板上に装着す
る電子部品装着装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components such as chip resistors and chip multilayer capacitors onto a substrate constituting an electronic circuit.
従来の技術
従来、電子部品装着装置としては、特開昭56−118
698号公報に開示されているようなものが知られてい
る。Conventional technology Conventionally, as an electronic component mounting device, Japanese Patent Application Laid-Open No. 56-118
The one disclosed in Japanese Patent No. 698 is known.
その電子部品装着装置で用いられているテープ状部品集
合体Aは、第6図に示すように、テープ本体aに所定ピ
ッチで一列に多数の収容凹部すを形成し、ここに電子部
品Cを収容するとともに、テープ本体aの表面にシール
テープdを貼着して前記電子部品Cを保持するように構
成されている。As shown in FIG. 6, the tape-shaped component assembly A used in the electronic component mounting apparatus has a large number of accommodation recesses formed in a row at a predetermined pitch in the tape body a, and the electronic components C are placed in the tape body a. The electronic component C is housed therein, and a sealing tape d is attached to the surface of the tape body a to hold the electronic component C.
電子部品装着装置は、前記テープ状部品集合体Aを送り
装置qにて一方向に間欠的に送り、テープ剥離装置りに
てシールテープを剥離して巻き取り、収容凹部す内に収
容された電子部品Cを吸着ヘッドiで吸着して取り出し
、この吸着ヘッド1にて基板j上の所定位置に装着する
ように構成されている。The electronic component mounting device intermittently feeds the tape-shaped component assembly A in one direction using a feeding device q, peels and winds up the sealing tape using a tape peeling device, and stores the tape-shaped component assembly A in a housing recess. The electronic component C is suctioned and taken out by a suction head i, and is mounted on a predetermined position on a substrate j using this suction head 1.
また、シールテープdを剥離した後に、テープ状部品集
合体Aの移動により電子部品Cが動いて収容凹部す内で
不正な姿勢になったり、抜は出したりして吸着ヘッドi
による吸着が失敗するのを防止するため、収容凹部すの
開口を閉止した状態でテープ状部品集合体とともに移動
し、テープ状部品集合体の移動復元の位置に後退するよ
うにした閉止部材を設けて吸着の直前に収容凹部すを開
放するようにしたものも提案されている。Furthermore, after peeling off the seal tape d, the movement of the tape-shaped component assembly A may cause the electronic component C to move and take an incorrect posture within the housing recess, or may be pulled out of the suction head i.
In order to prevent the suction from failing due to this, a closing member is provided which moves together with the tape-shaped parts assembly while closing the opening of the accommodation recess and retreats to the position where the tape-shaped parts assembly returns to its original position. It has also been proposed that the housing recess is opened immediately before suction.
まだ、吸着ヘッド1による電子部品Cの吸着を確実にす
るため、吸着時に電子部品Cを突き上げピンで下方から
突き上げるようにしたものも提案されている。In order to ensure that the electronic component C is suctioned by the suction head 1, a device in which the electronic component C is pushed up from below using a push-up pin during suction has also been proposed.
さらに、テープ状部品集合体Aとして、収容凹部すを複
数列形成して一つのテープ状部品集合体Aに多数の電子
部品Cを収容できるようにして作業能率を高めだものも
知られている。Furthermore, there is also known a tape-shaped component assembly A that has multiple rows of storage recesses so that a large number of electronic components C can be accommodated in one tape-shaped component assembly A to improve work efficiency. .
発明が解決しようとする問題点
ところが、上記複数列の収容凹部を備えたテープ状部品
集合体を用いるよう例した電子部品装着装置において、
吸着失敗を無くすために吸着時に突き上げピンで電子部
品を突き上げるようにすると、上記のような閉止部材を
設けても複数列の収容凹部が一度に開放されることにな
り、吸着ヘッドで電子部品を吸着する時にその収容凹部
の閉止部材のみを開放して他の収容凹部は閉止部材で閉
止状態を保持したままにすることは不可能であり、他の
列の吸着動作時に突き上げピンの動作の影響を受けて電
子部品が不正な姿勢になったり、抜は出したりして、吸
着を失敗する虞れがあるという問題がある。Problems to be Solved by the Invention However, in the electronic component mounting apparatus using the tape-shaped component assembly having the plurality of rows of accommodation recesses,
If the electronic component is pushed up with a push-up pin during suction to eliminate suction failure, multiple rows of accommodation recesses will be opened at once even if the above-mentioned closing member is provided, and the suction head will not be able to pick up the electronic component. When suctioning, it is impossible to open only the closing member of the accommodation recess and keep the other accommodation recesses closed with the closing members, and the influence of the operation of the push-up pins when suctioning other rows. There is a problem in that the electronic components may become incorrectly oriented or ejected as a result of this, and there is a risk that suction may fail.
本発明は上記問題点を解消することを目的とするもので
ある。The present invention aims to solve the above problems.
問題点を解決するだめの手段
本発明は上記目的を達成するため、進行方向に対し複数
列の位置の異なる部品収容凹部内に電子部品を収容する
とともにその開口をシールテープで閉鎖したテープ状部
品集合体の移動経路に、シールテープ剥離位置を設ける
と共に前記収容凹部内の電子部品を吸着すべく下降可能
な吸着ヘッドをテープ状部品集合体の幅方向に位置変更
可能に配設し、吸着ヘッド配設位置の下方に位置する収
容四部の開口を閉じかつ開放位置に移動可能な閉止部材
を収容凹部に対応させて配設するとともに、テープ状部
品集合体の下方にこれら各収容凹部内の電子部品を突き
上げる突き上げピンをそれぞれ配設し、吸着ヘッドの下
降と、収容凹部の閉止部材の開放位置への移動と、この
収容凹部に対向する突上げピンの作動とを連動させたこ
とを特徴とするものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a tape-shaped component in which electronic components are accommodated in component-accommodating recesses in multiple rows at different positions with respect to the traveling direction, and the openings are closed with sealing tape. A seal tape peeling position is provided on the moving path of the assembly, and a suction head that can be lowered to suction the electronic components in the housing recess is disposed so that its position can be changed in the width direction of the tape-shaped component assembly. Closing members that can close the openings of the four housing parts located below the installation position and move to the open position are arranged corresponding to the housing recesses, and the electronics in each of these housing recesses are placed below the tape-shaped component assembly. The device is characterized in that push-up pins are provided to push up the parts, and the lowering of the suction head, the movement of the closing member of the accommodation recess to the open position, and the operation of the push-up pins facing the accommodation recess are linked. It is something to do.
作 用
本発明は上記した構成を有するので、進行方向に対し複
数列の位tMの異なる収容凹部を備えたテープ状部品集
合体を用いて電子部品を装着する際て、吸着ヘッドが対
向した収容凹部の開口のみを、吸着ヘッドが下降して吸
着する前に開放することができ、他の列の収容凹部は閉
止部材で閉止した状態に保持でき、吸着動作時に確実に
吸着できるように突き上げピンで電子部品を下方から突
き上げても他の列の電子部品が不測に動いて不正な姿勢
になったり、抜は出したりすることがなく、吸着失敗を
生ずる虞れが無くなる。Operation Since the present invention has the above-described configuration, when mounting an electronic component using a tape-shaped component assembly provided with a plurality of rows of housing recesses with different numbers of tM in the direction of travel, the suction head is placed in the housing where the suction head faces the Only the opening of the recess can be opened before the suction head descends to pick up the suction, and the accommodation recesses in the other rows can be kept closed with a closing member. Even if an electronic component is pushed up from below, electronic components in other rows will not move unexpectedly and take an incorrect posture or be pulled out, eliminating the risk of suction failure.
実施例
以下、本発明の一実施例について、第1図〜第6図を参
照しながら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 6.
この電子部品装着装置で用いるテープ状部品集合体1は
、第5図に示すように、保持テープ2に電子部品を収容
する多数の収容凹部3が幅方向に所定ピッチで3列状に
形成されるとともに、テープ長と方向にも所定ピッチで
形成されている。保持テープ2の両側縁部に多数の送り
穴4が所定ピッチで形成されており、この保持テープ2
の収容凹部3内に電子部品P(図示せず。第3図を参照
。)を収容した後、保持チーブ2の上面に3列の収容凹
部3の開口を閉鎖するようにシールテープ6を貼着して
構成されている。また前記保持テープ2は、第3図に示
すように、収容凹部3を形成する貫通孔を穿設された厚
肉のテープ本体2aと収容凹部3の底壁を形成するよう
にテープ本体2aの下面に貼着された薄い支持テープ2
bとから構成されている。As shown in FIG. 5, the tape-shaped component assembly 1 used in this electronic component mounting apparatus has a holding tape 2 in which a large number of accommodating recesses 3 for accommodating electronic components are formed in three rows at a predetermined pitch in the width direction. At the same time, the tape length and direction are also formed at a predetermined pitch. A large number of perforations 4 are formed at a predetermined pitch on both side edges of the holding tape 2.
After storing electronic components P (not shown, see FIG. 3) in the housing recesses 3 of the holding tube 2, a sealing tape 6 is pasted on the upper surface of the holding tube 2 so as to close the openings of the three rows of housing recesses 3. It is made up of clothes. Further, as shown in FIG. 3, the holding tape 2 has a thick tape body 2a formed with a through hole that forms a housing recess 3, and a tape body 2a that forms a bottom wall of the housing recess 3. Thin support tape 2 attached to the bottom surface
It is composed of b.
このテープ状部品集合体1は、第1図及び第2図に示す
ような電子部品装着装置にセットされる。This tape-shaped component assembly 1 is set in an electronic component mounting apparatus as shown in FIGS. 1 and 2.
この電子部品装着装置は、前記送り穴4に係合する歯輪
7を備えた送り装置6と、前記シールテープ6を押え板
9の前方位置で剥離して巻き取るテープ剥離装置8と、
前記収容凹部3内の電子部品を吸着してピックアップし
、図外のプリント基板の所定位置に装着する吸着ヘッド
10とを備えている。This electronic component mounting device includes a feeding device 6 equipped with a gear ring 7 that engages with the feeding hole 4, a tape peeling device 8 that peels off the seal tape 6 at a position in front of a presser plate 9, and winds it up.
It includes a suction head 10 that suctions and picks up the electronic components in the housing recess 3 and attaches them to a predetermined position on a printed circuit board (not shown).
前記吸着ヘッド10の配置位置と前記シールテープ5の
剥離位置との間にはテープ状部品集合体1の上面を覆う
被覆板11が配設され、テープ状部品集合体1の移動時
に電子部品Pが抜は出さないように送り装置6の1回の
送り動作でテープ集合体1の長手方向に1個の部品収容
部3しか被覆板11から前に出ないようにしている。A cover plate 11 that covers the upper surface of the tape-shaped component assembly 1 is disposed between the placement position of the suction head 10 and the peeling position of the seal tape 5, and the electronic component P is disposed when the tape-shaped component assembly 1 is moved. In order to prevent the parts from being pulled out, only one component accommodating part 3 comes forward from the covering plate 11 in the longitudinal direction of the tape assembly 1 in one feeding operation of the feeding device 6.
前記吸着ヘッド10は各列の収容凹部3の上方に対向位
置し得るようにテープ状部品集合体10幅方向に位置変
更可能に構成されている。また、テープ状部品集合体1
の下方には、前記吸着ヘッド1oに対向位置するととも
に連動して移動するシリンダ装置やンレノイドなどの押
上げ手段12が配設されている。前記被覆板11の前部
、即ち吸着ヘッド10配置位置下方には前記収容凹部3
の開口を閉じる閉止部材13が収容凹部3の幅方向全て
を覆うように設け、かつ前記被覆板11に形成されたス
リット14内に進入した開放位置に移動し得るようにそ
れぞれシリンダ装置15に連結支持されている。また、
テープ状部品集合体1と前記押上げ手段12との間には
各列の収容凹部3に対向位置して3本の突き上げピン1
6が支持ブロック17にて上昇可能に支持されており、
前記押上げ手段12にて各別に突き上げ可能に構成され
ている。18は、送り装置6部分における保持テープ2
のガイドである。The suction head 10 is configured so that its position can be changed in the width direction of the tape-shaped component assembly 10 so that it can be positioned facing above the accommodation recesses 3 of each row. In addition, tape-shaped parts assembly 1
A push-up means 12, such as a cylinder device or a renoid, is disposed below the suction head 1o and moves in conjunction with the suction head 1o. The accommodation recess 3 is located in the front part of the covering plate 11, that is, below the placement position of the suction head 10.
Closing members 13 for closing the openings of the housing recesses 3 are provided so as to cover the entire width direction of the housing recesses 3, and are connected to the cylinder devices 15 so as to be movable to the open position in which they enter into the slits 14 formed in the covering plate 11. Supported. Also,
Between the tape-shaped component assembly 1 and the pushing-up means 12, there are three push-up pins 1 located opposite to the accommodation recesses 3 of each row.
6 is supported by a support block 17 so as to be able to rise,
It is constructed so that each can be pushed up individually by the pushing up means 12. 18 is the holding tape 2 in the feeding device 6 part.
This is a guide.
以上の構成において、テープ状部品集合体1は、送り装
置6によって第2図の矢印方向に1ピツチずつ間欠移動
される。その移動する間にまずテープ剥離装置8でシー
ルテープ5が剥離された後、被覆板11の下を通過して
吸着ヘッド10の下方位置に達する。前記送り装置6は
各収容凹部3が吸着ヘッド1oの下方位置で順次停止す
るように制御される。前記間欠移動時には、収容凹部3
の開口は閉止部材13VCで閉じられているので内部の
電子部品Pは確実に保持される。テープ状部品集合体1
が停止すると、吸着ヘッド10の下方に位置する3列の
収容凹部3の内、電子部品Pを取り出すべき任意の収容
凹部3に対向位置するように吸着ヘッド10が移動し、
それと同時に押上げ手段12もその収容凹部3に対向す
る突上げピン16の下方位置に移動する。次いで、第3
図に矢視で示すように、吸着ヘッド1oの下降に先立つ
て閉止部材13がシリンダ装置15にて開放位置に移動
し、続いて吸着ヘッド1Qが下降するとともに押上げ手
段12が作動して突上げピン16が上昇し、第3図の状
態から第4図に示すように、収容凹部3内の電子部品6
が吸着ヘッド10にて吸着されるとともに突上げピン1
6が収容凹部3の底壁を貫通して電子部品Pを押し上げ
、電子部品Pが吸着ヘッド10に確実に吸着されるよう
にする。こうして、電子部品Pは吸着ヘッド10にてピ
ックアップされ、この吸着ヘッド10にて図外のプリン
ト基板に装着される。電子部品Pを取り出された保持テ
ープ2は順次送り装置6の歯輪7に巻き付いてテープ状
部品集合体1を移動駆動する手用を果たすとともに反転
し、ガイド18に沿って図外の適宜切断装置に向かって
移動し、切断されて廃棄される。In the above configuration, the tape-like component assembly 1 is intermittently moved one pitch at a time in the direction of the arrow in FIG. 2 by the feeding device 6. During the movement, the seal tape 5 is first peeled off by the tape peeling device 8, and then passes under the cover plate 11 to reach a position below the suction head 10. The feeding device 6 is controlled so that each housing recess 3 sequentially stops at a position below the suction head 1o. During the intermittent movement, the housing recess 3
Since the opening is closed by the closing member 13VC, the electronic component P inside is securely held. Tape-shaped parts assembly 1
When the suction head 10 stops, the suction head 10 moves so as to be positioned opposite to any one of the three rows of accommodation recesses 3 from which the electronic component P is to be taken out.
At the same time, the push-up means 12 also moves to a position below the push-up pin 16 facing the housing recess 3 thereof. Then the third
As shown by the arrow in the figure, before the suction head 1o is lowered, the closing member 13 is moved to the open position by the cylinder device 15, and then the suction head 1Q is lowered and the push-up means 12 is activated to push the suction head 1o downward. The raising pin 16 rises, and the electronic component 6 in the housing recess 3 moves from the state shown in FIG. 3 to the state shown in FIG.
is sucked by the suction head 10 and the push-up pin 1
6 penetrates the bottom wall of the accommodation recess 3 and pushes up the electronic component P, so that the electronic component P is reliably attracted to the suction head 10. In this way, the electronic component P is picked up by the suction head 10, and mounted on a printed circuit board (not shown) by the suction head 10. The holding tape 2 from which the electronic components P have been taken out is sequentially wrapped around the gears 7 of the feeding device 6 to move and drive the tape-like component assembly 1, and is then reversed and cut as appropriate (not shown) along the guide 18. It travels towards the device and is cut and discarded.
本発明は上記実施例だ限定されるものではなく、種々に
変更して実施することが可能である。例えば、上記実施
例では複数の突き上げピン1θを上昇可能に配設し、吸
着ヘッド1oと連動して移動する押上げ手段12で突き
上げピン16を各別に動作させるようにしだが、各突き
−1こげピンゴロにそれぞれ、小動手段を設けて吸着ヘ
ッド10に対向する突き上げピン16を作動させるよう
にしてもよい。The present invention is not limited to the above embodiments, and can be implemented with various modifications. For example, in the embodiment described above, a plurality of push-up pins 1θ are arranged so as to be able to rise, and the push-up pins 16 are individually operated by the push-up means 12 that moves in conjunction with the suction head 1o. Each of the pin rollers may be provided with a small movement means to operate the push-up pin 16 facing the suction head 10.
発明の効果
本発明の電子部品装着装置によれば、以上のように複数
列の収容凹部を備えたテープ状部品集合体を用いるので
、1巻のテープ状部品集合体で、従来に比べ多数の電子
部品を保持できて、作業能率が向上し、また吸着動作時
に突き上げピンで収容凹部の底壁を突き破って電子部品
を下方から突き上げるようにしているので、電子部品を
吸着ヘッドで確実に吸着することができ、1回の送りで
1個の部品収容凹部の開口のみを開放することができ、
他の列の収容凹部は被覆板で閉止した状態に保持されて
いるので、上記のように突き上げピンで電子部品を突き
上げるようにしても他の列の電子部品が不測に動いて不
正な姿勢になったり、抜は出しだりすることがなく、吸
着失敗を生じる虞れがなくなり、又テープ状部品集合体
の移動時にも電子部品を収容凹部内に確実に保持できる
等、犬なる効果を発揮する。Effects of the Invention According to the electronic component mounting apparatus of the present invention, since a tape-shaped component assembly having multiple rows of accommodation recesses is used as described above, a large number of tape-shaped component assemblies can be mounted with one roll of the tape-shaped component assembly compared to the conventional method. It can hold electronic components, improving work efficiency, and during suction operation, the push-up pin breaks through the bottom wall of the storage recess and pushes up the electronic components from below, so electronic components can be reliably picked up by the suction head. It is possible to open only one component storage recess in one feeding,
The accommodation recesses in other rows are held closed by cover plates, so even if you try to push up the electronic components with the push-up pin as described above, the electronic components in other rows will move unexpectedly and become incorrectly positioned. There is no risk of suction failure as there is no possibility of the electronic parts being stuck or pulled out, and the electronic parts can be reliably held in the housing recess even when the tape-shaped parts assembly is moved. .
第1図は本発明の一実施例の要部斜視図、第2図は同全
体構成を示す部分断面概略正面図、第3図及び第4図は
要部の動作説明図、第5図はテープ状部品集合体の平面
図、第6図は従来例における部品装着機の部分断面正面
図である。
1・・・・・・テープ状部品集合体、3・・・・・・収
容凹部、5・・・・・・シールデープ、1o・・・・・
・吸着ヘッド、13・・・・・・閉止部材、16・・・
・・・突き上げピン、P・・・・・・電子部品。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名g4
1図
第2図Fig. 1 is a perspective view of the main parts of an embodiment of the present invention, Fig. 2 is a partially cross-sectional schematic front view showing the overall configuration, Figs. 3 and 4 are operational explanatory diagrams of the main parts, and Fig. 5 is FIG. 6 is a plan view of the tape-shaped component assembly, and a partially sectional front view of a conventional component mounting machine. 1...Tape-shaped parts assembly, 3...Accommodating recess, 5...Seal tape, 1o...
- Suction head, 13... Closing member, 16...
...Push-up pin, P...Electronic component. Name of agent: Patent attorney Toshio Nakao and 1 other person G4
Figure 1 Figure 2
Claims (1)
、電子部品を収容するとともに、その開口をシールテー
プで閉鎖したテープ状部品集合体の移動経路に、シール
テープ剥離位置を設けると共に、前記収容凹部内の電子
部品を吸着すべく上下動可能な吸着ヘッドをテープ状部
品集合体の幅方向に位置変更可能に配設し、吸着ヘッド
配設位置の下方に複列の位置の異なる部品収容凹部の開
口を閉じかつ開放位置に移動可能な閉止部材を設けると
ともに、テープ状部品集合体の下方にこれら各収容凹部
内の電子部品を突き上げる、突き上げピンをそれぞれ配
設し、前記吸着ヘッドの下降と、閉止部材の開放位置へ
の移動と、この収容凹部に対向する突き上げピンの作動
とを連動させたことを特徴とする電子部品装着装置。A sealing tape peeling position is provided in the moving path of a tape-shaped component assembly in which electronic components are accommodated in component housing recesses provided in multiple rows in the direction of travel, and the openings thereof are closed with sealing tape. A suction head that can move up and down to suction the electronic components in the storage recess is arranged so that its position can be changed in the width direction of the tape-shaped component assembly, and components are accommodated at different positions in double rows below the suction head placement position. A closing member that closes the opening of the recess and is movable to the open position is provided, and push-up pins are provided below the tape-shaped component assembly to push up the electronic components in each accommodation recess, and the suction head is lowered. An electronic component mounting device characterized in that the movement of the closing member to the open position and the operation of a push-up pin facing the accommodation recess are linked.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61008211A JPS62165994A (en) | 1986-01-17 | 1986-01-17 | Electronic parts mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61008211A JPS62165994A (en) | 1986-01-17 | 1986-01-17 | Electronic parts mounting apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62165994A true JPS62165994A (en) | 1987-07-22 |
Family
ID=11686902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61008211A Pending JPS62165994A (en) | 1986-01-17 | 1986-01-17 | Electronic parts mounting apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62165994A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117297A (en) * | 1982-12-24 | 1984-07-06 | 松下電工株式会社 | Device for supplying synthetic resin molded part |
JPS6024100A (en) * | 1983-07-19 | 1985-02-06 | 松下電器産業株式会社 | Electronic part mounting device |
-
1986
- 1986-01-17 JP JP61008211A patent/JPS62165994A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117297A (en) * | 1982-12-24 | 1984-07-06 | 松下電工株式会社 | Device for supplying synthetic resin molded part |
JPS6024100A (en) * | 1983-07-19 | 1985-02-06 | 松下電器産業株式会社 | Electronic part mounting device |
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