JPS62164892A - Liquid flow type plating method - Google Patents

Abstract

PURPOSE:To considerably increase the plating speed in a plating liquid and to obtain plating having high quality by ejecting the plating liquid flow from below to above in a liquid pipe line in the stage of disposing a belt-like body in the liquid pipe line in a plating cell formed by a wall surface and plating said body. CONSTITUTION:The upper plating cell 1 is disposed above the lower plating cell 4 and the liquid pipe line 3 is perpendicularly provided in the lower plating cell 1. The upper part thereof is disposed in the upper plating cell 1 through the bottom of the upper plating cell 1. The belt-like body 6 is disposed in the liquid pipe line 3 formed by the wall surface 30. The plating liquid in the lower plating cell 4 flows from above to below in the liquid pipe line 3 through the bottom 8 of the liquid pipe line to form the plating flow 13 when a pump 9 is operated. The belt-like body 6 is thereupon moved in the direction approximately perpendicular to the plating liquid flow 13 by which the belt-like body 6 is plated.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、帯状体のめっき方法に関し、特に液流を用い
て高品質、高速度なめっきを行うことのできる液流式め
っき方法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for plating a strip, and more particularly to a liquid flow plating method that can perform high-quality, high-speed plating using a liquid flow.

〈従来の技術〉 従来、帯状導体などの全面めっき又はストライブ状部分
めっきでは、被めっき処理物をほとんどめっき槽中を段
積走行させてめっきする方法や、液をわずかに噴流させ
てめっきする方法が行わ九ているが、それでもめつき速
度の向上には限界がある。めっき速度を上げるため、め
っき電流密度を増加していくと、それがある値以・上に
なるとめっき品質が劣化し、実用できなくなる限界電流
密度が存在する。<Conventional technology> Conventionally, in full-surface plating or stripe-like partial plating of strip-shaped conductors, etc., there have been methods in which most of the objects to be plated are moved through a plating tank in a stacked manner, or plating is carried out by slightly jetting a liquid. Although nine methods have been used, there are still limits to the improvement of plating speed. When the plating current density is increased in order to increase the plating speed, there is a limit current density at which the plating quality deteriorates and becomes unpractical when it exceeds a certain value.

この限界電流密度を向上する一つの方法として、被めっ
き面にめっき液を高速で吹き付けて攪拌する方法がある
が、ある程度以上広いめっき面になるとめっき液を全面
均一に攪拌することが困難となり、めっきむらを生じた
り、部分的に品質不良個所を生じたりする。One method to improve this critical current density is to spray the plating solution onto the surface to be plated at high speed and stir it, but if the plating surface is larger than a certain extent, it becomes difficult to stir the plating solution uniformly over the entire surface. This may cause uneven plating or partial quality defects.

とくに、帯状導体などの全面めっき又は、ストライブ状
部分めっきなどでは、液中でのめっき液の攪拌効果を上
げるために、一般的に一定形状を有するノズル孔（例え
ば、パイプの長手方向に一定ピッチであけられた孔）か
らめっき液を被めっき物に対して噴射する方法などが採
られている。In particular, in the case of full-surface plating or stripe-like partial plating of strip-shaped conductors, etc., in order to improve the stirring effect of the plating solution in the solution, the nozzle hole generally has a certain shape (for example, the nozzle hole is fixed in the longitudinal direction of the pipe). Methods such as spraying the plating solution onto the object to be plated through holes (holes made with pitch) have been adopted.

この液中噴射方式によると、めっき液の直接当たる部分
では攪拌効果が得られるため、限界電流密度を上げるこ
とができるが、被めっき物の長手方向についてみた場合
、噴射の当たる部分と当たらない部分の差ができやすく
、攪拌が規則性を伴って不均一になりやすい。したがっ
て、めっき面積か広くなってもめっき液を全面均一に攪
拌でき、めっきむらを生ぜず限界電流密度を向上するこ
とかできる高速めっきの開発が切望されている。According to this submerged injection method, the limiting current density can be increased because a stirring effect is obtained in the part that is directly hit by the plating solution, but when looking in the longitudinal direction of the object to be plated, the parts that are hit by the spray and the parts that are not hit by the plating solution are Differences in the temperature are likely to occur, and stirring tends to become irregular and uneven. Therefore, there is a strong need for the development of high-speed plating that can uniformly stir the plating solution over the entire surface even if the plating area is large, and that can improve the critical current density without causing uneven plating.

これらの諸問題を解決することができる高速めっき法と
して、本出願人は、すでに液流下式めっき方法（特願昭
５９−１１８６８２″＋）を出願した。このめっき方法
は、液流下式であるため、めっき面積が広くなっても、
帯状体の長さ方向に対してめっき液を全面均一に攪拌で
き、めっきむらを生ぜず限界電流密度を向上することが
できる有効なめっき方法の一つであるが、次のような問
題点も持っている。As a high-speed plating method that can solve these problems, the present applicant has already applied for a liquid flow plating method (Japanese Patent Application No. 118682/1983).This plating method is a liquid flow type plating method. Therefore, even if the plating area becomes larger,
It is an effective plating method that can uniformly stir the plating solution over the entire surface in the length direction of the strip, preventing uneven plating and improving the limiting current density, but it also has the following problems: have.

すなわち、液流下方式で高速めっき液流を得るためには
、ヘッド差を大きく取る必要があるのて、めっき槽の構
造が、従来の浸漬法に比べて大きくなりめっき液量が増
える。また、めっき液の流速が早くなると上部めっき槽
液面からの空気の巻き込みが増え、めっき液の劣化およ
びめっき品質に悪影響を及ぼしやすい欠点も持ちあわせ
ている。That is, in order to obtain a high-speed plating liquid flow using the liquid flow method, it is necessary to have a large head difference, so the structure of the plating tank is larger than that in the conventional immersion method, and the amount of plating liquid increases. In addition, when the flow rate of the plating solution increases, air entrainment from the liquid level of the upper plating tank increases, which has the disadvantage that it tends to deteriorate the plating solution and adversely affect the quality of the plating.

〈発明が解決しようとする問題点〉 本発明の目的は、前記した従来技術の欠点を解消し、液
中でのめっき速度を大幅に増加させ、高品質なめっきを
得ることができる新規な液流式めっき方法を提供するこ
とにある。<Problems to be Solved by the Invention> The purpose of the present invention is to solve the above-mentioned drawbacks of the prior art, and to provide a new liquid that can significantly increase the plating speed in liquid and obtain high-quality plating. The object of the present invention is to provide a flow plating method.

く問題点を解決するための手段〉 本発明は、帯状体を、壁面によって形成されるめっき槽
内の液管路中に配置してめっきを行うに際し、１１１記
液管路中のめっき液流が下方より上方に向って流れるも
のであり、このめっき液流に対して首記帯状体をほぼ直
角をなす方向に移動させることを特徴とする液流式めっ
き方法を提供するものである。Means for Solving the Problems> The present invention provides a method for reducing the plating solution flow in the liquid pipe described in 111 when plating is performed by disposing a strip in a liquid pipe in a plating tank formed by a wall surface. The purpose of the present invention is to provide a liquid plating method characterized in that the plating solution flows from the bottom to the top, and the band-like body is moved in a direction substantially perpendicular to the flow of the plating solution.

〈発明の構成〉 以下に、本発明を図面に示す好適実施例について説明す
る。<Configuration of the Invention> Below, preferred embodiments of the present invention shown in the drawings will be described.

本発明方法は、第１図に示す装置に限らず、帯状体の被
めっき物が、下方より上方に向って流れるめっき液流中
に、被めっき面をめっき液流に対してほぼ直角をなす方
向に移動させるものであればいかなるものでもよい。The method of the present invention is not limited to the apparatus shown in FIG. Any device that moves in any direction may be used.

第１図に示す装置は、帯状体６を壁面３０によって形成
される液管路３中に配置してめっき処理を行うものであ
る。The apparatus shown in FIG. 1 performs plating by disposing a strip 6 in a liquid pipe 3 formed by a wall surface 30.

液管路３は重置方向に設置され、液管路３中のめっき液
は、上方より上方に向って流れるめっき液流１３を有す
る。The liquid pipe line 3 is installed in the stacking direction, and the plating solution in the liquid line 3 has a plating liquid flow 13 flowing upwardly.

めっき液流１３は以−ドのようにして形成される。The plating solution flow 13 is formed as follows.

下部めっき槽４の上部に、上部めっき槽１を配設する。An upper plating tank 1 is arranged above the lower plating tank 4.

液管路３は、下１■めっき槽４内に屯直に設けられ、液
管路３の上部はト１１５めっき槽１の底をＬ′ｉ通して
に部めっき槽１内に配設される。べつに上部めっき梢ｌ
の底と下部めっきＭｇ４の間は、パイプ５によって流体
連通している。下部めっき槽４の底部は、めっき槽外の
適切な位置に置かれたポンプ９と流体連通しており、ポ
ンプ９からめっき液供給バイブが下部めっき槽４中を経
て液管路底部８からパイプ１０を経てめっき液を供給す
る。The liquid pipe line 3 is installed vertically in the lower part plating tank 4, and the upper part of the liquid pipe line 3 is arranged in the lower part plating tank 1 through L'i through the bottom of the plating tank 1. Ru. Top plated top
A pipe 5 provides fluid communication between the bottom of the plate and the lower plated Mg4. The bottom of the lower plating tank 4 is in fluid communication with a pump 9 placed at a suitable position outside the plating tank, and a plating solution supply vibe is sent from the pump 9 through the lower plating tank 4 and from the bottom 8 of the liquid pipe to a pipe. The plating solution is supplied through step 10.

このような構成とすることにより、下部めっきＭｇ４内
のめっき液は流路を経てポンプ９で加圧され、めっき液
供給パイプｌＯを通って、液管路底部８を経て、液管路
３中を下から上へ流れ、めっき液流１３となる。めっき
液流１３は、液管路３最上部に達し、オーバーフローし
て、上部めっき糟１中に流れ落ちる。上部めっきＭｌ中
のめっき液は、バイブ５を通して、下部めっき槽４中に
さらに流れ落ちる。以上のめっき液流がくり返され、液
管路３中のめっき液流１３が形成される。With this configuration, the plating solution in the lower plating Mg4 passes through the flow path, is pressurized by the pump 9, passes through the plating solution supply pipe IO, passes through the bottom part 8 of the liquid pipe path, and then enters the liquid pipe path 3. flows from bottom to top, forming plating solution flow 13. The plating solution stream 13 reaches the top of the solution line 3, overflows and flows down into the upper plating bath 1. The plating solution in the upper plating Ml passes through the vibrator 5 and further flows down into the lower plating tank 4. The above plating solution flow is repeated to form a plating solution flow 13 in the solution pipe 3.

上部めっき槽ｉ中のめっき液面２のレヘルは、液管路３
最上部より下位にあるが、めっき液面２からバイブ５へ
空気を巻き込まないような充分なめつき液ｉ１を保持す
るレベルとすることが好ましい。The level of the plating liquid level 2 in the upper plating tank i is the liquid pipe line 3.
Although it is below the top, it is preferably at a level that holds enough plating liquid i1 to prevent air from being drawn into the vibrator 5 from the plating liquid level 2.

めっき液流１３の形成は、強；Ｉｔ（Ｊ流動させる方式
であればいかなるものであってもよく、第１図に示すポ
ンプ９以外の圧力装置を用いるものであ）てもよい。The plating solution flow 13 may be formed by any method as long as it has a strong flow, and may use a pressure device other than the pump 9 shown in FIG. 1.

めっき液流１３の流速は、層流でも噴出流であってもよ
いが、被めっき処理物の種類、大きさ、めっきの種類、
めっき条件によって適切に選択される。The flow rate of the plating solution flow 13 may be a laminar flow or a jet flow, but it depends on the type and size of the object to be plated, the type of plating,
Appropriately selected depending on plating conditions.

めっき液流１３が下方から上方へ流れることにより、め
っき液中の気泡およびガスなどが排出されやすくなり、
高電流密度でめっきすることができる。As the plating solution flow 13 flows from below to above, bubbles, gas, etc. in the plating solution are easily discharged.
Can be plated at high current density.

帯状体６は、めっき面がめつき液流１３の流れ方向に対
してほぼ水平となるよう、かつめっき液流に対してほぼ
直角方向に移動するように配置される。めっき液流がめ
つき面に対してほぼ平行に流れると、めっき面に対して
めっき液の均一な高速流を容易に得ることが可能となる
。The strip 6 is arranged so that the plating surface is substantially horizontal to the flow direction of the plating liquid flow 13 and moves in a direction substantially perpendicular to the plating liquid flow. When the plating solution flows substantially parallel to the plating surface, it becomes possible to easily obtain a uniform high-speed flow of the plating solution toward the plating surface.

本発明では、さらに帯状体６が液管路３中をめっき液流
に対してほぼ直角方向に移動する構成とする。In the present invention, the belt-like body 6 is further configured to move in the liquid pipe 3 in a direction substantially perpendicular to the flow of the plating liquid.

すなわち帯状体６は第１図の紙面に取直方向に移動しつ
つめっきされる。このためめっき液中でのめっき速度は
さらに増大し、均一にめっきすることができる。In other words, the strip 6 is plated while moving in the direction perpendicular to the paper surface of FIG. Therefore, the plating speed in the plating solution is further increased, and uniform plating can be achieved.

陽Ｖｉ７は、帯状体６とめっき液流１３を挾んで対向す
る位置に配設するのが良い。It is preferable that the positive Vi7 be disposed at a position facing the band-shaped body 6 and the plating solution flow 13 between them.

帯状体６は、第２ａ図に示すようにマスキングテープ１
２でマスキングされ、被めっき部１１がめつき液に対し
て露出している帯状体の片側面のみにめっきされるもの
であってもよいし、第２ｂ図に示すように片面めっきの
帯状体を非めっき面をあわせて配設した、いわゆる２条
取りストライブめっき物であってもよい。また第２Ｃ図
に示すように全面めっきされる帯状体であってもよい。The strip 6 is covered with masking tape 1 as shown in FIG. 2a.
2 may be masked and plated only on one side of the strip where the part to be plated 11 is exposed to the plating solution, or as shown in FIG. 2b, the strip may be plated on one side. It may be a so-called two-stripe plated product in which the non-plated surfaces are arranged together. Alternatively, as shown in FIG. 2C, the entire surface may be plated.

〈実施例〉 第１図に示す装置を用いて、６６ｍｍｘ０．５　Ｌ　ｍ
ｍの全面ニッケルめっき材の帯状体にマスキングテープ
を用いて第２ａ図に示すような銀部分めっきを行った。<Example> Using the apparatus shown in Fig. 1, a 66 mm x 0.5 L m
Silver partial plating as shown in FIG. 2a was carried out on a strip of the entire surface of the nickel-plated material with masking tape.

めっき液は銀めっきを用い、めっき液流速は２．０〜４
．０　ｍ／ｓｅｃであった。電流密度３〇八／ｄｒｎ”
の高電流密度でも外観の良好な銀部分めっきが得られた
。The plating solution used was silver plating, and the plating solution flow rate was 2.0 to 4.
．． It was 0 m/sec. Current density 308/drn”
Silver partial plating with good appearance was obtained even at a high current density of .

〈発明の効果〉 本発明方法は、めっき液流を下方から上方に向けて噴出
させるので、めっき液面ヘッド差を利用した液流下式の
欠点である ■液面からの空気の巻込みによるめっき液の劣化 ■ガスの発生 ■めっきむら などがなくなり、めっき流速に；ｉ１１限を受けること
なく、高品質の帯状体を高速度でめっきすることが可能
である。<Effects of the Invention> Since the method of the present invention jets out the plating solution flow from below to above, it eliminates the drawbacks of the downward plating method that utilizes the difference in the plating solution level. Deterioration of liquid, generation of gas, uneven plating, etc. are eliminated, and it is possible to plate high-quality strips at high speed without being subject to limitations on plating flow rate.

また、液管路中で、帯状体のめっき面をめっき液流とほ
ぼゝト行になるよう配置し、帯状体をめっき液流に対し
てほぼ直角方向に移動させるので、被めっき面に対して
均一な高速流を容易に得ることが可能となり、均一な高
速めっきか得られ、その効果は大きい。In addition, the plating surface of the strip is placed in the liquid pipeline so that it is almost in line with the flow of the plating solution, and the strip is moved in a direction almost perpendicular to the flow of the plating solution. This makes it possible to easily obtain a uniform high-speed flow, resulting in uniform high-speed plating, which is highly effective.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明のめっき方法の概要を示す断面図であ
る。 第２図は、帯状体の概要を示す断面図である。 符号の説明 １・・・上部めっき槽、２・・・めっき液面、３・・・
液管路　、４・・・下部めっき梢、５・・−バイブ、６
・・・帯状体、７・・・陽極、８・・・液管路底部、９
・・・ポンプ、１０・・・めっき液供給バイブ、１１・
・・被めっき部、１２・・・マスキングテープ、１３・
・・めっき液流、３０・・・壁而ＦＩＧ、１ ＦＩＧ、２ａ　　　　　　　ＦＩＧ、２ｂＦ　Ｉ　Ｇ、
　２ｃFIG. 1 is a sectional view showing an outline of the plating method of the present invention. FIG. 2 is a cross-sectional view showing an outline of the band-shaped body. Explanation of symbols 1... Upper plating tank, 2... Plating liquid level, 3...
Liquid pipe line, 4...Lower plating top, 5...-vibrator, 6
...Band-shaped body, 7...Anode, 8...Liquid pipe bottom, 9
... Pump, 10... Plating solution supply vibe, 11.
...Plated part, 12...Masking tape, 13.
...Plating solution flow, 30...Wall FIG, 1 FIG, 2a FIG, 2bFIG,
2c

Claims (1)

【特許請求の範囲】[Claims] （１）帯状体を、壁面によって形成されるめっき槽内の
液管路中に配置してめっきを行うに際し、 前記液管路中のめっき液流が下方より上方に向って流れ
るものであり、このめっき液流に対して前記帯状体をほ
ぼ直角をなす方向に移動させることを特徴とする液流式
めっき方法。(1) When performing plating by disposing a strip in a liquid pipe in a plating tank formed by a wall surface, the plating liquid flow in the liquid pipe flows from the bottom to the top; A liquid flow plating method characterized in that the band-shaped body is moved in a direction substantially perpendicular to the flow of the plating solution.