JPS62152435U - - Google Patents
Info
- Publication number
- JPS62152435U JPS62152435U JP3905486U JP3905486U JPS62152435U JP S62152435 U JPS62152435 U JP S62152435U JP 3905486 U JP3905486 U JP 3905486U JP 3905486 U JP3905486 U JP 3905486U JP S62152435 U JPS62152435 U JP S62152435U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrodes
- dry etching
- etching
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図は、本考案の一実施例であるドライエツ
チング装置を示す構成図、第２図は、本考案の一
実施例のエツチング速度分布を示すグラフである
。
１……ＲＦ電源、２……基板、３……電極、４
……円板、５……電極。
FIG. 1 is a block diagram showing a dry etching apparatus according to an embodiment of the present invention, and FIG. 2 is a graph showing an etching rate distribution according to an embodiment of the present invention. 1...RF power supply, 2...Substrate, 3...Electrode, 4
...disk, 5...electrode.
Claims (1)
してプラズマを発生させ、前記電極の一方に基板
を配置してエツチングを行うドライエツチング装
置において、前記基板を配置した電極の前記基板
周囲を前記基板と同じインビーダンスの材料で覆
つたことを特徴とするドライエツチング装置。 In a dry etching apparatus that generates plasma by applying a voltage between electrodes disposed facing each other and performs etching by disposing a substrate on one of the electrodes, the periphery of the substrate of the electrode on which the substrate is disposed is etched by the etching process. A dry etching device characterized by being covered with the same impedance material as the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986039054U JPH0451473Y2 (en) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986039054U JPH0451473Y2 (en) | 1986-03-19 | 1986-03-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62152435U true JPS62152435U (en) | 1987-09-28 |
| JPH0451473Y2 JPH0451473Y2 (en) | 1992-12-03 |
Family
ID=30851870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986039054U Expired JPH0451473Y2 (en) | 1986-03-19 | 1986-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451473Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125831A (en) * | 1982-01-22 | 1983-07-27 | Seiko Epson Corp | Dry etching device |
| JPS58168232A (en) * | 1982-03-30 | 1983-10-04 | Fujitsu Ltd | Parallel flat plate type dry etching appratus |
-
1986
- 1986-03-19 JP JP1986039054U patent/JPH0451473Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125831A (en) * | 1982-01-22 | 1983-07-27 | Seiko Epson Corp | Dry etching device |
| JPS58168232A (en) * | 1982-03-30 | 1983-10-04 | Fujitsu Ltd | Parallel flat plate type dry etching appratus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451473Y2 (en) | 1992-12-03 |