JPS62147451U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例に係る平面研削盤
の回転砥石とその周辺部の縦断面図、第２図は前
記回転砥石の底面図、第３図は前記平面研削盤の
概略構成を示す外観斜視図、第４図ａ及び第４図
ｂはウエハ加工面の研削状態を説明する要部拡大
断面図、第５図は従来の回転砥石の一部を破断し
て示す外観斜視図である。 ３：回転テーブル、６ａ，６ｂ，６ｃ：回転砥
石、８……、８：メタルボンド砥石、９、……、
９：レンジボンド砥石、８ａ、……、８ａ，９ａ
、……、９ａ：端面切刃、Ｗ、……、Ｗ：ウエハ
、Ｓ０，Ｓ１，Ｓ２：加工面。 Fig. 1 is a vertical cross-sectional view of a rotary grinding wheel and its surrounding area of a surface grinding machine according to an embodiment of this invention, Fig. 2 is a bottom view of the rotary grinding wheel, and Fig. 3 is a schematic configuration of the surface grinding machine. FIG. 4a and FIG. 4b are enlarged cross-sectional views of essential parts to explain the grinding state of the wafer processed surface, and FIG. 5 is a partially cutaway external perspective view of a conventional rotary grindstone. be. 3: rotary table, 6a, 6b, 6c: rotary grindstone, 8..., 8: metal bond grindstone, 9,...,
9: Range bond whetstone, 8a, ..., 8a, 9a
, ..., 9a: end face cutting edge, W, ..., W: wafer, S0, S1, S2: processed surface.

Claims (1)

【実用新案登録請求の範囲】 (1) ワークを支持するワーク支持手段と、その
端面切刃が前記ワーク支持手段に支持されたワー
クの加工面と対峙する、１又は２以上の回転砥石
を備えた平面研削盤において、 前記回転砥石のうち少なくとも１つは、外周側
の端面切刃をなす第１の砥石と、内周側の端面切
刃をなす第２の砥石からなることを特徴とする平
面研削盤。 (2) 前記第１の砥石がメタルボンド砥石であり
、前記第２の砥石がレジンボンド砥石である実用
新案登録請求の範囲第１項記載の平面研削盤。[Claims for Utility Model Registration] (1) A workpiece support means for supporting a workpiece, and one or more rotating grindstones whose end cutting edges face the machined surface of the workpiece supported by the workpiece support means. In the surface grinding machine, at least one of the rotating grindstones includes a first grindstone forming an edge cutting edge on the outer circumference side and a second grindstone forming an edge cutting edge on the inner circumference side. Surface grinder. (2) The surface grinding machine according to claim 1, wherein the first grindstone is a metal bond grindstone, and the second grindstone is a resin bond grindstone.