JPS6272047U - - Google Patents

Info

Publication number
JPS6272047U
JPS6272047U JP1985162495U JP16249585U JPS6272047U JP S6272047 U JPS6272047 U JP S6272047U JP 1985162495 U JP1985162495 U JP 1985162495U JP 16249585 U JP16249585 U JP 16249585U JP S6272047 U JPS6272047 U JP S6272047U
Authority
JP
Japan
Prior art keywords
carrier plate
workpiece
double
head surface
surface grinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985162495U
Other languages
Japanese (ja)
Other versions
JPH0226608Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985162495U priority Critical patent/JPH0226608Y2/ja
Publication of JPS6272047U publication Critical patent/JPS6272047U/ja
Application granted granted Critical
Publication of JPH0226608Y2 publication Critical patent/JPH0226608Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す図面、第２
図はこの考案に用いられるキヤリヤプレートの平
面図、第３図は第２図のＡ―Ａ線に於ける拡大断
面図、第４図は従来例を示す図面である。 １…フレーム、２，３…クイル、８，９…回転
主軸、１２，１３…砥石、１４…キヤリヤプレー
ト、１７，１８…ドレツサー砥石。 Figure 1 is a drawing showing an embodiment of this invention;
The figure is a plan view of a carrier plate used in this invention, FIG. 3 is an enlarged sectional view taken along the line AA in FIG. 2, and FIG. 4 is a drawing showing a conventional example. DESCRIPTION OF SYMBOLS 1... Frame, 2, 3... Quill, 8, 9... Rotating main shaft, 12, 13... Grindstone, 14... Carrier plate, 17, 18... Dresser grindstone.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 砥石をその研削面を互いに対向させて配置し、
この両砥石間にキヤリヤプレートによりワークを
搬入して該ワークの両面を同時に上記両砥石で研
削加工する両頭平面研削盤に於いて、上記キヤリ
ヤプレートの上下面外周縁に所定の幅寸法でダイ
ヤモンド砥粒等を電着させて当該部分にドレツサ
ー砥石を形成したことを特徴とする両頭平面研削
盤。 Arrange the grindstones with their grinding surfaces facing each other,
In a double-head surface grinder that carries a workpiece between the two grinding wheels using a carrier plate and simultaneously grinds both sides of the workpiece with the two grinding wheels, a predetermined width dimension is formed on the outer periphery of the upper and lower surfaces of the carrier plate. A double-head surface grinder characterized in that a dresser grindstone is formed on the part by electrodepositing diamond abrasive grains or the like.
JP1985162495U 1985-10-23 1985-10-23 Expired JPH0226608Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985162495U JPH0226608Y2 (en) 1985-10-23 1985-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985162495U JPH0226608Y2 (en) 1985-10-23 1985-10-23

Publications (2)

Publication Number Publication Date
JPS6272047U true JPS6272047U (en) 1987-05-08
JPH0226608Y2 JPH0226608Y2 (en) 1990-07-19

Family

ID=31089808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985162495U Expired JPH0226608Y2 (en) 1985-10-23 1985-10-23

Country Status (1)

Country Link
JP (1) JPH0226608Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283371A (en) * 2001-08-30 2010-12-16 Siltronic Ag Method for producing semiconductor wafer, and semiconductor wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49137188U (en) * 1973-03-08 1974-11-26
JPS60103654U (en) * 1983-12-21 1985-07-15 光洋機械工業株式会社 Shaping and sharpening device for grinding wheel in double-head surface grinder

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49137188U (en) * 1973-03-08 1974-11-26
JPS60103654U (en) * 1983-12-21 1985-07-15 光洋機械工業株式会社 Shaping and sharpening device for grinding wheel in double-head surface grinder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283371A (en) * 2001-08-30 2010-12-16 Siltronic Ag Method for producing semiconductor wafer, and semiconductor wafer

Also Published As

Publication number Publication date
JPH0226608Y2 (en) 1990-07-19

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