JPS62140838A - Multilayer printed board - Google Patents
Multilayer printed boardInfo
- Publication number
- JPS62140838A JPS62140838A JP28104985A JP28104985A JPS62140838A JP S62140838 A JPS62140838 A JP S62140838A JP 28104985 A JP28104985 A JP 28104985A JP 28104985 A JP28104985 A JP 28104985A JP S62140838 A JPS62140838 A JP S62140838A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- multilayer printed
- type epoxy
- printed board
- novolac type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、耐湿性に、そして吸湿後の半田耐熱性にも優
れた多層プリント板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a multilayer printed board that has excellent moisture resistance and soldering heat resistance after moisture absorption.
［発明の技術的背景とその問題点〕
近年、ガラスエポキシ多層プリント板は、各種コンピュ
ータ、０ＡＩＩ器、マイクロエレクトロニクス用機器等
にその用途が急増しており、また多層プリント板自体の
積層数も更に高多層化されることが予想されている。[Technical background of the invention and its problems] In recent years, the use of glass epoxy multilayer printed boards has rapidly increased in various computers, 0AII devices, microelectronic equipment, etc., and the number of laminated layers of multilayer printed boards themselves has also increased. It is expected that the number of layers will increase.
このようなガラスエポキシ多層プリント板は、各種の特
性において慢れているものの吸湿による層間剥離の欠点
がある。 即ち、多層基板は、■穴明け→■エツチング
による回路部以外の銅箔除去→■スルーホールメッキ→
■半田コート→■部品取付け→■半田付けといった工程
により加工処理して多層プリント板とするが、銅箔を除
去した後の多層基板は、■のスルーホールメッキ工程で
の浴浸漬、■の工程から■の工程までの間の空気中の湿
度、■工程から■工程までの間の空気中の湿度等によっ
て吸湿する。 吸湿した多層基板が、■の半田コート、
■の半田付は等で加熱声れると、水分が爆発的に気化す
るため基板の層間剥離が発生する。 このような多層プ
リント板は、信頼性の点で使用することができないとい
う欠点があった。Although such glass epoxy multilayer printed boards have various properties, they suffer from delamination due to moisture absorption. In other words, the multilayer board consists of ■Drilling holes→■Removal of copper foil from areas other than the circuit area by etching→■Through-hole plating→
A multilayer printed board is processed through the following steps: ■Solder coating → ■Component attachment → ■Soldering. After removing the copper foil, the multilayer board is processed by bath dipping in the through-hole plating process (■), and process (■). Moisture is absorbed by the humidity in the air between steps 1 and 2, and the humidity in the air between steps 1 and 2. The moisture-absorbed multilayer board is coated with ■ solder,
When soldering (2) is heated, moisture evaporates explosively, causing delamination of the board. Such a multilayer printed board has a disadvantage in that it cannot be used in terms of reliability.
［発明の目的］
本発明は、前記の欠点を解消するためになされたもので
、その目的は、耐湿性、吸湿後における半田耐熱性に優
れた多層プリント板を提供しようとするものである。[Object of the Invention] The present invention was made to eliminate the above-mentioned drawbacks, and its purpose is to provide a multilayer printed board with excellent moisture resistance and soldering heat resistance after moisture absorption.
［発明の概要］
本発明者は、上記の目的を達成しようと鋭意研究を重ね
た結果、フェノールノボラック型エポキシ樹脂もしくは
ｏ−クレゾールノボラック型エポキシ樹脂、テトラブロ
ムビスフェノールＡ１およびビスフェノールＡ型エポキ
シ樹脂を塩基性触媒下で反応させて得られるエポキシ樹
脂組成物を用いた多層プリント板が、耐湿性、吸湿後の
耐半田性に優れていることを見いだし、本発明を完成す
るに至ったものである。[Summary of the Invention] As a result of intensive research aimed at achieving the above object, the present inventor has developed a phenol novolac type epoxy resin, o-cresol novolac type epoxy resin, tetrabromo bisphenol A1 and bisphenol A type epoxy resin. The inventors discovered that a multilayer printed board using an epoxy resin composition obtained by reacting under a chemical catalyst has excellent moisture resistance and solder resistance after absorbing moisture, leading to the completion of the present invention.
即ち本発明は、内層回路板とプリプレグとを交互に複数
回重ね合わせ、ざらに少なくとも片面に銅箔を重ねて、
加熱加圧し一体に積層成形する多層プリント板において
、内層回路板およびプリプレグを構成する樹脂がフェノ
ールノボラック型エポキシ樹脂もしくは０−クレゾール
ノボラック型エポキシ樹脂、テトラブロムビスフェノー
ルＡ１およびビスフェノールＡ型エポキシ樹脂を塩基性
触媒下で反応させて得られるエポキシ樹脂組成物である
ことを特徴とする多層プリント板である。That is, in the present invention, the inner layer circuit board and the prepreg are alternately stacked multiple times, and the copper foil is roughly stacked on at least one side,
In multilayer printed boards that are integrally laminated and molded by heating and pressurizing, the resins constituting the inner layer circuit board and prepreg are phenol novolac type epoxy resins, 0-cresol novolac type epoxy resins, tetrabromo bisphenol A1, and bisphenol A type epoxy resins that are basic. This is a multilayer printed board characterized by being an epoxy resin composition obtained by reaction under a catalyst.
そしてフェノールノボラック型エポキシ樹脂もしくはＯ
−クレゾールノボラック型エポキシ樹脂が、エポキシ樹
脂組成物に対して５〜２０重量％の割合で含有される多
層プリント板である。and phenol novolak type epoxy resin or O
- A multilayer printed board containing a cresol novolak type epoxy resin in an amount of 5 to 20% by weight based on the epoxy resin composition.
本発明に用いるフェノールノボラック型エポキシ樹脂と
しては、例えばＹＤＰＮ６３８ （東部化成社製、商品
名）が挙げられる。Examples of the phenol novolac type epoxy resin used in the present invention include YDPN638 (manufactured by Tobu Kasei Co., Ltd., trade name).
本発明に用いる０−クレゾールノボラック型エポキシ樹
脂としては、例えばＹＤＣＮ７０４ （東部化成社製、
商品名）等が挙げられる。As the 0-cresol novolak type epoxy resin used in the present invention, for example, YDCN704 (manufactured by Tobu Kasei Co., Ltd.,
product name), etc.
本発明に用いるテトラブロムビスフェノールＡは、ビス
フェノールＡのフェノールロー位置の水素を臭素と置換
したものである。Tetrabromobisphenol A used in the present invention is bisphenol A in which hydrogen at the phenol lo position is replaced with bromine.
以上のフェノールノボラック型エポキシ樹脂もしくは０
−クレゾールノボラック型エポキシ樹脂、テトラブロム
ビスフェノールＡ１およびビスフェノールＡ型エポキシ
樹脂を塩基性触媒下で反応させるが、塩基性触媒として
は例えばカセイソーダ、水酸化リチウムなどのリチウム
塩、テトラメチルアンモニウムクロライドなどの第四ア
ンモニウム塩、ピペリジン、ジエチルリン酸ソーダ、塩
化カルシウムなどのカルシウム塩、ｎ−ブチルアミンな
どのアミン類等が挙げられ、これらは単独又は２種以上
混合して用いる。or more phenol novolac type epoxy resin or 0
- Cresol novolac type epoxy resin, tetrabromo bisphenol A1 and bisphenol A type epoxy resin are reacted under a basic catalyst, and examples of basic catalysts include caustic soda, lithium salts such as lithium hydroxide, and esters such as tetramethylammonium chloride. Examples include calcium salts such as tetraammonium salts, piperidine, diethyl sodium phosphate, and calcium chloride, and amines such as n-butylamine, and these may be used alone or in combination of two or more.
フェノールノボラック型エポキシ樹脂もしくは０−クレ
ゾールノボラックエポキシ樹脂の配合割合は、エポキシ
樹脂組成物に対して５〜２０重量％であることが望まし
い。 配合層が５重量％未満では本発明の効果が得られ
ず、また２０重量％を超えるとプリプレグの成形性が劣
り、また成形した多層プリント板の特性も劣り好ましく
ない。 従って前記の範囲内に限定される。The blending ratio of the phenol novolac type epoxy resin or the 0-cresol novolac epoxy resin is preferably 5 to 20% by weight based on the epoxy resin composition. If the blended layer is less than 5% by weight, the effects of the present invention cannot be obtained, and if it exceeds 20% by weight, the moldability of the prepreg will be poor and the properties of the molded multilayer printed board will also be poor, which is not preferable. Therefore, it is limited within the above range.
［発明の実施例］
次に本発明の実施例について説明する。 本発明はこの
実施例に限定されるものではない。[Embodiments of the Invention] Next, embodiments of the present invention will be described. The invention is not limited to this example.
実施例
フェノールノボラック型エポキシ樹脂（エポキシ当ｆｌ
１７５） １２重１％と、ビスフェノールＡ型エポキ
シ樹脂（エポキシ当［１１９０） ４２ｆｉ１％と、テ
トラブロムビスフェノールＡ４６１１％とを、塩基性触
媒の下で反応させてエポキシ当ｆｆ１４８５のエポキシ
樹脂組成物を得た。 この組成物１００重量部、硬化剤
ジシアンジアミド３．５型車部、および硬化促進剤２−
エチル−４−メチルイミダゾール０．１５重量部を溶剤
に溶解し、固形分５０％のエポキシ樹脂組成物ワニスを
調製した。 このワニスをガラスクロス７６２８／ＡＳ
４５０ （旭シエーベル社製、商品名）に含浸し、１６
０℃で３分間加熱乾燥して半硬化のプリプレグを作った
。 このブリプレグを使用した５３Ｑｘ５３０ｍｍ ｘ
Ｏ，２ｍｍのガラスクロスエポキシ樹脂両面銅張積層
板（ＴＬＣ−Ｗ−５５１Ａ −０，２−７０μｍ束芝ケ
気力ル社製、商品名）の両面にエツチングレジストを用
いて回路パターンを形成し、非回路部分を塩化第二鉄を
用いて銅をエツチング除去し、次いでエツチングレジス
トを剥離した後、回路パターン銅箔を表面酸化処理して
内層回路板を作った。 内層回路板とプリプレグを交互
に重ね合わせ、最終的に重ねた両側に１８μｍの銅箔を
配置し、温度１７０℃、圧力４０１Ｄｌｆ／Ｃ１１１２
で９０分間加熱加圧して、厚さ １．６ｍｍの多層プリ
ント板を製造した。Example Phenol novolac type epoxy resin (epoxy fl
175) 1% by weight of bisphenol A epoxy resin (epoxy weight [1190) 42fi 1% and tetrabromobisphenol A 4611% were reacted under a basic catalyst to obtain an epoxy resin composition with ff1485 of epoxy weight. Ta. 100 parts by weight of this composition, a hardening agent dicyandiamide 3.5 type wheel, and a hardening accelerator 2-
An epoxy resin composition varnish having a solid content of 50% was prepared by dissolving 0.15 parts by weight of ethyl-4-methylimidazole in a solvent. Apply this varnish to glass cloth 7628/AS
450 (manufactured by Asahi Siebel Co., Ltd., trade name), 16
A semi-cured prepreg was produced by heating and drying at 0° C. for 3 minutes. 53Qx530mm x using this buri preg
A circuit pattern was formed using an etching resist on both sides of a 0.2 mm glass cloth epoxy resin double-sided copper-clad laminate (TLC-W-551A-0.2-70 μm manufactured by Takashiba Keikiru Co., Ltd., trade name). After removing the copper from the non-circuit portions by etching using ferric chloride and then peeling off the etching resist, the circuit pattern copper foil was surface oxidized to produce an inner layer circuit board. The inner layer circuit board and the prepreg were stacked alternately, and finally 18 μm copper foil was placed on both sides of the stack, and the temperature was 170°C and the pressure was 401Dlf/C1112.
A multilayer printed board with a thickness of 1.6 mm was produced by heating and pressurizing for 90 minutes.
比較例
難燃性エポキシ樹脂としてアラルダイト８０１１（日本
チバガイギー社製、商品名）９０重世部、フェノールノ
ボラック型エポキシ樹脂としてＤＥＮ−４３１（ダウケ
ミカル社製、商品名）１０重組部、硬化剤ジシアンジア
ミド３．５重量部、および硬化促進剤２−エチル−４−
メチルイミダゾール０．１５部を溶剤に溶解させて、固
形分５０％のエポキシ樹脂組成物ワニスを［１した。
以下、実施例と同様にしてプリプレグおよび多層プリン
ト板を製造した。Comparative Examples Araldite 8011 (manufactured by Nippon Ciba Geigy Co., Ltd., trade name) as a flame-retardant epoxy resin: 90 parts, DEN-431 (manufactured by Dow Chemical Company, trade name) as a phenol novolak type epoxy resin: 10 parts, curing agent dicyandiamide 3 parts .5 parts by weight, and curing accelerator 2-ethyl-4-
An epoxy resin composition varnish having a solid content of 50% was prepared by dissolving 0.15 parts of methylimidazole in a solvent.
Thereafter, prepregs and multilayer printed boards were manufactured in the same manner as in the examples.
実施例および比較例で製造した多層プリント板をエツチ
ングして両面の銅箔を除去した後、５０×５０ＩＩ１ｍ
に切断し、第１表に示した強制吸湿試験を行い、吸湿率
と半田フロート後のフクレの様子を試験した。 その結
果を第１表に示したが、本発明の多層プリント板はフク
レの発生が少なく本発明の効果が認められた。After etching the multilayer printed boards manufactured in Examples and Comparative Examples to remove the copper foil on both sides,
The sample was cut into pieces and subjected to the forced moisture absorption test shown in Table 1, and the moisture absorption rate and appearance of blisters after solder float were tested. The results are shown in Table 1, and the effect of the present invention was recognized in the multilayer printed board of the present invention with less occurrence of blisters.
第１表
＄１ ： ２６０’Ｃの半田槽に３０秒間フロートさ
せて、試験片８個中のフクレの数を示した。Table 1 $1: The number of blisters in 8 test pieces is shown after floating in a solder bath at 260'C for 30 seconds.
［発明の効果］
本発明の多層プリント板は、フェノールノボラック型エ
ポキシ樹脂もしくはｏ−クレゾールノボラック型エポキ
シ樹脂、テトラブロムビスフェノールＡ、およびビスフ
ェノールＡ型エポキシ樹脂を塩基性触媒下で反応させて
なるエポキシ樹脂組成物を使用したことによって、耐湿
性、吸湿後の半田耐熱性に優れたもので、基板の層間剥
離等の発生が少なく、従ってより多層化が可能であり、
またこの多層プリント板を使用することによって信頼性
の高い電子機器等を製造することができる。[Effects of the Invention] The multilayer printed board of the present invention uses an epoxy resin obtained by reacting a phenol novolac type epoxy resin, an o-cresol novolac type epoxy resin, tetrabromobisphenol A, and a bisphenol A type epoxy resin under a basic catalyst. By using the composition, it has excellent moisture resistance and soldering heat resistance after moisture absorption, and there is less occurrence of delamination of the substrate, so it is possible to have more multilayers.
Furthermore, by using this multilayer printed board, highly reliable electronic devices and the like can be manufactured.
Claims (1)
せ、さらに少なくとも片面に銅箔を重ねて、加熱加圧し
一体に積層成形する多層プリント板において、内層回路
板およびプリプレグを構成する樹脂がフェノールノボラ
ック型エポキシ樹脂もしくはｏ−クレゾールノボラック
型エポキシ樹脂、テトラブロムビスフェノールＡ、およ
びビスフェノールＡ型エポキシ樹脂を塩基性触媒下で反
応させて得られるエポキシ樹脂組成物であることを特徴
とする多層プリント板。 ２ フェノールノボラック型エポキシ樹脂もしくはｏ−
クレゾールノボラック型エポキシ樹脂が、エポキシ樹脂
組成物に対して５〜２０重量％の割合で含有される特許
請求の範囲第１項記載の多層プリント板。[Scope of Claims] 1. A multilayer printed board in which an inner layer circuit board and a prepreg are alternately stacked multiple times, copper foil is further stacked on at least one side, and the inner layer circuit board and the prepreg are laminated and molded together by heating and pressing. The constituent resin is an epoxy resin composition obtained by reacting a phenol novolac type epoxy resin, an o-cresol novolac type epoxy resin, tetrabromobisphenol A, and a bisphenol A type epoxy resin under a basic catalyst. Multilayer printed board. 2 Phenol novolac type epoxy resin or o-
The multilayer printed board according to claim 1, wherein the cresol novolac type epoxy resin is contained in a proportion of 5 to 20% by weight based on the epoxy resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28104985A JPS62140838A (en) | 1985-12-16 | 1985-12-16 | Multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28104985A JPS62140838A (en) | 1985-12-16 | 1985-12-16 | Multilayer printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62140838A true JPS62140838A (en) | 1987-06-24 |
| JPH0586333B2 JPH0586333B2 (en) | 1993-12-10 |
Family
ID=17633590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28104985A Granted JPS62140838A (en) | 1985-12-16 | 1985-12-16 | Multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140838A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05301980A (en) * | 1992-04-24 | 1993-11-16 | Toshiba Chem Corp | Prepreg for printed-wiring board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3367990A (en) * | 1952-02-11 | 1968-02-06 | Dow Chemical Co | Epoxy resins formed by interacting a diglycidyl ether of a dihydric phenol, an epoxidized novolac and a dihydric phenolic compound |
| JPS59210946A (en) * | 1983-04-29 | 1984-11-29 | ウエスチングハウス エレクトリック コ−ポレ−ション | Flame resistant laminate board |
| JPS603184A (en) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | Resin-bonded carbon fiber substrate material |
| JPS60135436A (en) * | 1983-12-23 | 1985-07-18 | Matsushita Electric Works Ltd | Production of epoxy resin laminate |
| JPS61148226A (en) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | Solid epoxy resin for paint and laminated board |
| JPS61188413A (en) * | 1985-02-18 | 1986-08-22 | Dainippon Ink & Chem Inc | Epoxy resin composition |
| JPS6360053A (en) * | 1986-08-30 | 1988-03-16 | Tohoku Metal Ind Ltd | Production of super rapidly cooled metal strip |
| JPH0586333A (en) * | 1991-03-29 | 1993-04-06 | Arakawa Chem Ind Co Ltd | Colorless rosin ester derivative and its production |
-
1985
- 1985-12-16 JP JP28104985A patent/JPS62140838A/en active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3367990A (en) * | 1952-02-11 | 1968-02-06 | Dow Chemical Co | Epoxy resins formed by interacting a diglycidyl ether of a dihydric phenol, an epoxidized novolac and a dihydric phenolic compound |
| JPS59210946A (en) * | 1983-04-29 | 1984-11-29 | ウエスチングハウス エレクトリック コ−ポレ−ション | Flame resistant laminate board |
| JPS603184A (en) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | Resin-bonded carbon fiber substrate material |
| JPS60135436A (en) * | 1983-12-23 | 1985-07-18 | Matsushita Electric Works Ltd | Production of epoxy resin laminate |
| JPS61148226A (en) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | Solid epoxy resin for paint and laminated board |
| JPS61188413A (en) * | 1985-02-18 | 1986-08-22 | Dainippon Ink & Chem Inc | Epoxy resin composition |
| JPS6360053A (en) * | 1986-08-30 | 1988-03-16 | Tohoku Metal Ind Ltd | Production of super rapidly cooled metal strip |
| JPH0586333A (en) * | 1991-03-29 | 1993-04-06 | Arakawa Chem Ind Co Ltd | Colorless rosin ester derivative and its production |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05301980A (en) * | 1992-04-24 | 1993-11-16 | Toshiba Chem Corp | Prepreg for printed-wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0586333B2 (en) | 1993-12-10 |
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