JPS62136539A - Copper alloy having high electric conductivity and superior migration resistance - Google Patents

Abstract

PURPOSE:To obtain a Cu alloy having high electric conductivity represented by >=60% IACS and superior migration resistance by adding specified amount of Fe, P and Zn to Cu as essential components. CONSTITUTION:The composition of a Cu alloy is composed of 0.05-0.2wt% Fe, 0.025-0.05wt% P, 0.1-3.5wt% Zn and the balance Cu with inevitable impurities. When the alloy contains <0.1wt% one or more among Be, B, Mg, Al, Si, Ti, Cr, Mn, Ni, Co, Zr, Ag, In, Sn and Sb besides Fe, P and Zn as essential components, >=60% IACS electric conductivity is satisfied.

Description

【発明の詳細な説明】 ［産業上の利用分野１ 本発明は耐マイグレーション性に優れた高導電性銅合金
に関し、さらに詳しくは、半導体部品、開閉器部品、ブ
スバー、端子、コネクター等の機構部品およびプリント
配線板等の電子および電気部品材料に適した耐マイグレ
ーション性に優れた高導電性銅合金に関する。[Detailed Description of the Invention] [Industrial Application Field 1] The present invention relates to a highly conductive copper alloy with excellent migration resistance, and more specifically to mechanical parts such as semiconductor parts, switch parts, busbars, terminals, and connectors. and a highly conductive copper alloy with excellent migration resistance suitable for electronic and electrical component materials such as printed wiring boards.

［従来技術１ 家庭電化製品のクーラー、ＴＶ、ＶＴＲおよび自動車等
に塔載される電気部品および電子部品は非常な勢いで小
型化、高密度実装化が進んできている。[Prior Art 1] Electrical and electronic components installed in home appliances such as coolers, TVs, VTRs, and automobiles are rapidly becoming smaller and more densely packaged.

これら電気部品および電子部品を実装する配線回路（プ
リント配線板、ブスバ一平面板）もその影響を受けて、
配線回路の高密度化或いは多層化等が進みつつある。The wiring circuits (printed wiring boards, bus bar flat boards) that mount these electrical and electronic components are also affected by this.
BACKGROUND ART Wiring circuits are becoming denser and more multi-layered.

また、これら電極間距離も小さくなりつつあり、しかも
、他方では電流容量の向上が試みられている。Moreover, the distance between these electrodes is becoming smaller, and on the other hand, attempts are being made to improve the current capacity.

その結果、電線回路や電極部は結露塵埃（水を吸着し易
くなる。）および電界等の影響を受は易くなり、従来の
材料では金属の電気化学的なマイグレーションが生じ、
絶縁性が低下し、小型化および高密度実装化に困難があ
った。As a result, wire circuits and electrodes become more susceptible to the effects of condensation dust (which tends to absorb water) and electric fields, and with conventional materials, electrochemical migration of metal occurs.
The insulation properties deteriorated, making it difficult to miniaturize and implement high-density packaging.

マイグレーションとは、電極間に結露等が起ると金属元
素がイオン化し、このイオン化した金属元素がクーロン
７オー入により陰極に移動して析出し、めっき（電析）
と同じように陰極から樹枝状に金属結晶が成長し、陽極
側までに達し短絡することをいう。Migration is when a metal element is ionized when condensation occurs between the electrodes, and this ionized metal element moves to the cathode by 7 coulombs and precipitates, resulting in plating (electrodeposition).
In the same way, metal crystals grow in a dendritic manner from the cathode, reaching the anode side and causing a short circuit.

乾燥、結露等の環境に応じて金属結晶中および表面に酸
化物を伴なうことが多く、電極間の物質がブラスチンク
、ガラスおよびセラミンタ等の絶縁物の表面上を極めて
薄膜状で走り、先端では複数本となることが多い。印加
電圧は数〜数十ボルトで、電流は数〜数十アンペアで起
り、一般的には銀が起り易いといわれてきたが、最近の
電気・電子部品の配線回路の高密度実装化、多層化の進
展につれて銅および銅合金にも生じる恐れがあることが
わかった。Depending on the environment such as dryness or dew condensation, oxides are often present in the metal crystal and on its surface, and the material between the electrodes runs in an extremely thin film on the surface of the insulating material such as brass tink, glass, and ceraminta, and the tip There are often multiple books. The applied voltage is several to several tens of volts, and the current is several to several tens of amperes, and it has been said that silver is generally more likely to cause this. It was found that there is a possibility that copper and copper alloys may also be affected as the chemical reaction progresses.

［発明が解決しようとする問題点１ 本発明は、上記に説明したような従来における種々の問
題点に鑑みなされたものであって、開閉器部品、ブスバ
ー、端子、コネクター等の機構部品、プリント配線板お
よび半導体部品の小型化、高密度で実装化され、配線回
路の絶縁距離および電極間距離が０．６３５〜１．２７
ｎ＋ｍと近接し、結露しても電析物の成長を抑制し、マ
イグレーションを起し難くし、さらに、電流容量の向上
の目的にも対応できるよう少なくとも６０％ｌＡＣ３以
上の導電率を有し、純銅、燐脱酸銅よりも８！械的性質
を向上させた耐マイグレーション性に優れた高導電性銅
合金を提供するものである。[Problem to be Solved by the Invention 1] The present invention has been made in view of the various problems in the prior art as explained above. Wiring boards and semiconductor components are becoming smaller and more densely packaged, and the insulation distance and interelectrode distance of wiring circuits are 0.635 to 1.27.
n + m, suppresses the growth of deposits even when dew condenses, makes migration difficult to occur, and has a conductivity of at least 60%lAC3 or more so that it can also meet the purpose of improving current capacity, 8 higher than pure copper and phosphorus deoxidized copper! The present invention provides a highly conductive copper alloy with improved mechanical properties and excellent migration resistance.

［問題点を解決するための手段１ 本発明に係る耐マイグレーション性に優れた高導電性銅
合金の特徴とするところは、 Ｆｅ　０．０５〜０．２０ｗＬ％、Ｐ　０．０２５〜０
．０５０ｗｔ％、Ｚｎ　０．１−３，５ｗｔ％ を含有し、残部実質的にＣｕからなるものである。[Means for solving the problem 1 The characteristics of the highly conductive copper alloy with excellent migration resistance according to the present invention are as follows: Fe 0.05-0.20 wL%, P 0.025-0
．． 050 wt%, Zn 0.1-3.5 wt%, and the remainder substantially consists of Cu.

そして、導電率が６０％ｌＡＣ３以上であり、耐マイグ
レーション性に優れた電子・電気部品用として適してい
る銅合金である。The copper alloy has an electrical conductivity of 60%lAC3 or more and is suitable for use in electronic and electrical parts with excellent migration resistance.

本発明に係る耐マイグレーション性に優れた高導電性銅
合金について、以下詳細に説明する。The highly conductive copper alloy with excellent migration resistance according to the present invention will be described in detail below.

先ず、本発明に係る耐マイグレーション性に優れた高導
電性銅合金の含有成分および成分割合について説明する
。First, the components and component ratios of the highly conductive copper alloy with excellent migration resistance according to the present invention will be explained.

ＦｅおよびＰは同時に含有されることによって、母相中
に燐化鉄を形成して強化に寄与するもので、Ｆｅ含有量
が０．０５ｗｔ％未満では、Ｐが０．０２５−０．０５
０ｗｔ％含有されていても燐化鉄の形成には関与しない
余剰のＰが母相に固溶して導電率を低下させ、また、Ｆ
ｅ含有量が０．２１）ｕｔ％を越えるとＰを０．０５０
ｗｔ％含有させても燐化鉄の形成に関与しない余剰のＦ
ｅが母相に固溶して導電率を低下させる。よって、Ｆｅ
含有量は０．０５−０．２０ｗ　Ｌ％とする。When Fe and P are contained at the same time, they form iron phosphide in the matrix and contribute to strengthening.
Excess P, which does not participate in the formation of iron phosphide even if it is contained at 0 wt%, dissolves in the matrix and lowers the electrical conductivity.
If the e content exceeds 0.21) ut%, P will be 0.050
Excess F that does not participate in the formation of iron phosphide even if it is included in wt%
e dissolves in the matrix and lowers the conductivity. Therefore, Fe
The content is 0.05-0.20wL%.

Ｐは含有量が０．０２５四ｔ％未満ではＦｅが０．０５
〜０．２０ｗｔ％含有させても燐化鉄の形成に関与しな
いＦｅが母相中に固溶して導電率を低下させ、また、Ｐ
含有量が０，０５０ｗｔ％を越えて含有されると通常の
半連続鋳造により製造した鋳塊が熱間圧延に耐えられず
、製品化することができない。よって、Ｐ含有量は０．
０２５−０．０５０ｗｔ％とする。When the content of P is less than 0.0254t%, Fe is 0.05%.
Fe, which does not participate in the formation of iron phosphide even when contained at ~0.20 wt%, is dissolved in the matrix and reduces the conductivity.
If the content exceeds 0,050 wt%, the ingot produced by normal semi-continuous casting will not be able to withstand hot rolling and cannot be manufactured into a product. Therefore, the P content is 0.
025-0.050wt%.

Ｚｎは結露によりイオン化することによって、Ｃｕイオ
ンの溶出を抑えマイグレーションを抑制するための必須
の元素であり、含有量が０．１＋ＩＩｔ％未満ではこの
効果は少なく、また、３．５ｗＬ％を越えて含有される
とマイグレーションの抑制効果はあるが、含有量の増加
に伴なって導電率が低下し、電子部品材料としての導電
率６０％ｌＡＣ３以上を満足できなくなる。よって、Ｚ
ｎ含有量は０．１〜３．５社％とする。Zn is an essential element that suppresses the elution of Cu ions and suppresses migration by ionizing through dew condensation.If the content is less than 0.1+IIt%, this effect will be small, and if the content exceeds 3.5wL%, When contained, there is an effect of suppressing migration, but as the content increases, the electrical conductivity decreases, and it becomes impossible to satisfy the electrical conductivity of 60% lAC3 or more as an electronic component material. Therefore, Z
The n content is 0.1 to 3.5%.

なお、上記Ｆｅ、ＰおよＶＺｎの必須成分の池に、Ｂｅ
ＳＢ５Ｍｇ％ＡＩ、Ｓｉ、　Ｔｉ％Ｃｒ、　Ｍｎ、　Ｎ
ｉ、Ｃｏ１Ｚｒ、Ａｇ、Ｉｎ、Ｓｎおよびｓｂの１種ま
たは２種以上を０．ｌｌｌｌｔ％以下の含有であれば、
導電率６０％ｌＡＣ３以上を満足し、さらに、池の特性
を損なうことがないので、上記範囲内の含有は許容され
る。In addition, Be is added to the above essential components of Fe, P and VZn.
SB5Mg%AI, Si, Ti%Cr, Mn, N
i, Co1Zr, Ag, In, Sn, and sb. If the content is less than llllt%,
Content within the above range is permissible because it satisfies the electrical conductivity of 60% lAC3 or more and does not impair the characteristics of the pond.

［実施例］ 次に、本発明に係る耐マイグレーション性に優れた高導
電性銅合金の実施例を説明する。[Example] Next, an example of a highly conductive copper alloy with excellent migration resistance according to the present invention will be described.

実施例 第１表に示す含有成分および成分割合の銅合金をクリプ
トル炉において、大兄中で木炭被覆下に溶解し、傾注式
の鋳鉄製のブックモールドに鋳込み、厚さ６０ｍｍ、幅
６０ｍｍ、長さ１８０ｎｎｏの鋳塊を製作した。Example A copper alloy having the components and proportions shown in Table 1 was melted in a Kryptor furnace under a coating of charcoal in a large oven, and cast into a tilted cast iron book mold to a thickness of 60 mm, width of 60 mm, and length of 60 mm. A 180nno ingot was produced.

これらの鋳塊の表面および裏面を夫々２．５１１１１１
１面削し、黄銅は７４０’Ｃ１その池の合金は８５０°
Ｃの温度で熱間圧延を行ない、厚さ１０ｍ１ｎの板厚と
腰黄銅以外は８００°Ｃの温度に再加熱し、水中急冷し
た。The front and back sides of these ingots are each 2.511111
One side is ground, brass is 740'C1, and the alloy of the pond is 850°
Hot rolling was carried out at a temperature of 800° C., and the parts other than the plate thickness of 10 m1n and the stiff brass were reheated to a temperature of 800° C. and quenched in water.

これらの熱間圧延材の表面の酸化スケールを除去後、冷
間圧延により厚さ１．１１ｍｍまで圧延し、黄銅は４３
０°ＣＸ　２　Ｈｒ、　Ｎｏ、　７は４５０℃×２８ｒ
、その池の合金は５００℃Ｘ２Ｈｒの焼鈍を行ない、ス
ケールを酸洗除去後、厚さ１．０ｍｍまで圧延した。After removing the oxidation scale on the surface of these hot rolled materials, they were cold rolled to a thickness of 1.11 mm, and the brass was
0°CX 2 Hr, No. 7 is 450°C x 28r
The alloy was annealed at 500° C. for 2 hours, scale was removed by pickling, and then rolled to a thickness of 1.0 mm.

このような板材から、厚さ１．Ｏｎ＋ｍ、幅３．０ｍｍ
、長さ６０＋ａｍの試験片を２枚１組として調整し、第
１図に示すように試験片の通電試験および第２図に示す
ような試験片の浸漬試験に基いて、１４Ｖの電圧を加え
たまま１０分間浸漬→１０分開乾燥の繰返し試験を行な
い、１００サイクルに至るまでの最大漏洩電流を実測し
、マイグレーション性を評価した。From such a board, the thickness is 1. On+m, width 3.0mm
, two test pieces with a length of 60+ am were prepared as a set, and a voltage of 14 V was applied based on the energization test of the test pieces as shown in Figure 1 and the immersion test of the test pieces as shown in Figure 2. A repeated test of immersion for 10 minutes followed by open drying for 10 minutes was conducted, and the maximum leakage current up to 100 cycles was actually measured to evaluate migration performance.

電流の測定は白首電機製のメモリーハイコーダ・８８０
２により行なった。Current measurement is done using Shirakubi Denki's Memory Hicorder 880.
2.

引張強さおよび伸びは試料の使手方向を圧延方向に平行
としｒこＪ　ＩＳ５号試験片にて測定した。The tensile strength and elongation were measured using a riko JIS No. 5 test piece with the handle direction of the sample parallel to the rolling direction.

その結果を第２表に示す。The results are shown in Table 2.

第２表から以下説明することが明らかである。From Table 2 it is clear that the following will be explained.

本発明に係る耐マイグレーション性に優れた高導電性銅
合金のＮｏ、１、Ｎｏ、２、Ｎｏ、３およびＮｏ、４は
、その何れもが６０％Ｉ　Ａ　ＣＳ以上の導電率を有し
ており、また、７／３黄銅と同等の漏洩電流値を示し、
マイグレーションの数と漏洩電流は比例関係にあり、配
線回路の高密度化或いは多層化に伴ない、配線間の距離
が近接化しても、従来材よりはマイグレーションによる
絶縁性の低下が少ないことを示している。All of the highly conductive copper alloys No. 1, No. 2, No. 3 and No. 4 having excellent migration resistance according to the present invention have a conductivity of 60% I A CS or more. It also shows a leakage current value equivalent to 7/3 brass,
There is a proportional relationship between the number of migrations and leakage current, indicating that even if the distance between wires becomes closer due to higher density or multilayer wiring circuits, there is less deterioration in insulation due to migration than with conventional materials. ing.

また、引張強さと伸びのバランスにおいても、純銅のＮ
ｏ、７よりも優れていることを示している。Also, in terms of the balance between tensile strength and elongation, pure copper N
It shows that it is better than 7.

また、７／３黄銅のＮｏ、６は漏洩電流が少なくマイグ
レーションを生じ難いが、導電率が２８％ｌＡＣ３と極
めて低いため小型化或いは高密度化に対応させるために
は限界がある。Further, 7/3 brass No. 6 has a small leakage current and is difficult to cause migration, but its conductivity is extremely low at 28% lAC3, so there is a limit to making it compatible with miniaturization or high density.

このような事実は、直流によって示したが、交流でも結
露中にＣｕイオンの溶出が起り、電析物およびその酸化
物がプラスチック、プラスおよびセラミック等の絶縁性
を低下させることも考えられるが、本発明に係る耐マイ
グレーション性に優れた高導電性銅合金ではこのような
現象を解決することができる。Although this fact was shown using direct current, it is also possible that Cu ions are eluted during dew condensation even with alternating current, and that the deposits and their oxides reduce the insulation properties of plastics, plastics, ceramics, etc. The highly conductive copper alloy with excellent migration resistance according to the present invention can solve this phenomenon.

［発明の効果１ 以上説明したように、本発明に係る耐マイグレーション
性に優れた高導電性銅合金は上記の構成を有しているか
ら、半導体部品、機構部品およびプリント配線用の材料
として必要な６０％ｌＡＣ３以上の導電率を有し、さら
に、耐マイグレーション性も黄銅並に優れているという
効果を有しているものである。[Effect of the Invention 1 As explained above, the highly conductive copper alloy with excellent migration resistance according to the present invention has the above structure, and therefore is necessary as a material for semiconductor parts, mechanical parts, and printed wiring. It has a conductivity of 60%lAC3 or more, and also has migration resistance as excellent as that of brass.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は試験片の通電方式を示す概略図、第２図は試験
片の浸漬方式を示す概略図である。 矛２図FIG. 1 is a schematic diagram showing a method of energizing a test piece, and FIG. 2 is a schematic diagram showing a method of immersing a test piece. Spear 2

Claims (1)

【特許請求の範囲】 　Ｆｅ０．０５〜０．２０ｗｔ％、Ｐ０．０２５〜０．
０５０ｗｔ％、Ｚｎ０．１〜３．５ｗｔ％ を含有し、残部実質的にＣｕからなることを特徴とする
導電率６０％ＩＡＣＳ以上の耐マイグレーション性に優
れた高導電性銅合金。[Claims] Fe0.05-0.20wt%, P0.025-0.
A highly conductive copper alloy having a conductivity of 60% IACS or higher and excellent migration resistance, characterized by containing 0.050 wt%, Zn0.1 to 3.5 wt%, and the remainder substantially consisting of Cu.