JPS62119932A - Wire clamping mechanism - Google Patents

Wire clamping mechanism

Info

Publication number
JPS62119932A
JPS62119932A JP60259330A JP25933085A JPS62119932A JP S62119932 A JPS62119932 A JP S62119932A JP 60259330 A JP60259330 A JP 60259330A JP 25933085 A JP25933085 A JP 25933085A JP S62119932 A JPS62119932 A JP S62119932A
Authority
JP
Japan
Prior art keywords
wire
fixed
movable
clamping piece
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60259330A
Other languages
Japanese (ja)
Inventor
Tetsukazu Inoue
哲一 井上
Saburo Miyai
宮井　三郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60259330A priority Critical patent/JPS62119932A/en
Publication of JPS62119932A publication Critical patent/JPS62119932A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To hold a wire firmly while assuring it of normal tension cutting it without fail by a method wherein at least one side wire clamping pieces of a wire clamping mechanism are fixed to a holding arm through the intermediary of an elastic member. CONSTITUTION:Eve if a movable clamping piece 2c and a fixed clamping piece 2d are not in parallel with each other, when a member 5a is pushed up to depress an arm 2f upward, the movable piece 2c is depressed on the fixed piece 2d making an elastic member 2e deform to absorb any deflected parallelism making both pieces 2c, 2d in parallel with each other. Resultantly, no gap is made between the clamping pieces 2c, 2d and a wire 4 improving their adhesive property to firmly hold the wire 4 without slipping. The central part of depressing member 5a is free-oscillatorily held by an axle 5b to drive 6 a roller 5e fixed to another member 5d by a cam 7. Owing to the elastic member 2e made of conductive material, the wire 4 can be prevented from adhering due to no charge on the movable clamping piece 2c in case of discharge. In such a constitution, the wire 4 is firmly clamped so that the wire 4 may be drawn out up to moderate length to be cut off without fail.

Description

【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、ワイヤボンディング技術分野で利用され、
特に、ワイヤをクランプするワイヤクランプ機構に関す
る。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial field of application This invention is used in the field of wire bonding technology,
In particular, it relates to a wire clamp mechanism for clamping wires.

（ロ）従来の技術 従来、■Ｃチップとパッケージのリード線とを例えば、
ステーフジ上にチップとリード線とを設ける一方、この
ステージの上方に、キャピラリとクランプ手段とを設け
たワイヤボンダが知られている。(b) Conventional technology Conventionally, ■C chip and package lead wire, for example,
A wire bonder is known in which a chip and a lead wire are provided on a stage, and a capillary and a clamping means are provided above the stage.

第２図は従来のワイヤボンダにおけるクランプ機構の要
部を示した平面図である。固定支持アーム２ｇと可動支
持アーム２ｆとの先端部には、固定ワイヤ挟持片２ｄと
可動ワイヤ挟持片２ｃとか対向するように取り付けられ
ている。前記挟持片２ｄ。FIG. 2 is a plan view showing the main parts of a clamp mechanism in a conventional wire bonder. A fixed wire clamping piece 2d and a movable wire clamping piece 2c are attached to the distal ends of the fixed support arm 2g and the movable support arm 2f so as to face each other. The clamping piece 2d.

２ｃとの間隙を、紙面垂直方向にＡｕワイヤが通過する
。可動支持アーム２ｒは、抑圧部材５ａの先端部に取り
付けられた突起５ｃに向かう弾性を備えている。前記抑
圧部材５ａが駆動されることによって、挟持片２ｄ、２
ｃが開閉されろ。このようなりランプ機構は、Ａｕワイ
ヤのカット用及びＡｕワイヤへのテンション付加用とし
てそれぞれ個別に設けられるのが通常である。The Au wire passes through the gap with 2c in a direction perpendicular to the plane of the paper. The movable support arm 2r has elasticity toward the protrusion 5c attached to the tip of the suppressing member 5a. By driving the suppressing member 5a, the holding pieces 2d, 2
c is opened and closed. Such a ramp mechanism is usually provided separately for cutting the Au wire and for applying tension to the Au wire.

そして、このワイヤボンダによりワイヤボンディングす
るときは、テンション付加用のクランブピラリにＡｕワ
イヤを貫挿した状態で下方に繰り出し、該ワイヤの先端
部をチップ（第１接点）に圧着する。その後、キャピラ
リを上昇させると同時にクランプ手段を移動してワイヤ
を所定長さ繰り出し、第２接点の上方に来たところでキ
ャピラリを下降させて、該ワイヤ途中をリード線（第２
接点）に圧着する。そして、カット用のクランプ機構で
ワイヤをクランプして引っ張ることにより、該ワイヤを
第２接点圧着部でカットしてワイヤボンディングを完了
するようになされていた。When wire bonding is performed using this wire bonder, the Au wire is inserted into the clamp pillar for applying tension and is fed out downward, and the tip of the wire is crimped to the chip (first contact). Thereafter, at the same time as the capillary is raised, the clamp means is moved to let out the wire for a predetermined length, and when it reaches above the second contact, the capillary is lowered and the lead wire (second
(contact). Then, by clamping and pulling the wire with a cutting clamp mechanism, the wire is cut by the second contact crimping portion and wire bonding is completed.

（ハ）発明が解決しようとする問題点 上述のように、クランプ機構は、ワイヤボンディング中
のＡｕワイヤに張力を与えて、ボンディングされた。Ａ
ｕワイヤが滑らかなループ形状になるようにするととも
に、第２接点のボンディング後にワイヤをカットする機
能を営むものである。(c) Problems to be Solved by the Invention As described above, the clamp mechanism applies tension to the Au wire during wire bonding. A
It functions to ensure that the u-wire has a smooth loop shape and to cut the wire after bonding the second contact.

従って、これらの機能が正常に発揮されるには、各クラ
ンプ機構はワイヤを確実にクランプしておく必要がある
。Therefore, in order for these functions to be properly performed, each clamp mechanism must reliably clamp the wire.

しかし、従来のクランプ機構は、ワイヤクランプの取付
不良や長期間の使用等により、一対のワイヤ挟持片２　
ｃ、　２　ｄの平行度にずれが生じていると、抑圧部材
５ａを介して可動ワイヤ挟持片２Ｃが固定ワイヤ挟持片
２ｄ側に押圧された時、ワイヤを確実にクランプできな
いという問題があった。However, in the conventional clamp mechanism, due to improper installation of the wire clamp or long-term use, etc., the pair of wire clamping pieces 2
If there is a deviation in the parallelism of c and 2d, there is a problem that the wire cannot be reliably clamped when the movable wire clamping piece 2C is pressed toward the fixed wire clamping piece 2d via the suppressing member 5a. .

すなわち、リード線にワイヤを圧着した後、該ワイヤを
カットする場合、カットのクランプ機構の挟持力の平行
度がずれていると、両挟持片の間にギャップが生じるの
で、ワイヤが滑ってカットできないという問題があった
。In other words, when cutting a wire after crimping it to a lead wire, if the clamping force of the cutting clamp mechanism is not parallel enough, a gap will be created between both clamping pieces, causing the wire to slip and prevent the cutting. The problem was that I couldn't do it.

また、テンション付加用のクランプ機構の挟持片の平行
度がずれていると、ワイヤに正常な張力が作用しないた
めに、ワイヤのループが異常に低くなることや、その逆
に、ワイヤがたるんで垂れた状態となる。そのため、チ
ップにワイヤが接触したり、隣接ワイヤ間が接触する等
によって、ショート不良が生じ、製品の歩留り低下及び
信頼性の低下を引き起こすという問題を生じていた。In addition, if the parallelism of the clamping pieces of the clamping mechanism for applying tension is off, normal tension will not be applied to the wire, and the loop of the wire will become abnormally low, or conversely, the wire will become slack. It becomes sagging. Therefore, short-circuit failures occur due to contact of wires with chips, contact between adjacent wires, etc., resulting in problems in that product yield and reliability are lowered.

この発明は、かかる点に鑑み、クランプ機構の挟持片の
平行度が多少ずれたとしても、ワイヤを確実にクランプ
して該ワイヤに正常な張力を与えるとともに、ワイヤの
カットも確実に行い得るワイヤボンダにおけるワイヤク
ランプ機構を提供することを目的としている。In view of this, the present invention provides a wire bonder that can reliably clamp a wire, apply normal tension to the wire, and reliably cut the wire even if the parallelism of the clamping pieces of the clamping mechanism is slightly deviated. The purpose of the present invention is to provide a wire clamping mechanism for

（ニ）問題点を解決するための手段及び作用この発明は
、ステージ上に被接続材が載置される一方、このステー
ジの上方にワイヤを貫挿せしめたキャピラリが設けられ
ると共に、このキャピラリの上方に一対のワイヤ挟持片
を有するワイヤクランプ機構が設けられたワイヤボンダ
におけるワイヤクランプ機構であって、少なくとも一方
のワイヤ挟持片を、弾性部材を介して支持アームに取り
付けたことを特徴としている。(d) Means and operation for solving the problems In this invention, while the material to be connected is placed on a stage, a capillary into which a wire is inserted is provided above the stage, and the capillary is This wire clamping mechanism for a wire bonder is provided with a wire clamping mechanism having a pair of wire clamping pieces above, and is characterized in that at least one of the wire clamping pieces is attached to a support arm via an elastic member.

（ポ）実施例 以下、この発明の一実施例について、第１図（ａ）及び
（ｂ）に基づき詳細に説明する。なお、同図（ａ）はワ
イヤボンダの主要部の側面図であり、同図（ｂ）はクラ
ンプ機構の平面図である。(P) Example Hereinafter, an example of the present invention will be described in detail based on FIGS. 1(a) and (b). Note that FIG. 3A is a side view of the main parts of the wire bonder, and FIG. 1B is a plan view of the clamp mechanism.

ワイヤボンダ１は、主要部としてワイヤ４をクランプし
て偏力を与えるものとカットするためのワイヤクランプ
機構２と、貫挿したワイヤ４を圧着するためのキャピラ
リ３とを具備していて、ステージ（図示せず）の上方に
配設されている。The wire bonder 1 is equipped with a wire clamp mechanism 2 for clamping and applying bias to the wire 4, and a capillary 3 for crimping the inserted wire 4, and a stage ( (not shown).

ワイヤクランプ機構２は、上部ワイヤクランプ２ａと下
部ワイヤクランプ２ｂとからなり、上部ワイヤクランプ
２ａはテンション付加用とし、下部ワイヤクランプ２ｂ
はカット用クランプとして用いられる。The wire clamp mechanism 2 consists of an upper wire clamp 2a and a lower wire clamp 2b.The upper wire clamp 2a is used for applying tension, and the lower wire clamp 2b is used for applying tension.
is used as a cutting clamp.

各ワイヤクランプ２　ａ、　２　ｂは、可動ワイヤ挟持
片２ｃと固定ワイヤ挟持片２ｄとを各々具備してい、る
。この可動ワイヤ挟持片２ｃは、平板状でステンレス材
等からなり、スポンジ等の弾性部材２ｅを介して可動支
持アーム２ｒの先端に取り付けられている。一方、固定
ワイヤ挟持片２ｄも平板状でステンレス材等からなり、
可動支持アーム２ｒに対向する位置に配設っされた固定
支持アーム２ｇの先端に取り付けられている。また、可
動支持アーム２ｆは、仮ばねで固定支持アーム２ｇに連
設する基部２ｈに後端部が固着されている。そして、こ
の可動支持アーム２ｒに平行して押圧部１１．５ａが配
設されている。この押圧部材５ａは、その中央部分が支
軸５ｂによって、揺動自在に支持されている。抑圧部材
５ａの先端には突起５Ｃが取り付けられており、この突
起５ｃは、可動支持アーム２ｒと接触している。該押圧
部材５ａの後端には、部材５ｄが固着されており、この
部材５ｄに追従ローラ５ｅが取り付けられている。この
追従ローラ５ｅは、モー汐６によって回転駆動されるカ
ム７の周面に押し付けられた状態になっている。Each wire clamp 2a, 2b includes a movable wire clamping piece 2c and a fixed wire clamping piece 2d. This movable wire clamping piece 2c has a flat plate shape and is made of stainless steel or the like, and is attached to the tip of the movable support arm 2r via an elastic member 2e such as a sponge. On the other hand, the fixed wire clamping piece 2d is also flat and made of stainless steel, etc.
It is attached to the tip of a fixed support arm 2g disposed at a position facing the movable support arm 2r. Further, the movable support arm 2f has its rear end fixed to a base 2h connected to the fixed support arm 2g by a temporary spring. A pressing portion 11.5a is arranged parallel to this movable support arm 2r. This pressing member 5a is swingably supported at its central portion by a support shaft 5b. A projection 5C is attached to the tip of the suppressing member 5a, and this projection 5c is in contact with the movable support arm 2r. A member 5d is fixed to the rear end of the pressing member 5a, and a follower roller 5e is attached to this member 5d. This follow-up roller 5e is pressed against the circumferential surface of a cam 7 that is rotationally driven by the motor 6.

キャピラリ３は、略円筒形で支持部材３ａに固定されて
おり、軸心の貫通小孔にはワイヤ４が貫挿されていて、
前記ワイヤクランプ機構２と共に上下方向及び水平方向
に移動可能になっている。The capillary 3 has a substantially cylindrical shape and is fixed to a support member 3a, and a wire 4 is inserted into a small through hole in the axis.
It is movable in the vertical and horizontal directions together with the wire clamp mechanism 2.

ワイヤ４は、直径が例えば３０μｍないし２５μｍに形
成されたＡｕワイヤで、ドラム形のボビン４ａに巻回さ
れており、該ボビンの６管を通り、ガイド４ｂに取り付
けられた複数のガイドリング４Ｃを貫通し、さらにワイ
ヤクランプ機構２の挟持片２ｃ、２ｄの間隙を通って、
ステージの上方に位置するキャピラリ３に貫挿される。The wire 4 is an Au wire formed to have a diameter of 30 μm to 25 μm, for example, and is wound around a drum-shaped bobbin 4a, passes through six tubes of the bobbin, and connects a plurality of guide rings 4C attached to a guide 4b. It penetrates through, and further passes through the gap between the clamping pieces 2c and 2d of the wire clamp mechanism 2.
It is inserted through the capillary 3 located above the stage.

このステージの上面には披接続材であるＩＣチップ（第
１接点）６とパッケージのリード線（第２接点）７とが
所定間隔を存して載置されており、Ｘ−Ｙ方向に水平移
動可能な構成になっている。On the top surface of this stage, an IC chip (first contact) 6, which is a connecting material, and a package lead wire (second contact) 7 are placed at a predetermined distance from each other, and are placed horizontally in the X-Y direction. It has a movable configuration.

次に、このワイヤクランプ機構２によりワイヤ４のクラ
ンプ作用を第１図（ａ）及び（ｂ）に基づいて説明する
。Next, the clamping action of the wire 4 by the wire clamp mechanism 2 will be explained based on FIGS. 1(a) and 1(b).

先ず、ワイヤボンディングの初期において、ボビン４ａ
から繰り出されたワイヤ４が上部ワイヤクランプ２ａと
下部ワイヤクランプ２ｂでクランプされると共に、キャ
ピラリ３より先端を突出させており、該先端は球形に形
成されている。このとき、ワイヤ４は、両ワイヤクラン
プ２ａ、２ｂに確実にクランプされている。すなわち、
可動ワイヤ挟持片２ｃもしくは固定ワイヤ挟持片２ｄの
何れか一方が傾斜して両者の平行度がずれていても、抑
圧部材５ａにより可動支持アーム２ｆに押圧力が付勢さ
れたとき、固定された固定ワイヤ挟持片２ｄ側に可動ワ
イヤ挟持片２Ｃが押し付（）られ、圧縮された弾性部材
２ｅが、弾性変形してずれを吸収し、両ワイヤ挟持片２
　ｃ、　２　ｄを常に平行状態に保つから、該両ワイヤ
挟持片２　ｃ、　２　ｄとワイヤ４との間にはギャップ
が生じず、各々の密着性が高められている。従って、こ
のワイヤ４は滑りが防止された状態で確実にクランプさ
れている。First, in the initial stage of wire bonding, the bobbin 4a
The wire 4 let out is clamped by an upper wire clamp 2a and a lower wire clamp 2b, and has a tip protruding from the capillary 3, and the tip is formed into a spherical shape. At this time, the wire 4 is securely clamped by both wire clamps 2a and 2b. That is,
Even if either the movable wire clamping piece 2c or the fixed wire clamping piece 2d is tilted and the parallelism between the two is deviated, the movable wire clamping piece 2c or the fixed wire clamping piece 2d is fixed when a pressing force is applied to the movable support arm 2f by the suppressing member 5a. The movable wire clamping piece 2C is pressed against the fixed wire clamping piece 2d, and the compressed elastic member 2e elastically deforms to absorb the displacement, and both wire clamping pieces 2
Since the wire clamping pieces 2c and 2d are always kept in a parallel state, no gap is created between the wire clamping pieces 2c and 2d and the wire 4, and the adhesion between them is enhanced. Therefore, this wire 4 is securely clamped in a state where slippage is prevented.

次に、下部ワイヤクランプ２ｂの可動支持アーム２ｒの
押圧力を消勢し、可動ワイヤ挟持片２ｃを開放してクラ
ンプされていたワイヤ４の該クランプを解除する。そし
て、キャピラリ３を下降させてチップ６のポンディング
パッドにワイヤ４の先端を圧着する。続いて、キャピラ
リ３を上昇させると共に、ステージを移動し、両ワイヤ
クランプ２　ａ、　２　ｂとキャピラリ３とを平行移動
させてリード線７の上方に位置させる。この移動により
、ワイヤ４は、上部ワイヤクランプ２ａによって適宜の
張力カ与えられつつ、所定長さ繰り出されることになる
。その後、下部ワイヤクランプ２ｂとともにキャピラリ
３を下降させる。これによりワイヤ４は張力を与えられ
て真っ直ぐに取り出される。Next, the pressing force of the movable support arm 2r of the lower wire clamp 2b is deenergized, the movable wire clamping piece 2c is opened, and the wire 4 is unclamped. Then, the capillary 3 is lowered to press the tip of the wire 4 to the bonding pad of the chip 6. Subsequently, the capillary 3 is raised and the stage is moved to move both wire clamps 2 a, 2 b and the capillary 3 in parallel to position them above the lead wires 7. By this movement, the wire 4 is fed out a predetermined length while being applied with an appropriate tension by the upper wire clamp 2a. Thereafter, the capillary 3 is lowered together with the lower wire clamp 2b. As a result, the wire 4 is tensioned and taken out straight.

このクランプ作用 ランプ２ａの可動ワイヤ挟持片２Ｃがワイヤ４を弾力的
に押圧しているので、該ワイヤは平行状態のワイヤ挟持
片２　ｃ、　２　ｄ間に確実にクランプされ、垂れるこ
となく適正なルーピングが行なわれている。Since the movable wire clamping piece 2C of the clamp action lamp 2a elastically presses the wire 4, the wire is reliably clamped between the parallel wire clamping pieces 2c and 2d, and is held properly without sagging. Looping is occurring.

そして、ワイヤ４途中はリード線７に圧接されて、第２
接点の圧着がなされる。続いて、キャピラリ３の上昇途
中に、下部ワイヤクランプ２ｄでワイヤ４をクランプす
る。この時ら上述の通り、第１図（ｂ）に示す両ワイヤ
挟持片２　ｃ、　２　ｄは、平行状態に保たれるのでワ
イヤ４を確実にクランプしている。そして、下部ワイヤ
クランプ２ｂをキャピラリ３と共に上昇さＵ゛ると、ワ
イヤ４はリード線７の圧着部でカットされて、チップ６
とリード線７とがワイヤボンディングされる。Then, the middle part of the wire 4 is pressed against the lead wire 7, and the second
The contacts are crimped. Subsequently, while the capillary 3 is rising, the wire 4 is clamped by the lower wire clamp 2d. At this time, as described above, the wire clamping pieces 2c and 2d shown in FIG. 1(b) are maintained in a parallel state, so that the wire 4 is reliably clamped. Then, when the lower wire clamp 2b is raised together with the capillary 3, the wire 4 is cut at the crimp portion of the lead wire 7, and the chip 6
and lead wire 7 are wire-bonded.

最後に、電極（図示せず）を用い、該電極とワイヤ４と
の間に放電することによって、ワイヤ４の先端を球形に
形成して完了する。次に、ワイヤクランプ２ｈを開き、
かつ、ワイヤクランプ２ａでクランプしてワイヤを引き
上げ、ワイヤ球をキャピラリ−３の先端まで移動させて
おく。以後、ステージを移動し、この動作を繰り返すこ
とになる。Finally, by using an electrode (not shown) and generating an electric discharge between the electrode and the wire 4, the tip of the wire 4 is formed into a spherical shape. Next, open the wire clamp 2h,
Then, the wire is clamped with the wire clamp 2a and pulled up, and the wire ball is moved to the tip of the capillary 3. After that, the stage will be moved and this operation will be repeated.

尚、上述したワイヤクランプ機構２における各ワイヤク
ランプ２　ａ、　２　ｂのクランプタイミングは、抑圧
部材５ａを駆動しているカム７で調節される。Incidentally, the clamp timing of each wire clamp 2a, 2b in the wire clamp mechanism 2 described above is adjusted by the cam 7 that drives the suppressing member 5a.

また、この実施例の被接続材は、ＩＣチップ６とリード
線７としたが、この発明は各種の電子製品のワイヤボン
ディングに適用することができる。Further, although the materials to be connected in this embodiment are the IC chip 6 and the lead wire 7, the present invention can be applied to wire bonding of various electronic products.

さらに、ワイヤ４先端の球形の形成は、実施例に限られ
ないこと勿論である。Furthermore, it goes without saying that the spherical shape of the tip of the wire 4 is not limited to the embodiment.

ところで、この実施例では可動ワイヤ挟持片２Ｃをスポ
ンジ材等の弾性部材２ｅを介して可動支持アーム２ｒに
取り付けるようにしたが、他の実施例では、この弾性部
材２ｅを導電材料とした。Incidentally, in this embodiment, the movable wire clamping piece 2C is attached to the movable support arm 2r via an elastic member 2e such as a sponge material, but in other embodiments, the elastic member 2e is made of a conductive material.

これにより、電極とワイヤ４との間に放電してワイヤ４
先端を球形にする際に生じていたワイヤ４の繰り出し不
能の難点が解消される。すなわち、弾性部材２ｅがスポ
ンジ等の絶縁材料である場合、下部ワイヤクランプ２ｂ
の内面である可動ワイヤ挟持片２Ｃに電荷が生じ、この
電荷による電磁作用によってワイヤ４を該可動ワイヤ挟
持片側に引き付けるので、ワイヤクランプ２ａを開放し
て解除したときには、ワイヤ４が可動ワイヤ挟持片２Ｃ
に密着してワイヤ４の繰り出しが不能になる場合があっ
た。This causes a discharge between the electrode and the wire 4, causing the wire 4 to
The difficulty of not being able to feed out the wire 4, which occurred when the tip was made into a spherical shape, is resolved. That is, when the elastic member 2e is an insulating material such as sponge, the lower wire clamp 2b
An electric charge is generated on the movable wire clamping piece 2C, which is the inner surface of the movable wire clamping piece 2C, and the wire 4 is attracted to one side of the movable wire clamping piece by the electromagnetic action of this electric charge. 2C
In some cases, the wire 4 could not be fed out due to close contact with the wire.

しかし、弾性部材２ｅに導電材料を使用すると、放電時
には可動ワイヤ挟持片２ｃに電荷が生じないので、ワイ
ヤ４の密着の問題は解消し、ワイヤ４の繰り出し作業性
を向上させることができる。However, if a conductive material is used for the elastic member 2e, no charge will be generated on the movable wire clamping piece 2c during discharge, so the problem of tight adhesion of the wire 4 can be solved and the workability of feeding out the wire 4 can be improved.

なお、実施例では、弾性部材２ｅを可動支持アーム２ｒ
に取り付けたが、これは固定支持アーム２ｇに取り付け
てもよい。In addition, in the embodiment, the elastic member 2e is connected to the movable support arm 2r.
Although this is attached to the fixed support arm 2g, it may also be attached to the fixed support arm 2g.

（へ）効果 以上のように、この発明によれば、ワイヤクランプ機構
の各クランプに配設される可動ワイヤ挟持片を、弾性部
材を介して可動支持アームに取り付けたので、ワイヤの
クランプ時に両ワイヤ挟持片の平行度のずれが吸収され
るから、該ワイヤ繰り出しが適性長さに行えると共に、
ワイヤカットも確実となり、ショート不良等の問題が回
避されて、製品の歩留りが向上すると共に、その信頼性
をも高めることができる。(f) Effects As described above, according to the present invention, the movable wire clamping piece disposed in each clamp of the wire clamp mechanism is attached to the movable support arm via an elastic member, so that when clamping the wire, both Since deviations in the parallelism of the wire clamping pieces are absorbed, the wire can be fed out to an appropriate length, and
Wire cutting becomes reliable, problems such as short-circuit defects are avoided, and the yield of products is improved, as well as their reliability.

また、第２の実施例によればワイヤ挟持片にワイヤが密
着する問題が回避されるので、ワイヤポンディグをより
確実に行うことができる。Furthermore, according to the second embodiment, the problem of the wire coming into close contact with the wire clamping piece can be avoided, so that wire ponding can be performed more reliably.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、この発明の一実施例を示し、（ａ）は、ワイ
ヤボンダの概略側面図、（ｂ）はクランプ機構の概略平
面図、第２図は従来のワイヤクランプの一部を示す平面
図である。 Ｉ　・・・ワイヤボンダ、２　・・・ワイヤクランプ機
構、２ａ・・・上部ワイヤクランプ、２ｂ・・・下部ワ
イヤクランプ、２ｃ・・・可動ワイヤ挟持片、２ｄ・・
・固定ワイヤ挟持片、２ｅ・・弾性部材、３　・・・キ
ャピラリ、４・・・ワイヤ。1 shows an embodiment of the present invention, (a) is a schematic side view of a wire bonder, (b) is a schematic plan view of a clamp mechanism, and FIG. 2 is a plan view showing a part of a conventional wire clamp. It is a diagram. I: wire bonder, 2: wire clamp mechanism, 2a: upper wire clamp, 2b: lower wire clamp, 2c: movable wire clamping piece, 2d:
・Fixed wire clamping piece, 2e...Elastic member, 3...Capillary, 4...Wire.

Claims (1)

【特許請求の範囲】[Claims] （１）ステージ上に被接続材が載置される一方、このス
テージの上方にワイヤを貫挿せしめたキャピラリが設け
られると共に、このキャピラリの上方に一対のワイヤ挟
持片を有するワイヤクランプ機構が設けられたワイヤボ
ンダにおけるワイヤクランプ機構において、少なくとも
一方のワイヤ挟持片を、弾性部材を介して支持アームに
取り付けたことを特徴とするワイヤクランプ機構。(1) While the material to be connected is placed on a stage, a capillary into which a wire is inserted is provided above the stage, and a wire clamp mechanism having a pair of wire clamping pieces is provided above the capillary. A wire clamp mechanism for a wire bonder according to the present invention, wherein at least one wire clamping piece is attached to a support arm via an elastic member.
JP60259330A 1985-11-19 1985-11-19 Wire clamping mechanism Pending JPS62119932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60259330A JPS62119932A (en) 1985-11-19 1985-11-19 Wire clamping mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60259330A JPS62119932A (en) 1985-11-19 1985-11-19 Wire clamping mechanism

Publications (1)

Publication Number Publication Date
JPS62119932A true JPS62119932A (en) 1987-06-01

Family

ID=17332594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60259330A Pending JPS62119932A (en) 1985-11-19 1985-11-19 Wire clamping mechanism

Country Status (1)

Country Link
JP (1) JPS62119932A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268942A (en) * 1988-09-02 1990-03-08 Matsushita Electric Ind Co Ltd Wire-clamping method and device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268942A (en) * 1988-09-02 1990-03-08 Matsushita Electric Ind Co Ltd Wire-clamping method and device

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