JPH0362933A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPH0362933A
JPH0362933A JP1198462A JP19846289A JPH0362933A JP H0362933 A JPH0362933 A JP H0362933A JP 1198462 A JP1198462 A JP 1198462A JP 19846289 A JP19846289 A JP 19846289A JP H0362933 A JPH0362933 A JP H0362933A
Authority
JP
Japan
Prior art keywords
bonding
capillary
wire
air cylinder
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1198462A
Other languages
Japanese (ja)
Inventor
Hidetaka Yamaguchi
山口　英隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP1198462A priority Critical patent/JPH0362933A/en
Publication of JPH0362933A publication Critical patent/JPH0362933A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H01L2224/49173—Radial fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H01L2224/78823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase the bonding strength at the second side to the same degree as the first side and to prevent the occurrence of defective bonding by adding a mechanism for inclining a capillary in the direction of the bonding position at the first side with respect to a line that is orthogonal to the bonding surface. CONSTITUTION:A pair of knocking pins A and B 13 and 14 and a pair of knocking pins C and D 15 and 16 are arranged at both end parts in the longitudinal direction of the outer surface of an air cylinder 7 and at both sides of an acting plate 12, respectively. The air cylinder 7 is inclined in the directions of arrows (a), (b), (c) and (d) by 1 deg.-30 deg.. When bonding is performed to leads and the like on the second side, appropriate knocking pins are pushed singly or at the same time together. The air cylinder 7 is inclined by the specified angle in the directions of the corresponding arrows (a), (b), (c) and (d). Thus, a capillary 9 which is attached to the air cylinder 7 is inclined by the same angle in the direction of the bonding position on the first side with respect to a line that is orthogonal to the bonding surface. Thus, the bonding strength can be increased.

Description

【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、セカンド側ボンディング位置での接合強度を
増大させることができるワイヤーボンディング装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a wire bonding device that can increase bonding strength at a second side bonding position.

（従来の技術） 従来から半導体チップの電極端子（パッド）とリードフ
レームの電極端子（リード）とを、金、銅、アルミニウ
ム等のワイヤーを用いて接続するには、ボンディング面
に対して垂直に支持され、前記ワイヤーが内部通路に挿
通されたキャピラリーと、このキャピラリーを直交座標
に沿ってＸあるいはＹ方向に移動させるＸＹサーボ機構
等とを備えた、ワイヤーボンダーと呼ばれるボンディン
グ装置が使用されている。(Prior art) Conventionally, in order to connect the electrode terminals (pads) of a semiconductor chip and the electrode terminals (leads) of a lead frame using wires made of gold, copper, aluminum, etc., wires of gold, copper, aluminum, etc. A bonding device called a wire bonder is used, which includes a supported capillary with the wire inserted into an internal passage, and an XY servo mechanism that moves the capillary in the X or Y direction along orthogonal coordinates. .

そしてこのようなワイヤーボンディング装置によれば、
まず第４図（ａ）に示すように、キャピラリー１の挿通
路を通しその先端よりわずかに突出されたワイヤー２の
先端を、電気スパークあるいは水素トーチによって溶融
してボール３（ネイルヘッド）を作り、キャピラリー１
に超音波振動を加えながら、このボール３をキャピラリ
ー１の先端で半導体チップ４のパッド５上に押付けて融
着させる。（ファースト側のボンディング）次いで第４
図（ｂ）に示すように、キャピラリー１を移動させると
同時にその先端からワイヤー２を引出してループを作る
。And according to such wire bonding equipment,
First, as shown in Fig. 4(a), the tip of the wire 2, which is passed through the insertion path of the capillary 1 and slightly protrudes from the tip, is melted using an electric spark or a hydrogen torch to form a ball 3 (nail head). , capillary 1
While applying ultrasonic vibration to the ball 3, the tip of the capillary 1 presses the ball 3 onto the pad 5 of the semiconductor chip 4 to fuse it. (first side bonding) then fourth
As shown in Figure (b), at the same time as the capillary 1 is moved, the wire 2 is pulled out from its tip to form a loop.

そして第４図（Ｃ）に示すように、キャピラリー１の先
端をリード６上に押し当てた状態でファースト側と同様
に超音波振動を加え、ワイヤー２ループの基端をリード
６上に融着させる。（セカンド側のボンディング） さらに融着後キャピラリー１を持上げ、クランパによっ
てワイヤー２を融着部とキャピラリー１との間で切断し
、次のボンディング操作に備える。Then, as shown in FIG. 4(C), with the tip of the capillary 1 pressed against the lead 6, ultrasonic vibration is applied in the same way as on the first side, and the proximal end of the wire 2 loop is fused onto the lead 6. let (Second side bonding) After the fusion, the capillary 1 is further lifted, and the wire 2 is cut between the fused portion and the capillary 1 by a clamper, in preparation for the next bonding operation.

（発明が解決しようとする課ＷＪ） しかしながら従来のワイヤーボンディング装置によるこ
のような方法においては、ファースト側では最初に水素
トーチ等によってワイヤー２の先端をボール状に溶融さ
せているため、−ワイヤー２とパッド５との接合強度（
ボンディング強度）が大きいが、セカンド側においては
、キャピラリー１の先端でワイヤー２を押付は超音波振
動をかけて圧着するだけなので、ファースト側に比べて
ボンディング強度が小さい。(Problem to be solved by the invention WJ) However, in such a method using a conventional wire bonding device, the tip of the wire 2 is first melted into a ball shape using a hydrogen torch or the like on the first side. The bonding strength between and pad 5 (
However, on the second side, pressing the wire 2 at the tip of the capillary 1 only applies ultrasonic vibration and crimping, so the bonding strength is smaller than on the first side.

そのためボンディングの良不良を計価するための引張り
拭験で、セカンド側のワイヤー２が融着部から剥がれる
ことが多かった。For this reason, the wire 2 on the second side often peeled off from the fused portion during a tensile wiping test to evaluate the quality of bonding.

またセカンド側のボンディング強度を高め、ファースト
側のボンディング強度との差異を縮めるために、キャピ
ラリー１の圧接峙間、圧接力、超音波振動力などを増大
させることが考えられるが、いまだ根本的な解決に至っ
ていないのが現状であった。In addition, in order to increase the bonding strength on the second side and reduce the difference with the bonding strength on the first side, it is possible to increase the pressure contact distance, pressure contact force, ultrasonic vibration force, etc. of capillary 1, but there is still no fundamental problem. At present, the issue has not been resolved.

さらにキャピラリー１の先端の径を大きくしてセカンド
側での圧着面積を増大させ、それによってボンディング
強度を高めることも考えられるが、これは、近年の高密
度実装化に伴うパッド５およびリード６の小面積化の傾
向にそぐわないという問題があった。Furthermore, it is possible to increase the diameter of the tip of the capillary 1 to increase the crimping area on the second side, thereby increasing the bonding strength. There was a problem in that it did not match the trend toward smaller areas.

本発明はこれらの問題を解決するためになされたもので
、セカンド側におけるボンディングの強度をファースト
側と同程度まで増大させ、ボンディング不良の発生を防
止することができるワイヤーボンディング装置を提供す
ることを目的とする。The present invention has been made to solve these problems, and an object of the present invention is to provide a wire bonding device that can increase the bonding strength on the second side to the same level as that on the first side and prevent the occurrence of bonding defects. purpose.

［発明の構成コ （課題を角￥決するための手段） 本発明のワイヤーボンディング装置は、内部の神通路に
ｔＩＴｉ通されたボンディングワイヤーを保持する牛ヤ
ピラリーと、前記キャピラリーを直交座標に沿ってＸあ
るいはＹ方向に移動させるＸＹサーボ機構と、前記キャ
ピラリーを上下に運動させる上下動機構と、前記ワイヤ
ーの先端を肩融させる加熱機構とを備えてなるワイヤー
ボンディング装置において、前記キャピラリーをセカン
ド側のボンディング位置で、ボンディング面に垂直な直
線に対してファースト側ボンディング位置の方向へ１０
から３０°傾ける機構を、前記ＸＹサーボ機構に付加し
てなることを特徴としている。[Configuration of the Invention (Means for Solving the Problem) The wire bonding apparatus of the present invention includes a capillary that holds a bonding wire passed through an internal channel, and a capillary that is Alternatively, in a wire bonding apparatus comprising an XY servo mechanism that moves the capillary in the Y direction, a vertical movement mechanism that moves the capillary up and down, and a heating mechanism that melts the tip of the wire, the capillary is bonded to a second side. 10 in the direction of the first side bonding position with respect to a straight line perpendicular to the bonding surface.
The present invention is characterized in that a mechanism for tilting by 30 degrees from the XY servo mechanism is added to the XY servo mechanism.

（作用） 本発明のワイヤーボンディング装置においては、キャピ
ラリーがセカンド側のボンディング位置に達したとき、
これをボンディング面に垂直な直線に対してファースト
側ボンディング位置の方向へ１″から３０°傾ける機構
が設けられているので、セカンド側のボンディングの際
にはキャピラリーはファースト側に前記角度たけ傾けら
れた状態で押付けられる。(Function) In the wire bonding device of the present invention, when the capillary reaches the bonding position on the second side,
A mechanism is provided to tilt the capillary by 1" to 30 degrees in the direction of the first side bonding position with respect to a straight line perpendicular to the bonding surface, so when bonding the second side, the capillary is tilted by the above angle toward the first side. It is pressed in a closed position.

したがってこのときワイヤーは、傾けられたキャピラリ
ーの先端によってより強くボンディング面に押付けられ
、かつこれによってワイヤーとボンディング面との接触
面積が増大するので、ボンディング強度が増大される。Therefore, at this time, the wire is pressed more strongly against the bonding surface by the tip of the inclined capillary, and this increases the contact area between the wire and the bonding surface, thereby increasing the bonding strength.

またワイヤーボンディング装置におけるキャピラリーは
、超音波振動、機械的スクラブ、ボンディング荷重（ボ
ンディングの際の押圧力）など多くの力が加えられ、こ
れをボンディング面に伝える重要な役割を有する構成要
素であるが、本発明においてはこのような傾き形成機構
を付加しても、キャピラリーの働きが妨げられることが
ない。In addition, the capillary in wire bonding equipment is a component that plays an important role in transmitting many forces such as ultrasonic vibration, mechanical scrubbing, and bonding load (pressing force during bonding) to the bonding surface. In the present invention, even if such an inclination forming mechanism is added, the function of the capillary is not hindered.

さらにセカンド側ボンディング後のワイヤーの切断効率
も向上するので、切断ミスの発生およびこれに起因する
ボンディング不良を低減することができる。Furthermore, since the efficiency of cutting the wire after second-side bonding is improved, it is possible to reduce the occurrence of cutting errors and bonding defects caused by the cutting errors.

（実施例） 以下、本発明の実施例を図面に基づいて説明する。(Example) Embodiments of the present invention will be described below based on the drawings.

第１図は本発明のワイヤーボンディング装置の一実施例
を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the wire bonding apparatus of the present invention.

図において符号７はエアーシリンダを示し、これはＸＹ
テーブル（図示を省略。）の上に載置され、直交座標に
沿ってＸあるいはＹ方向に移動することができるように
構成されている。In the figure, numeral 7 indicates an air cylinder, which is
It is placed on a table (not shown) and is configured to be movable in the X or Y direction along orthogonal coordinates.

そしてこのエアーシリンダ７の円筒状の外周面には支持
棒８が突設されており、支持棒８の先端にはキャピラリ
ー９がボンディング面に対してほぼ垂直になるように取
着されている。このキャピラリー９を長さ方向に貫通し
て設けられた挿通路には、金線のようなボンディングワ
イヤー１０が挿通され保持されている。A support rod 8 is protruded from the cylindrical outer peripheral surface of the air cylinder 7, and a capillary 9 is attached to the tip of the support rod 8 so as to be substantially perpendicular to the bonding surface. A bonding wire 10, such as a gold wire, is inserted into and held in an insertion path provided through the capillary 9 in the length direction.

またエアーシリンダ７の端面と外周面上部には、作用板
１１．１２がそれぞれ前記外周面に垂直に取付けられて
いる。Furthermore, action plates 11 and 12 are respectively attached to the end face and the upper part of the outer peripheral surface of the air cylinder 7, perpendicular to the outer peripheral surface.

さらにエアーシリンダ７の外周面の長さ方向両端部と作
用板１２の両側には、一対のノックピンＡとＢ１３．１
４およびＣとＤ１５．１６がそれぞれ配置されており、
各ノックピンを押すことによってエアーシリンダ７が対
応する矢印ａ、ｂ。Furthermore, a pair of knock pins A and B13.
4 and C and D15.16 are respectively arranged,
By pushing each dowel pin, the air cylinder 7 corresponds to arrows a and b.

Ｃ１およびｄの方向へｌ″から３０″だけ傾くように構
成されている。It is configured to be inclined by 30'' from l'' in the direction of C1 and d.

またさらに作用板１１．１２を間に挟んでその両側には
、一対のコイル状スプリング１７．１８がそれぞれ対向
して配置されており、通常はこれらのスプリングによっ
て作用板１１．１２が両側から同じ力で押圧付勢され、
水平あるいは垂直な状態に保持されるように構成されて
いる。Furthermore, a pair of coiled springs 17.18 are arranged facing each other on both sides of the action plate 11.12, and normally these springs force the action plate 11.12 from the same side from both sides. Pressed and biased by force,
It is configured to be held horizontally or vertically.

また作用板１１．１２の周りには、それぞれ断面コの字
形のストッパー１９．２０が配設されており、エアーシ
リンダ７がキャピラリー９の形状などによって異なる所
定の角度を越えて傾けられることがないように構成され
ている。Further, stoppers 19 and 20 each having a U-shaped cross section are arranged around the action plates 11 and 12, so that the air cylinder 7 is not tilted beyond a predetermined angle that varies depending on the shape of the capillary 9, etc. It is configured as follows.

さらにキャピラリー９は、図示を省略したカム軸による
上下動機構に連結されており、前記ＸＹテーブルによる
水平方向の移動とタイミングをとって、上下動が行われ
るように構成されている。Further, the capillary 9 is connected to a vertical movement mechanism using a camshaft (not shown), and is configured to move vertically in synchronization with horizontal movement by the XY table.

またさらにこのような実施例のボンディング装置には、
ワイヤーの先端を溶融させる水素トーチのような加熱機
構と、キャピラリー９に超音波振動を加える超音波発生
器（いずれも図示を省略。）とが付設されている。Furthermore, the bonding apparatus of such an embodiment includes:
A heating mechanism such as a hydrogen torch that melts the tip of the wire and an ultrasonic generator (both not shown) that apply ultrasonic vibration to the capillary 9 are attached.

このように構成される実施例のワイヤーボンディング装
置においては、セカンド側のリード等へのボンディング
のときに、適当なノックピンを単独であるいは同時に押
し、エアーシリンダ７をそれぞれに対応する矢印ａ、ｂ
Ｓｃ、およびｄの方向へ所定の角度だけ傾けることによ
って、エアーシリンダ７に取付けられたキャピラリー９
を、ボンディング面に垂直な線に対してファースト側ボ
ンディング位置の方向へ同じ角度だけ傾け、これによっ
てボンディング強度を高めることができる。In the wire bonding apparatus of the embodiment configured as described above, when bonding to the second side lead, etc., appropriate dowel pins are pressed singly or simultaneously, and the air cylinder 7 is moved in the direction of the arrows a and b corresponding to the respective dowel pins.
The capillary 9 attached to the air cylinder 7 is tilted by a predetermined angle in the directions of Sc and d.
are tilted by the same angle in the direction of the first bonding position with respect to a line perpendicular to the bonding plane, thereby increasing the bonding strength.

すなわち第２図に示すように、ファースト側ボンディン
グの位置座標を（０，０）とすると、セカンド側のボン
ディング位置の座標によって、図に示すＡ−Ｄの各ノッ
クピンを単独でまたは２つ以上同時に作動させた場合に
は、第３図（ａ）に拡大して示すように、キャピラリー
９は、ストッパー１９．２０の配設位置によって決めら
れた所定の角度だけファースト側へ傾けられた状態でボ
ンディング面２１に押し当てられる。In other words, as shown in Fig. 2, if the position coordinates of the first side bonding are (0, 0), then each dowel pin A to D shown in the figure can be moved singly or two or more at the same time depending on the coordinates of the second side bonding position. When activated, the capillary 9 is tilted toward the first side by a predetermined angle determined by the position of the stoppers 19 and 20, as shown in an enlarged view in FIG. It is pressed against the surface 21.

そのためワイヤー１０は、キャピラリー９の先端によっ
てより強くボンディング面２１に押付けられ、かつこの
ときワイヤー１０とボンディング面２１との接触面積が
、キャピラリー９をボンディング面２１に垂直に押付け
た場合（第３図（ｂ）に示す。）に比べて増大するので
、ボンディング強度が大きくなる。Therefore, the wire 10 is pressed more strongly against the bonding surface 21 by the tip of the capillary 9, and at this time, the contact area between the wire 10 and the bonding surface 21 is larger than that when the capillary 9 is pressed perpendicularly to the bonding surface 21 (see FIG. (b)), so the bonding strength increases.

なお以上の実施例においては、２対のノックピンＡとＢ
１３．１４およびＣとＤ１５．１６をそれぞれ用い、エ
アーシリンダー７の各方向の傾き角度を変えるように構
成したが、このような構造に限定されず、エアーシリン
ダー７の傾きを任意に変えることができる機構であれば
どのような機構でも使用することができる。In the above embodiment, two pairs of dowel pins A and B are used.
13.14, C, and D15.16 are used to change the inclination angle of the air cylinder 7 in each direction, but the structure is not limited to this, and the inclination of the air cylinder 7 can be changed arbitrarily. Any mechanism that can be used can be used.

［発明の効果コ 以上説明したように本発明のワイヤーボンディング装置
においては、キャピラリーをボンディング面に垂直な線
に対してファースト側ボンディング位置の方向に傾ける
機構が付加されているので、セカンド側におけるボンデ
ィングの強度をファースト側と同程度まで増大させるこ
とができる。[Effects of the Invention] As explained above, in the wire bonding apparatus of the present invention, a mechanism is added that tilts the capillary in the direction of the first side bonding position with respect to a line perpendicular to the bonding surface. The strength of the first side can be increased to the same level as the first side.

またボンディング後のワイヤーの切断効率も向上し、切
断ミスの発生およびそれに起因する導通不良を防止する
ことができる。Furthermore, the efficiency of cutting the wire after bonding is improved, and it is possible to prevent the occurrence of cutting errors and conduction defects caused by them.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明のワイヤーボンディング装置の一実施例
を示す斜視図、第２図はセカンド側ボンディング位置と
作動させるノックピンの種類を示す説明図、第３図は実
施例におけるキャピラリーの圧接状態を示す拡大図、第
４図はワイヤーボンディング方性を説明するための模式
図である。 ７・・・・・・・・・エアーシリンダー９・・・・・・
・・・キャピラリー １０・・・・・・・・・ワイヤー １３． １４．１５．１６・・・ノックビン １７． １８・・・スプリング １９． ２０・・・ストッパーFig. 1 is a perspective view showing an embodiment of the wire bonding device of the present invention, Fig. 2 is an explanatory diagram showing the second side bonding position and the type of knock pin to be operated, and Fig. 3 shows the press contact state of the capillary in the embodiment. The enlarged view shown in FIG. 4 is a schematic diagram for explaining the wire bonding direction. 7... Air cylinder 9...
...Capillary 10...Wire 13. 14.15.16... Knock bottle 17. 18...Spring 19. 20...stopper

Claims (1)

【特許請求の範囲】[Claims] （１）内部の挿通路に挿通されたボンディングワイヤー
を保持するキャピラリーと、前記キャピラリーを直交座
標に沿ってＸあるいはＹ方向に移動させるＸＹサーボ機
構と、前記キャピラリーを上下に運動させる上下動機構
と、前記ワイヤーの先端を溶融させる加熱機構とを備え
てなるワイヤーボンディング装置において、前記キャピ
ラリーをセカンド側のボンディング位置で、ボンディン
グ面に垂直な直線に対してファースト側ボンディング位
置の方向へ１゜から３０゜傾ける機構を、前記ＸＹサー
ボ機構に付加してなることを特徴とするワイヤーボンデ
ィング装置。(1) A capillary that holds a bonding wire inserted through an internal insertion passage, an XY servo mechanism that moves the capillary in the X or Y direction along orthogonal coordinates, and a vertical movement mechanism that moves the capillary up and down. , a wire bonding apparatus comprising a heating mechanism for melting the tip of the wire, the capillary is moved at a second side bonding position by 1° to 30° in the direction of the first side bonding position with respect to a straight line perpendicular to the bonding surface. A wire bonding device characterized in that a tilting mechanism is added to the XY servo mechanism.
JP1198462A 1989-07-31 1989-07-31 Wire bonding apparatus Pending JPH0362933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1198462A JPH0362933A (en) 1989-07-31 1989-07-31 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1198462A JPH0362933A (en) 1989-07-31 1989-07-31 Wire bonding apparatus

Publications (1)

Publication Number Publication Date
JPH0362933A true JPH0362933A (en) 1991-03-19

Family

ID=16391510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1198462A Pending JPH0362933A (en) 1989-07-31 1989-07-31 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPH0362933A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2101350A1 (en) * 2008-03-12 2009-09-16 F&K Delvotec Bondtechnik GmbH Method and wire bonder for producing a gold wire bond connection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2101350A1 (en) * 2008-03-12 2009-09-16 F&K Delvotec Bondtechnik GmbH Method and wire bonder for producing a gold wire bond connection

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