JPS62110989U - - Google Patents
Info
- Publication number
- JPS62110989U JPS62110989U JP1985202937U JP20293785U JPS62110989U JP S62110989 U JPS62110989 U JP S62110989U JP 1985202937 U JP1985202937 U JP 1985202937U JP 20293785 U JP20293785 U JP 20293785U JP S62110989 U JPS62110989 U JP S62110989U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting display
- light
- transmitting resin
- concave surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985202937U JPH0241662Y2 (de) | 1985-12-28 | 1985-12-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985202937U JPH0241662Y2 (de) | 1985-12-28 | 1985-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62110989U true JPS62110989U (de) | 1987-07-15 |
JPH0241662Y2 JPH0241662Y2 (de) | 1990-11-06 |
Family
ID=31167788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985202937U Expired JPH0241662Y2 (de) | 1985-12-28 | 1985-12-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0241662Y2 (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003529792A (ja) * | 2000-03-31 | 2003-10-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるled発光器 |
JP2004512670A (ja) * | 2000-05-12 | 2004-04-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトニック素子及びその製造方法 |
JP2007065080A (ja) * | 2005-08-29 | 2007-03-15 | Sony Corp | 空間光変調光学装置とこれを用いた虚像光学装置及び投射型画像表示装置 |
JP2014165333A (ja) * | 2013-02-25 | 2014-09-08 | Kyocera Corp | 光照射デバイス、光照射モジュールおよび印刷装置 |
JP2016045306A (ja) * | 2014-08-21 | 2016-04-04 | 株式会社エンプラス | 光束制御部材、面光源装置および表示装置 |
-
1985
- 1985-12-28 JP JP1985202937U patent/JPH0241662Y2/ja not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003529792A (ja) * | 2000-03-31 | 2003-10-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるled発光器 |
JP2004512670A (ja) * | 2000-05-12 | 2004-04-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトニック素子及びその製造方法 |
JP2007065080A (ja) * | 2005-08-29 | 2007-03-15 | Sony Corp | 空間光変調光学装置とこれを用いた虚像光学装置及び投射型画像表示装置 |
JP2014165333A (ja) * | 2013-02-25 | 2014-09-08 | Kyocera Corp | 光照射デバイス、光照射モジュールおよび印刷装置 |
JP2016045306A (ja) * | 2014-08-21 | 2016-04-04 | 株式会社エンプラス | 光束制御部材、面光源装置および表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0241662Y2 (de) | 1990-11-06 |