JPS6210621Y2 - - Google Patents
Info
- Publication number
- JPS6210621Y2 JPS6210621Y2 JP12629182U JP12629182U JPS6210621Y2 JP S6210621 Y2 JPS6210621 Y2 JP S6210621Y2 JP 12629182 U JP12629182 U JP 12629182U JP 12629182 U JP12629182 U JP 12629182U JP S6210621 Y2 JPS6210621 Y2 JP S6210621Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- mat
- electronic circuit
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 4
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 23
- 101100495270 Caenorhabditis elegans cdc-26 gene Proteins 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 3
- 235000011613 Pinus brutia Nutrition 0.000 description 3
- 241000018646 Pinus brutia Species 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- -1 ship engine rooms Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
この考案は、発熱体と放熱体の間にマツトを配
置した熱伝達装置に関するものである。[Detailed Description of the Invention] This invention relates to a heat transfer device in which a mat is arranged between a heating element and a heat radiating element.
第１図は従来の熱伝達装置である冷却装置の構
成を示す断面図であり、図において１は配線板、
２は配線板上に装着および配線結合された抵抗
体、ICを含む電子回路部品であり、大矢印は強
制対流の流れを示す。 FIG. 1 is a cross-sectional view showing the configuration of a cooling device, which is a conventional heat transfer device. In the figure, 1 is a wiring board;
2 is an electronic circuit component including a resistor and an IC mounted and wired on a wiring board, and the large arrow indicates the flow of forced convection.
この構成において、電子回路部品２を作動させ
ると、これら電子回路部品２から成る発熱体は昇
温することになるが、温度が許容値以上になる
と、正常に作動しなくなるためなんらかの方法に
より冷却する必要がある。冷却の方法としては、
一般に大気中においてフアン、あるいはコンプレ
ツサ等（図示していない）で送り出される空気を
使つて電子回路部品２の温度が許容値以下となる
よう強制空冷をしている。 In this configuration, when the electronic circuit components 2 are operated, the temperature of the heating element made up of these electronic circuit components 2 will rise, but if the temperature exceeds a permissible value, it will no longer operate normally, so it must be cooled down by some method. There is a need. As a method of cooling,
Generally, forced air cooling is performed in the atmosphere using air sent out by a fan or a compressor (not shown) so that the temperature of the electronic circuit component 2 is below a permissible value.
しかし、配線板１の設置される場所は電子計算
機室や生産管理制御室などのように温度、湿度、
塵埃の調節や対策が厳しく行われているとは限ら
ない。例えば船舶の機関室、製鉄所、および精粉
所のように塩分を含む環境や、導電性、腐食性の
ガスやミスト、粉塵が空気中に浮遊している場所
等、悪環境の場所に設置される場合が最近ますま
す増加しているのが現状である。したがつて、上
記のような悪環境においては第１図に示した電子
回路部品２の装着部、および配線箇所に導電性あ
るいは腐食性のガスやミストを含む粉塵が付着す
るため粉塵の付着した部分が腐食したり、絶縁破
壊して電子回路部品２の機能が低下したり、寿命
が短くなるという欠点がある。 However, the location where the wiring board 1 is installed may vary in temperature, humidity, etc., such as in a computer room or a production management control room.
Dust control and countermeasures are not always strictly enforced. For example, installation in locations with adverse environments, such as environments containing salt such as ship engine rooms, steel mills, and flour mills, or locations where conductive or corrosive gases, mist, or dust are suspended in the air. The current situation is that the number of cases where this is done is increasing recently. Therefore, in the above-mentioned adverse environment, dust containing conductive or corrosive gas or mist adheres to the mounting area of the electronic circuit component 2 shown in Figure 1 and the wiring area. There are disadvantages in that parts may corrode or dielectric breakdown may occur, reducing the functionality of the electronic circuit component 2 and shortening its lifespan.
このような欠点を無くする方法として、第２図
に他の従来の熱伝達装置である冷却装置の構成を
断面図で示す。図において１，２および大矢印は
上記従来装置と全く同一のものであり、３は放熱
体である。 As a method for eliminating such a drawback, the structure of another conventional heat transfer device, a cooling device, is shown in a cross-sectional view in Figure 2. In the figure, 1, 2 and the large arrow are exactly the same as those in the above-mentioned conventional device, and 3 is a heat sink.
この構成において、電子回路部品２や配線板１
を外気と遮断する密閉容器を兼ねた放熱体３に収
納しようとするものであるが、この場合には電子
回路部品２を上記従来例のように冷却用の空気で
直接冷却できず、電子回路部品２の温度を次に説
明する理由から許容値内にすることが困難となる
欠点がある。 In this configuration, electronic circuit components 2 and wiring board 1
However, in this case, the electronic circuit components 2 cannot be directly cooled with cooling air as in the conventional example, and the electronic circuit components 2 There is a drawback that it is difficult to keep the temperature of the component 2 within an allowable value for reasons explained below.
(イ) 放熱体３が無い場合の電子回路部品２と冷却
空気との温度差の試算。(a) Trial calculation of the temperature difference between the electronic circuit component 2 and the cooling air when there is no heat sink 3.
この場合、電子回路部品２からの熱は冷却空
気により直接奪われることになる。電子回路部
品２と冷却空気との温度差をΔθ１とすると、
Δθ１は1a式で表わされる。 In this case, heat from the electronic circuit component 2 is directly removed by the cooling air. If the temperature difference between the electronic circuit component 2 and the cooling air is Δθ 1 ,
Δθ 1 is expressed by equation 1a.
△θ１＝ｑ（１／αａｖ・Ｓ）deg （1a）
（ｑ：電子回路部品２の発熱量Ｗ
αav：強制対流熱伝達率であり、通常40W／m2℃
（風速10ｍ／Ｓ、代表長さ0.1ｍ）程度であ
る。 △θ 1 = q (1/αav・S) deg (1a) (q: Calorific value W of electronic circuit component 2 αav: Forced convection heat transfer coefficient, usually 40 W/m 2 ℃ (Wind speed 10 m/S, typical The length is approximately 0.1m).
Ｓ：伝熱面積m2） したがつて1a式は1b式のようになる。S: heat transfer area m 2 ) Therefore, formula 1a becomes formula 1b.
△θ１＝ｑ／４０Ｓdeg （1b）
(ロ) 放熱体３が有る場合の電子回路部品２と冷却
空気との温度差の試算。 △θ 1 = q/40Sdeg (1b) (b) Estimation of the temperature difference between the electronic circuit component 2 and the cooling air when the heat sink 3 is provided.
この場合、電子回路部品２からの熱はまず放
熱体３内の空気に熱伝達により伝わつた後、放
熱体３の壁に熱伝達により伝わり、次に放熱体
から冷却空気へ熱伝達により伝わることにな
る。電子回路部品２と冷却空気との温度差を△
θ２とすると、△θ２は2a式で表わされる。 In this case, the heat from the electronic circuit component 2 is first transferred to the air inside the heat sink 3 by heat transfer, then to the wall of the heat sink 3 by heat transfer, and then from the heat sink to the cooling air by heat transfer. become. The temperature difference between electronic circuit component 2 and cooling air is △
When θ 2 is assumed, Δθ 2 is expressed by equation 2a.
△θ２＝ｑ（１／αａｎ・Ｓ＋１／αａｎ・Ｓ ＋１／αａｖ・Ｓ）deg （2a） （ｑ・αav・Ｓは1a式と同じである。 Δθ 2 =q(1/αan・S+1/αan・S+1/αav・S)deg (2a) (q・αav・S is the same as equation 1a.
αan：空気の自然対流熱伝達率であり、通常
5W／m2℃程度である。）
したがつて2a式は2b式のようになる。αan: Natural convection heat transfer coefficient of air, usually
It is about 5W/m 2 ℃. ) Therefore, formula 2a becomes formula 2b.
△θ２＝ｑ（１／５Ｓ＋１／５Ｓ＋１／４０Ｓ）＝
１７ｑ／４０Ｓdeg（2b）
なお、実際には2a式において、放熱体３の壁を
熱が伝わる影響も考慮する必要があるがこの影響
は非常に小さいので無視した。 △θ 2 =q(1/5S+1/5S+1/40S)=
17q/40Sdeg (2b) In practice, in formula 2a, it is necessary to consider the effect of heat being transmitted through the wall of the heat sink 3, but this effect is very small, so it was ignored.
上記1b，2b式から得られた△θ１，△θ２の
値を比較するとわかるように、放熱体３を設ける
ことにより、電子回路部品２の冷却空気に対する
温度上昇値は、放熱体３を設けない場合の17倍に
もなる。 As can be seen by comparing the values of △θ 1 and △θ 2 obtained from equations 1b and 2b above, by providing the heat sink 3, the temperature rise value of the electronic circuit component 2 relative to the cooling air is This is 17 times more than if it were not installed.
この考案は、上記のような従来のものの欠点を
除去するためになされたもので、発熱体と放熱体
との間隙に、両者に密着しておかれたマツトを内
部に外気圧より高圧の熱媒体を充満させ変形自在
に形成することにより悪環境条件下においても、
熱輸送量を増大させ発熱体の熱を効果的に放熱し
ようとするものである。 This idea was made in order to eliminate the drawbacks of the conventional ones as mentioned above.In the gap between the heating element and the heat radiating element, a mat that was placed in close contact with both was placed inside to generate heat at a higher pressure than the outside pressure. By filling the medium and making it deformable, even under adverse environmental conditions,
The aim is to increase the amount of heat transport and effectively dissipate the heat from the heating element.
第３図はこの考案の一実施例を示す断面図であ
り、１，２は上記従来装置と全く同一のものであ
る。３は配線板１と電子回路部品２をその内部に
収納できるように作られた密閉容器を兼ねた放熱
体であるが、電子回路部品２の取換えや保守点検
の際には外せる構造になつている。４は伝熱マツ
トであり、５は伝熱マツト膜で、変形自在な材料
で形成されている。６は熱媒体であり例えば水な
どの液体が封入されている。 FIG. 3 is a sectional view showing an embodiment of this invention, and numerals 1 and 2 are exactly the same as the conventional device described above. Reference numeral 3 denotes a heat radiator that also serves as a sealed container that is made to accommodate the wiring board 1 and electronic circuit components 2, but has a structure that allows it to be removed when replacing or maintaining the electronic circuit components 2. ing. 4 is a heat transfer mat, and 5 is a heat transfer mat film made of a deformable material. Reference numeral 6 denotes a heat medium, and a liquid such as water is sealed therein.
上記のように構成された熱伝達装置である冷却
装置において、伝熱マツト４は、電子回路部品２
群と放熱体３の間隙に設けており、その体積を放
熱体３と電子回路部品２群の包絡面との間にでき
る間隙体積より少し大きくし、内圧も外圧より高
圧にしておくと、伝熱マツトが変形して、放熱体
と電子回路部品２の両方に密着することになる。
この場合、電子回路部品２からの熱は、まず電子
回路部品２に密着した伝熱マツト膜５を伝導で伝
わつた後、伝熱マツト４内の熱媒体６に熱伝達に
より伝わり、放熱体３に密着した伝熱マツト膜５
に熱伝達により伝わる。その後、マツト膜５と放
熱体３壁を伝導で伝わり、最後に冷却空気へ熱伝
達により伝わることになる。電子回路部品２と冷
却空気間の温度差を△θ３とすると、△θ３は3a
式で表わされる。 In the cooling device, which is a heat transfer device configured as described above, the heat transfer mat 4 is connected to the electronic circuit component 2.
If the volume is slightly larger than the volume of the gap formed between the heat sink 3 and the envelope surface of the electronic circuit component group 2, and the internal pressure is higher than the external pressure, the transmission will be improved. The thermal mat is deformed and comes into close contact with both the heat sink and the electronic circuit component 2.
In this case, the heat from the electronic circuit component 2 is first transmitted by conduction through the heat transfer mat film 5 in close contact with the electronic circuit component 2, and then transmitted to the heat medium 6 in the heat transfer mat 4 by heat transfer, and then transferred to the heat dissipation body 3. Heat transfer mat film 5 in close contact with
is transferred by heat transfer. Thereafter, the heat is transmitted through the pine membrane 5 and the wall of the heat sink 3 by conduction, and finally to the cooling air by heat transfer. If the temperature difference between the electronic circuit component 2 and the cooling air is △θ 3 , △θ 3 is 3a
It is expressed by the formula.
△θ３＝ｑ（１／αＧ・Ｓ＋１／αＷ・Ｓ＋１／αＷ
・Ｓ
＋１／αＧ・Ｓ＋１／αａｖ・Ｓ）deg （3a）
ｑ・αav・Ｓは1a式と同じである。 △θ 3 = q (1/αG・S+1/αW・S+1/αW
・S +1/αG・S+1/αav・S)deg (3a) q・αav・S is the same as formula 1a.
１／αＧ・Ｓ：伝熱マツト膜の伝導熱抵抗に相当する
ものであり、伝熱マツト膜の厚さを0.2mmとする
と、等価的にαＧの値を1500W／m2・℃と考えら
れる。 1/αG・S: Corresponds to the conductive heat resistance of the heat transfer pine film. If the thickness of the heat transfer pine film is 0.2 mm, the value of αG can be equivalently considered to be 1500W/m 2・℃ .
αＷ：水の自然対流熱伝導率であり、通常
400W／m2・℃（平板代表長さ0.1ｍ）程度
である。αW: natural convection thermal conductivity of water, usually
It is about 400W/ m2・℃ (flat plate typical length 0.1m).
したがつて、3a式は3b式のようになる。 Therefore, formula 3a becomes formula 3b.
△θ３＝ｑ（１／１５００Ｓ＋１／４００Ｓ＋１／４
００Ｓ＋１／１５００Ｓ
＋１／４０Ｓ）＝１．２５ｑ／４０Ｓdeg （3b）
以上説明したように、この考案による伝熱マツ
ト４を使用することにより、電子回路部品２を放
熱体３に収納したにもかかわらず、電子回路部品
２と冷却空気間の温度差を、放熱体が無いものに
対して、25％程度の増加に押えることができる。
又、熱媒体６の容積比熱は熱媒体６が水の場合、
空気に比べて約3800倍も大きいため、電子回路部
品２にパルス的な過大発熱が生じても、熱媒体６
が熱を吸収して、電子回路部品２の温度上昇を最
小にすることが可能である。 △θ 3 = q (1/1500S+1/400S+1/4
00S + 1/1500S + 1/40S) = 1.25q/40Sdeg (3b) As explained above, by using the heat transfer mat 4 of this invention, even though the electronic circuit component 2 is housed in the heat sink 3 , the temperature difference between the electronic circuit component 2 and the cooling air can be suppressed to about 25% increase compared to one without a heat sink.
In addition, the volumetric specific heat of the heat medium 6 is when the heat medium 6 is water,
Since it is approximately 3800 times larger than air, even if pulsed excessive heat generation occurs in electronic circuit component 2, heating medium 6
can absorb heat and minimize the temperature rise of the electronic circuit component 2.
なお上記実施例で用いた変形自在マツトは、例
えばシリコーンゴム、フツソゴム等のゴム膜など
の伸縮性材料または、ガラスクロス等の裏面に、
熱媒体６に対して腐食、洩れのない金属や合成樹
脂等をコーテイングしたシートを少し大きめのマ
ツトにして用いても同様の動作を期待できる。更
に、これらの電気絶縁材料を伝熱マツト膜５に使
用することにより、電子回路部品２に伝熱マツト
膜５が密着した際にも電気的に何の問題も起こら
ないのはもちろんである。 The deformable mat used in the above examples is made of a stretchable material such as a rubber film such as silicone rubber or soft rubber, or the back side of glass cloth, etc.
A similar operation can be expected even if a sheet coated with metal, synthetic resin, etc. that does not corrode or leak against the heat medium 6 is used as a slightly larger mat. Furthermore, by using these electrically insulating materials for the heat transfer mat film 5, it goes without saying that no electrical problems will occur even when the heat transfer mat film 5 is brought into close contact with the electronic circuit component 2.
ところで上記説明ではこの考案を電子回路部品
２と放熱体３間の熱伝達をスムースに行わせる場
合について説明したが、これにとどまらず一般的
に発熱体と放熱体との間に熱が伝わりにくい空間
が存在する場合にも利用できることはいうまでも
ない。 By the way, in the above explanation, this invention was explained in the case of smooth heat transfer between the electronic circuit component 2 and the heat radiator 3, but it is not limited to this, and is generally applicable to cases in which heat is difficult to transfer between the heat generator and the heat radiator. Needless to say, it can be used even if there is space.
又、以上では発熱体として、ホツトな熱を発
し、放熱体でホツトな熱を放出する場合について
説明したが、発熱体として冷熱を発し、放熱体で
冷熱を放出する場合でも同様に適用できるもので
ある。 In addition, although the above description has been made of the case where the heating element emits hot heat and the heat radiator emits the hot heat, it can be similarly applied to the case where the heating element emits cold heat and the heat radiator emits the cold heat. It is.
次にフラツト面から成る発熱体からの熱を円筒
形のヒートパイプにより取り去る場合の従来例の
断面図を第４図に示す。図において７は発熱体、
８はヒートパイプであり、小矢印は熱の伝わり方
を示す。第５図に、この考案による伝熱マツト４
を使つた設置状況の断面図を示す。８，７は第４
図と全く同一である。これらを比較すると従来例
では、発熱体７とヒートパイプ８とは線接触であ
り、伝熱面積が小さい結果、発熱体の熱はヒート
パイプ８に伝わりにくい欠点がある。一方、この
考案による伝熱マツト４を使用した場合は、発熱
体７とヒートパイプ８とは接触部の形状にかかわ
らず、間に介在する伝熱マツト４と面接触とな
り、従来例に比べて伝熱面積が大きくなる結果、
発熱体７の熱がヒートパイプ８に伝わり易くな
る。 Next, FIG. 4 shows a sectional view of a conventional example in which heat from a heating element having a flat surface is removed by a cylindrical heat pipe. In the figure, 7 is a heating element,
8 is a heat pipe, and small arrows indicate how heat is transferred. Figure 5 shows a heat transfer mat 4 according to this invention.
A cross-sectional view of the installation situation is shown. 8 and 7 are the 4th
It is exactly the same as the figure. Comparing these, in the conventional example, the heating element 7 and the heat pipe 8 are in line contact, and as a result of the small heat transfer area, there is a drawback that the heat of the heating element is difficult to be transferred to the heat pipe 8. On the other hand, when the heat transfer mat 4 according to this invention is used, the heating element 7 and the heat pipe 8 come into surface contact with the heat transfer mat 4 interposed between them, regardless of the shape of the contact part, and compared to the conventional example, As a result of the increased heat transfer area,
The heat of the heating element 7 is easily transmitted to the heat pipe 8.
なお伝熱マツトの使用例を参考に示す。発熱体
又は放熱体の伝熱面積が小さい場合の熱輸送を増
加させるのに使用できる。すなわち空気中に置か
れた伝熱面積の小さな発熱体の熱を自然対流熱伝
達により放熱する場合の一般的の構成の断面図を
第６図に示す。図において８は空気中におかれた
伝熱面積の小さい発熱体である。第７図に伝熱マ
ツト４を使用した場合の構成の断面図を示す。図
において、伝熱マツト４は、内部に水が封入され
ている。これらを比較すると、一般的構成の場
合、放熱は、空気の自然対流熱伝達率（5W／
m2・℃）により行なわれるのに対し、伝熱マツト
４を使用した場合は、水の自然対流熱伝達率
（400W／m2・℃）を利用できるので、（1a）〜
（3a）式から類推して、伝熱マツトを使用すれ
ば、使用しない場合と比べ、熱輸送を増加させら
れることになる。 An example of the use of heat transfer mats is shown for reference. It can be used to increase heat transport when the heat transfer area of the heating element or heat dissipation element is small. That is, FIG. 6 shows a cross-sectional view of a general configuration in which heat from a heating element with a small heat transfer area placed in the air is radiated by natural convection heat transfer. In the figure, 8 is a heating element with a small heat transfer area placed in the air. FIG. 7 shows a cross-sectional view of the structure when the heat transfer mat 4 is used. In the figure, a heat transfer mat 4 has water sealed inside. Comparing these, in the case of a typical configuration, heat radiation is determined by the natural convection heat transfer coefficient of air (5W/
m2・℃), whereas when heat transfer mat 4 is used, the natural convection heat transfer coefficient of water (400W/ m2・℃) can be used, so (1a) ~
By analogy with equation (3a), using heat transfer mats can increase heat transport compared to not using them.
この考案は以上説明したとうり、発熱体と放熱
体との間隙に、内部に外気圧より高圧の熱媒体を
充満させて変形自在にしたマツトを両者に密着さ
せて置くことにより、悪環境条件下においても、
熱輸送量を増大させ発熱体の熱を効果的に放熱で
きる。 As explained above, this idea uses a deformable mat that is filled with a heating medium of higher pressure than the outside air pressure inside the gap between the heating element and the heat radiating element, and is placed in close contact with both of them. Even below,
The amount of heat transported can be increased and the heat of the heating element can be effectively dissipated.
第１図は従来の熱伝達装置である冷却装置を示
す断面図、第２図は他の従来の熱伝達装置である
冷却装置を示す断面図、第３図は、この考案の一
実施例を示す断面図、第４図は他の従来の熱伝達
装置である冷却装置を示す断面図、第５図はこの
考案の他の実施例を示す熱伝達装置である冷却装
置の断面図、第６図は一般的な冷却装置の冷却状
況を示す断面図、第７図は、参考に示すもので、
伝熱マツトを使用する冷却装置の断面図である。
図において１は配線板、２は電子回路部品等の
発熱体、３は放熱体、４は伝熱マツト、５は伝熱
マツト膜、６は熱媒体、７は発熱体、８はヒート
パイプである。なお各図中同一符号は同一または
相当部分を示すものとする。
Fig. 1 is a sectional view showing a cooling device which is a conventional heat transfer device, Fig. 2 is a sectional view showing a cooling device which is another conventional heat transfer device, and Fig. 3 is a sectional view showing an embodiment of this invention. 4 is a sectional view showing a cooling device which is another conventional heat transfer device. FIG. 5 is a sectional view of a cooling device which is a heat transfer device according to another embodiment of this invention. The figure is a cross-sectional view showing the cooling situation of a general cooling device, and Figure 7 is for reference.
1 is a cross-sectional view of a cooling device using a heat transfer mat. In the figure, 1 is a wiring board, 2 is a heating element such as an electronic circuit component, 3 is a heat sink, 4 is a heat transfer mat, 5 is a heat transfer mat film, 6 is a heat medium, 7 is a heating element, and 8 is a heat pipe. be. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
に密着しておかれ、内部に外気圧より高圧の熱
媒体を充満させた変形自在マツトを備えた熱伝
達装置。 (2) マツトを伸縮性材料で構成したことを特徴と
する実用新案登録請求の範囲第１項記載の熱伝
達装置。 (3) マツトを電気絶縁材料で構成したことを特徴
とする実用新案登録請求の範囲第１項または第
２項記載の熱伝達装置。 (4) マツトの内面に、マツト内の熱媒体に対して
耐久性を有する材料をコーテイングしたことを
特徴とする実用新案登録請求の範囲第１項ない
し第３項の何れかに記載の熱伝達装置。[Scope of Claim for Utility Model Registration] (1) A heating element, a heat radiating element, and a deformable mat that is in close contact with both and filled with a heating medium at a pressure higher than the outside pressure is provided in the gap between the two. Heat transfer device. (2) The heat transfer device according to claim 1, wherein the mat is made of a stretchable material. (3) The heat transfer device according to claim 1 or 2, wherein the mat is made of an electrically insulating material. (4) The heat transfer according to any one of claims 1 to 3 of the claims for utility model registration, characterized in that the inner surface of the mat is coated with a material that is durable against the heat medium inside the mat. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12629182U JPS5929575U (en) | 1982-08-19 | 1982-08-19 | heat transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12629182U JPS5929575U (en) | 1982-08-19 | 1982-08-19 | heat transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5929575U JPS5929575U (en) | 1984-02-23 |
| JPS6210621Y2 true JPS6210621Y2 (en) | 1987-03-12 |
Family
ID=30287220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12629182U Granted JPS5929575U (en) | 1982-08-19 | 1982-08-19 | heat transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929575U (en) |
-
1982
- 1982-08-19 JP JP12629182U patent/JPS5929575U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5929575U (en) | 1984-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4410466B2 (en) | Electronic equipment | |
| US6019167A (en) | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments | |
| US7623349B2 (en) | Thermal management apparatus and method for a circuit substrate | |
| TW470873B (en) | Miniaturization of power supply system of portable computer by improving heat dissipation | |
| CN107509365B (en) | Ultrathin microwave assembly and heat pipe radiating device | |
| US20050039884A1 (en) | Conformal heat sink | |
| JP3445784B2 (en) | Equipment for heat dissipation, especially for high performance rated ultrasonic transducers | |
| JPS6210621Y2 (en) | ||
| CN111479450A (en) | Electrical apparatus box and be equipped with its indirect heating equipment | |
| JPH1051170A (en) | Cooling device | |
| WO2013189316A1 (en) | Terminal device | |
| CN211183776U (en) | High-temperature isolation power supply module | |
| CN212362210U (en) | Indoor unit and air conditioner with condensation prevention function | |
| JP2000013066A (en) | Outdoors casing | |
| CN213659730U (en) | Semi-physical simulation training equipment | |
| CN113498305A (en) | High-power water-cooling direct-current power supply | |
| EP3209102A1 (en) | Communication system and communication device therefor | |
| CN112739176A (en) | Radiating assembly, electric cabinet and air conditioner | |
| CN217884248U (en) | Case and electronic equipment | |
| CN212086776U (en) | Possesses high-efficient heat dissipation electrical apparatus box of leakproofness | |
| CN211831667U (en) | Electrical apparatus box and be equipped with its indirect heating equipment | |
| CN220691149U (en) | Optical module, heat radiation structure and communication equipment | |
| CN218632406U (en) | Heat radiation structure for communication antenna equipment | |
| KR100886289B1 (en) | An electronic device | |
| US11520391B1 (en) | Power supply for a mining machine |