JPS6185649A - Production of stamper - Google Patents
Production of stamperInfo
- Publication number
- JPS6185649A JPS6185649A JP20785284A JP20785284A JPS6185649A JP S6185649 A JPS6185649 A JP S6185649A JP 20785284 A JP20785284 A JP 20785284A JP 20785284 A JP20785284 A JP 20785284A JP S6185649 A JPS6185649 A JP S6185649A
- Authority
- JP
- Japan
- Prior art keywords
- film
- stamper
- master disk
- resist
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 238000005323 electroforming Methods 0.000 claims abstract description 3
- 239000010408 film Substances 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 abstract description 7
- 230000001681 protective effect Effects 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 238000001771 vacuum deposition Methods 0.000 abstract description 2
- 238000004299 exfoliation Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 206010011416 Croup infectious Diseases 0.000 description 3
- 201000010549 croup Diseases 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 206010011732 Cyst Diseases 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 208000031513 cyst Diseases 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/0057—Intermediate mediums, i.e. mediums provided with an information structure not specific to the method of reproducing or duplication such as matrixes for mechanical pressing of an information structure ; record carriers having a relief information structure provided with or included in layers not specific for a single reproducing method; apparatus or processes specially adapted for their manufacture
Landscapes
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は繰り返し使用が可能な光デイスク用スタンバの
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for manufacturing a standber for an optical disk that can be used repeatedly.
光ディスクはレー１す光を使用して情報の記録と再生を
行うメモリであって、大容量記録が可能であり、非接触
で記録と再生ができ、また塵埃の影■を受は難いなど優
れた特徴を備えている。An optical disk is a memory that records and reproduces information using laser beams, and has advantages such as being capable of large-capacity recording, non-contact recording and reproduction, and being impervious to the shadows of dust. It has the following characteristics.
か賢る光ディスクはニッケル（Ｎｉ）製のスタンパを用
いてアクリル樹脂のような透明樹脂を成型し、このよう
にして作った透明基板の上にテルル（Ｔｅ ） 、セレ
ン（Ｓｅ ）などの非金属元素或いはこの化合物からな
る記録媒体を膜形成した後、かかる二枚の基板を記録媒
体面を内側とするエアサンドインチ型の構造をとって作
られている。Smart optical discs are made by molding transparent resin such as acrylic resin using a nickel (Ni) stamper, and then applying non-metallic materials such as tellurium (Te) and selenium (Se) onto the transparent substrate made in this way. After a recording medium made of an element or a compound thereof is formed into a film, the two substrates are formed into an air sandwich type structure with the recording medium side facing inside.
スタンパは平滑なガラス基板にレジストを被覆し、これ
に写真食刻技術（ホトリソグラフィ）を用いて同心円状
の多数のプリグループを作り、か＼るレジスト被覆基板
にＮｉ を真空蒸着し、その後このＮｉ蒸着膜を陰極と
してＮｉの電鋳メンキを行い、カラス基板から２ＪＩ
１ｉｘｉすることにより作られている。In the stamper, a smooth glass substrate is coated with resist, a large number of concentric pre-groups are created on this using photolithography, Ni is vacuum-deposited on the resist-coated substrate, and then Ni is vacuum-deposited on the resist-coated substrate. Electroforming of Ni is performed using the Ni vapor deposited film as a cathode, and 2JI is applied from the glass substrate.
1ixi.
第２図（Ａ）〜（Ｅ）は従来の製造工程を示すもので具
体的に説明すると次のようになる。FIGS. 2(A) to 2(E) show the conventional manufacturing process, which will be specifically explained as follows.
表面をｇｆ磨して平坦にした厚さ約１ ｃｍのガラス基
板１の上にスピンコード法により）７さ約７００ 人の
レジスト膜２を形成する（同図へ）。A resist film 2 having a thickness of approximately 700 mm is formed by a spin code method on a glass substrate 1 having a thickness of approximately 1 cm and whose surface has been flattened by gf polishing (refer to the same figure).
次にか＼るレジスト膜２に写真食刻技術を用い−ζ同上
円状のプリグループ３お数多くパターン形成する（同図
Ｂ）。Next, a large number of circular pre-groups 3 are patterned on the resist film 2 by photolithography (FIG. B).
二＼でプリグループ３は約０１）（μｍの幅と約１゜（
ｉ ）ｔ ｍ ｃ、） ｌニノナをもって形成されてお
り、直径３ｂ（、ｍのティスフの（；５合、プリグルー
プの故は４８０００Ｉ−フッ゛７と１すｊｙ）て多い。2\ and the pregroup 3 is about 01) (μm width and about 1° (
i)tmc,)l is formed with a diameter of 3b(,m) (;5, because of the pre-group, it is 48000I-F7 and 1jy).
次！’二、’ｌ・・べ′、Ｗ板上に真空凍着法Ｇこより
Ｎ１膜をキ、’、１ ：ｌ Ｅｌ ｆ＋ 、覧’） Ｉ
′、！ごに形成して電Ｈｉｌｌう１，１とする（同図０
） 。Next! '2, 'l...be', put a N1 film on the W plate using the vacuum freezing method G,',1: l El f+, view') I
',! 0 to 1 (Fig. 0).
).
次にこの電１５ｉ ＩＩり４を陰ｉ墳としてＮｉ メッ
キ浴にｌ；／（”ｊし、；Ｌ鋳メッキを行って′上極ｊ
模４の上うこ厚さｉ’Ｊ３００ Ｉｔｍのメッキ層５を
形成する（同図１〕）。Next, this electrode 15i II 4 was placed in a Ni plating bath as a negative tomb, and cast plating was performed to form the upper electrode.
A plating layer 5 having a thickness of i'J300 Itm is formed on the upper surface of pattern 4 (FIG. 1).
次ＧこＪ、・キ層５を力うス拮（反１かり’Ｍ’ｌ ；
’Ｊｔするごと；こ、Ｌリスタンパ６が形成される（同
図Ｅ）。Next GkoJ, ・Ki layer 5 is forced (anti-1kari'M'l;
Every time Jt is carried out, L listramp 6 is formed (E in the same figure).
以上のようにしてスタンパ６を形成し、これをｔＥ用し
−ご樹脂鋳型することにより光ティスフＷ ｌ）ｊ。The stamper 6 is formed as described above, and the stamper 6 is molded into a resin mold for tE to produce an optical stamper Wl)j.
が形成されている。is formed.
が：し、多数の光ティスフ４ Ｕｙ、を鋳込み成形する
とｔノを型が（１’、耗するため、成る回数に互２．て
使用するとスタンパ６を更新することが必要であるが、
今までは第２図（Ｂ）に示すプリグループ原盤７からは
一個のスタンパしか形成できなかったために改めて（Δ
）の工程に遡ってやり直すことが必要であり、そのため
多大の工数を必要とし、この改とが要望されていた。However, when molding a large number of optical stamps 4, the mold wears out, so it is necessary to renew the stamper 6 when used repeatedly.
Until now, only one stamper could be formed from the pre-group master disk 7 shown in FIG.
), it is necessary to go back and redo the process, which requires a large amount of man-hours, and this revision was requested.
（発明か解決しようとする問題点〕
以上記したように光ディスク基板を樹脂成形するのに使
用するスタンパは型寿命があり、そのため規定回数使用
すると更新か必要であるが、この場合にプリクループ原
盤は再使用ができないために初めから作り直すことが必
要で、その度毎に多くの工数を要することが問題であっ
た。(Problem to be solved by the invention) As mentioned above, the stamper used to resin mold the optical disk substrate has a mold life, and therefore needs to be renewed after a specified number of uses. Since it cannot be reused, it has to be remade from scratch, which requires a lot of man-hours each time.
上記の問題点はレジスト原盤に電極膜を被覆した後、該
電極１りに電鋳メッキを施してスタンパを形成する光デ
イスク基板の形成工程において、レジスト原盤に金属薄
膜を被覆し、該金属薄膜を酸化する処理を行った該被処
理基板に電極膜の被覆と電ｔノｔメッキ処理を行ってス
タンパを形成することを特徴とするスタンパの製造方法
をとることにより解決することができる。The above problem arises when the resist master is coated with a metal thin film in the process of forming an optical disk substrate, in which a resist master is coated with an electrode film and then one electrode is electroplated to form a stamper. This problem can be solved by using a stamper manufacturing method characterized in that the stamper is formed by coating the substrate to be processed, which has been subjected to an oxidation process, with an electrode film and performing an electric plating process.
従来行われてきたスタンパの製造方法において一個のプ
リグループ原盤より一個のスタンパしか製造できない理
由は第２図（Ｄ）に示すメッキ層５をカラス基板１から
７８１１■して同ｔｆｌ （Ｅ）に不ずス壬“ンバ（ｊ
を形成する際、プリクループ原盤のし一′・ストち部分
的に：ｔ、＋＋ ＃ＩＩｔされて精度か低トするために
原；斥ｒとして使えなくなることによる。The reason why only one stamper can be manufactured from one pre-group master in the conventional stamper manufacturing method is that the plating layer 5 shown in FIG. Fuzusu Mi “Mba (j
When forming the pre-croup master, the pre-croup master's position and strike are partially changed, reducing the accuracy and making it unusable as a master.
そこで）コ）゛こ明はメッキ層５を′ｌ、すｊ言；Ｉ［
する際にレジストか７１１：１１１１シないように保護
膜を設けることにより代↓々Ｈの使用をｉｉＪ能にする
ものである。Therefore, the plating layer 5 is
By providing a protective film to prevent the resist from 711:1111 damage during the process, the use of H can be made more efficient.
（実晦例〕
第１図は本発明を実施したスタンパの製造り程１・′１
て従、＋６の一１程と５１（なる所はブリクルーフ原詔
上に硬くまた。７＋１型作用のある保、ｉｉｉ ｌｌ夕
を設りたことである。(Example) Figure 1 shows the manufacturing process 1/'1 of a stamper according to the present invention.
Therefore, +6's 11th degree and 51th (this is due to the establishment of a 7 + 1-type effect protection, iii ll) on the Brickloof original edict.
以丁図面により本発明を説明する。The present invention will now be explained with reference to the drawings.
第１ ＋：’＜Ｉ （Δ）はガラス基ｔｅｌのににスピ
ンコ−１・法によりレノスト膜２を形成した状態、同図
（Ｂ）はこのレジスト膜２を選択エノヂングしてプリグ
ループ３を形成した状態で従来工程と変わらない。1st +:'<I (Δ) shows a state in which a renost film 2 is formed on a glass substrate tel by the spinco-1 method. Figure (B) shows a state in which a pregroup 3 is formed by selectively etching this resist film 2. The formed state is no different from the conventional process.
本発明の特徴はこのようにして形成した従来のプリグル
ープ原盤の上にＮｉ或いはクローｌ、（Ｃｒ）のような
金属薄膜を真空蒸着法などにより形成し、これを酸化し
て金属酸化物からなる硬くて薄い保護膜を形成する。The feature of the present invention is to form a metal thin film such as Ni or Cr (Cr) on the conventional pre-group master disk formed in this manner by vacuum evaporation method or the like, and then oxidize it to form a metal oxide. Forms a hard and thin protective film.
この場合、保護ｎりはパターン精度をｔ員なわぬよう成
るべく薄＜且つ硬いことが必要であり、また酸化処理に
当たってプリグループパターンに変形を起こさせないこ
とが必要である。In this case, the protection layer needs to be as thin and hard as possible so as not to affect the pattern accuracy, and it is also necessary to prevent the pregroup pattern from being deformed during the oxidation treatment.
その方法として本実施例においては真空前１１１法によ
りＮｉ 金Ｊ、７７ｓ膜８を約３００人の厚さに形成し
く同図０）、次にこれをプラズマ処理！装置にセ−／
トし、ＦＺＳＷ分圧２．３ Ｘ １Ｏ−２Ｔｏｒｒ、電
力２００ワツトの条件でプラズマ酸化してＮ１金属Ｉり
８を酸化物に変え、これを保護ｌり９とする（同図Ｄ）
。As a method for this purpose, in this example, a Ni gold J, 77S film 8 is formed to a thickness of approximately 300 mm by the vacuum 111 method (Fig. 0), and then this is plasma-treated! Save to the device/
Then, plasma oxidation was performed under the conditions of FZSW partial pressure 2.3 x 1O-2 Torr and power 200 watts to change N1 metal layer 8 to oxide, which was used as protection layer 9 (Figure D).
.
ごこて本発明においては、同図（Ｄ）に示すように従来
のプリグループ原盤の上に保護膜９を設Ｕたちのかブリ
クルリーフ原２’：：７１１）となる。In the present invention, a protective film 9 is provided on a conventional pre-group master as shown in FIG.
なお、プラス−１°酸化」−程を通してＬシス） Ｉｌ
’ｚ！２は或イ）稈吸加熱されるが数ＩＯ℃程匿であり
、一方レノスト膜２はスビンコーｌ−後の焼付処理にお
いて１５（１℃程ｌ艷の加熱処理を経ているので、この
程度の処理で変形が起こることはない。In addition, plus -1° oxidation" - L cis) Il
'z! 2 is heated by a) culm absorption, but only at a temperature of several IO degrees Celsius, while Lennost film 2 is heated for about 15 degrees (1 degree Celsius) in the baking treatment after Svincor l-1. No deformation occurs during processing.
次にこの保、：集成９の」二にに来と同様にｒη空蒸着
法によりＮｉ を約３００ 人の厚さに形成して電極膜
・１を形成しく同図Ｅ）、この重し＋＋；＞４を１℃極
としてメッキ層５を形成しく同図Ｆ）、これをガラス）
２４Ｊｘ ｌから剥離することによりスタンバ６が形成
される。Next, in the same way as in "Assembly 9", Ni is formed to a thickness of about 300 mm using the rη air evaporation method to form the electrode film 1. > 4 as the 1°C pole to form the plating layer 5 (FIG. F), which is applied to the glass)
A stand bar 6 is formed by peeling off from 24Jxl.
ここて剥；掘に当たってはスタンバ６はプリグループ原
盤１０の」二から２１１離されるため原盤の精度をｂｔ
なうことはなく、そのため繰り返して使用することがで
きる。At this point, when digging, the standber 6 is separated by 211 points from the pre-group master 10, so the precision of the master is reduced.
It never gets old, so it can be used repeatedly.
以上のように本発明はプリクループを形成したし・シス
ト１１りの上に金属酸化物からなる保護膜を設けたもの
をプリグループ原盤とするものであり、そのため反復使
用かｉｉＪ能である。As described above, the present invention uses a pre-group master having a protective film made of a metal oxide on the cyst 11 formed with the pre-croup, and therefore can be used repeatedly.
然し、スタンパらを使用して樹脂ｉｈ型する場合も同様
であるが繰り返して使用するに従ってパターン精度は低
下するので５回程度の使用で止めるのが信頼性保持の点
から無難である。However, when making a resin IH mold using a stamper, the pattern accuracy decreases as the stamper is used repeatedly, so it is safe to stop using it after about 5 times in order to maintain reliability.
第１図（Δ）〜（Ｇ）は本発明の製造工程を説明する断
面図、
第２図（Ａ）〜（Ｅ）は従来の製造工程を説明する断面
図、
である。
図において、
１はガラス基板、 ２はレジスト膜、３はプリ
グループ、 ４は電極１１り、５はメッキ層、
６はスタンパ、７、ＩＯはプリグループ原盤
、
である。FIGS. 1 (Δ) to (G) are cross-sectional views explaining the manufacturing process of the present invention, and FIGS. 2 (A) to (E) are cross-sectional views explaining the conventional manufacturing process. In the figure, 1 is a glass substrate, 2 is a resist film, 3 is a pre-group, 4 is an electrode 11, 5 is a plating layer,
6 is a stamper, 7, IO is a pre-group master.
Claims (1)
ッキを施してスタンパを形成する光ディスク基板の形成
工程において、レジスト原盤に金属薄膜を被覆し、該金
属薄膜を酸化する処理を行った該被処理基板に電極膜の
被覆と電鋳メッキ処理を行ってスタンパを形成すること
を特徴とするスタンパの製造方法。After the resist master is coated with an electrode film, the electrode film is electroformed and plated to form a stamper. In the process of forming an optical disk substrate, the resist master is coated with a metal thin film and the metal thin film is oxidized. A method for manufacturing a stamper, comprising forming a stamper by coating the substrate with an electrode film and electroforming plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20785284A JPS6185649A (en) | 1984-10-03 | 1984-10-03 | Production of stamper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20785284A JPS6185649A (en) | 1984-10-03 | 1984-10-03 | Production of stamper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185649A true JPS6185649A (en) | 1986-05-01 |
Family
ID=16546589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20785284A Pending JPS6185649A (en) | 1984-10-03 | 1984-10-03 | Production of stamper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185649A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5489082A (en) * | 1987-12-28 | 1996-02-06 | Canon Kabushiki Kaisha | Reproducible molding die having a removable cleaning layer |
-
1984
- 1984-10-03 JP JP20785284A patent/JPS6185649A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5489082A (en) * | 1987-12-28 | 1996-02-06 | Canon Kabushiki Kaisha | Reproducible molding die having a removable cleaning layer |
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